757 results about "Microelectromechanical systems" patented technology

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

The invention discloses a micro-cantilever geometric structure parameter inversion system, method and device, and belongs to the technical field of micro-electro-mechanical systems. According to the system, a dynamic model containing geometry, material and electromechanical coupling nonlinearity is constructed, a PINNs network fused with physical constraints is designed, a staged training optimization strategy is adopted, and efficient inversion of micro-cantilever geometric parameters is achieved. The core of the method is that a nonlinear kinetic equation is used as a constraint to be embedded into a neural network for training, experimental data and physical residual errors are combined to construct a composite loss function, and the problems that a traditional method neglects a nonlinear effect, depends on finite element simulation and is low in inversion precision are solved. The average relative error of inversion of the system is lower than 1%, which is obviously superior to that of a traditional method, and the method can be widely applied to MEMS device design, online detection and closed-loop control scenes.

The technology described herein is directed towards a metasurface arranged with unit cells for narrowband sound absorption, in which the unit cells are based on Helmholtz resonators that can have their resonant frequencies adjusted via MEMS actuators. A sound absorbing unit-cell is designed and constructed based on a general resonance frequency, and includes a neck portion and air chamber dimensioned to resonate close to the desired resonance frequency and thereby inverse phase cancel corresponding narrowband frequencies of incoming sound waves. A bimorph MEMS actuator and / or moveable part in the resonators, controlled by a controller, facilitates changing of the airflow the unit cells to adjust the resonant frequencies thereof, to cancel acoustic waves of different frequencies corresponding to noise, which can change over time. The unit cells can be distributed as part of a metasurface, which can be positioned proximate to a noise source to phase cancel the noise.

The present disclosure, in some embodiments, relates to a MEMS (Microelectromechanical systems) structure. The MEMS structure includes a first comb structure having a first plurality of comb fingers extending outward from a first branch. A second comb structure has a second plurality of comb fingers extending outward from a second branch. The first plurality of comb fingers are laterally interleaved between the second plurality of comb fingers. The first plurality of comb fingers respectively include a weighted core material and one or more peripheral materials. The weighted core material has a larger density than the one or more peripheral materials.

The invention discloses a lead zirconate titanate film material with an ultrahigh voltage coefficient as well as a preparation method and application of the lead zirconate titanate film material, and belongs to the technical field of electronic material development and film materials. The preparation of the lead zirconate titanate film material is realized by adopting a sol-gel spin-coating method and controlling the annealing times. The piezoelectric film material provided by the invention can be directly deposited on a Si substrate coated with metal Pt, does not need to introduce an additional buffer layer or dope any element, is short in annealing time and simple in preparation process, all required raw materials are cheap and easy to obtain, and the piezoelectric film material particularly has high orientation degree, low coercive voltage and excellent ferroelectric and piezoelectric properties, is suitable for preparing large-size (2-4 inches) wafers, and has a wide application prospect. And huge application potential is shown in the field of piezoelectric micro-electro-mechanical system (MEMS) devices.

An optoelectronic apparatus includes an array of emitters configured to emit beams of optical radiation. An optical substrate is mounted over the array. An optical metasurface is disposed on the optical substrate and configured to collimate and split each of the emitted beams into a respective group of collimated sub-beams, and to direct the collimated sub-beams toward a target to form a pattern of spots on the target.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a portion of a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and slits defined in the piezoelectric element about the perimeter of the piezoelectric element, the slits defining a plurality of partial anchors securing the piezoelectric element to the support substrate to improve sensitivity of the piezoelectric microelectromechanical system microphone.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

The invention discloses an electroplating process method for preparing a deep-etching thick metal mask, and belongs to the technical field of micro electro mechanical system electroplating processes. Comprising the following steps: firstly, carrying out photoetching and patterning on the surface of a wafer by using positive photoresist; then, carrying out seed layer sputtering on the wafer subjected to pattern photoetching, and forming a to-be-electroplated region with a preset pattern through a stripping process; then, photoetching is carried out on the to-be-electroplated area through negative photoresist, and a thick photoresist layer with the thickness larger than that of a preset metal coating is formed; and finally, the electroplating area is electroplated, and the metal coating with the preset thickness is obtained. According to the method, the negative photoresist process is adopted, so that the transverse growth of the metal coating is effectively inhibited, the perpendicularity of the side wall of the metal coating is improved, and meanwhile, the damage to the surface of the wafer when the seed layer in the non-electroplating area is removed is avoided. The problems that mushroom-shaped protrusions are easily formed on the edge of a plating layer, crystal grains are coarsened and the like in the electroplating process of an existing electroplating method are solved.

