231results about How to "Improve electrical connection reliability" patented technology

A tuning fork-like terminal is accommodated in a terminal-containing section. The tuning fork-like terminal is provided on the central end with a slit adapted to receive a tab being connected. Clamping portions are projected from the opposed surfaces of the slit to pinch the tab between the clamping portions. A slit gage is inserted into a rectangular terminal hole formed in an end of the terminal-containing section to inspect a slit width between the clamping portions of the tuning fork-like terminal. A wide hole portion is formed in the rectangular terminal hole at the insertion position of the slit gage. The wide hole portion is formed by widening a length of a short side of the rectangular terminal hole. The central position of the slit in the tuning fork-like terminal and the central position of the slit gage coincide with each other, even if the tuning fork-like terminal is maximally shifted from the central position in the terminal-containing section, whereby the slit width can be precisely inspected to precisely inspect a slit width in a tuning fork-like terminal accommodated in a terminal-containing section of an electrical junction box.

A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are formed in via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom; an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors; an embedding member arranged around the electronic components so that the electronic component is embedded therein; and a second substrate having an adhesive layer laminated to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member, wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.

In order to promote the adhesion of a crimp terminal (10) to an aluminum electric wire (100) by virtue of crimping to thereby realize an improvement in electric connecting performance, the thickness of tin plating applied to an inner surface of a conductor crimping portion (13) of the crimp terminal (10) is set to be in the range from 2.1 μm to 5.0 μm, and then, the conductor crimping portion (13) is crimped to a conductor (100a) of the aluminum electric wire (100).

A fuse-containing box is formed by placing a battery fuse and a bus bar connected to a terminal of the battery fuse on a supporting plate and by mounting a lower case and an upper case on the supporting plate. The fuse-containing box is mounted on an upper surface of a battery. A battery terminal to be fixedly fitted on a battery post projecting from the upper surface of the battery is fastened to the bus bar to electrically connect the battery fuse and the battery to each other. The lower case and the upper case are formed from a polypropylene-based resin. The supporting plate on which the battery fuse and the bus bar are mounted is formed from a heat-resistant nylon-based resin.

A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.

An electric connector includes a first housing including a guide shaft and a second housing including a guide hole into which the guide shaft is inserted, the guide shaft including a main body, and a projection radially projecting from the main body, the guide hole being formed at an inner surface thereof with a groove into which the projection is fit, the projection and the groove being formed such that a first imaginary line intersects with a second imaginary line, the first imaginary line being defined by extending a contact plane at which the projection and the groove make contact with each other when the first housing rotates relative to the second housing, towards a center of the main body, the second imaginary line being defined as a line bisecting a top surface of the projection and extending towards a center of the main body.

In a method for manufacturing a semiconductor device having a plate-shaped member, a semiconductor element, and a wiring board, the manufacturing method for the semiconductor device includes: a concave portion forming step (S101) of the plate-shaped member; a semiconductor element provisionally adhering step (S102) for provisionally adhering the semiconductor element to a portion located in the vicinity of a first corner portion of a concave portion; a semiconductor element aligning step (S103) for aligning the semiconductor element based upon thermal expansion of a semiconductor element depressing member; a resin molding step (S104) of the plate-shaped member; an electrode pad exposing step (S105) for exposing an electrode pad by grinding the plate-shaped member; and a wiring board stacking step (S106) for stacking layers by directly connecting the exposed electrode pad to the wiring layer on the ground plane of the plate-shaped member.

A thin-film common mode filter is provided, comprising: a pair of magnetic plates; upper/lower coil conductors formed between the magnetic plates, spirally wound in the magnetic plate surface direction, overlapped each other; upper/lower lead conductors one ends of which are connected electrically to one ends in centers of the upper/lower coil conductors, respectively, extended to external portions across these coil conductors; an upper/lower lead drawing terminals to which the other ends of the upper/lower lead conductors are connected, respectively; an upper/lower coil drawing terminals to which the other ends of the upper/lower coil conductors are connected, respectively; and each of the lower lead/coil drawing terminals and the upper coil/lead drawing terminals having a structure where at least two of conductor layers to be patterned into the upper/lower lead conductors and the upper/lower coil conductors are stacked, and brought into conduction with each other.

