Heat-curable resin composition

A resin composition, thermosetting technology, applied in the field of thermosetting resin composition

Active Publication Date: 2017-08-01
THREE BOND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, cyanate resin reacts under low temperature storage when acid components such as phenol are added, so there is a problem of storage stability when acid components are used as catalysts, etc.

Method used

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  • Heat-curable resin composition
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  • Heat-curable resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0094] Embodiments of the present invention are exemplified below.

[0095] 1. A thermosetting resin composition containing the following (A) to (D) components, and relative to the total of the following (A) component, the following (B) component, and the following (D) component, containing 10 to 45% by mass of the following (D) component,

[0096] (A) component: epoxy resin;

[0097] (B) component: cyanate resin;

[0098] (C) component: curing agent;

[0099] (D) component: the polyol compound whose viscosity in 25 degreeC atmosphere is 50000 mPa*s or less.

[0100] 2. The thermosetting resin composition as described in said 1 further containing an organic filler as (E) component.

[0101] 3. The thermosetting resin composition according to 1 or 2 above, wherein the component (C) includes a curing agent comprising a modified amine compound and a phenolic resin of the component (C1) below, and ( C2) A curing agent made of a modified amine compound and a phenolic resin,

...

Embodiment 1～13、 comparative example 1～5

[0119] In order to prepare the thermosetting resin composition of Examples 1-13 and Comparative Examples 1-5, the following components were prepared (Hereinafter, a thermosetting resin composition is also simply called a composition).

[0120] (A) component: epoxy resin

[0121] ・Bisphenol A type and F type mixed epoxy resin (EXA-835LV DIC Co., Ltd.) (hereinafter referred to as EP.)

[0122] (B) Component: Cyanate resin

[0123] ・1,1-bis(4-cyanatophenyl)ethane (hereinafter referred to as CY.)

[0124] (C) Component: curing agent

[0125] ・Preparation of the first curing agent made of modified amine compound and phenolic resin containing the component (C1): put 130 g of N,N-dimethylaminopropylamine in the flask, keep it at 80°C, Secondary addition of bisphenol A type epoxy resin (EP-4100E manufactured by ADEKA Co., Ltd., epoxy equivalent 190) 213g ([bisphenol A type epoxy resin relative to the epoxy equivalent of 1 mole of N,N-dimethylaminopropylamine 1.12]). After adding ...

Embodiment 7～13、 comparative example 5

[0174] In order to prepare the composition of Examples 7-13 and the comparative example 5, after stirring the said (A) component, (B) component, and (D) component (or (D') component) for 15 minutes, add (E) component, Stir for a further 15 minutes. Finally, (C)component was added, and it stirred for 30 minutes. The detailed preparation amount is according to Table 3, and all numerical values ​​are expressed in parts by mass.

[0175] table 3

[0176]

[0177]

[0178] Regarding the compositions of Examples 1, 7 to 13 and Comparative Examples 4 and 5, 90° C. curing time measurement, peel resistance confirmation, and flexibility confirmation were performed. The results are summarized in Table 4 below.

[0179] [Confirmation of peel resistance]

[0180] On an aluminum plate (A1050P) of width 25 mm x length 100 mm x thickness 0.5 mm, the composition was applied so as to be width 10 mm x length 30 mm x thickness 1 mm. Then, the composition was left to stand for 1 hour in...

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Abstract

To provide a heat-curable resin composition which is rapid-curing while having excellent storage stability, peeling resistance and bendability, and which makes it possible to fix neodymium magnets in a stable manner, even after durability testing. A heat-curable resin composition containing components (A) to (D) below, wherein the content of component (D) with respect to the total of components (A), (B) and (D) falls within the range of 10-45 mass%. Component (A): epoxy resin. Component (B): cyanate ester resin. Component (C): hardener. Component (D): polyol compound having a viscosity not exceeding 50000mPa.s in an atmosphere of 25 DEG C.

Description

technical field [0001] The present invention relates to a thermosetting resin composition which has rapid curing properties and is suitable for fixing a neodymium magnet. Background technique [0002] In recent years, neodymium magnets have been widely used in various fields such as electric / electronic fields and automotive fields due to their strong magnetic properties. It can be used as the drive part of the hard disk drive in the electronic equipment and as the engine part of the hybrid car for vehicle. Normally, magnets expand when heated and contract when cooled, but neodymium magnets instead contract when heated and expand when cooled. In order to fix the neodymium magnets, adhesives, sealants, etc. are used, but in the high-temperature storage test (100°C atmosphere), low-temperature storage test (0°C or -40°C atmosphere), thermal shock test (0°C atmosphere for 1 hour) of the assembled parts In durability tests such as a 1-hour cycle at 100°C atmosphere) and a therm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/56C08G59/62C08L25/04C08L33/08C08L33/10C08L63/00
CPCC08G59/56C08G59/62C08L25/04C08L33/08C08L33/10C08L63/00
Inventor 坂本宽树长田诚之井上学小岛一宏
Owner THREE BOND CO LTD
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