960 results about "Microelectromechanical systems" patented technology

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

Within integrated photonic circuits the ability to induce an optical phase shift allows multiple circuit elements to be implemented including, for example, modulators and optical switches. It is beneficial to achieve lower power consumption for these phase shift elements to reduce overall power consumption of the photonic circuits and their associated drive circuits. Exploiting processing techniques for microelectromechanical systems (MEMS) designs are outlined for high efficiency thermo-optic phase shifter elements with suspended elements that improve thermal isolation and counteract stress induced phase shifts that reduce the thermal induced phase shift. MEMS based spring structures provide both mechanical support and thermal pathways for improved responsivity. Other designs employ direct MEMS based modification of the waveguide path length without exploiting thermal based index changes.

A method of making an acoustic sensor (e.g., a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone) includes forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip (e.g., unsupported free end), the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion. The method also comprises attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam. One or more electrodes are disposed on or in the proximal portion of the beam.

The invention discloses a micro-cantilever geometric structure parameter inversion system, method and device, and belongs to the technical field of micro-electro-mechanical systems. According to the system, a dynamic model containing geometry, material and electromechanical coupling nonlinearity is constructed, a PINNs network fused with physical constraints is designed, a staged training optimization strategy is adopted, and efficient inversion of micro-cantilever geometric parameters is achieved. The core of the method is that a nonlinear kinetic equation is used as a constraint to be embedded into a neural network for training, experimental data and physical residual errors are combined to construct a composite loss function, and the problems that a traditional method neglects a nonlinear effect, depends on finite element simulation and is low in inversion precision are solved. The average relative error of inversion of the system is lower than 1%, which is obviously superior to that of a traditional method, and the method can be widely applied to MEMS device design, online detection and closed-loop control scenes.

The technology described herein is directed towards a metasurface arranged with unit cells for narrowband sound absorption, in which the unit cells are based on Helmholtz resonators that can have their resonant frequencies adjusted via MEMS actuators. A sound absorbing unit-cell is designed and constructed based on a general resonance frequency, and includes a neck portion and air chamber dimensioned to resonate close to the desired resonance frequency and thereby inverse phase cancel corresponding narrowband frequencies of incoming sound waves. A bimorph MEMS actuator and / or moveable part in the resonators, controlled by a controller, facilitates changing of the airflow the unit cells to adjust the resonant frequencies thereof, to cancel acoustic waves of different frequencies corresponding to noise, which can change over time. The unit cells can be distributed as part of a metasurface, which can be positioned proximate to a noise source to phase cancel the noise.

An acoustic sensor device includes a substrate, a cavity formed in the substrate, and a microelectromechanical system (MEMS) transducer having a diaphragm supported by the substrate. The diaphragm includes a first portion configured to be fixed to the substrate and a second portion extending from the first portion and suspended over the cavity. The second portion is configured to vibrate when the MEMS transducer is subject to an external stimulus. The diaphragm also includes an anchor portion that attaches the first portion of the diaphragm to the substrate on at least two sides of the substrate such that an interface between the first portion of the diaphragm and the second portion of the diaphragm is moved away from an edge of the substrate along the cavity.

An acoustic sensor device comprises a package, a substrate disposed in the package or forming a part of the package, and a plurality of microelectromechanical system (MEMS) transducers supported by the substrate and packaged in the package. The plurality of sound ports configured to couple the plurality of MEMS transducers to an ambient environment of the acoustic sensor device. The plurality of sound ports are arranged in the package such that respective MEMS transducers, among the plurality of MEMS transducers, exhibit different directional pick-up patterns with respect to sound waves traveling in the ambient environment of the acoustic sensor device.

A microelectromechanical system (MEMS) accelerometer incorporates deformation sensing with a plurality of sense electrodes positioned to facilitate determining a deformation pattern (e.g., asymmetric or symmetric) of an underlying substrate layer relative to a MEMS layer. The deformation pattern of the substrate layer contributes to offset and / or sensitivity of the accelerometer, so the determination of the deformation pattern enables processing circuitry to compensate and improve offset and / or sensitivity stability. Tilt sense electrodes and / or comparison electrodes may be incorporated alongside the plurality of sense electrodes to monitor deformation of the substrate layer relative to a fixed portion of the MEMS layer.

