93 results about "Thermal isolation" patented technology

The application provides a MEMS differential thermal analysis sensor and a DTA / DSC testing method, the sensor comprising a detection thermocouple, a reference thermocouple, an ambient resistance and a shielding ring, wherein the detection thermocouple and the reference thermocouple each comprise a single crystal silicon substrate, a heat insulation cavity, a plurality of single crystal silicon thermocouple pairs and a supporting film, the heat insulation cavity is located in the single crystal silicon substrate, the plurality of single crystal silicon thermocouple pairs are connected in series and are supported by the supporting film to be suspended above the heat insulation cavity to achieve thermal isolation, and the single crystal silicon thermocouple pair comprises an N-type single crystal silicon thermocouple and a P-type single crystal silicon thermocouple connected in series, the temperature and power sensitivity of the sensor are significantly improved, reach 28 mV / K and 100 V / W, and the noise equivalent temperature difference and the noise equivalent power reach 0.5 mK or 0.2 muW. Based on the output signal of the sensor, differential thermal analysis testing and differential scanning calorimetry testing on physical or chemical processes of material heat absorption and release can be realized, the sample consumption is small, and the testing precision is high.

This utility model discloses a high-temperature resistant cooling circulation structure for a fluoroplastic magnetic pump, specifically relating to the field of magnetic pumps. It includes a base, pump body, pump cover, connecting frame, isolation sleeve, inner magnetic rotor, outer magnetic rotor, motor, and impeller. The isolation sleeve, inner magnetic rotor, and outer magnetic rotor are all housed inside the connecting frame. The high-temperature resistant cooling circulation structure of this fluoroplastic magnetic pump features a spiral cooling channel inside the isolation sleeve. The coolant flows directly through the core area of ​​the heat source, rapidly absorbing heat transferred by magnetic eddy currents and high-temperature media through forced convection, thus improving cooling efficiency and effectively blocking heat transfer to the outer magnetic rotor, preventing permanent magnets from demagnetizing and failing due to high temperatures. Copper-nickel alloy heat-conducting fins are welded to the inner wall of the isolation sleeve, combined with a layer of thermally conductive silicone grease, accelerating the conduction of heat from the inner magnetic rotor to the cooling channel. A vacuum cavity is provided between the spiral cooling channel and the outer wall of the isolation sleeve to suppress heat conduction to the outer magnetic rotor, achieving double thermal isolation.

A nanoscale temperature detector comprising a diamond sensing probe (1) having a lateral dimension of at least 200 nanometers and having a sensing tip (2) with a radius of curvature (R) of less than 100 nanometers, less than 10 nanometers or less than 1 nanometer and a plurality of color centers (5) showing temperature sensitive features in the emission count rate. The diamond sensing probe (1) has a lateral dimension of at least 200 nanometers and is connected to a detector system (13) by a mounting structure (6). A thermal isolation barrier (3) thermally separates the sensing probe (1) from the detector system (13).

The invention provides a phase change display array control structure based on thermal isolation. The phase change display array control structure comprises a phase change display pixel unit, an electric insulation heat conduction layer, a pixelated heating electrode, a thermal through hole structure, a thermal isolation dielectric layer and an addressing cross electrode layer. Non-conduction type thermal excitation is achieved through the electric insulation heat conduction layer, transverse diffusion of heat is limited through the thermal isolation dielectric layer, and thermal crosstalk is reduced. The pixelated heating electrode is combined with the thermal through hole structure and the addressing cross electrode layer to form a longitudinally-conducted addressing control path, and the pixel-level thermal response control precision is optimized; the electric insulation heat conduction layer is made of a high-heat-conductivity material so as to accelerate the crystallization process of the phase change material; and the thermal isolation dielectric layer is made of a low-thermal-conductivity insulating material and is used for improving the pixel resolution capability. The liquid crystal display device is compact in structure, efficient in performance and suitable for being applied to high-resolution, low-power-consumption and fast-response phase change display devices.

