9results about How to "Improve electrical connection reliability" patented technology

The invention relates to a rotating shaft assembly, a grounding part and electronic equipment, the rotating shaft assembly comprises a rotating shaft and the grounding part, the grounding part is arranged between the rotating shaft and a rotating shaft back cover in the electronic equipment and is electrically connected with the rotating shaft back cover and the rotating shaft to form a grounding circuit, and the grounding part comprises a voltage limiting element. When the voltage in the grounding circuit is greater than or equal to a first threshold value of the voltage limiting element, the voltage limiting element conducts the grounding circuit; when the voltage in the grounding circuit is smaller than the first threshold value of the voltage limiting element, the voltage limiting element disconnects the grounding circuit. The rotating shaft assembly is simple in structure, easy to manufacture and low in cost, the ESD grounding requirement of the rotating shaft back cover and the daily use requirement of a user can be met at the same time, the service life of a metal appearance part outside the electronic equipment is prolonged, and the use safety of the electronic equipment is improved.

The utility model discloses a kind of photosensitive chip packaging structures, including circuit board, fixed filling adhesive layer, CIS photosensitive chip, support adhesive layer, wrapping filling adhesive layer, optical filter and multiple pads.CIS photosensitive chip is fixed on the top of circuit board by fixed filling adhesive layer, and the photosensitive area is jointly constituted by the support adhesive layer of setting in its outer edge and the top optical filter Sealing chip inner cavity;Photosensitive chip and circuit board are connected by multiple gold wires, and are packaged by wrapping filling adhesive layer to prevent gold wire exposure, improve structural stability.The utility model structure is packaged by optimization, effectively prevent gold wire fracture, and by reducing chip inner cavity volume, reduce the risk of fogging caused by air thermal expansion, to improve the stability and imaging reliability of photosensitive chip, applicable to the image acquisition equipment of higher imaging quality requirement.

The utility model discloses a kind of multi-grade adjustment rotary switches, including base, shell cover, rotating handle and contact assembly, rotating handle rotationally arranged between base and shell cover, and drive rod extending along its radial direction is provided;Contact assembly includes the multiple elastic structure's moving contact bridge of the shaft center of rotating handle as center annularly arranged in installation cavity, and multiple static contact pieces are arranged in base and respectively opposite multiple moving contact bridges, multiple moving contact bridges are connected and respectively located on the movement path of drive rod, drive rod respectively drives multiple moving contact bridges and multiple static contact pieces contact in rotating handle rotating process, by the mechanism of the wheel contact formed by drive rod and multiple moving contact bridges, operation pressure is significantly dispersed, avoid single moving contact bridge sustained stress, greatly reduce the mechanical load and fatigue degree of moving contact bridge, reduce the probability of heating, reduce wear and risk of fusion welding, extend mechanical service life.

This application provides a bump packaging structure and method, relating to the field of semiconductor packaging technology. The bump packaging structure includes a chip with pads, a buffer layer, and a wiring layer. Multiple spaced first conductive pillars are provided on the pads, and the first conductive pillars are electrically connected to the pads. The buffer layer covers the multiple first conductive pillars, and the wiring layer is connected to the buffer layer, which is electrically connected to at least one of the first conductive pillars and the pads. The buffer layer can absorb stress in the wiring layer, preventing structural delamination and breakage, and improving conductivity and structural reliability.

The invention relates to the technical field of vehicle accessory devices and vehicle safety auxiliary devices, in particular to a storage backpack at the tail of an automobile and an automobile tail door with a storage function, which comprises a shell with an open back, a lining arranged on the inner side of the shell, a brake lamp and a rear camera, first annular waterproof foam is arranged on the portion, close to the open side of the back face, of the side wall of the lining, the lining is sleeved with the shell, the shell and the lining are connected to form a storage backpack, the first annular waterproof foam is used for sealing an assembly gap between the shell and the lining, the lining is provided with a storage cavity, and the storage cavity is communicated with the shell. The opening of the storage cavity faces the open side of the back face of the shell, on the basis that the tail storage function is guaranteed, reasonable integrated arrangement of the brake lamp and the rear camera is achieved, and the function integration level and waterproof reliability of the whole machine and the working stability of electric devices are improved.