The present disclosure, in some embodiments, relates to a MEMS (Microelectromechanical systems) structure. The MEMS structure includes a first comb structure having a first plurality of comb fingers extending outward from a first branch. A second comb structure has a second plurality of comb fingers extending outward from a second branch. The first plurality of comb fingers are laterally interleaved between the second plurality of comb fingers. The first plurality of comb fingers respectively include a weighted core material and one or more peripheral materials. The weighted core material has a larger density than the one or more peripheral materials.

The invention discloses a lead zirconate titanate film material with an ultrahigh voltage coefficient as well as a preparation method and application of the lead zirconate titanate film material, and belongs to the technical field of electronic material development and film materials. The preparation of the lead zirconate titanate film material is realized by adopting a sol-gel spin-coating method and controlling the annealing times. The piezoelectric film material provided by the invention can be directly deposited on a Si substrate coated with metal Pt, does not need to introduce an additional buffer layer or dope any element, is short in annealing time and simple in preparation process, all required raw materials are cheap and easy to obtain, and the piezoelectric film material particularly has high orientation degree, low coercive voltage and excellent ferroelectric and piezoelectric properties, is suitable for preparing large-size (2-4 inches) wafers, and has a wide application prospect. And huge application potential is shown in the field of piezoelectric micro-electro-mechanical system (MEMS) devices.

An optoelectronic apparatus includes an array of emitters configured to emit beams of optical radiation. An optical substrate is mounted over the array. An optical metasurface is disposed on the optical substrate and configured to collimate and split each of the emitted beams into a respective group of collimated sub-beams, and to direct the collimated sub-beams toward a target to form a pattern of spots on the target.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a portion of a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and slits defined in the piezoelectric element about the perimeter of the piezoelectric element, the slits defining a plurality of partial anchors securing the piezoelectric element to the support substrate to improve sensitivity of the piezoelectric microelectromechanical system microphone.

In some embodiments, the present disclosure relates to a piezomicroelectromechanical system (piezoMEMS) device that includes a second piezoelectric layer arranged over the first electrode layer. A second electrode layer is arranged over the second piezoelectric layer. A first contact is arranged over and extends through the second electrode layer and the second piezoelectric layer to contact the first electrode layer. A dielectric liner layer is arranged directly between the first contact and inner sidewalls of the second electrode layer and the second piezoelectric layer. A second contact is arranged over and electrically coupled to the second electrode layer, wherein the second contact is electrically isolated from the first contact.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

The invention discloses an electroplating process method for preparing a deep-etching thick metal mask, and belongs to the technical field of micro electro mechanical system electroplating processes. Comprising the following steps: firstly, carrying out photoetching and patterning on the surface of a wafer by using positive photoresist; then, carrying out seed layer sputtering on the wafer subjected to pattern photoetching, and forming a to-be-electroplated region with a preset pattern through a stripping process; then, photoetching is carried out on the to-be-electroplated area through negative photoresist, and a thick photoresist layer with the thickness larger than that of a preset metal coating is formed; and finally, the electroplating area is electroplated, and the metal coating with the preset thickness is obtained. According to the method, the negative photoresist process is adopted, so that the transverse growth of the metal coating is effectively inhibited, the perpendicularity of the side wall of the metal coating is improved, and meanwhile, the damage to the surface of the wafer when the seed layer in the non-electroplating area is removed is avoided. The problems that mushroom-shaped protrusions are easily formed on the edge of a plating layer, crystal grains are coarsened and the like in the electroplating process of an existing electroplating method are solved.

The invention relates to the technical field of manufacturing of micro electro mechanical systems, in particular to a metallization method of a micro-hemispherical harmonic oscillator for trimming after assembly, which comprises the following steps of: establishing a micro-hemispherical harmonic oscillator structure model, simulating and calculating modal parameters of the harmonic oscillator; calculating an influence rule of the trimming width and the trimming depth on frequency splitting of the micro-hemispherical harmonic oscillator model by adopting finite element software to obtain a relation curve of trimming quality and frequency splitting change; measuring the resonant frequency f and the frequency cracking f of the working mode of the harmonic oscillator to be processed, estimating the removal mass required by the corresponding frequency cracking according to the calculated relation curve, carrying out mass trimming to obtain a relation curve of the actual removal mass and the frequency cracking, and confirming the minimum width wmin required by the actual trimming; and removing the film layer with the ring width of wmin by adopting laser. According to the invention, quality trimming is carried out on the premise of not influencing the capacitance value of the harmonic oscillator, and driving and detection gain errors caused by quality trimming are reduced.