The invention provides a three-dimensional vertical structure phase change memory and a preparation method thereof. The preparation method comprises the following steps: forming a word line structure in a stacking structure on a substrate; symmetrical sunken structures are formed in the electrode layer of the word line structure; forming a gate layer in the recessed structure; filling an insulating medium, and forming a through hole structure in the insulating medium at two sides of the word line structure; sequentially forming an insertion layer and a phase change layer on the outer side of the gating layer; and forming a top electrode layer in the through hole structure. Aiming at the bottleneck of a laminated hole etching process, through hole processing is carried out on an insulating medium, so that the etching difficulty is reduced; the insulating medium forms a thermal isolation groove at the periphery of the storage unit to block a thermal diffusion path, so that the thermal crosstalk of adjacent units is reduced, and the data storage reliability is improved; the storage density is doubled by optimizing the position of the bit line circuit and the efficient arrangement of the multiple layers of storage units. According to the method, an efficient solution is provided for high-density nonvolatile storage requirements in the fields of artificial intelligence, cloud computing and the like.

The invention provides a two-stage correction device which can be applied to the technical field of mask deformation correction. The device comprises a first movable assembly and a second movable assembly, wherein one end of the first movable assembly can move in a first direction; the second movable assembly comprises a thermal isolation layer and an amplification assembly, the amplification assembly is arranged on the first movable assembly through the thermal isolation layer, the clamping assembly comprises an elastic compensation ring and a clamping part, the clamping part is connected with the second movable assembly through the elastic compensation ring, and the clamping part is used for clamping a mask; the second movable assembly can adjust the clamping part to move in the first direction through the amplification assembly.

The application relates to a dual-phase high-entropy ceramic material for high-temperature thermal barrier coatings and a preparation method thereof, in particular to a dual-phase high-entropy ceramic (La 0.2 Nd 0.2 Gd 0.2 Y 0.2 Ho 0.2 )2Zr2O7 with low thermal conductivity and high thermal expansion coefficient, which is mainly used for thermal isolation, thermal barrier coatings and other applications in high-temperature environments. The application is prepared by adopting a solid-phase reaction sintering process through accurate design of the combination of rare earth elements, forms a stable dual-phase structure, effectively inhibits grain growth through grain boundary pinning, and thus maintains a nanoscale grain structure. Meanwhile, the material can efficiently block heat transfer at high temperatures through optimization of phase proportion, and the thermal expansion characteristics are matched with a metal base layer, effectively avoiding the falling risk caused by the difference in thermal expansion of the two, and thus greatly improving the service life and reliability of the material in a high-temperature environment. The high-entropy ceramic material of the application can be widely applied to fields with high demand for high-temperature thermal isolation in aerospace, aviation, automobile industry and the like, is especially suitable for thermal barrier coatings, high-temperature thermal insulation materials and other high-temperature thermal insulation applications, and has important engineering application value.

A system and method of using a multi-zone substrate to perform electromigration testing of integrated circuits in the high-frequency RF domain. Here, the device under test (DUT) is affixed to a single, multi-zone substrate with a high-temperature zone, a transitional thermal isolation zone, to a low-temperature zone. The high-temperature zone has a DUT interface with a localized heater arrangement. The low-temperature zone provides the interface with RF lines or high speed digital lines to the RF test instrumentation. The DUT input and output pins are attached to the high-temperature zone, and the configuration allows both direct current (DC) and RF stressing of the DUT. The high-temperature zone can raise the DUT temperature to 300-450° C. The RF test port and associated test equipment remain at room temperature.

