388results about "Piezoelectric/electrostrictive microphones" patented technology

A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a portion of a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and slits defined in the piezoelectric element about the perimeter of the piezoelectric element, the slits defining a plurality of partial anchors securing the piezoelectric element to the support substrate to improve sensitivity of the piezoelectric microelectromechanical system microphone.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

The present disclosure is of a bone conduction microphone. The bone conduction microphone comprises of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, the vibration unit deforms in response to the vibration of the base structure, and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. A resonant frequency of the bone conduction microphone is within a range of 2.5 kHz-4.5 KHz.

The invention relates to the technical field of audio driving, in particular to a driving circuit and method and electronic equipment. The method comprises the following steps: arranging two boosting units at the output end of the power amplifier, respectively receiving two paths of signals with opposite phases output by the power amplifier so as to realize that boosted signals output by the two boosting units are also signals with opposite phases, arranging one boosting unit to be connected with the positive electrode of the piezoelectric ceramic module, and arranging the other boosting unit to be connected with the negative electrode of the piezoelectric ceramic module; and the other boosting unit is connected with the negative electrode of the piezoelectric ceramic module, so that the driving voltage of the piezoelectric ceramic module is increased. The boost unit is simple in structure, occupies a small area of a circuit board, and can be effectively applied to miniaturized electronic equipment.

A piezoelectric sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and extending to an unsupported distal end. An electrode is disposed on or in the proximal portion of the beam and has an outer boundary with a shape substantially corresponding to a contour line of a strain distribution plot for the cantilever beam resulting from a force applied to the cantilever beam.

The invention discloses a laser piston sounder normal vector microphone low-frequency calibration device and method, and solves the technical problems that the calibration frequency range is limited, the model dependence is strong and the environmental noise interference is obvious in a low-frequency band in the existing vector microphone calibration method. The device comprises a piston sounder, a laser interferometer, a vector microphone and a data acquisition system, the piston sounder comprises a piston, an excitation source and a piston cavity, an end cover of the piston cavity is provided with an optical window, and the laser interferometer measures the movement speed and displacement of the piston through the optical window; the vector microphone is hermetically coupled to the piston sounder from the side wall of the piston cavity through the adapter; and electric signal outputs of the laser interferometer and the vector microphone are connected to an input channel of the data acquisition system. The calculation model of the sound pressure and the particle vibration velocity in the piston sounder is clear, does not depend on the type of a piston excitation source, and is high in universality.

A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer. The elastic element (2122) is connected around a side wall of the quality element (2121).

Fabrication and processing of flexible acoustic sensor systems and various configurations of sensor stacks associated therewith are disclosed. In some embodiments, a method for fabrication of a flexible acoustic sensing apparatus may include: obtaining a stack of materials on a glass wafer, the stack of materials including: a thin-film transistor (TFT) component having a flexible substrate; a piezoelectric component on the TFT component, the piezoelectric component configured to, responsive to receipt of an acoustic signal, provide an electrical signal to one or more receiver elements having associated circuitry on the TFT component; and an electrode component on the piezoelectric component, the electrode component including one or more acoustic transmitter elements configured to transmit one or more acoustic signals; performing a laser liftoff (LLO) process to separate the stack of materials from the glass wafer; and implementing at least a portion of the stack of materials with a display component.

Aspects of transducers with feedback transduction are described. One aspect is a transducer system comprising an operational amplifier having an inverting input, a non-inverting input, and an output. The transducer system also includes a piezoelectric microelectromechanical system (MEMS) transducer having a first node and a second node, wherein the first node is coupled to the inverting input of the operational amplifier, and wherein the piezoelectric MEMS transducer is configured to generate an electrical signal across the first node and the second node in response to a signal incident upon the piezoelectric MEMS transducer. The transducer system also includes an attenuator having an input and an output, wherein the input of the attenuator is coupled to the output of the operational amplifier, and wherein the output of the attenuator is coupled to the second node of the piezoelectric MEMS transducer.

The present invention relates to vibration sensor comprising a pressure detecting arrangement for detecting generated pressure variations, wherein the pressure detecting arrangement comprises a MEMS die and a signal processor, wherein the MEMS die comprises a front volume and a MEMS cartridge, and wherein the MEMS die comprises oppositely arranged first and second surfaces; a pressure generating arrangement for generating pressure variations in a coupling volume in response to vibrations of the vibration sensor, wherein the pressure generating arrangement comprises a frame structure comprising an indentation, a suspension member comprising first and second surfaces and a moveable mass secured to at least part of the first or second surfaces of the suspension member; and a PCB comprising a first surface, and a housing secured to the first surface of the PCB using an adhesive, wherein the housing and the first surface of the PCB define, in combination, a volume within which volume the pressure detecting arrangement and the pressure generating arrangement are arranged, wherein the coupling volume is defined by the indentation of the frame structure and at least part of the second surface of the suspension member, and wherein said coupling volume is acoustically connected to the MEMS cartridge of the MEMS die via an acoustical opening in the frame structure, and wherein the first surface of the MEMS die is secured to at least part of the frame structure, and wherein at least part of the second surface of the MEMS die is secured to the first surface of the PCB. The present invention further relates to a hearing device comprising such a vibration sensor, and to use of such a vibration sensor for detecting voice induced vibrations in the skull of a user of a hearing device.