The invention relates to the technical field of manufacturing of micro electro mechanical systems, in particular to a metallization method of a micro-hemispherical harmonic oscillator for trimming after assembly, which comprises the following steps of: establishing a micro-hemispherical harmonic oscillator structure model, simulating and calculating modal parameters of the harmonic oscillator; calculating an influence rule of the trimming width and the trimming depth on frequency splitting of the micro-hemispherical harmonic oscillator model by adopting finite element software to obtain a relation curve of trimming quality and frequency splitting change; measuring the resonant frequency f and the frequency cracking f of the working mode of the harmonic oscillator to be processed, estimating the removal mass required by the corresponding frequency cracking according to the calculated relation curve, carrying out mass trimming to obtain a relation curve of the actual removal mass and the frequency cracking, and confirming the minimum width wmin required by the actual trimming; and removing the film layer with the ring width of wmin by adopting laser. According to the invention, quality trimming is carried out on the premise of not influencing the capacitance value of the harmonic oscillator, and driving and detection gain errors caused by quality trimming are reduced.

A torsional micro-electro-mechanical systems (MEMS) mirror module provides for thermally-stable ancillary modes of mirror oscillation (e.g., vertical, horizontal, and rocking) by utilizing MEMS die packaging techniques that implement a cantilevered (i.e., fixed-free) die package in which one end of the die is partially fixedly-attached to a die carrier substrate while the non-attached end of the die is free from the die carrier substrate and unsupported. The cantilevered die package with fixed-free architecture effectively decouples the effects of coefficient of thermal expansion (CTE) mismatch of the MEMS die, die-bond adhesive, and die carrier substrate on temperature-dependent MEMS flexure stress. Ancillary mode oscillation frequencies changes with temperatures are thus limited to a smaller range relative to those experienced with conventional package designs.

The technology described herein is directed towards a metasurface arranged with unit cells for narrowband sound absorption, in which the unit cells are based on Helmholtz resonators that can have their resonant frequencies adjusted via MEMS actuators. A sound absorbing unit-cell is designed and constructed based on a general resonance frequency, and includes a neck portion and air chamber dimensioned to resonate close to the desired resonance frequency and thereby inverse phase cancel corresponding narrowband frequencies of incoming sound waves. A moveable partition in the resonators, controlled by MEMS actuators, facilitates changing of the resonators' air cavity dimensions, to adjust the resonant frequencies to cancel acoustic waves of different frequencies corresponding to noise, which can change over time. The unit cells can be distributed as part of a metasurface, which can be positioned proximate to a noise source to phase cancel the noise.

Laser-scanning systems for augmented reality glasses displays and LiDAR (light detection and ranging) use photonic integrated circuits to generate multiple collimated (or low-divergence) modulated laser beams. Laser light is guided on the photonic chip, expanded, and emitted from the surface of the chip (using grating coupler devices) as one or more large-diameter (e.g., millimeter-scale), collimated or low-divergence beams. These gratings may be integrated onto movable microelectromechanical systems (MEMS) plates to steer the beam along two angular axes. Alternatively, the beam(s) from the grating(s) may be steered by a separate MEMS mirror integrated onto the photonic chip or on another chip. Such systems enable multi-beam laser scanning systems without collimation lenses, reducing the size and packaging complexity of high-performance laser scanning systems for augmented reality glasses and LiDAR.

A visualization system for dynamically visualizing an eye includes a laser module operable for outputting a primary laser beam along a beam axis, a beam splitter positioned in the beam axis and configured to direct a first beam portion along the beam axis and a second beam portion along a detection axis that is orthogonal to the beam axis. A microelectromechanical system (MEMS) scanner is arranged on the beam axis and configured, in response to the first beam portion, to output a scanning laser along a visualization path. An avalanche photodiode (APD) detector receives the second beam portion. A 4F correlator optical system has a spatial filter arranged along the visualization path. An optional optical flat may be disposed between the eye and the 4F correlator optical system to achieve stereo parallax.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

The present invention belongs to the technical field of microelectromechanical systems, and discloses a conformal MEMS friction sensor for measuring the surface friction of a conical model and an assembly method thereof. The conformal MEMS friction sensor includes a packaging housing, a head structure and an interface circuit; the packaging housing protects the head structure and the interface circuit through an upper and lower locked packaging cover plate and a packaging base. The conformal MEMS friction sensor is installed on the surface of the conical model perpendicular to the generatrix of the conical model, directly measures the surface friction in the direction parallel to the generatrix, and performs friction measurement with automatic deduction of the pressure difference resistance. The assembly method includes the assembly of the silicon-glass microstructure and the interface circuit, the assembly of the floating element, and the assembly of the packaging housing. The conformal MEMS friction sensor for measuring the surface friction of the conical model and the assembly method thereof of the present invention have the characteristics of small volume, good temperature stability, high reliability, etc., and can accurately measure the frictional resistance on the surface of the conical model.

