111 results about "Microelectromechanical systems" patented technology

This invention provides a microbridge structure and its fabrication method, as well as an uncooled infrared microbolometer, belonging to the fields of microelectromechanical systems (MEMS) and infrared detection technology. The microbridge structure includes two diagonally arranged anchor posts, two supporting legs, a bridge deck, and an umbrella-shaped canopy. Each supporting leg consists of multiple alternating longitudinal segments and multiple transverse segments connected end-to-end. The longitudinal segments extend at an angle greater than 45 degrees relative to the horizontal plane, while the transverse segments extend parallel to the horizontal plane. One end of each supporting leg is connected to an anchor post, and the other end is connected to the end of the bridge deck, suspending the bridge deck. This design maintains the slender characteristics of the supporting legs to ensure low thermal conductivity and high thermal insulation performance, while significantly reducing the residual stress on the supporting legs by utilizing the high cross-sectional moment of inertia of the longitudinal segments. This improves the mechanical stability and deformation resistance of the microbridge structure, solving the problem of balancing stability and thermal performance in traditional horizontal supporting leg structures. This invention also provides a corresponding fabrication method.

This application provides a detection device, a control method and control unit for the detection device, a lidar system, and a terminal. The detection device includes at least one laser, at least one area array detector, at least one lens assembly, at least one photodetector, and at least one microelectromechanical system (MEMS) micromirror. The lens assembly focuses the reflected light from at least one first laser beam onto the area array detector, with the reflected light from the at least one first laser beam located within the detection range of the lens assembly. The MEMS micromirror reflects the reflected light from at least one second laser beam onto the photodetector, with the reflected light from the at least one second laser beam located within the detection range of the MEMS micromirror. Specifically, the at least one first laser beam and the at least one second laser beam are emitted by at least one laser. The MEMS micromirror and lens assembly in the detection device receive the reflected light from lasers in different areas, achieving long-distance ranging through this dual-range mode.

This invention discloses a wireless, passive, and visualized cerebrospinal fluid drainage tube flow monitoring sensor, system, and fabrication method, belonging to the field of biomedical sensing and microelectromechanical systems (MEMS) technology. It includes a flexible substrate, an interdigital capacitor-open resonant ring structure disposed on the substrate surface, and a microchannel pressure conversion structure bonded to it; the microchannel corresponds vertically to the position of the interdigital capacitor. The pressure generated by the cerebrospinal fluid flow drives the displacement of the liquid metal, modulating the equivalent dielectric constant of the interdigital capacitor and causing a resonant frequency shift. The frequency drift is wirelessly read by an external device, and the flow rate is calculated using an algorithm, achieving passive wireless continuous monitoring. This invention, employing the aforementioned sensor, system, and fabrication method, solves the problems of high infection risk, low accuracy, and inability to continuously monitor existing drainage monitoring methods that rely on manual observation or wired sensors. It has the advantages of high sensitivity, flexible integration, and good safety.

This invention relates to the fields of microelectromechanical systems (MEMS) and new energy technologies, and discloses a piezoelectric energy harvester based on a nonlinear gradient negative Poisson's ratio structure. Its elastic matrix has a fixed end and a free end, with a negative Poisson's ratio structural segment on it. The piezoelectric transducer element is bonded to the surface of the negative Poisson's ratio structural segment via an epoxy resin adhesive layer. The core innovation lies in the nonlinear monotonically decreasing thickness of the elastic matrix from the fixed end to the free end along its length. This change profile is defined by a specific cubic polynomial function, which can accurately approximate the theoretical model of an isostress beam, making the stress distribution on the matrix surface tend to be uniform during vibration. Simultaneously, the lateral expansion characteristics of the negative Poisson's ratio structural segment and the longitudinal stress enhancement effect of the nonlinear thickness synergistically amplify the charge output of the piezoelectric element. This invention significantly improves the utilization efficiency of piezoelectric materials and the power density of the energy harvester, and has the advantages of compact structure, high energy conversion efficiency, and mass production via 3D printing.

Methods and apparatuses disclosed herein use an outward-facing display of an eye-worn device (10) to provide indications (42) to an observer device (120) having line-of-sight to the eye-worn device (10). Example indications (42) include solid colors or patterns, which may or may not use color, serving as authentication symbols. In one or more embodiments, the eye-worn device (10) displays or updates an indication (42) on a responsive basis, as part of authentication procedure. Various display types may be used, with one or more embodiments relying on the use of microelectromechanical system (MEMS) mirrors, and the indications (42) may be provided using visible light or light in other wavelengths.

