Halogen-free resin composition and method for manufacturing prepreg and laminated board by using halogen-free resin composition

A technology of resin composition and manufacturing method, which is applied in the field of manufacturing prepregs, laminates for printed circuits, and halogen-free resin compositions, can solve the problems of loss of dielectric properties of cyanate resin, etc., and achieve low dielectric loss factor and excellent resistance. Effect of flammability, high glass transition temperature

Inactive Publication Date: 2014-07-23
ZHEJIANG WAZAM NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with cyanate ester, the resin composition has a certain improvement in toughness and moisture resistance, but greatly loses the dielectric properties of cyanate resin, and the resin system is a halogen system.

Method used

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  • Halogen-free resin composition and method for manufacturing prepreg and laminated board by using halogen-free resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Take 25 parts of dicyclopentadiene (DCPD) type epoxy resin (XD-1000, Nippon Kayaku), 20 parts of phosphorus-containing epoxy resin (XZ92530, DOW), bisphenol A type cyanate resin (BA-3000S, Lonza) 45 parts, anhydride curing agent (SMA EF40, Sartomer) 10 parts, benzoxazine (XTW8291, Huntsman Advanced Materials) 15 parts, 2-methylimidazole (Shikoku Chemicals) 0.08 parts, carboxyl-terminated nitrile rubber (1072CG, Zeon Corporation) 5 parts, spherical silica (SFP-30M, DENKA) 40 parts, the solid content of the resin composition was adjusted to 40wt% with butanone solvent.

[0028] The thermosetting resin composition is impregnated and coated on E-type glass cloth (2116, unit weight 104g / m 2 ) and baked in an oven at 170°C for 4 minutes to obtain a prepreg with a resin content of 50%.

[0029] Put the prepared prepreg with a resin content of 50%, put a piece of copper foil on the upper and lower sides, and press it in a vacuum hot press to obtain a copper-clad laminate. The...

Embodiment 2

[0032] Take 50 parts of biphenyl type epoxy resin (NC-3000, Nippon Kayaku), 30 parts of bisphenol A type cyanate resin (CY-1, Jiangdu Wuqiao Resin Factory), 12 parts of anhydride curing agent (SMA EF40, Sartomer) 40 parts, benzoxazine (XTW8291, Huntsman Advanced Materials) 40 parts, 2-ethyl-4-methylimidazole (Shikoku Chemical) 0.12 parts, core-shell rubber (Fortegra351, Dow Chemical) 3 parts, hypophosphorous acid 5 parts of aluminum (OP935, Clariant, Germany), 50 parts of fused silica powder (Lianyungang Donghai silica powder), 20 parts of boehmite (BS100, Hehe lime), and adjust the solid content of the resin composition to 60wt% with butanone solvent .

[0033] The preparation methods of the prepreg and the copper-clad laminate are the same as in Example 1.

[0034] The properties of copper clad laminates are shown in Table 1.

Embodiment 3

[0036] Take 30 parts of dicyclopentadiene (DCPD) type epoxy resin (XD-1000, Nippon Kayaku), 10 parts of phosphorus-containing epoxy resin (XZ92530, DOW), dicyclopentadiene type cyanate resin (CY-3 , Jiangdu Wuqiao Resin Factory) 50 parts, anhydride curing agent (SMA EF60, Sartomer) 15 parts, benzoxazine (XTW8291, Huntsman Advanced Materials) 20 parts, 2-ethyl-4-methylimidazole (Shikoku Chemicals ) 0.06 parts, rubber modified epoxy resin (EponResin58005, Hexion Specialty Chemicals, Inc.) 10 parts, PX-200 (Japan Daihachi Chemical) 6 parts, spherical silica (SFP-30M, DENKA) 50 parts, with The butanone solvent adjusted the solid content of the resin composition to 50wt%.

[0037] The preparation methods of the prepreg and the copper-clad laminate are the same as in Example 1.

[0038] The properties of copper clad laminates are shown in Table 1.

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Abstract

The present invention discloses a halogen-free resin composition and a method for manufacturing a prepreg and a laminated board by using the halogen-free resin composition. The halogen-free resin composition is prepared by dispersing the following components in an organic solvent, wherein the components comprise, by weight, 10-100 parts of a halogen-free epoxy resin, 10-80 parts of cyanate, 10-70 parts of an anhydride curing agent, 10-100 parts of a benzoxazine resin, 0.01-1.0 part of a curing accelerator, 1-15 parts of a toughening agent, 0-50 parts of a fire retardation agent, and 0-100 parts of an inorganic filler, and the solid content of the halogen-free resin composition is 30-70 wt%. The prepared prepreg and the copper foil-clad laminated board have characteristics of good heat resistance, high glass-transition temperature, low water absorption rate, excellent fire retardation, low dielectric constant and low dielectric loss factor.

Description

technical field [0001] The invention belongs to the field of polymer composite material manufacturing, and in particular relates to a halogen-free resin composition and a method for manufacturing a prepreg and a printed circuit laminate using the halogen-free resin composition. Background technique [0002] In recent years, with the rapid development of cloud computing and mobile Internet, the transmission capacity of signals is getting larger and faster, and the transmission speed is getting faster and faster, and the signal processing frequency is developing towards high frequency. The dielectric constant (Dk) and dielectric loss factor (Df) of the circuit substrate have a great influence on the signal transmission of the end product. High Dk will slow down the signal transmission rate, and high Df will convert part of the electromagnetic energy of the signal into heat energy. The loss is in the substrate material and has a greater impact on the transmission of high-freque...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04B32B27/04B32B27/18B32B15/092H05K1/03
Inventor 沈宗华潘锦平董辉姜欢欢虞德坤
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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