In accordance with an embodiment, a microelectromechanical system (MEMS) switch device includes: a substrate; a switching membrane disposed above the substrate; a pull-in electrode disposed above the switching membrane; a metal contact disposed on the switching membrane; and a pull-back electrode disposed below the switching membrane, wherein the switching membrane is movable between an open position and a closed position, and wherein in the closed position, the metal contact electrically connects two RF signal lines.

Microelectromechanical systems (MEMS) have found widespread applications across biotechnology, medicine, communications, and consumer electronics. These are typically one-dimensional MEMS (e.g. rotation, linear translation on a single axis) or two-dimensional MEMS (e.g. linear translation in two directions in the plane of the MEMS). It would be beneficial therefore for designers of components, circuits, and systems to exploit MEMS elements that produce both out-of-plane and in-plane motion thereby allowing for novel two-dimensional and three-dimensional MEMS micropositioners.

MEMS device (10) with a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), wherein the drive device (14) has at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

The invention provides a micro-mirror chip, a micro-mirror device and an optical device, and belongs to the technical field of micro electro mechanical systems. The micro-mirror chip comprises a substrate, a micro-mirror array, an electrode, a light window and a fixing ring. The micromirror array is located on the first surface of the substrate, the electrode is located on the second surface of the substrate, and the first surface and the second surface are opposite in position in the thickness direction of the substrate; the fixing ring is fixed on the first surface of the substrate, the micro-mirror array is located in an in-ring space of the fixing ring, and the light window is fixed on the fixing ring and covers the micro-mirror array. In the packaging of the micro-mirror chip, the micro-mirror array is sealed in the sealed space formed by the substrate, the fixing ring and the light window, so that small particles do not fall into the environment where the micro-mirror array is located in the subsequent packaging process, the qualified rate of the packaged micro-mirror device can be improved, and the yield of the packaged micro-mirror device can be improved. Therefore, the yield of the packaged micro-mirror device is improved.

A circuit for a MEMS gyroscope having at least one mass excitable to an oscillatory motion. The circuit includes: a signal generator circuit for generating a periodic test signal, the test signal being applicable to a first MEMS-side signal input of a driver circuit and / or to a second MEMS-side signal input of a readout circuit and causing a response measurement signal, so that the phase offset between a demodulation signal and the response measurement signal can be determined on the basis of the response measurement signal. A corresponding method for operating a MEMS gyroscope is also described.

An obstacle detector uses a Micro-Electro-Mechanical System (MEMS) Micro-mirror Array (MMA) for scanning one or more laser beams over a field of regard to identify negative obstacles in the path of an autonomous vehicle or in other limited visual environments. In certain examples, the MEMS MMA may be segmented to concurrently and independently form and scan multiple laser beams over the field of regard to interrogate different areas, concurrently identify and verify candidate objects, maintain specified spatial resolution or implement a composite scan pattern. The MEMS MMA may be configured to concurrently and independently scan multiple laser beams at different wavelengths or spectral bands. The MEMS MMA may be configured to adjust a size, divergence or intensity profile of the laser beam(s) or to provide wavefront correction to compensate for atmospheric distortion. In certain embodiments, the MEMS MMA may be provided with tip, tilt and piston actuation of the mirrors to form the laser beams.

A three-dimensional (3D) compressive sensing based eye tracking system using single photon avalanche diode (SPAD) sensors achieves high resolution depth measurement by using low resolution SPAD sensors and active encoded illumination such as two- or three-dimensional fringe patterns, random speckles, random patterns, and / or superimposed patterns projected onto a surface of an eye. The patterns may be projected by high speed illuminators such as a digital micromirror device (DMD) or micro-electromechanical system (MEMS) projector in series changing at the same rate as the SPAD sensor capture rate. A processor may employ compressive sensing techniques to obtain a high resolution image and depth information from the captured images of varying patterns.