A wafer test cassette having a fluid inlet and a fluid outlet, includes a first housing, a second housing, a heat source, and an isolation device. The first housing includes a probe card including probes. The second housing is coupled to the first housing, so that a test space is defined. The second housing carries a wafer arranged in the test space, and the probes are electrical contact with an upper surface of the wafer. The heat source heats a lower surface of the wafer, and a high temperature region is defined between the lower surface and the second housing. The solation device surrounds the high temperature region for thermally isolating the high temperature region from the test space. The fluid inlet receives a gas, the gas flows between the probe card and the upper surface of the wafer, and exits through the fluid outlet.

The invention relates to the field of solid carbon dioxide preparation and forming processing, and discloses a device for efficiently preparing high-density dry ice.The device comprises a base, a device body is arranged at the top of the base, a feeding assembly is arranged in the device body, and a temperature control assembly is arranged in the device body; a blanking assembly is arranged outside the device body, the blanking assembly is combined with the pressing assembly to make the granular dry ice into dry ice blocks, an air injection assembly is arranged at the top of the base and used for cleaning the interior of the pressing assembly, and a radiator is arranged at the top of the device body. And through the arrangement of a heat blocking composite cylinder body structure with a heat exchange runner, thermal isolation of a low-temperature snow making environment in the pressing cavity and a wall surface micro-temperature regulation and control environment is achieved. According to the structural design, input of heat is concentrated on an inner wall contact interface, invalid heat transfer loss is reduced, and the low-temperature stability of the overall structure of the device body is maintained while the gas film generation efficiency is guaranteed.

A nanoscale temperature detector including a diamond sensing probe with a transverse dimension of at least 200 nanometres and a sensing tip-having a curvature radius of less than 100 nanometres, less than 10 nanometres or less than 1 nanometre, and a plurality of colour centres, whose emission count rate show temperature-sensitive features. The diamond sensing probe has a transverse dimension of at least 200 nanometres and is connected to a to a detector system by means of a mounting structure. A thermal isolation barrier thermally decouples the sensing probe from the detector system.

The invention relates to a wired inclinometer high-temperature-resistant fireproof protection integrated device, and the device comprises an inclinometer which is disposed in the device and is used for monitoring the inclination angle of a structure in real time; the inclinometer is connected with an external analysis control platform through a lead; the heat insulation plate covers the inclinometer and forms a heat buffer area; the outer framework serves as an overall supporting frame and is used for supporting and protecting the whole device; the outer partition plate is fixed on the outer framework to form a six-surface closed protective structure; and the mounting plate is welded on the outer framework and is used for fixing the device. Compared with the prior art, the invention has the advantages of strong high-temperature adaptability and excellent thermal isolation performance; the structure integration degree is high, and installation and deployment are flexible; the method has the advantages of adjustable performance design capability, high adaptability and the like.

The utility model relates to a cooling device of a test board and the test board, the test board is provided with a test area and a controller installation area, the cooling device comprises an insulation heat conduction silica gel pad, a heat dissipation metal layer, a first cooling pipeline, a second cooling pipeline and a cooling pump, the insulation heat conduction silica gel pad is arranged on a controller, and the heat dissipation metal layer is arranged on the first cooling pipeline. The heat dissipation metal layer is arranged on the insulating heat conduction silica gel pad, one end of the first cooling pipeline is arranged on the heat dissipation metal layer, the other end of the first cooling pipeline is connected with the cooling pump, the first cooling pipeline is used for providing cooling liquid for the heat dissipation metal layer under the action of the cooling pump, and one end of the second cooling pipeline is arranged on the heat dissipation metal layer. And the other end of the second cooling pipeline is connected with the cooling pump, and the second cooling pipeline is used for recycling the cooling liquid from the heat dissipation metal layer to the cooling pump. According to the invention, on the premise of maintaining a high-temperature test environment of the tested module, efficient thermal isolation and heat dissipation control can be independently carried out on the controller area, and the temperature of the controller is ensured to be always in a safe range.