Disclosed is a flux activator that comprises a compound with a condensed polycyclic oxazine skeleton.

A three-dimensional semiconductor device includes: a substrate having a cell array region and a contact region; a stacked structure including a plurality of electrodes and a plurality of electrode isolation insulating layers, which are alternately stacked on the substrate in a vertical direction, and having a stepwise structure on the contact region; vertical structures penetrating the stacked structure in the cell array region, each of the vertical structures constituting a cell string; and word line contact plugs, each penetrating an uppermost electrode among the plurality of electrodes in aregion of each of tread portions of the stacked structure having the stepwise structure, being connected to another electrode under the penetrated uppermost electrode, and being electrically insulated from the penetrated uppermost electrode.

The switch includes a base body side connector and a movable body side connector for connecting electrical circuits provided in a base body side and a movable body side of a motor vehicle. One of the base body side connector and the movable body side connector has a receptacle terminal while the other has a pin tab terminal. The other connector has a terminal cover piece for receiving an electrical contact portion provided in a free end side of the pin tab terminal. The terminal cover piece is slidable in engagement and disengage directions of the terminals. The terminal cover piece is urged by a resilient member parallel to an extended direction of the pin tab terminal. The resilient member is positioned between a flange of the terminal cover piece and a bottom surface of a housing of the movable body side connector.

The invention discloses a method for manufacturing a three-dimensional through hole interconnection structure based on a molten glass skeleton, and relates to the interconnection technology of silicon through holes. Grooves are etched in a silicon layer, and silicon columns are formed. A screen printing plate with a pattern is made to align at the etched pattern of the silicon layer. Glass powder is arranged on the screen printing plate. The glass powder is extruded in the vertical direction to be filled into the grooves, and the screen printing plate is moved away. The glass powder on the surfaces of the tops of the silicon columns is removed. The silicon layer filled with the glass powder is heated and molten, no bubble exists inside the silicon layer, a molten glass structure is obtained after cooling, the silicon layer of the obtained molten glass structure is arranged in etching liquid, the remaining molten glass structure on the surfaces of the tops of the silicon columns is removed by the adoption of the wet etching technology, and the molten glass skeleton inside the grooves is obtained. By the adoption of the mechanical lapping mode, the lower portion of the silicon layer is machined in a thinned mode until the bottoms of the silicon columns are exposed out of the lower portion of the silicon layer, then, lapping damage is repaired by the adoption of the chemical mechanical polishing mode, and therefore the three-dimensional through hole interconnection structure based on the molten glass skeleton is obtained.

An electrical connecting module includes a first electrical connector, and a second electrical connector, both being coaxially fittable into each other. The first electrical connector includes a first housing, and a contact terminal housed in a terminal space formed in the first housing. The second electrical connector includes a second housing and a cylindrical terminal fixed in the second housing, the cylindrical terminal being fabricated by joining opposite ends of an electrically conductive sheet to each other in a manner such that the sheet defines a circular cross-section. The contact terminal includes an elastic contact piece contacting an inner surface of the cylindrical terminal. Each of the housings includes a positioning section for causing the elastic contact piece to contact the cylindrical terminal at the inner surface other than an area through which the opposite ends of the electrically conductive sheet are joined to each other.

An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.

A connector includes: a first connector body having a plurality of first lead terminals soldered onto a first wiring board; a second connector body having a plurality of second lead terminals soldered onto a second wiring board; a screw member; and a fastening member engageable to the screw member. The first connector body and the second connector body are engaged with each other to bring the first lead terminals and the second lead terminals into contact such that the first lead terminals and the second terminals electrically connect the first wiring board to the second wiring board. The first and second wiring boards and the first and second connector bodies are integrally fastened together by engaging the screw member to the fastening member.