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388results about How to "Avoid contact" patented technology

Air indirect cooling refrigerator and temperature control method thereof

The invention provides a temperature control method of an air indirect cooling refrigerator. The temperature control method includes steps of A, dividing n equal parts between upper limit voltage V1 and lower limit voltage Vn+1 according to the preset value n to acquire n+1 voltage values V1 to Vn+1, and acquiring upper limit temperature Tu and lower limit temperature Td according to preset temperature Ts of a refrigerating chamber and preset difference temperature delta T; B, detecting current temperature Tc of the refrigerating chamber, comparing the Tc with the Td, starting counting, and setting a counting initial value as 0; C, respectively applying V1 or Vn+1 to a first fan within a preset time period if Tc is larger than or equal to Tu or if Tc is smaller than Td, setting a counting value as 0, and returning to the step B; and D, applying voltage Vx+2 to the first fan within a preset time period if Tu is larger than Tc and Tc is larger than or equal to Td, and simultaneously adding 1 to x which is a current counting value. By the aid of the method, a fluctuation range of temperature of the refrigerating chamber is small, and preservation capacity is improved. The invention further provides the air indirect cooling refrigerator. The refrigerator prevents humidity loss of the refrigerating chamber.
Owner:HEFEI MIDEA REFRIGERATOR CO LTD +1

Preparation method of rare earth complex crystal boundary modification sintered neodymium-iron-boron magnetic body

The invention discloses a preparation method of a rare earth complex crystal boundary modification sintered neodymium-iron-boron magnetic body. The preparation method comprises the following steps of: preparing neodymium-iron-boron alloy particles, smashing the neodymium-iron-boron alloy particles into powder and injecting an antioxidant; ejecting mixed liquid of a rare earth complex and petroleum into neodymium-iron-boron powder in a spraying manner and mixing uniformly; and pressing the mixture into a blank magnetic body in magnetic aligning and sintering. In the preparation method, the mixture of the rare earth complex and the petroleum is added in the spraying manner, so that contact of the particles with oxygen can be effectively prevented, the oxygen absorption in the magnetic body preparing process is lowered, and the magnetic performance of the sintered magnetic body is enhanced. The rare earth complex is added and a rare earth product left by the decomposition of the sintered rare earth complex is mainly positioned at a crystal boundary, so that the prepared sintered neodymium-iron-boron magnetic body has a higher coercive force value and a lower temperature coefficient compared with the conventional sintered neodymium-iron-boron magnetic body. Moreover, the preparation method has a simple process, is easy to operate, and is suitable for batch production.
Owner:浙江凯文磁业有限公司

Deep ultraviolet LED packaging structure and manufacturing method thereof

The invention provides a deep ultraviolet LED packaging structure and a manufacturing method thereof. The packaging structure comprises a deep ultraviolet LED chip and a bracket, an antireflection layer, a light-transmitting insulating layer and a light-transmitting cover plate, wherein the bracket has a downward concave hollow cavity with an upward opening; the inner bottom wall of the hollow cavity comprises a first coating region attached with a first metal layer and a second coating region attached with a second metal layer; the first coating region and the second coating region are arranged at intervals with different electrical properties; the deep ultraviolet LED chip stretches across between the first metal layer and the second metal layer; the antireflection layer is attached to the surface of the deep ultraviolet LED chip; the light-transmitting insulating layer is attached to regions, not in contact with the deep ultraviolet LED chip, on the outer surfaces of the first metallayer and the second metal layer; and the light-transmitting cover plate covers the opening of the bracket. By virtue of the deep ultraviolet LED packaging structure, occurrence of oxidization and corrosion phenomena of the metal material caused by exposure at a high temperature can be reduced; and in addition, a total reflection phenomenon of the LED chip light emitting surface caused by high material interface refractive index difference can be relieved.
Owner:MAANSHAN JASON SEMICON CO LTD
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