A method of dicing a semiconductor wafer comprises steps of a) positioning a stencil mask over the semiconductor wafer, with the stencil mask being spaced from the semiconductor wafer by a gap such that the stencil mask does not touch a component arranged on the semiconductor wafer, the stencil mask having an aperture; and b) subsequently etching through the semiconductor wafer by performing a reactive ion etch, wherein the stencil mask controls the etch. The method may allow a wafer to be diced without the use of die attach tape and without need for a cleaning step, and may be useful for dicing wafers bearing microelectromechanical systems. Also provided are a stencil mask and system useful in the method.

The disclosed technology relates generally to switching devices and more particularly to switching devices employing micro-electromechanical system (MEMS) switches. The switching devices can serve as circuit breakers for protecting electrical systems against certain electrical events. The switching devices can be configured to monitor and control one or both the MEMS switches and the electrical systems being protected. The disclosed technology additionally relates to systems including the switching devices and methods of using the switching devices.

This invention relates to the field of materials science, specifically to a method for preparing a high-bonding, ultrahard nanolayered thin film, the film itself, and its applications. The film comprises a Cr / Ti metal bonding layer, a CrTiN intermediate layer, a TiNC transition layer, and an a-C:Ti nanocomposite surface layer sequentially deposited on a substrate surface. The a-C:Ti ultrahard nanolayered thin film prepared by this invention achieves multi-layer stacking at the microscale by controlling the periodic modulation structure of the bonding layer, intermediate layer, and transition layer, effectively suppressing dislocation and crack propagation. Through Ti doping modification and gradient periodic modulation structure design, the internal stress of the film is reduced, improving its bonding strength, wear resistance, and toughness, reducing the risk of coating cracking or peeling, and enhancing the film's service stability. The a-C:Ti ultrahard nanolayered thin film of this invention is particularly suitable for applications such as precision machining tool coatings, surface strengthening of aero-engine gears and bearings, and wear protection of microelectromechanical systems (MEMS).

Methods of fabricating and packaging ohmic microelectromechanical system (MEMS) switch devices can include constructing a switch device on an insulating substrate. The switch device can have contacts composed of a platinum group metal. The methods can also include forming an oxide layer of the platinum group metal on an outer surface of each of the one or more contacts. The methods can also include bonding an insulating cap to the insulating substrate to hermetically seal the switch device. The bonding can occur in an atmosphere having an oxygen proportion in a range of 0.5% to 30%, such that after the switch device has been hermetically sealed within a sealed cavity, the atmosphere within the sealed cavity has an oxygen proportion in a range of 0.5% to 30%. The platinum group metal can be ruthenium, and the oxide layer of the platinum group metal can be ruthenium dioxide.

This application relates to a method and apparatus for determining the outgassing characteristics of internal materials in wafer-level vacuum-packaged devices. The method includes: with the original test sample placed in a temperature test chamber, adjusting the temperature of the test chamber to obtain a first quality factor of the original test sample at each test temperature; wherein the original test sample is a wafer-level vacuum-packaged microelectromechanical system (MEMS) device; with an open-hole test sample placed in a vacuum chamber at a target pressure, adjusting the temperature of the vacuum chamber to obtain a second quality factor of the open-hole test sample at each test temperature; and determining the outgassing characteristics of the internal materials of the original test sample based on the first quality factor of the original test sample at each test temperature and the second quality factor of the open-hole test sample at each test temperature. This method can accurately obtain the outgassing characteristics of internal materials in wafer-level vacuum-packaged devices.

An aircraft recorder system is provided in which a vibration sensor including at least one of a micro-electromechanical systems (MEMS) microphone and a MEMS accelerometer. The system further includes a cockpit voice recorder (CVR) and an active microphone. The active microphone and the vibration sensor each output signals to a signal processor including a subtractor configured to output, to the CVR, a signal that is a result of a subtraction of the signal from the vibration sensor from the signal from the active microphone.

This invention discloses a frame decoupling structure and a MEMS resonant gyroscope incorporating it, belonging to the field of microelectromechanical systems (MEMS) technology. The frame decoupling structure is a centrally symmetric structure, comprising a drive decoupling frame and a detection decoupling frame. The drive decoupling frame is connected to a fixed anchor point via a first elastic support structure with low stiffness in the drive direction and high stiffness in the detection direction, and is connected to a mass block via a second elastic support structure with high stiffness in the drive direction and low stiffness in the detection direction. The detection decoupling frame is connected to the fixed anchor point via a third elastic support structure with low stiffness in the detection direction and high stiffness in the drive direction, and is connected to the mass block via a fourth elastic support structure with high stiffness in the detection direction and low stiffness in the drive direction. This design physically separates the mechanical paths of drive and detection using anisotropic stiffness beams, thereby effectively suppressing orthogonality errors and improving the gyroscope's performance and production yield.