The utility model discloses a semiconductor device and electrical equipment, the semiconductor device comprises a substrate, a pin frame and a plastic package body, a first main surface of the substrate is provided with a fan inversion bonding pad part, a compressor inversion bonding pad part, a power bonding pad part and a rectification bonding pad part, and the plastic package body packages at least a part of the substrate and a part of the pin frame; the radiator is arranged on the second main surface side and is in heat conduction connection with at least part of the plastic package body and / or at least part of the substrate, a containing cavity is defined between the radiator and the substrate, and the projection of the containing cavity in the direction perpendicular to the first main surface at least partially coincides with the power bonding pad part, or at least partially coincides with the rectification bonding pad part, or at least partially coincides with the rectification bonding pad part. At least partially overlapping a region between the power pad portion and the rectification pad portion; the temperature detector is located in the containing cavity. The temperature detector does not occupy the space of the first main surface of the substrate, thereby facilitating the reduction of the size of the substrate, and improving the temperature detection accuracy of the temperature detector.

The embodiment of the utility model belongs to the display technology, and provides a display device which can comprise a backboard, a mainboard and a grounding elastic piece. The mainboard is arranged on the backboard. The grounding elastic piece is arranged on the mainboard and electrically connected with the mainboard, the grounding elastic piece is provided with a free part, and the free part is configured to be connected with the backboard so that the mainboard can be electrically connected with the backboard. The display device can solve the problem that the connection reliability of a grounding structure in the related art is low.

The utility model discloses a semiconductor device and electrical equipment, the semiconductor device comprises a substrate, a pin frame and a plastic package body, a first main surface of the substrate is provided with a fan inversion bonding pad part, a compressor inversion bonding pad part, a power bonding pad part and a rectification bonding pad part, and the plastic package body packages at least a part of the substrate and a part of the pin frame; the radiator is arranged on the second main surface side and is in heat conduction connection with at least part of the plastic package body and / or at least part of the substrate, a containing cavity is defined between the radiator and the substrate, and the projection of the containing cavity in the direction perpendicular to the first main surface at least partially coincides with the fan inversion bonding pad part, or at least partially coincides with the compressor inversion bonding pad part, or at least partially coincides with the compressor inversion bonding pad part. At least part of the inverter pad part is overlapped with an area between the fan inverter pad part and the compressor inverter pad part; the temperature detector is located in the containing cavity. The temperature detector does not occupy the space of the first main surface of the substrate, thereby facilitating the reduction of the size of the substrate, and improving the temperature detection accuracy of the temperature detector.

The invention provides a horizontal rotary connector, and relates to the technical field of electronic connectors, the horizontal rotary connector comprises a fixed disc, the inner side of the fixed disc is provided with a plurality of concentrically sleeved metal rings, annular grooves are formed between adjacent metal rings, and the outer side of the fixed disc is provided with first terminal pieces integrally formed with the metal rings; one side, facing the metal ring, of the movable disc is provided with a plurality of second terminal pieces, and each second terminal piece is of an integrally formed structure and comprises a first welding leg, a first connecting end extending to the lower part of the outer side of the metal ring from the first welding leg, and a feeler protruding upwards from the first connecting end and in sliding contact with the peripheral surface of the metal ring; traditional male and female plugging is changed into sliding contact between the movable disc antenna and the outer peripheral face of the fixed disc metal ring, the contact area and the fitting degree are increased, instant disconnection or resistance sudden change caused by frequent stretching or external force shaking is effectively avoided, and therefore the electric connection reliability is remarkably improved, and the stability of power supply and signal transmission is guaranteed.