This invention discloses a coil support device for a stellarator magnet and a stellarator magnet. The coil support device includes a first sliding component and a second sliding component. When applied to a stellarator magnet, the sliding end of the first sliding component can slide relative to the fixed end in a first direction within a first displacement threshold range, and the sliding end of the second sliding component can slide relative to the fixed end in a second direction within a second displacement threshold range. This provides the coil with multiple degrees of freedom in various directions, facilitating assembly and absorbing the multi-directional deformation generated during stellarator magnet operation, avoiding unidirectional stress concentration and thus reducing the risk of stress concentration in the stellarator as a whole. Furthermore, the coil support device is equipped with a heat insulation component, which blocks the longitudinal heat transfer path from the high-temperature environment to the support structure. Therefore, the coil support device provided by this invention can both compensate for magnet displacement and provide thermal isolation through the heat insulation component.

The application discloses a kind of thermally induced deformation regulation and control silicon optical chip packaging methods, belong to semiconductor packaging and optoelectronic communication technical field.It includes: obtaining the packaging substrate including flexible compensation area, rigid fixed area and thermal isolation groove;Heating electrode array and double material strain layer are set in flexible compensation area, and temperature sensor is set in rigid fixed area;Silicon optical chip is fixed to the surface of rigid fixed area, and preset bias voltage is input to heating electrode array, so that flexible compensation area generates initial bending deformation state;In the initial bending deformation state, optical fiber assembly is solidified and connected to the end of flexible compensation area, and initial optical coupling link is constructed.The application obtains real-time temperature by temperature sensor, dynamically adjusts driving voltage to change the curvature of flexible compensation area, and drives optical fiber assembly to generate alignment displacement.Active thermal deformation feedback adjustment means is used, which can effectively offset the coupling offset caused by temperature drift and improve the stability of optical coupling link.

The utility model relates to a controller, a motor and a water pump, which solve the problem in the prior art that heat in the controller is not dissipated timely, and adopts the technical scheme that the controller comprises a control box and a circuit board arranged in the control box, and is characterized in that the circuit board is provided with a control area, a power area and an auxiliary area which are arranged at intervals; the control area is provided with a control module, the power area is provided with a power module, the auxiliary area is provided with a power circuit module, the power circuit module is electrically connected with the power module and the control module, and the interval between the control area and the power area achieves the purpose of thermal isolation. The beneficial effects of the utility model are that the main improvement is that components and circuits on the circuit board in the controller are reasonably arranged, and the operation reliability of the control module and the power supply circuit module (especially the control module) is prevented from being damaged by a large amount of heat generated when the power module works, so that the operation reliability of the controller is improved, and the replacement and maintenance probability is reduced; the use cost is reduced.

The invention discloses a position-sensitive Te nanowire photoelectric detector and a preparation method and application thereof, and belongs to the technical field of photoelectric detection and neuromorphic calculation. The invention discloses a suspended Te nanowire to minimize parasitic interference of a substrate so as to improve the collection efficiency of photon-generated carriers, and also can realize rapid thermal isolation to accurately control the temperature gradient so as to realize the photoelectric response of a wide spectrum at 1310-1650nm under a zero offset value. The position-adjustable positive and negative photoconductive characteristics generated by the Seebeck effect are utilized to show the calculation application of the device in the sensing under the zero offset value, 85% of accuracy is realized in the image identification application, and the problems that the calculation power consumption in the traditional sensing is large, the device separation degree is poor, the application in the communication wave band is difficult to realize and the like are solved. The device provides a thought for developing a low-power-consumption visual sensing system under wide spectrum response.

The invention provides a temperature difference self-powered wireless sensing device and system based on thermal isolation and modularization, and the device comprises a temperature difference power generation module which is used for carrying out the thermal coupling with an external heat source for thermoelectric energy conversion, and is provided with at least one power supply interface; the wireless sensing module is provided with a power connection interface matched with the power supply interface, and the wireless sensing module is provided with at least one pluggable sensing function sub-module; when the wireless sensing module is arranged in a low-temperature area far away from an external heat source, the power connection interface is electrically connected with the power supply interface through a conductor wire; when the wireless sensing module is arranged in a high-temperature area close to an external heat source, the wireless sensing module is coated with a heat insulation structure external member, and the heat insulation structure external member is any one of a vacuum heat insulation cavity, an aerogel shell or a composite heat insulation material shell. The temperature difference self-powered wireless sensing device has the beneficial effects that the temperature difference self-powered wireless sensing device with efficient thermal isolation capability, modularized and configurable functions and flexible deployment can be realized.