The disclosed method that may be used for eye tracking includes measuring, by a controller, a distance to an object (316) based on a combination of polarization information of detected light and time-of-flight information of the detected light, wherein the detected light results from at least one of scattering or reflection of a light beam from the object (316). The disclosed method additionally includes performing, by an artificial reality system that includes the controller, one or more user interaction procedures based on information that includes the measured distance to the object (316). A system includes a laser scanning polarization imager including and a detector system (302) including a plurality of photodetectors 304. Each photodetector (306) includes a polarizer (308) having a particular polarization direction oriented at zero, 45, 90 and 135 degrees. A light source (310) may include a vertical cavity surface emitting laser (VCSEL) to emit a light beam (312). A reflector (314), such as a MEMS scanner, directs the light beam (312) onto the object (316), such as an eye. Light (318), e.g., specular and / or diffusive, is reflected and / or scattered from the object (316) and detected by the detector system (302). A controller measures a distance to the object (316) based on this detected light (318). Additionally, the controller measures position and / or size of one or more regions (320) of the object, such as a pupil and / or cornea.

Disclosed herein are a microelectromechanical system (MEMS) devices comprising a first electrode layer, an aluminum nitride based piezoelectric layer, and a second electrode layer. The aluminum nitride based piezoelectric layer comprises a piezoelectric material of formula AlxScyYbzN, wherein x+y+z=1. Also disclosed are acoustic components comprising the piezoelectric material.

The present invention relates to the technical field of microelectromechanical system manufacturing, and particularly relates to a micro-hemispherical gyro structure with a curved surface electrode and a preparation method thereof; the method includes coating the outer surface of a micro-hemispherical resonator, coating the inner and outer surfaces of the micro-hemispherical curved surface electrode and spraying photoresist; aligning a photomask plate with an optical lens structure with the inner surface of the micro-hemispherical curved surface electrode, performing photolithography and development to pattern the photoresist of the curved surface structure; using the photoresist as a mask to pattern the metal film on the micro-hemispherical curved surface electrode to form excitation detection electrodes, shielding electrodes, and anchor electrodes; coaxially aligning the micro-hemispherical resonator with the micro-hemispherical curved surface electrode, curing and conducting the resonator anchor points and the curved surface electrode anchor points, and fixing the reference surface of the outer edge of the curved surface electrode on a buffer plate to form a micro-hemispherical gyro structure with a curved surface electrode; the present invention can effectively reduce the process difficulty and cost of manufacturing the curved surface electrode and has better thermal adaptation performance.

A device for switching a differential signal includes an input port, a first output port, a second output port, a first micro electromechanical system (MEMS) switch, and a second MEMS switch. The first and second MEMS switches selectively couple the input port to either the first output port or the second output port. The differential input port is separated into two single-ended paths. One single-ended path is switched through the first MEMS switch, and the other single-ended path is switched through the second MEMS switch. The single-ended paths are spatially matched with respect to length and orientation, and are at least partially distributed through at least two layers of electrical conductors, with adjacent layers of electrical conductors separated by electrically insulating layers.

Described herein are sensors for measuring various parameters. The sensors may be used in systems, devices, and methods for controlling blood flow or for measuring (e.g., monitoring) blood pressure, pH, or analyte levels such as a lactate level, an oxygen level, and / or a carbon dioxide level. The sensors may include a membrane configured to generate a measurable response (e.g., a change in an electrical signal such as resistance, capacitance, current, voltage) when the membrane interacts with a parameter of interest. In some instances, the sensors may include a piezoresistive MEMS subassembly. In other instances, the sensors may include an electrochemical membrane.

Silicon Photonics is a candidate technology for adding integrated optics functionality, either passive or active optical waveguides) to integrated circuits by leveraging the economies of scale of the CMOS microelectronics industry and using materials for the waveguide core such as silicon nitride (SiXNY) and silicon oxynitride (SiOXN1-X) for example. Microelectromechanical systems (MEMS) provide for movable platforms relative to the substrate allowing additional functionality to be added to a silicon circuit but also Silicon Photonics. Accordingly, by combining “fixed” waveguides formed upon the substrate with “movable” waveguides formed upon one or more movable platforms the inventors have established a series of Integrated Optics MEMS (IO-MEMS) based on Silicon Photonics. Such IO-MEMS include optical switches, optical attenuators, optical gates, optical switch matrices, configurable wavelength division multiplexer / demultiplexer devices, etc. exploiting both platforms and deformable beams.

Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.