To provide a throat microphone which hardly receives an influence due to a motion of a body of a user.SOLUTION: A throat microphone that is used so as to be wound to a neck of a user, and converts a vibration generated around a throat of the user into an electric signal to output it, comprises: a band-like member that can be wound to the neck of the user; a flat plate member that is attached to the band-like member so as to match a thickness direction; and a sheet-like piezoelectric sensor that is attached to a surface plate part in an inner direction in the flat plate member. When the band-like member is wound to the neck of the user, the band-like member makes the piezoelectric sensor contact to the neck of the user with a pressure, and thus a sensor surface of the piezoelectric sensor is tightly adhered to skin of the user.SELECTED DRAWING: Figure 1

The vibration apparatus may include a vibration generating portion including a first vibration portion and a second vibration portion overlapping the first vibration portion, a first cover member at a first surface of the vibration generating portion, a second cover member at a second surface different from the first surface of the vibration generating portion, and a signal cable including first, second and third signal lines connected to the first vibration portion and the second vibration portion and disposed between the first cover member and the second cover member. An apparatus for vibration may include a passive vibration member and the vibration apparatus.

A set of headphones comprising a digital signal processor, a headphone power management unit (PMU) to provide power to the digital signal microprocessor (DSP), a voice pick-up sensor to detect vibrations at a user's head caused by the user talking, and the DSP to determine where the user's voice audio input is picked up via an array of microphones formed into the set of headphones and wherein, when the DSP does not detect the user's voice audio input at the array of microphones, the DSP executes computer-readable program code of a beamforming module to recalibrate an angle of a voice detection zone at which the array of microphones detect the user's voice. The DSP to further calibrate the beamforming angle of the voice detection zone once the user's voice audio input is detected to meet an amplitude threshold level or a signal to noise level threshold level.

Embodiments of the present application provide a piezoelectric microphone and a manufacturing method therefor, an electronic device and a sound source detection method. The piezoelectric microphone comprises: a substrate provided with a back hole; and a structural layer connected to the substrate and covering one side of the back hole, wherein the structural layer comprises a main body and a cantilever beam, and a gap exists between the cantilever beam and the main body; a piezoelectric layer is arranged on the cantilever beam, and a first electrode and a second electrode are arranged on two sides of the piezoelectric layer, respectively. The embodiments of the present application have the advantages of simple structure and low cost.

A MEMS-based sound producing device has a support structure (S) that surrounds a cavity. At least three flexible cantilevers are attached to the support structure (S) along a respective base side (b1, b2, b3, b4). Each cantilever has side edges (e11, e12; e21, e22; e31, e32; e41, e42) being movable relative to the support structure (S). The flexible cantilevers are arranged over the cavity such that each of them adjoins two neighboring flexible cantilevers along respective side edges. The flexible cantilevers together cover the cavity and each of them is configured to be deflected relative to the support structure (S) in response to a control signal influencing a respective piezoelectric actuator (A1, A2, A3, A4) mechanically linked to the flexible cantilever. A set of links (L1, L2, L3, L4) is arranged between the flexible cantilevers, such that the links (L1, L2, L3, L4) exclusively couple the side edges (e11, e21; e22, e32; e31, e41; e42, e12) of two neighboring flexible cantilevers mechanically to one another.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

The present invention relates to a smartphone recorder. The smartphone recorder according to an embodiment of the present invention comprises: a case body comprising a front cover attachable to / detachable from the rear surface of a smartphone and a rear case which is coupled to the rear portion of the front cover and has an accommodation space therein; a magnet which attaches the front cover to the rear surface of the smartphone by using magnetism; an input unit which receives an input of speech information during making a call via the smartphone; and a recording portion which records the speech information input to the input unit.

A piezoelectric microelectromechanical systems device can include a cavity bounded by walls and an asymmetrical bimorph structure at least partially spanning the cavity that includes at least a piezoelectric layer and two electrode layers. The electrode layers can have relative thicknesses configured to compensate for expected temperature stress in the bimorph structure. Thus, metals having different thicknesses can be positioned and configured to compensate deflection due to thermal stress of any or all of the piezoelectric layer, the first metal layer, and second metal layer and a substrate. A method for making the piezoelectric microelectromechanical systems device is also provided.

A method and apparatus for monitoring vehicle window vibrations for voice command recognition are disclosed. An exemplary vehicle includes a vehicle window; an exterior panel; a vibration sensor coupled to the vehicle window to detect audio vibrations; an audio actuator coupled to the exterior panel to vibrate the exterior panel; and a controller. The controller is configured to detect a voice command from a user via the vibration sensor, identify an audio response based on the voice command, and transmit the audio response to the user via the audio actuator.

An electrical current generating device having a sound wave force magnifying structure in the form of a force transmission pin which is longitudinally slidable within a body bore and having a proximal end of a large area for receiving sound wave forces, and having a greatly reduced area distal end which bears on a piezoelectric element.

