5 results about "Positive type" patented technology

The invention relates to an onium salt, a chemically amplified resist composition and a pattern forming method. The present invention addresses the problem of providing, in optical lithography using energy rays, high sensitivity and excellent resolution regardless of the positive type or the negative type, whereby lithography performance such as LWR of a line pattern and CDU, EL, and DOF of a hole pattern can be improved, and photolithographic performance can be improved. The present invention relates to an onium salt for use in a chemically amplified resist composition, a chemically amplified resist composition, and a pattern forming method, and more particularly, to a chemically amplified resist composition and a pattern forming method. [Solution] An onium salt represented by formula (1).

This invention discloses a method for extending the shelf life of polyamic ester (PAE) solutions during the manufacturing of positive-type photosensitive polyimide (PSPI) precursor resins. With the addition of certain acids within a specified loading range to the reaction solution after the acetal esterification reaction, the shelf of the PAE solution can be significantly increased by decreasing the rate of imidization. The acid additive may consume part or all of the impurities generated from the acetal esterification reaction, which improves the stability of the PAE polymer. This invention substantially improves the feasibility and manufacturing cost of positive-type PSPI precursor polymers.

Provided is a thick film chemically amplified positive type resist composition. A thick film chemically amplified positive type resist composition comprising an alkali-soluble resin (A) having a certain structure, a photoacid generator (B), and a solvent (C).

To provide a positive type photosensitive resin composition which enables formation of a thick film pattern with high accuracy.SOLUTION: A positive type photosensitive resin composition contains a hydrophobic resin (A), an alkali-soluble resin (B), a quinonediazide compound (C), and a fluorine-based surfactant (D). When the positive type photosensitive resin composition is applied so that a film thickness after prebaking is 3±0.3 μm, and prebaked at 125°C for 120 seconds to form a film, then exposed under a condition of 30 mJ / cm2, and developed with 2.38 mass% of a tetramethylammonium hydroxide aqueous solution at a temperature of 23°C, a dissolution speed of a coating surface layer is lower than a dissolution speed of the whole film. The dissolution speed of the coating film surface layer is an average dissolution speed when the film surface layer is dissolved until the film thickness of the film become 80%, and the dissolution speed of the whole film is an average dissolution speed when the film is dissolved until the film thickness of the film becomes 30%.SELECTED DRAWING: Figure 1

To provide an onium salt used for a chemically amplified resist composition which has high sensitivity, excels in resolution, improves lithography performance such as EL, LWR, CDU, and DOF, and can suppress collapse of a resist pattern in photolithography using high energy rays regardless of a positive type or a negative type, and to provide a chemically amplified resist composition and a pattern forming method.SOLUTION: An onium salt having the formula (1): Herein Xq - is an anion. However, the acid (XqH) having Xq - as a conjugate base has a boiling point of less than 165 °C. and a molecular weight of 150 or less. ) SELECTED DRAWING: None