354 results about "Cyanate" patented technology

Advantageous aqueous mixed salt systems viscosified with water-soluble or water-dispersable polymers which are superior to corresponding single salt systems of similar densities are provided. The mixed salt systems comprise water; a water-soluble or water-dispersable polymer capable of viscosifying an aqueous medium; one or more cations including a member selected from the group consisting of lithium, sodium, potassium, cesium, magnesium, calcium, zinc, or mixtures thereof; and one or more anions including a member selected from the group consisting of chloride, bromide, iodide, formate, nitrate, acetate, cyanate, thiocyanate, a zinc complex anion or mixtures thereof; there being present either at least two cations or at least two anions. Inventive viscosified mixed salt systems display-under such stressing factors as aging, heat, mechanical agitation, and shear-greater stability compared to the single salt systems of similar densities. Also provided are methods for making viscosified mixed salt systems and methods for advantageously using the same as drilling, drill-in, completion, hydraulic fracturing, work-over, packer, well treating, testing, spacer, or hole abandonment fluids.

The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy.

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150C.

A transparent, non elastomeric, high index, impact resistant polythiourethane/urea material comprising the reaction product of: a) at least one (alpha, omega)-diiso(thio)cyanate cycloaliphatic or aromatic prepolymer having a number average molecular weight ranging from 100 to 3000 gmol-1, and b) at least one primary diamine, in an equivalent molar ratio amine function/iso(thio)cyanate function from 0.5 to 2, preferably from 0.90 to 1.10, wherein, said prepolymer and diamine are free from disulfide (-S-S-) linkage and at least one of the prepolymer or the diamine contains one or more S atoms in its chain.

The invention discloses a thermosetting resin composition which is characterized by comprising the following components in parts by weight: 10-65 parts of alkyl modified bismaleimide resin prepolymer, 5-60 parts of composite cyanate resin and 5-65 parts of halogen-free epoxy resin, wherein the total weight of the resins is 100 parts; the alkyl modified bismaleimide resin prepolymer is obtained byreacting a bismaleimide resin with a diallyl compound for 20-120 minutes at the temperature of 110-160 DEG C and then cooling; and the weight ratio of bismaleimide resin to diallyl compound is 100: (15-120). A prepreg and a laminated board can be prepared by using the composition. The composition, the prepreg and the laminated board have the characteristics of good manufacturability, halogen-free inflaming retardance, excellent humidity resistance and heat resistance, low thermal expansion coefficient and low dielectric constant and dielectric loss, and are suitable for the fields of integrated circuit package, high-frequency, high-speed and high-density interconnection and the like.

The invention discloses a composite metal salt catalyst for a hydrochlorination reaction of acetylene, belonging to the technical field of catalysts. The composite metal salt catalyst takes gold as active metal, and the reduction deactivation of the composite metal salt catalyst is reduced by reducing reduction potential of metal through a complexing action of a thiocyanate radical or a cyanate radical. Carbon deposition in a reaction process is restrained by introducing one or more of potassium, cerium and lanthanum elements. The composite metal salt catalyst is loaded on active carbon or carbon nanometer pipe with the specific surface area of not less than 100m<2>*g<-1>, wherein the mass fraction of a gold load is 0.05-0.50%, the mass fraction of a copper load is 0.1-5.0%, and the mass fraction of the potassium/cerium/lanthanum load is 0.1-5.0%. In a reaction for preparing vinyl chloride, composite salt of gold and copper has excellent activity, selectivity and stability; furthermore, one or two of cerium and lanthanum are added to a catalyst so as to be capable of effectively restraining the carbon deposition and catalyzing a hydrochlorination process of the acetylene in low cost and high efficiency.

A low-free radical TDI polyurethane curing agent, its production and product are disclosed. The process is carried out by putting tolylene-diisoester cyanate, solvent S and catalyst A into reactor, adding into antioxidant and long-chain alcohol, agitating in reactor, heating, keeping temperature, inspecting NCO value, adding into phase-transferring solvent X while reaching NCO value to 20-40%, adding into catalyst B till reaching NCO value to 10-15, adding into inhibitor to stop reaction, adding into solvent S, decreasing pressure, distilling and removing phase-transferring solvent X. It's cheap and convenient.

