2062 results about "Microelectromechanical systems" patented technology

A method of formation of a microelectromechanical system (MEMS) resonator or filter which is compatible with integration with any analog, digital, or mixed-signal integrated circuit (IC) process, after or concurrently with the formation of the metal interconnect layers in those processes, by virtue of its materials of composition, processing steps, and temperature of fabrication is presented. The MEMS resonator or filter incorporates a lower metal level, which forms the electrodes of the MEMS resonator or filter, that may be shared with any or none of the existing metal interconnect levels on the IC. It further incorporates a resonating member that is comprised of at least one metal layer for electrical connection and electrostatic actuation, and at least one dielectric layer for structural purposes. The gap between the electrodes and the resonating member is created by the deposition and subsequent removal of a sacrificial layer comprised of a carbon-based material. The method of removal of the sacrificial material is by an oxygen plasma or an anneal in an oxygen containing ambient. A method of vacuum encapsulation of the MEMS resonator or filter is provided through means of a cavity containing the MEMS device, filled with additional sacrificial material, and sealed. Access vias are created through the membrane sealing the cavity; the sacrificial material is removed as stated previously, and the vias are re-sealed in a vacuum coating process.

A method for making a Si-containing material comprises transporting a pyrolyzed Si-precursor to a substrate and polymerizing the pyrolyzed Si-precursor on the substrate to form a Si-containing film. Polymerization of the pyrolyzed Si-precursor may be carried out in the presence of a porogen to thereby form a porogen-containing Si-containing film. The porogen may be removed from the porogen-containing Si-containing film to thereby form a porous Si-containing film. Preferred porous Si-containing films have low dielectric constants and thus are suitable for various low-k applications such as in microelectronics and microelectromechanical systems.

A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

In one embodiment, the invention provides a MEMS device. The MEMS device comprises a plurality of functional components including at least one moveable component; and a sacrificial component to at least reduce movement of the moveable component during shipping of the microelectromechanical systems device, wherein the sacrificial component can be removed after shipping.

The invention provides a sensor probe which has: one or more microelectromechanical systems (MEMS) sensors configured to sense one or more parameters and a communication bus in electrical communication therewith. The one or more sensors and communication bus are disposed on a substrate. The sensor probe includes a digital storage module in which a unique probe identifier is stored and which is in electrical communication with the communication bus. The probe includes, a cable, a first end of which is in electrical communication with the communication bus and a second end of which is in electrical communication with a remote monitoring unit. The cable is configured to provide electrical power received from the remote monitoring unit to the one or more sensors, via the communication bus, and to communicate data received from the one or more sensors, via the communication bus, to the remote monitoring unit.

A component for use in a combustion turbine (10) is provided that includes a substrate (212) and a microelectromechanical system (MEMS) device (50, 250) affixed to the substrate (212). At least one connector (52) may be deposited in electrical communication with the MEMS device (50, 250) for routing a data signal from the MEMS device (50, 250) to a termination location (59). A barrier coating (216) may be deposited on the substrate (212) wherein the MEMS device (50, 250) is affixed beneath a surface of the barrier coating (216). A plurality of trenches (142) may be formed in the barrier coating (216) at respective different depths below the surface of the barrier coating (216) and a MEMS device (50, 250) deposited within each of the plurality of trenches (142). A monitoring system (30) is provided that may include a processing module (34) programmed for receiving data from the MEMS device (50, 250).

The present invention discloses a method of surface texturing at nano/micro-scale by aluminum-induced rapid crystallization of amorphous silicon for controlling the wettability of a surface, enhancing cell attachment to a surface, and promoting cell growth on a surface. The present invention can be used in a variety of applications, such as producing superhydrophobic or superhydrophilic surfaces for medical devices, microelectromechanical systems, and microfluidic channels.

A micro-electromechanical system (MEMS) device having a pair of spaced apart top and bottom substrates or cover plates having mutually opposing inner surfaces structured to cooperate with a micro-machined electromechanical device mechanism, such as a micro-machined sensor or actuator mechanism. Such a micro-machined electromechanical device mechanism is coupled to the inner surface of one of the top and bottom substrates. A metal chip bond pad is formed on the inner surface of the bottom substrate and is electrically coupled to an electrical path; another metal chip bond pad formed on the inner surface of the top substrate in a complementary position opposite the chip bond pad on the bottom substrate; and an electrically conductive gold stud bump is mechanically and electrically coupled between the metal chip bond pads on the top and bottom substrates.

A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

A nonvolatile memory cell comprises a conductive cantilever beam having a free end in a first charge state, a first FET having a conductive gate in a second charge state and a pull-in electrode adapted to bring the cantilever beam into electrical contact with the gate to effect a charge state change in the gate. A pull-in electrode input is connected to the electrode, a cantilever input is connected to the cantilever, a column select input is connected to the first FET and a row select input is connected to the first FET. The nonvolatile memory cell is selected by signals applied to the row select input and the column select input. The cell also includes a second FET connected between the cantilever beam and the cantilever input for controlling the passage of signals from the cantilever input to the cantilever beam and a third FET connected between the pull-in electrode and the pull-in electrode input for controlling the passage of signals from the pull-in electrode input to the electrode. The second FET and third FET have gates connected to the row select input. The row select input turns on the second FET and the third FET to allow the passage of signals from the pull-in electrode input to the pull-in electrode and from the cantilever input to the cantilever beam when the nonvolatile memory cell is selected.

Implantable medical devices, including stents, grafts, covered stents, catheters, patches or the like having regions of the device which are functionalized employing microelectromechanical systems that are capable of acting as electromechanical sensors or biosensors in response to either an endogenous event, such as tissue growth, biochemical binding events, pressure changes, or respond to an externally applied stimulus, such as RF energy, to cause a change in the state of the device, such as to induce an oscillation signal which may be interrogated and interpreted external the body or may generate an induced electrical or electromagnetic potential in the device to activate micromotors to effect a geometric change in the device.

