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234results about How to "Improve electrical connection reliability" patented technology

Electrical junction box having an inspection section of a slit width of a tuning fork-like terminal

A tuning fork-like terminal is accommodated in a terminal-containing section. The tuning fork-like terminal is provided on the central end with a slit adapted to receive a tab being connected. Clamping portions are projected from the opposed surfaces of the slit to pinch the tab between the clamping portions. A slit gage is inserted into a rectangular terminal hole formed in an end of the terminal-containing section to inspect a slit width between the clamping portions of the tuning fork-like terminal. A wide hole portion is formed in the rectangular terminal hole at the insertion position of the slit gage. The wide hole portion is formed by widening a length of a short side of the rectangular terminal hole. The central position of the slit in the tuning fork-like terminal and the central position of the slit gage coincide with each other, even if the tuning fork-like terminal is maximally shifted from the central position in the terminal-containing section, whereby the slit width can be precisely inspected to precisely inspect a slit width in a tuning fork-like terminal accommodated in a terminal-containing section of an electrical junction box.
Owner:SUMITOMO WIRING SYST LTD

Micro optical probe of endoscope

ActiveCN102401995AImmune to environmental factorsAchieve high volumeSurgeryDiagnostic recording/measuringOptomechatronicsEndoscope
The invention discloses a micro optical probe of endoscope, which comprises an MEMS microscope, a circuit board, a self focusing optical assembly, a locating bottom plate and a housing; the micro optical probe of endoscope is characterized in that: the endoscope probe is designed by using integrated symmetrical structure, the MEMS microscope; the circuit board and the self focusing optical assembly are assembled on the locating bottom plate according to design requirements of optomechatronics to form a probe body, and a probe housing is formed by injection molding or casting and is tightly connected with the probe body. The housing opposite to the microscope surface of the MEMS microscope can be formed with an optical window, or the housing material is transparent to the used light. The probe housing is formed at a time by injection molding / casting technology, and this structure can protect the MEMS microscope from being influenced with environment factor and can bear a certain vibration impact and random shock; the sealed probe can work in various liquid environments; and large-batch and low-cost processing production of probes can be realized, and the aim of disposable probes will be fulfilled.
Owner:无锡微文半导体科技有限公司

Laminated wiring board and manufacturing method for same

A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are formed in via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom; an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors; an embedding member arranged around the electronic components so that the electronic component is embedded therein; and a second substrate having an adhesive layer laminated to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member, wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.
Owner:THE FUJIKURA CABLE WORKS LTD

Method for crimping terminal to aluminum electric wire

In order to promote the adhesion of a crimp terminal (10) to an aluminum electric wire (100) by virtue of crimping to thereby realize an improvement in electric connecting performance, the thickness of tin plating applied to an inner surface of a conductor crimping portion (13) of the crimp terminal (10) is set to be in the range from 2.1 μm to 5.0 μm, and then, the conductor crimping portion (13) is crimped to a conductor (100a) of the aluminum electric wire (100).
Owner:YAZAKI CORP

Polymer Particles, Conductive Particles, and an Anisotropic Conductive Packaging Materials Containing the Same

Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.
Owner:KUKDO ADVANCED MATERIALS CO LTD

Battery fuse-containing box

A fuse-containing box is formed by placing a battery fuse and a bus bar connected to a terminal of the battery fuse on a supporting plate and by mounting a lower case and an upper case on the supporting plate. The fuse-containing box is mounted on an upper surface of a battery. A battery terminal to be fixedly fitted on a battery post projecting from the upper surface of the battery is fastened to the bus bar to electrically connect the battery fuse and the battery to each other. The lower case and the upper case are formed from a polypropylene-based resin. The supporting plate on which the battery fuse and the bus bar are mounted is formed from a heat-resistant nylon-based resin.
Owner:SUMITOMO WIRING SYST LTD

Camera module

A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.
Owner:SHINKO ELECTRIC IND CO LTD

Manufacturing method of semiconductor device, semiconductor device, and electronic device

In a method for manufacturing a semiconductor device having a plate-shaped member, a semiconductor element, and a wiring board, the manufacturing method for the semiconductor device includes: a concave portion forming step (S101) of the plate-shaped member; a semiconductor element provisionally adhering step (S102) for provisionally adhering the semiconductor element to a portion located in the vicinity of a first corner portion of a concave portion; a semiconductor element aligning step (S103) for aligning the semiconductor element based upon thermal expansion of a semiconductor element depressing member; a resin molding step (S104) of the plate-shaped member; an electrode pad exposing step (S105) for exposing an electrode pad by grinding the plate-shaped member; and a wiring board stacking step (S106) for stacking layers by directly connecting the exposed electrode pad to the wiring layer on the ground plane of the plate-shaped member.
Owner:SHINKO ELECTRIC IND CO LTD

Module having built-in electronic component and method for manufacturing such module

An electronic component embedded module that can improve reliability of electric connection of inner vias, and a manufacturing method therefor are provided. A first electronic component (11) is embedded in a second electrical insulating layer (13) and connected electrically to a first wiring pattern (14) through first inner vias (16) that penetrate a first electrical insulating layer (12). The first wiring pattern (14) and a second wiring pattern (15) are connected electrically to each other through second inner vias (17) that penetrate the first electrical insulating layer (12) and third inner vias (18) that penetrate the second electrical insulating layer (13). The second inner vias (17) and the third inner vias (18) are arranged continuously.
Owner:PANASONIC CORP

