Positive Photosensitive Resin Composition

A technology of photosensitive resin and composition, applied in optics, opto-mechanical equipment, instruments, etc., can solve the problems of insufficient storage stability and low sensitivity, and achieve the effects of excellent sensitivity stability and excellent adhesion

Active Publication Date: 2011-12-21
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The conventionally known photosensitive resin composition mentioned above can improve the adhesiveness with the substrat

Method used

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  • Positive Photosensitive Resin Composition
  • Positive Photosensitive Resin Composition
  • Positive Photosensitive Resin Composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0092]Examples and the like are given below to illustrate the present invention, but the present invention is not limited to these examples. In addition, the evaluation of the positive photosensitive resin composition in an Example was performed by the following method.

[0093] (1) Storage stability evaluation of sensitivity

[0094] Preparation of photosensitive resin film

[0095] A positive-type photosensitive resin composition (hereinafter referred to as varnish) is coated on a 6-inch silicon wafer so that the film thickness after prebaking is 8 μm, and then a hot plate (coating and developing device Mark- 7) It prebaked at 120 degreeC for 3 minutes, and obtained the photosensitive resin film.

[0096] Film Thickness Measuring Method

[0097] Using Lambda Ace STM-602 manufactured by Dainippon Screen Manufacturing Co., Ltd., the film after prebaking and development was measured with a refractive index of 1.629, and the cure film was measured with a refractive index of 1...

Synthetic example 1

[0110] Synthesis Example 1 Synthesis of an acid anhydride (a) having a hydroxyl group

[0111] Under a stream of dry nitrogen, 18.3 g (0.05 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF) and 34.2 g (0.3 mol) of allyl glycidyl ether were dissolved in 100g of γ-butyrolactone (GBL), cooled to -15°C. 22.1 g (0.11 mol) of trimellitic anhydride acid chloride dissolved in 50 g of GBL was dropped therein so that the temperature of the reaction liquid did not exceed 0°C. After completion of dripping, it was made to react at 0 degreeC for 4 hours. This solution was concentrated with a rotary evaporator and poured into 1 L of toluene to obtain an acid anhydride (a) having a hydroxyl group represented by the following formula.

[0112]

Synthetic example 2

[0113] Synthesis Example 2 Synthesis of diamine compound (b) having a hydroxyl group

[0114] 18.3 g (0.05 mol) of BAHF was dissolved in 100 mL of acetone and 17.4 g (0.3 mol) of propylene oxide, and cooled to -15°C. 20.4 g (0.11 mol) of 3-nitrobenzoyl chloride dissolved in 100 mL of acetone was added dropwise thereto. After completion|finish of dripping, it was made to react at -15 degreeC for 4 hours, and it returned to room temperature after that. The precipitated white solid was filtered and vacuum-dried at 50°C.

[0115] Put 30g of solid into a 300mL stainless steel autoclave, disperse it in 250mL of methyl cellosolve, and add 2g of 5% palladium-carbon. Hydrogen is introduced into it with a balloon, and the reduction reaction is carried out at room temperature. After about 2 hours, it was confirmed that the balloon was no longer deflated, and the reaction was terminated. After completion of the reaction, the catalyst palladium compound was removed by filtration, and c...

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Abstract

Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350°C or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.

Description

technical field [0001] The invention relates to a positive photosensitive resin composition. More specifically, the present invention relates to a positive-type photosensitive resin suitable for use as a surface protection film of a semiconductor element, an interlayer insulating film, an insulating layer of an organic field-to-light-emitting element, etc., and the exposed part dissolves in an alkaline developer. combination. Background technique [0002] Since heat-resistant resins such as polyimide and polybenzoxazole have excellent heat resistance and electrical insulation, they can be used for surface protection films of semiconductor devices such as LSI (Large Scale integration; large scale integration), interlayer insulating film, etc. With the miniaturization of semiconductor elements, the resolution of several μm is also required for surface protection films, interlayer insulating films, and the like. Therefore, in the above use, a positive-type photosensitive pol...

Claims

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Application Information

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IPC IPC(8): G03F7/023C08G73/10C08G73/22G03F7/075H01L21/027
CPCG03F7/0751C08G73/10C08L79/04C08L79/08C08G73/22C08K5/5425C08K5/5435G03F7/0233C08K5/29C08L63/00G03F7/022G03F7/039
Inventor 宫部伦次藤田阳二
Owner TORAY IND INC
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