Provided are a charging and discharging device (100) and system (200) for a battery. The charging and discharging device (100) comprises: a rack assembly (22) and a partition mechanism (21) disposed on the rack assembly (22); and a power module (30) connected to the rack assembly (22), wherein a battery can also be disposed on the rack assembly (22); the power module (30) is located on a first side of the partition mechanism (21), and the battery is located on a second side of the partition mechanism (21); the partition mechanism (21) is provided with at least one opening (A) that can be opened or closed; and at least a portion of the power module (30) is configured to be movable from the first side to the second side when the opening (A) is opened. By means of arranging the power module (30) and the battery on two sides of the partition mechanism (21), thermal isolation between the power module (30) and the battery can be realized, thereby preventing the battery from being subjected to thermal interference. Furthermore, the opening (A) that can be opened or closed is provided in the partition mechanism (21), thereby making the access, installation, replacement, or maintenance of the power module (30) more convenient.

The invention relates to a high-energy-efficiency compact type triangular circulating compressor which comprises a cylinder body. The controller is mounted on one side of the first end of the cylinder body; the rear cover is mounted on one side of the second end of the cylinder body; the container mechanism comprises a special-shaped cavity and a sealing plate, the wall face of the cylinder body is concaved inwards to form the special-shaped cavity, and the sealing plate is welded to the outside of the special-shaped cavity in a covering mode; the flow guide pipe is used for communicating the container mechanism with the rear cover and comprises a first spherical joint in sealed connection with the first reflux inlet of the container mechanism and a second spherical joint in sealed connection with the second reflux inlet of the rear cover; the functional element is mounted at the top of the cylinder body, and a preset gap is formed between the functional element and the top wall of the cylinder body. The container mechanism and the cylinder body are integrally designed, the container mechanism and the rear cover are flexibly connected through the flow guide pipe in ball joint, the total size and the installation difficulty are reduced, thermal isolation is achieved through overhead treatment of functional elements at the top of the cylinder body, and the energy efficiency is improved.

An inspection apparatus for a warpage of a semiconductor die includes a carrier, a thermal isolation material, a holding unit, a heater, a transparent cover, a light source, and a capture device. The thermal isolation material is disposed over the carrier. The holding unit stands on and is in contact with the thermal isolation material. The heater is disposed inside the holding unit and is configured to heat the semiconductor die. The transparent cover stands on and is in contact with the holding unit, where the semiconductor die is disposed between the transparent cover and the heater. The light source is disposed over the transparent cover and is configured to project a light having a pattern to the semiconductor die. The capture device is disposed over the transparent cover and is configurated to capture an image of the semiconductor die for inspecting the warpage of the semiconductor die after heating.

The disclosed system includes a thermally optimized circuit board configured for use in thermostats to enhance temperature measurement accuracy. The circuit board integrates embedded thermistors strategically positioned in distinct thermal zones. A hot thermistor is influenced by heat-generating components in a hot zone, and a cool thermistor is thermally isolated in a more stable, cool zone. The system leverages the temperature differential between these zones to compensate for heat offsets caused by component board heating, enabling more accurate ambient temperature readings. Thermal isolation is achieved through features such as thermal gaps, serpentine routes, and thermal peninsulas, which reduce heat conduction into the cool zone. The circuit board's configuration supports precise temperature sensing, reliable RF operation, and scalability for compact devices. The system improves thermostat functionality by combining thermal management, electrical connectivity, and accurate environmental monitoring for modern smart thermostats.

