The present invention provides a conductive
adhesive agent capable of being diluted with a
solvent to give good
coating workability and allowing formation of a conductive joint excellent in both
thermal conductivity and electrical
conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive
adhesive agent according to the present invention is a conductive
adhesive agent wherein, based on 100 parts by weight of silver
powder having an average particle
diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle
diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of
solvent for adjustment of a
fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in
thermal conductivity and electrical
conductivity is achieved.