The present application relates to the technical field of piezoelectric thin film material, and particularly relates to a piezoelectric thin film nozzle suitable for a micro-electro-mechanical system and a preparation method thereof. The nozzle comprises a silicon substrate, a composite vibrating membrane layer, a lower electrode, a gradient lanthanum-doped lead zirconate titanate piezoelectric thin film and a ring-shaped upper electrode. The piezoelectric thin film is sequentially provided with a lanthanum-rich bottom layer, a lanthanum-transition middle layer and a lanthanum-depleted surface layer along the thickness direction. Through gradient doping, layered atmosphere heat treatment and full-film three-stage gradient crystallization annealing, residual stress is effectively released, warping deformation and micro-crack propagation are inhibited, and the piezoelectric coefficient is improved. The design of the ring-shaped upper electrode and the center reserved spray hole can stably convert the low stress advantage of the material level into the improvement of the liquid droplet spraying direction precision, volume consistency and long-term stability, thereby solving the problem that the piezoelectric thin film is prone to warping and cracking, and the spraying precision and reliability are difficult to be considered in the prior art.

This disclosure provides a neural microelectrode with temperature control and temperature measurement functions, which can be applied in the field of microelectromechanical systems (MEMS) biosensor technology. The neural microelectrode includes: a substrate including a detection region; a microelectrode array disposed on the substrate and overlapping with the detection region, the microelectrode array being used to measure the electrical signal of a analyte; a temperature control element disposed on the substrate and overlapping with the detection region, used to control the temperature of the detection region; a temperature measurement element disposed on the substrate and overlapping with the detection region, used to measure the temperature of the detection region; and an insulating layer disposed on the microelectrode array, the temperature control element, and the temperature measurement element, covering the microelectrode array, the temperature control element, and the temperature measurement element. This disclosure integrates temperature control and temperature measurement functions with the neural microelectrode, realizing temperature control and temperature measurement of neurons, while simultaneously recording the electrical signals of neurons.

A coplanar waveguide (CPW) structure on a micro-electromechanical system (MEMS) device may comprise a glass device substrate that hosts a MEMS component on a first surface of the glass device substrate. The glass device substrate may have an associated set of metal layers that are used for fabrication of the MEMS component. The CPW structure may further comprise a glass cap having a top metal layer and a bottom metal layer. The CPW structure may further comprise a CPW signal path on the first surface of the glass device substrate, and a CPW ground plane on the first surface of the glass device substrate along a side of the CPW signal path. The CPW ground plane may comprise the bottom metal layer of the glass cap and at least one metal layer of the set of metal layers that are used for fabrication of the at least one MEMS component.

The invention relates to a MEMS (Micro-Electro-Mechanical System) gas sensor combined with the architecture of a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor, in which conventional pixels are replaced by various gas-sensitive two-dimensional (2D) materials. This substitution significantly improves selectivity, enabling the precise identification of each gas thanks to the materials specific reactions to different compounds. The integration of CMOS technology with MEMS systems also allows for fast and efficient data processing, while optimizing energy consumption and costs, making this solution ideal for gas detection in various environments.

The present disclosure relates to deep trenches on a microelectromechanical system wafer for stealth dicing. A die includes a substrate; an insulating layer disposed on the substrate; a device layer disposed on the insulating layer, a microelectromechanical system (MEMS) device is defined within the device layer, the MEMS device having an opening into one or more internal cavities; a shelf surrounding an exterior of the die, the shelf defining a change in cross-sectional width of the die; and a weakened structure region disposed below the shelf and proximate to the exterior of the die. The shelf is disposed at a predefined depth of the die such that the shelf is disposed at the device layer, at the insulating layer, or at the substrate.

A proton exchange membrane fuel cell (PEMFC) comprising a porous membrane element formed from a porous silicon wafer is disclosed, wherein the porosity is at least partially coated with a precious metal. Alternatively, the porous silicon wafer may be sandwiched between sheets of paper, carbon, or graphite impregnated with a precious metal. A separator is constructed using MEMS technology. Additionally, a lithium-ion battery is disclosed having a cathode electrode; an anode electrode formed from a porous silicon substrate, wherein the pore surface of the porous silicon substrate is at least partially coated with a metal silicide; a separator element disposed between the cathode and the anode; and an electrolyte.

A MEMS device for generating sound and / or detecting sound includes a diaphragm that is deflectable along a stroke axis and a MEMS unit. The MEMS unit includes at least one cantilever arm for generating and / or detecting a stroke motion of the diaphragm and which is spaced apart from the diaphragm along the stroke axis such that a cavity is formed between the cantilever arm and the diaphragm. The MEMs unit also includes a stroke structure arranged in the cavity and connected to the diaphragm, and a connecting element that movably connects the cantilever arm to the stroke structure. The connecting element narrows and / or widens in at least one area in the direction of the stroke structure, and / or has at least one recess.