A torsional micro-electro-mechanical systems (MEMS) mirror module provides for thermally-stable ancillary modes of mirror oscillation (e.g., vertical, horizontal, and rocking) by utilizing MEMS die packaging techniques that implement a cantilevered (i.e., fixed-free) die package in which one end of the die is partially fixedly-attached to a die carrier substrate while the non-attached end of the die is free from the die carrier substrate and unsupported. The cantilevered die package with fixed-free architecture effectively decouples the effects of coefficient of thermal expansion (CTE) mismatch of the MEMS die, die-bond adhesive, and die carrier substrate on temperature-dependent MEMS flexure stress. Ancillary mode oscillation frequencies changes with temperatures are thus limited to a smaller range relative to those experienced with conventional package designs.

In accordance with an embodiment, an earphone includes: a housing having a cavity structure disposed within, and a sound output port in communication with the cavity structure; and a first sound transducer, a second sound transducer, and a third sound transducer disposed in the cavity structure, wherein: a sound production frequency of the second sound transducer is greater than a sound production frequency of the third sound transducer and is less than a sound production frequency of the first sound transducer, and the third sound transducer is a micro-electro-mechanical-system located between the first sound transducer and the sound output port.

The technology described herein is directed towards a metasurface arranged with unit cells for narrowband sound absorption, in which the unit cells are based on Helmholtz resonators that can have their resonant frequencies adjusted via MEMS actuators. A sound absorbing unit-cell is designed and constructed based on a general resonance frequency, and includes a neck portion and air chamber dimensioned to resonate close to the desired resonance frequency and thereby inverse phase cancel corresponding narrowband frequencies of incoming sound waves. A moveable partition in the resonators, controlled by MEMS actuators, facilitates changing of the resonators' air cavity dimensions, to adjust the resonant frequencies to cancel acoustic waves of different frequencies corresponding to noise, which can change over time. The unit cells can be distributed as part of a metasurface, which can be positioned proximate to a noise source to phase cancel the noise.

Laser-scanning systems for augmented reality glasses displays and LiDAR (light detection and ranging) use photonic integrated circuits to generate multiple collimated (or low-divergence) modulated laser beams. Laser light is guided on the photonic chip, expanded, and emitted from the surface of the chip (using grating coupler devices) as one or more large-diameter (e.g., millimeter-scale), collimated or low-divergence beams. These gratings may be integrated onto movable microelectromechanical systems (MEMS) plates to steer the beam along two angular axes. Alternatively, the beam(s) from the grating(s) may be steered by a separate MEMS mirror integrated onto the photonic chip or on another chip. Such systems enable multi-beam laser scanning systems without collimation lenses, reducing the size and packaging complexity of high-performance laser scanning systems for augmented reality glasses and LiDAR.

A visualization system for dynamically visualizing an eye includes a laser module operable for outputting a primary laser beam along a beam axis, a beam splitter positioned in the beam axis and configured to direct a first beam portion along the beam axis and a second beam portion along a detection axis that is orthogonal to the beam axis. A microelectromechanical system (MEMS) scanner is arranged on the beam axis and configured, in response to the first beam portion, to output a scanning laser along a visualization path. An avalanche photodiode (APD) detector receives the second beam portion. A 4F correlator optical system has a spatial filter arranged along the visualization path. An optional optical flat may be disposed between the eye and the 4F correlator optical system to achieve stereo parallax.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

The invention discloses a self-adaptive endoscope system and method based on photoacoustic image structure feature recognition, and relates to the technical field of photoacoustic endoscopic imaging, the system comprises a control system, a light source system, an endoscope probe, a feedback system, a signal processing system and a computing terminal; the control system synchronously triggers the light source system and the signal processing system, the light source system comprises a white light source and a laser, laser exciting light enters the endoscope probe through a single-mode optical fiber, scanning is controlled by a micro-electro-mechanical system (micro-electro-mechanical system scanning micro-mirror) scanning micro-mirror in the probe, scanning light enters the focusing lens group through the relay lens, and the focusing lens group is connected with the signal processing system through the relay lens. A to-be-imaged tissue surface is irradiated by the liquid lens, echo signals are acquired and processed by the signal processing system, photoacoustic image reconstruction is completed, the feedback system is connected with the liquid lens in the probe, and optical signals of optical images are acquired and reconstructed by an eyepiece at the top of the endoscope and a matched CMOS (complementary metal oxide semiconductor).