A cyanate-bimaleimide resin adhesive and a preparation method belong to the adhesive field, solving the problems of poor heat resistance, low dielectric property and poor adhesive property of current high-temperature adhesives. The adhesive of the invention is prepared by a cyanate ester resin, a bismaleimide resin, an internally toughened phenolic resin, an epoxy resin and a catalyst. The preparation method is as follows: 1. carrying out pre-reaction on the epoxy resin and the internally toughened phenolic resin to obtain a prepolymer resin B; 2. carrying out pre-reaction on the cyanate, the bimaleimide and the catalyst to obtain a prepolymer C; 3. carrying out pre-reaction on the prepolymer C and the prepolymer B to prepare the adhesive of the invention. The prepared adhesive has reasonable formulation, good heat resistance, dielectric property, adhesive property and curing process property, can be used for adhesion of high-temperature resistance composite materials with high dielectric property and used as a matrix resin, and is simple in method and easy operation.

The present invention discloses a phenol-formaldehyde cyanate resin. It provides its chemical formula and synthesis method, and ablative composite material formed from the the above-mentioned phenol-formaldehyde cyanate resin.

The invention relates to a cyanate resin for hot-melt prepregs and a preparation method thereof, belonging to the technical field of hot-melt prepregs. The cyanate resin is composed of 60-95 parts of modified cyanate resin and 5-40 parts of toughener. The cyanate resin for hot-melt prepregs has the advantages of simple technique and no solvent volatilization, and is suitable for industrial production. A hot-melt process can be adopted to prepare the prepreg. The prepreg has favorable manufacturability and long storage period. The prepared cyanate resin fiber composite material has the advantages of higher comprehensive mechanical properties, favorable heat resistance and favorable radiation resistance, can widely satisfy the requirements for high-performance aerospace structure materials, and has favorable application prospects.

The invention discloses a high-performance wave transmitting composite material based on PBO (poly-p-phenylene benzobisthiazole) fiber and a preparation method of the composite material. The preparation method comprises the steps of: preparing epoxy-modified cyanate resin prepolymer from PBO fiber as a reinforcing material and modified bisphenol A type cyanate resin as a substrate through a heating fusion method, wherein the used cyanate resin contains an epoxy modifier; and adding an organic solvent to prepare liquid glue, immersing and winding treated PBO fiber, obtaining a prepreg after solvent is volatilized, paving the prepreg in a mold, and preparing the PBO fiber-reinforced cyanate composite material by a high-temperature pressure molding method. The high-performance wave transmitting composite material has the advantages of high strength, high modulus, low density, excellent high-temperature resistance and dielectric properties, excellent molding process property and the like.

The invention discloses a beneficiation reagent, a synthesis method and a method for comprehensively utilizing generated waste gases. The beneficiation reagent is formed by solid-phase synthesis of inorganic or organic raw materials and comprises the following raw materials in parts by weight: 300 to 700 parts of a nitrogen-containing compound, 500 to 800 parts of chlorine salt, 400 to 650 parts of carbonate, 80 to 160 parts of strong alkali, 50 to 500 parts of cyanide complex double salt, 0 to 300 parts of cyanate, 5 to 20 parts of potassium sulfide, 50 to 200 parts of carbon and 0 to 100 parts of lime nitrogen. The beneficiation reagent is prepared by the following steps: mixing the raw materials uniformly; adding the mixed raw materials into a reaction kettle; quickly heating to 500 to 1,200 DEG C; maintaining high temperature for 1 to 2 hours; and cooling and crushing to obtain the product. Ammonia gas and carbon dioxide generated in a synthesis process are absorbed by a sodium sulfate solution to generate byproducts sodium carbonate and ammonium sulfate. The invention has the advantages of low production cost, simple operation, low toxicity and easy control. The product can be widely applied to leaching of noble metals such as gold oxide ores and silver oxide ores, floatation inhibitors and metal heat treatment and electroplating industries.