Microelectromechanical RF and microwave frequency power limiter and electrostatic protection devices for use in high-speed circuits are presented. The devices utilize an airbridge or a cantilever arm including a contact pad positioned operatively adjacent to an electrically conductive and substantially planar transmission line. When the power level in the transmission line exceeds a particular threshold, the airbridge or cantilever arm yields due to force between the contact pad and the transmission line, directing undesired power away from active devices. This characteristic can either serve as a method by which to limit the amount of power passing through the transmission line to a determined value or as a method by which to protect devices along the transmission line from damage due to large electrostatic bursts.

Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.

A micro-miniature x-ray apparatus comprises: a first chip subassembly including a source of x-rays including both Bremsstrahlung photons and characteristic x-rays; a second chip subassembly including a filter for transmitting the characteristic x-rays and blocking the Bremsstrahlung photons; a third chip subassembly including a movable element for focusing or collimating the transmitted characteristic x-rays into a beam and means for controlling the position of the focusing element. In one embodiment, the controlling means include a micro-electromechanical system (MEMS). In another embodiment, the position of the movable element determines how the x-ray beam is steered to the focal area. In still another embodiment, the x-ray source includes a field emitter electron source and a target responsive to the electrons for generating x-rays. In this case, the x-ray beam is also steered by selectively energizing the anode segments. In yet another embodiment, the movable element includes a Fresnel zone plate; in still another embodiment it includes an array of poly-capillaries. Advantageously, our x-ray source, including its focusing, collimating and steering components, can be fabricated small enough to be mounted at the end of a catheter. In addition, in some embodiments it can also fabricated sufficiently inexpensively to be disposable after each use.

Techniques are disclosed for enhancing the quality of a displayed image using a tactile or other texture display. In particular, the disclosed techniques leverage active-texture display technology to enhance the quality of graphics by providing, for example, outlining and/or shading when presenting a given image, so as to create the effect of increased contrast and image quality and/or to reduce observable glare. These effects can be present even at high viewing angles and in environments of high light reflection. To these ends, one or more graphics processes, such as edge-detection and/or shading, may be applied to an image to be displayed. In turn, an actuator element (e.g., microelectromechanical systems, or MEMS, devices) of the tactile display may be manipulated (e.g., in Z-height) to provide fine-grain adjustment of image attributes such as: pixel brightness/intensity; pixel color; edge highlighting; object outlining; effective shading; image contrast; and/or viewing angle.

A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.

A prosthetic implant for the body having an associated gyroscope, accelerometer and/or magnetometer as the sensor to detect changes in position of the implant. The device incorporates a miniature gyroscope, accelerometer, and/or magnetometer as a permanent part of the prosthesis for navigational information. Alternatively, the magnetometer can be external to the implant when the implant has magnetic elements associated with it. The sensors can be microelectromechanical system (MEMS) sensors placed within a drilled hole and sealed with a screw or a cap (20). The implant can be responsive to an external interrogation and powering systems. The device provides information so as to help to properly place the prosthetic implant during surgery and to assess proper functioning. The gyroscope, accelerometer, and/or magnetometer are used after implantation to provide diagnostic information in situ based upon the changed positioning or motion of the device in the prosthesis. The device can be a total joint replacement, dental implant or other type of prosthetic implant.

The invention relates to a system and a method for performing impact loading on a micro test piece and measuring dynamic mechanical property. The method comprises the following steps of: instantly accelerating a bullet by using an electromagnetic pulse launch technology and launching the bullet at high speed; transmitting a stretching stress wave generated by collision of the bullet to the micro test piece by using a separated Hopkinson bar technology so as to generate the impact loading on the micro test piece; recording strain data of an input bar and an output bar, and acquiring an enlarged surface dynamic deformation image of the micro test piece; analyzing and obtaining a stress strain curve of the micro test piece subjected to the impact loading having different strain rates; and analyzing the surface dynamic deformation image of the micro test piece and obtaining a distribution of a bidimensional displacement field and a strain field during dynamic impact loading of the micro test piece. By the system and the method, the problem of research on the dynamic mechanical property of a micro electro mechanical system (MEMS), and membrane materials such as piezoelectric thin films, ferroelectric thin films and the like is solved.

A building component system includes a building component that is controllable between a first state and a second state in response to a sensed condition. The system may include a sensor on a first side of the building component and a sensor on the second side of the building component. The building component may be a window that is controllable between an opaque state and a clear state by a micro electromechanical system (MEMS) network that senses the conditions on both sides of the window.

A reflectance-type optical sensor includes one or more photodiodes formed in a semiconductor substrate. A well having sidewalls and a bottom is formed in the top surface of the substrate, and a reflective layer is formed on the sidewalls and bottom. A light-emitting diode (LED) is mounted in the well, so that light emitted laterally and rearwardly from the LED strikes the sidewalls or bottom and is redirected in a direction generally perpendicular to the top surface of the substrate. The optical sensor can be fabricated using microelectromechanical systems (MEMS) fabrication techniques.

Systems and methods for modulating light with light in high index contrast waveguides clad with graphene. Graphene exhibits a large nonlinear electro-optic constant χ³. Waveguides fabricated on SOI wafers and clad with graphene are described. Systems and methods for modulating light with light are discussed. Optical logic gates are described. Waveguides having closed loop structures such as rings and ovals, Mach-Zehnder interferometer, grating, and Fabry-Perot configurations, are described. Optical signal processing methods, including optical modulation at Terahertz frequencies, are disclosed. Optical detectors are described. Microelectromechanical and nanoelectromechanical systems using graphene on silicon substrates are described.