Three-dimensional semiconductor device

A three-dimensional semiconductor device includes: a substrate having a cell array region and a contact region; a stacked structure including a plurality of electrodes and a plurality of electrode isolation insulating layers, which are alternately stacked on the substrate in a vertical direction, and having a stepwise structure on the contact region; vertical structures penetrating the stacked structure in the cell array region, each of the vertical structures constituting a cell string; and word line contact plugs, each penetrating an uppermost electrode among the plurality of electrodes in aregion of each of tread portions of the stacked structure having the stepwise structure, being connected to another electrode under the penetrated uppermost electrode, and being electrically insulated from the penetrated uppermost electrode.
Owner:SAMSUNG ELECTRONICS CO LTD

Method for manufacturing three-dimensional through hole interconnection structure based on molten glass skeleton

The invention discloses a method for manufacturing a three-dimensional through hole interconnection structure based on a molten glass skeleton, and relates to the interconnection technology of silicon through holes. Grooves are etched in a silicon layer, and silicon columns are formed. A screen printing plate with a pattern is made to align at the etched pattern of the silicon layer. Glass powder is arranged on the screen printing plate. The glass powder is extruded in the vertical direction to be filled into the grooves, and the screen printing plate is moved away. The glass powder on the surfaces of the tops of the silicon columns is removed. The silicon layer filled with the glass powder is heated and molten, no bubble exists inside the silicon layer, a molten glass structure is obtained after cooling, the silicon layer of the obtained molten glass structure is arranged in etching liquid, the remaining molten glass structure on the surfaces of the tops of the silicon columns is removed by the adoption of the wet etching technology, and the molten glass skeleton inside the grooves is obtained. By the adoption of the mechanical lapping mode, the lower portion of the silicon layer is machined in a thinned mode until the bottoms of the silicon columns are exposed out of the lower portion of the silicon layer, then, lapping damage is repaired by the adoption of the chemical mechanical polishing mode, and therefore the three-dimensional through hole interconnection structure based on the molten glass skeleton is obtained.
Owner:XIAMEN UNIV

Insulation displacement contact and electric connector using the same

An insulation displacement contact includes a pair of insulation displacement blades and a pair of resilient contact pieces. The pair of insulation displacement blades are opposite to each other with their bases connected to each other such that there is formed, by their inner sides, a slot for receiving an insulated wire of which core wire portion is covered with an insulation. The pair of insulation displacement blades are arranged such that when the insulated wire is inserted into the slot, the insulation is cut and the core wire portion comes in press-contact with the insulation displacement blades. Each of the pair of resilient contact pieces is made of a plate member which is connected to the outer side of each insulation displacement blade, which extends toward the side opposite of the inlet of the slot up to a position exceeding the base of each insulation displacement blade, which has a contact portion for holding or nipping a mating contact at a position opposite of the slot inlet with respect to the base of each insulation displacement blade, and which has, between the connection portion connected to the outer side of each insulation displacement blade and the contact portion, a tapering portion of which width is gradually narrowed in the direction toward the contact portion.
Owner:JST MFG CO LTD

Electrical connecting module

An electrical connecting module includes a first electrical connector, and a second electrical connector, both being coaxially fittable into each other. The first electrical connector includes a first housing, and a contact terminal housed in a terminal space formed in the first housing. The second electrical connector includes a second housing and a cylindrical terminal fixed in the second housing, the cylindrical terminal being fabricated by joining opposite ends of an electrically conductive sheet to each other in a manner such that the sheet defines a circular cross-section. The contact terminal includes an elastic contact piece contacting an inner surface of the cylindrical terminal. Each of the housings includes a positioning section for causing the elastic contact piece to contact the cylindrical terminal at the inner surface other than an area through which the opposite ends of the electrically conductive sheet are joined to each other.
Owner:DAIICHI SEIKO CO LTD

Connector and a connecting structure of circuit boards therewith

A connector and a connecting structure of circuit boards therewith is provided, which includes: a first circuit board; a second circuit board orthogonally arranged relative to the first circuit board; a terminal having first and second contact portions for the respective first and second circuit boards; and a housing to accommodate the terminal. An engaging member for attaching the housing to the first circuit board projects from the housing, and the first contact portion projects in a same direction as the engaging member. The engaging member is longitudinally movable at an engaging portion provided on the first circuit board. The engaging member is pivotable. The housing consists of a pair of housings turnable about a hinge, and a second contact portion of the terminal is accommodated between the housings. A groove as a positioning portion for a housing is provided. The housing consists of a fixed-side housing having the engaging member for the first circuit board and a moving-side housing movable relative to the fixed-side housing, and the terminal is accommodated in the moving-side housing. A shaft portion is provided on either one of the fixed-side housing and the moving-side housing, and a shaft engaging portion to movably engage the shaft portion is provided on the other of the fixed-side housing and the moving-side housing. A moving-side housing engaging portion is provided on the first circuit board, and an engaging portion for the moving-side housing engaging portion is provided on the moving-side housing.
Owner:YAZAKI CORP

Insulated conductive particles and anisotropic conductive adhesive film containing the particles

An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.
Owner:KUKDO ADVANCED MATERIALS CO LTD

Ultrathin semiconductor chip packaging structure and manufacturing process thereof

The invention discloses an ultrathin semiconductor chip packaging structure, wherein double-layer leads are adopted for packaging a chip with a weld pad in double-row arrangement, and the two paths of leads do not mutually interfere, thereby further improving the reliability of electric connection; meanwhile, compared with the prior art, a single-side polymer is adopted for replacing the glass on the back surface of an original chip, a glass-silicon-polymer structure is adopted, the packaging thickness is further thinned, and the thickness can be reduced from the original 0.9mm to 0.5mm when in practical application, thereby greatly reducing the packaging volume of a semiconductor chip.
Owner:CHINA WAFER LEVEL CSP
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