The present specification relates to the technical field of chip packaging, and particularly relates to a chip packaging assembly. A micro-electro-mechanical system (MEMS) die has a pad disposed thereon. The pad is below a top surface of the MEMS die. The top surface is distal from a packaging substrate when the MEMS die is disposed on the packaging substrate. Embodiments of the present specification can reduce packaging thickness.

The application relates to the technical field of micro-electro-mechanical systems, in particular to a MEMS-based ultra-wideband micro-vibration monitoring system and a signal processing method thereof, which comprises the following steps: a MEMS ultra-wideband sensing array module collects the ultra-wideband micro-vibration time domain signals, environmental temperature and humidity and installation attitude data of a measured equipment; an ultra-wideband micro-vibration digital twin construction module constructs an equipment multi-physical field digital twin and outputs multi-physical field simulation data; an ultra-wideband feature fusion intelligent diagnosis core adopts a CNN-Transformer model enhanced by a multi-scale attention mechanism to generate a hierarchical maintenance strategy; a micro-vibration field three-dimensional visualization interaction module constructs an interactive three-dimensional micro-vibration field virtual scene and presents diagnosis results and maintenance strategies; and an edge-cloud collaborative adaptive regulation and control module performs collaborative regulation and control of edge real-time processing and cloud iterative optimization. Therefore, the problems of limited collection range, insufficient processing efficiency and precision and the like in the prior art are solved.

The disclosed technology relates generally to switching devices and more particularly to switching devices employing micro-electromechanical system (MEMS) switches. The switching devices can serve as circuit breakers for protecting electrical systems against certain electrical events. The switching devices can be configured to monitor and control one or both the MEMS switches and the electrical systems being protected. The disclosed technology additionally relates to systems including the switching devices and methods of using the switching devices.

Aspects of the disclosure relate to microelectromechanical systems (MEMS) devices for pressure measurements. In particular, various examples herein describe techniques for limiting a diaphragm displacement of capacitive MEMS transducers to enable high sound pressure level (SPL) measurements. A reduced diaphragm displacement may be achieved by using a cap over the diaphragm of the MEMS transducer to reduce a volume of a back cavity of a MEMS transducer. A smaller back cavity may acoustically load the diaphragm and reduce the diaphragm displacement. Additionally, or alternatively, a reduced diaphragm displacement may also be achieved by stacking multiple MEMS transducers over each other such that the multiple MEMS transducers are in series acoustically.

A MEMS element for moving a mass element of an acoustic transducer for generating and / or receiving acoustic signals. The MEMS element is produced from a substrate. The MEMS element has an actuator element with at least one piezo element, applied to the actuator element, for moving the actuator element in a vertical direction in relation to the main extension plane of the MEMS element. The geometry of the actuator element is defined by a cavity in the substrate. The MEMS element has a connecting element, arranged on the actuator element, for connecting the actuator element to the mass element of the acoustic transducer and for transferring the movement of the actuator element to the mass element. The connecting element has a greater stiffness than the actuator element. The cavity is formed in the substrate so that the substrate forms a depth stop for the actuator element.

This disclosure relates to the field of microelectromechanical systems (MEMS) technology, specifically to a method for fabricating a MEMS micromirror structure and the MEMS micromirror structure itself. The method includes: providing a substrate and forming a protective layer covering a target surface of the substrate; providing a silicon wafer, the back side of which includes a first sacrificial layer for defining a micromirror anchor layer; forming a first patterned photoresist layer covering the first sacrificial layer for defining a back comb layer; forming a back comb layer within the silicon wafer based on the first patterned photoresist layer; etching the silicon wafer based on the first sacrificial layer and the back comb layer to obtain a protrusion located directly below the first sacrificial layer; removing the first sacrificial layer and bonding the top surface of the protrusion to the substrate; forming a mirror electrode on the front side of the thinned silicon wafer and then forming a first patterned mask layer covering the mirror electrode; and etching the silicon wafer at least twice based on the first patterned mask layer to form the MEMS micromirror structure. This method can at least reduce the complexity and cost of the fabrication process and improve product yield and integration.

The disclosure relates to a microelectromechanical system comprising a support and an actuator comprising a drive module comprising: a fixed drive portion, mounted fixedly on the support, and comprising a fixed comb with fingers, and a movable drive portion, mounted movably relative to the support, and comprising a movable comb with fingers, a latching mechanism movable between an initial unlatched configuration and a final latched configuration. The movable comb is arranged facing the fixed comb so that when the latching mechanism is in the initial unlatched configuration, the fingers of the movable comb are not engaged between the fingers of the fixed comb, and when the latching mechanism is in the final latched configuration, the fingers of the movable comb are engaged between the fingers of the fixed comb and the latching mechanism prevents disengagement of the fingers of the movable comb from between the fingers of the fixed comb.