The invention belongs to the technical field of extremely low temperature tests, and particularly discloses a double-layer sample rod suitable for an extremely low temperature test in a pulsed magnet liquid helium Dewar, which comprises a first rod section, a second rod section and a switching assembly, the first rod section comprises a first outer pipe and a first inner pipe which are coaxially arranged in a sleeved mode, a condensation layer is formed between the first outer pipe and the first inner pipe, and a vacuum layer is formed in the first inner pipe. The second rod section comprises a second outer pipe and a second inner pipe which are coaxially sleeved, a feeding port is formed in the upper end of the second outer pipe, the lower end of the second outer pipe is sealed, a sample cavity is formed between the second outer pipe and the second inner pipe, and a sample clamp is hermetically mounted at the lower end of the second inner pipe; the switching assembly comprises a first switching piece, a condensation pipe, a second switching piece and a sealing plate. According to the structural design, the extremely low temperature condition is guaranteed, and controllable thermal isolation between the sample cavity and the external refrigerating working medium serving as a cold source is effectively achieved.

The invention relates to a looped network inflatable cabinet with a multilayer explosion-proof structure, which relates to the technical field of electrical equipment, and comprises a cabinet body, a cable chamber and a pressure relief chamber are arranged in the cabinet body, the cabinet wall of the pressure relief chamber is provided with a multilayer seamless explosion-proof structure, a stainless steel plate, an insulating plate and high-temperature-resistant fireproof cloth are sequentially arranged from inside to outside, and gaps are blocked by fireproof mud to form a closed protection system. An aluminum core plate can be adhered to the outer side of the high-temperature-resistant fireproof A dynamic pressure relief structure is further arranged in the pressure relief chamber and comprises a cylinder body and a piston, a low-rigidity spring and a high-rigidity spring set are arranged in the cylinder body, the piston is provided with a high-temperature-resistant sealing ring, a transparent observation barrel with scale marks is arranged on the outer wall of the pressure relief chamber of the cabinet body and communicated with the cylinder body, and an alarm is arranged in the observation barrel. According to the invention, the technical effects of effectively bearing internal arcing high temperature and mechanical impact, realizing electrical insulation and thermal isolation, high-temperature blocking and flexible sealing and gap sealing, absorbing and buffering high-pressure impact, observing the position of the piston in real time and giving an alarm when necessary are achieved.

A wall anchor provides thermal isolation between an inner wythe and an outer wythe of a cavity wall. The wall anchor includes a structural body. A support block is about a support plate of the structural body and a connection bar block is about a connection bar of the structural body.

The invention relates to the technical field of micro electro mechanical system element manufacturing, and discloses an ultra-fast fusing fuse device based on an MEMS process and a preparation method thereof. The preparation method specifically comprises the following steps: S101, obtaining a monocrystalline silicon substrate with good semiconductor characteristics and mechanical stability as a basic supporting structure of a device, and growing a silicon dioxide insulating layer with the thickness of 100-1000nm on the bottom surface of the monocrystalline silicon substrate; and S102, spin-coating a layer of soluble polymer material with uniform thickness on the silicon dioxide insulating layer to serve as a sacrificial layer, and performing pre-baking through a hot plate to remove the solvent and perform curing. According to the invention, the suspended aluminum fuse link structure supported by the silicon dioxide bridge beam is successfully constructed by creating the MEMS sacrificial layer and a dissolving process, and the structure enables the fuse link and the substrate to realize thermal isolation, so that heat dissipation is greatly reduced, and a device can realize microsecond-level ultra-fast response through a Joule heating effect during overcurrent.