The present invention belongs to the technical field of microelectromechanical systems, and discloses a conformal MEMS friction sensor for measuring the surface friction of a conical model and an assembly method thereof. The conformal MEMS friction sensor includes a packaging housing, a head structure and an interface circuit; the packaging housing protects the head structure and the interface circuit through an upper and lower locked packaging cover plate and a packaging base. The conformal MEMS friction sensor is installed on the surface of the conical model perpendicular to the generatrix of the conical model, directly measures the surface friction in the direction parallel to the generatrix, and performs friction measurement with automatic deduction of the pressure difference resistance. The assembly method includes the assembly of the silicon-glass microstructure and the interface circuit, the assembly of the floating element, and the assembly of the packaging housing. The conformal MEMS friction sensor for measuring the surface friction of the conical model and the assembly method thereof of the present invention have the characteristics of small volume, good temperature stability, high reliability, etc., and can accurately measure the frictional resistance on the surface of the conical model.

In accordance with an embodiment, a microelectromechanical system (MEMS) switch device includes: a substrate; a switching membrane disposed above the substrate; a pull-in electrode disposed above the switching membrane; a metal contact disposed on the switching membrane; and a pull-back electrode disposed below the switching membrane, wherein the switching membrane is movable between an open position and a closed position, and wherein in the closed position, the metal contact electrically connects two RF signal lines.

The invention provides a molecular clock, a manufacturing method thereof and electronic equipment, an oscillator can be manufactured in a first film layer structure of a source chip through a micro electro mechanical system processing technology, a molecular waveguide structure can be manufactured in a second film layer structure of a waveguide chip, the size of the oscillator and the size of the molecular waveguide structure can reach the chip level, and the size of the molecular clock is reduced. Compared with an oscillator and a molecular waveguide structure manufactured in the prior art, the size of the molecular clock is reduced, so that the size of the molecular clock is reduced, and the problem that the size of the molecular clock is large due to the fact that the sizes of the molecular waveguide structure and the oscillator are large in the prior art is solved.

Microelectromechanical systems (MEMS) have found widespread applications across biotechnology, medicine, communications, and consumer electronics. These are typically one-dimensional MEMS (e.g. rotation, linear translation on a single axis) or two-dimensional MEMS (e.g. linear translation in two directions in the plane of the MEMS). It would be beneficial therefore for designers of components, circuits, and systems to exploit MEMS elements that produce both out-of-plane and in-plane motion thereby allowing for novel two-dimensional and three-dimensional MEMS micropositioners.

MEMS device (10) with a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), wherein the drive device (14) has at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

The invention provides a micro-mirror chip, a micro-mirror device and an optical device, and belongs to the technical field of micro electro mechanical systems. The micro-mirror chip comprises a substrate, a micro-mirror array, an electrode, a light window and a fixing ring. The micromirror array is located on the first surface of the substrate, the electrode is located on the second surface of the substrate, and the first surface and the second surface are opposite in position in the thickness direction of the substrate; the fixing ring is fixed on the first surface of the substrate, the micro-mirror array is located in an in-ring space of the fixing ring, and the light window is fixed on the fixing ring and covers the micro-mirror array. In the packaging of the micro-mirror chip, the micro-mirror array is sealed in the sealed space formed by the substrate, the fixing ring and the light window, so that small particles do not fall into the environment where the micro-mirror array is located in the subsequent packaging process, the qualified rate of the packaged micro-mirror device can be improved, and the yield of the packaged micro-mirror device can be improved. Therefore, the yield of the packaged micro-mirror device is improved.

Digital isolators in heterogenous system-in-package solutions are important devices for overcoming the challenge of managing the multiple voltage domains with different ground references. However, electronic digital isolators may be limited in their temperature range or be susceptible to electrostatic / electromagnetic fields which inherently result in electromagnetic interference. Micro-electromechanical systems (MEMS) based resonators are not susceptible to electromagnetic interference and through different materials can provide increased temperature operation. Accordingly, digital isolators exploiting vertical, lateral or side-by-side MEMS resonators to generate and receive acoustic waves, such as bulk acoustic waves, are outlined to provide such digital isolators.