The present application provides a sound capture method applied to a microphone. The microphone comprises a laser self-mixing device and a diaphragm device, the diaphragm device comprises a membrane configured to respond to sound vibration, and the laser self-mixing device and the diaphragm device are separately configured to detect the vibration of the membrane. In the method, a first voltage signal is obtained using the laser self-mixing device, and a second voltage signal is simultaneously obtained using the diaphragm device. If the first voltage signal is equal to or less than a preset threshold, the first voltage signal is converted into an audio signal, or if the first voltage signal is greater than a preset threshold, the second voltage signal is converted into an audio signal. According to the method of the present application, the audio signal may be collected in two different manners, so that the switching between the two signals is realized using a preset threshold, and the more consistent signal is selected and converted into an audio signal. This can ensure the quality of the audio signal. The present application further relates to a microphone and an electronic device.

The application discloses a piezoelectric sensing unit, a piezoelectric microphone and a terminal. The piezoelectric sensing unit comprises a base, an auxiliary layer, a center film, a piezoelectric film and a plurality of cantilevers. The base has a cavity extending along a first direction, and the cavity forms a polygonal opening on a first surface of the base, the polygonal opening having adjacent first and second sides. The auxiliary layer is formed on the first surface of the base, and the auxiliary layer comprises a first auxiliary part located in a region adjacent to the first side of the first surface. The cantilevers are connected to the sides of the polygonal opening one by one, and each cantilever comprises a first end part and a second end part, the first end part is connected to the first auxiliary part, and the connection point of the first end part and the first auxiliary part is located on one side of the first auxiliary part close to the second side. The cantilever extends along the extension direction of the second side. The second end part of each cantilever is connected to the center film. In the scheme, the length of the cantilever is relatively long, which is beneficial to improving the signal-to-noise ratio of the piezoelectric microphone.

The embodiments of the present disclosure provide a sensor device, including: a sensor assembly with a first resonant frequency and a sound pickup assembly configured to communicate with an external sound of the sensor device through a sound inlet, wherein an acoustic cavity may be formed between the sound pickup assembly and the sensor assembly, when the sound pickup assembly vibrates in response to an air conduction sound transmitted through the sound inlet, vibrations of the sound pickup assembly may change a sound pressure in the acoustic cavity, and the sensor assembly may convert the air conduction sound into an electrical signal based on changes of the sound pressure in the acoustic cavity, wherein the sound pickup assembly may provide the sensor device with a second resonant frequency, and a difference between the second resonant frequency and the first resonant frequency may be in a range of 1000 Hz-10000 Hz.

The application provides a combined beam microphone, belonging to the field of piezoelectric microphones, which comprises a substrate, a circular recess is formed on the upper surface of the substrate, a cavity is formed in the recess, and the cavity is located directly below the recess; a center diaphragm is arranged in the recess and located at the center of the recess; transition beams are arranged at intervals around the center diaphragm and connected to the center diaphragm, and first gaps are formed between adjacent transition beams; fixed beams are arranged at intervals around the center diaphragm, and the two ends of the fixed beams along the radial direction of the recess are connected to the inner wall of the recess and the transition beams respectively; cantilever beams are arranged between adjacent fixed beams and connected to the transition beams, and second gaps are formed between the cantilever beams, the inner wall of the recess and the fixed beams. By changing the structure of the beams in the microphone, increasing the number of fixed beams and the combination form between the beams, increasing the area of the high stress concentration region, and combining the reasonable layout of the center diaphragm, the transition beams, the fixed beams and the cantilever beams, the stress distribution is more uniform, and the effective utilization rate of the diaphragm area is improved.

A transducer (10A) is provided with: a substrate (20) that contains silicon; and a piezoelectric element (30) that is disposed on the substrate (20). The substrate (20) has: a film body (21) having a first surface (21a) and a second surface (21b) that face one another from opposite directions in a thickness direction; and a frame body (22) that surrounds the film body (21) when viewing the film body (21) from the thickness direction. The piezoelectric element (30) is disposed on the first surface (21a) of the film body (21). A portion of an outer edge (21c) of the film body (21) when viewed from the thickness direction forms a connected part (21d) that is connected to the frame body (22), and the remainder of the outer edge (21c) aside from the connected part (21d) is separated from the frame body (22). The substrate (20) has a projecting part (24) that projects in the thickness direction from a region, of the second surface (21b), that includes at least a portion of the remainder of the outer edge (21c).

The invention provides a piezoelectric element, a piezoelectric device, and a method for manufacturing the piezoelectric element. Wherein the plurality of vibration regions (22) are separated from each other by slits (41), and the slits (41) are formed in a state in which the vibration regions (22) constitute a tapered portion (42) in which the width becomes narrower from one surface (22a) of the vibration regions (22) on the opposite side to the support body (10) toward the other surface (22b) of the vibration regions (22) on the opposite side to the one surface (22a). The electrode film (60) is disposed further toward the inside than the slit (41) in the normal direction to the one surface (22a), and an angle ([theta] 1) formed by a side surface (22c) constituting the tapered portion (42) in the vibration region (22) and surfaces (22b, Sv) parallel to the one surface (22a) is 39-81 DEG.