The invention discloses a preparation method of an array laser, and relates to the technical field of semiconductor optoelectronic integrated devices, and the method comprises the steps: dividing a substrate into a plurality of unit laser regions, growing active and passive materials in the unit laser regions through a selective epitaxy and etching technology, and forming a gain layer and a grating layer; the method comprises the following steps: preparing a grating region, preparing a uniform grating in the grating region, then integrally growing a cover layer and a contact layer, etching to form a shallow ridge waveguide structure, further etching on a grating layer below the shallow ridge waveguide structure to form a cantilever beam structure comprising a suspension arm and an air slot so as to realize thermal isolation and local tuning, and finally preparing a P-surface electrode, a heating electrode and an N-surface electrode. Constructing a complete electrically-driven and thermally-tuned array laser; thermal crosstalk among laser units in the array laser is effectively eliminated, wavelength independence and accurate control are achieved, the overall wavelength stability of the array is improved, the thermal action size is reduced through a low-heat-capacity suspension arm structure, and tuning power consumption is remarkably reduced.

The invention relates to the related technical field of integrated circuits, in particular to a sensor-based integrated circuit arrangement optimization method and device, and the method comprises the steps: setting an initial circuit arrangement network based on an integrated circuit substrate, and determining a candidate circuit arrangement combination in combination with a thermal isolation wiring constraint condition and an electromagnetic isolation wiring constraint condition, and inputting a multi-objective optimization engine to carry out Pareto frontier search, and determining a global optimal circuit arrangement combination. The technical problems that a multi-field coupling amplification area cannot be accurately recognized, wiring constraint setting lacks pertinence, and reliability of a sensor-based integrated circuit is limited are solved, thermal isolation constraint of a thermal feedback strengthening loop and electromagnetic isolation constraint of an electromagnetic resonance loop are combined, a multi-target optimization engine is introduced to carry out Pareto frontier search, and the reliability of the sensor-based integrated circuit is improved. And thermoelectric coupling, magneto-mechanical coupling and electro-mechanical coupling non-dominated solution sets are synchronously generated, and the adverse effect of circuit performance under the interaction of multiple physical fields is effectively controlled.

This invention belongs to the field of semiconductor packaging technology, specifically relating to a packaging device and method for micro LED chips. The method involves a bonding head grasping a micro LED chip array and aligning it with the electrodes of a target substrate. Upon contact, the device senses the contact pressure of each block and independently adjusts the local pressure of the corresponding block to dynamic equilibrium based on pressure deviation. Packaging is then completed through ultrasonic solid-state bonding or thermo-press reflow bonding. The core of the device is a bonding head containing a modular adaptive array. Components include a sealed cavity, a pressure-bearing substrate, an integrated pressure sensor, a micro linear actuator, and control components. A thermal isolation component provides high-temperature protection. This invention achieves adaptive local pressure adjustment of the bonding head, resulting in high pressure adjustment accuracy, stable operation under high-temperature environments, and effective compensation for structural deviations between the chip and the substrate, significantly improving packaging yield while simplifying equipment structure and reducing manufacturing costs.

The invention discloses a double-sliding-mode cascade control method of an electric drive system, a split type motor and a system, and provides the double-sliding-mode cascade control method suitable for the split type motor, the split type motor has fault tolerance, on one hand, a stator winding is manufactured in a split mode and is composed of a plurality of independent decoupling stator units with consistent characteristics, and on the other hand, the stator winding is manufactured in a split mode; each split type stator unit structure is independent, electromagnetic and thermal isolation is achieved, and the fault tolerance is high; more importantly, the control technology is optimized, the design of a double-sliding-mode cascade fault-tolerant controller and a composite sliding-mode disturbance observer is provided, and the composite sliding-mode disturbance observer conducts online observation on unknown disturbance in a motor rotating speed ring and a flux linkage ring and system operation state quantity. And the double-sliding-mode cascade fault-tolerant controller is used for obtaining a voltage instruction value of each motor unit. According to the technical scheme, the operation quality of the split type motor under the parameter mismatch condition can be remarkably improved, the dynamic response speed is improved, and the fault tolerance performance under the parameter mismatch condition is improved.