The present invention relates to an adhesive resin composition for fabrication of circuit boards and its use. The adhesive resin composition of the present invention includes a cyanate ester resin, a fluorine-based resin powder dispersed in the cyanate ester resin, and a rubber component and has low dielectric constant and low dielectric loss factor, which enables the fabrication of circuit boards with further enhanced electrical characteristics.

The invention relates to hybrid pre-polymers and polymers produced by converting difunctional, oligofunctional and/or polyfunctional cyanates and/or pre-polymers thereof with monomer, oligomer and/or polymer silazanes. The polymers are duromers having high glass transition temperature and very high fracture toughness from the respective cyanate output materials. They can be dissolved in a pre-polymerized state in solvents and are therefore suitable as impregnating resins for prepregs, for example. In addition, they can be processed to moulded articles. The fire characteristics thereof are particularly exceptional.

A. new compound, a high temperature POSS-dianiline is provided. It is a composition of nanoparticles, which can be incorporated into polymers such as polyimides, polyamides, cyanate esters, and epoxies, for improved properties and performance of such polymers.

A process is described for preparing 3-phenyl(thio)uracils or 3-phenyldithiouracils of the formula I, by reacting a phenyl iso(thio)cyanate of the formula II with an enamine of the formula III and, if appropriate, in a further step, the resulting 3-phenyl(thio)uracil or 3-phenyldithiouracil of the formula I where R¹=R^1a, when R¹=hydrogen, is reacted with an aminating agent of the formula IV to give 3-phenyl(thio)uracils or 3-phenyldithiouracils of the formula I where R¹=amino

where the variables R¹, R^1a, R², R³, R⁴, X¹, X², X³, Ar, A and L1 are each as defined in claim 1.

The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.

Chemical mechanical polishing (CMP) compositions for polishing tungsten or tungsten-containing substrates comprise an abrasive, at least one solid catalyst, a chemical additive selected from the groups consisting of piperazine derivatives, salts of cyanate, and combinations thereof; and a liquid carrier. Systems and processes use the aqueous formulations for polishing tungsten or tungsten-containing substrates.

The invention relates to a cyanate resin composition, and a prepreg, laminated board, metal foil clad laminated board and printed circuit board prepared from the same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin disclosed as Formula (I) and a maleimide compound (C). The cyanate resin composition, and the prepreg, laminated board, metal foil clad laminated board and printed circuit board prepared from the cyanate resin composition have the advantages of favorable moisture resistance, favorable heat resistance, high flame retardancy, high reliability and low planar thermal expansion coefficient, and is suitable for substrate materials for manufacturing high-density printed circuit boards.

The invention discloses a cyanic acid ester resin composition and a preparation method thereof. The cyanic acid ester resin composition provided by the invention comprises a modifier and a tetramethyl bisphenol F-typed cyanic acid ester preformed polymer, wherein, the modifier comprises bisphenol E-typed cyanic acid ester. The electrical property and the heat resistance property of modified cyanic acid ester resin composition are very superior and the modified cyanic acid ester resin composition is liquid at normal temperature, thus being capable of being applied to winding or RTM forming technology and having excellent manufacturability.

The invention discloses an aluminum oxide composite material which graphene-oxide-coated aluminum oxide particles, an allyl phenolic compound modified bismaleimide-cyanate composite and a curing agent. The aluminum oxide surface is coated with the graphene oxide laminae and the allyl phenolic compound modified bismaleimide-cyanate composite, and the graphene oxide and the allyl phenolic compound modified bismaleimide-cyanate composite have high interaction force, thereby enhancing the interfacial interaction, lowering the interface resistance and reducing the cluster phenomenon. Compared with the traditional aluminum oxide composite material, the aluminum oxide composite material disclosed by the invention can not easily produce the cluster phenomenon. The invention also discloses a preparation method of the aluminum oxide composite material and a copper clad base plate using the aluminum oxide composite material.