6182 results about "Heat flow" patented technology

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g / m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g / m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.

A method of treating a brain disorder by heat transfer from brain tissue comprising the steps of surgically cutting a heat transfer aperture into a patient's skull, thereby exposing a predetermined portion of patient's brain; surgically implanting into said heat transfer aperture a heat pump having one or more electrical sensor elements and one or more temperature sensor elements; surgically implanting a heat transfer management unit in a body cavity of said patient such that a micro controller of the heat transfer management unit is connected to one or more activity sensor elements and one or more temperature sensor elements contacting brain tissue and connecting the heat transfer management unit to said heat pump via a lead bundle. Optionally, the heat transfer unit may be located external to the patient's body. Responsive to signals from one or more activity or temperature sensor elements, mathematical algorithms of the heat transfer management unit determine abnormal brain activity, causing the heat pump to remove heat from the brain tissue into a heat sink, thereby cooling the predetermined portion of the patient's brain. This technique utilizes acute hypothermia by means of a Peltier cooler or similar device to cool the brain temperature to reduce or prevent seizure initiation and / or propagation. The method may be used in association with brain stimulation and / or drug application to acutely avoid the occurrence of a seizure episode.

A thermographic test method locally resolves detection and identification of defects near the surface in a test object. A surface area of the test object is heated up. A series of thermographic images following one after another at a time interval is recorded within a heat propagation phase, each image representing a local temperature distribution in a surface region of the test object recorded by the image. Positionally correctly assigned temperature profiles are determined from the images, each positionally correctly assigned temperature profile being assigned to the same measuring region of the test object surface. Variations over time of temperature values are determined from the temperature profiles for a large number of measuring positions of the measuring region. These variations are evaluated on the basis of at least one evaluation criterion indicative of the heat flow in the measuring region.

A device and a method of use for treating a medical disorder by surgically implanting into a patient at least one sensor element capable of detecting and conveying cell signals: attaching a management unit such that a micro controller of the management unit is connected to at least one sensor element; and connecting the management unit via a lead bundle to at least one treatment device. The treatment device may be an electrical stimulation device, a magnetic stimulation device, a heat transfer device, or a medication delivery device. Responsive to signals from the one or more sensor elements, mathematical algorithms of the management unit use wavelet crosscorrelation analysis to prompt delivery of at least one treatment modality, such heat transfer, current pulses, magnetic stimulation or medication. The medical disorder may arise from the brain, central nervous system or organs and tissues outside of the central nervous system.

An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

A probe for friction stir welding MMCs, ferrous alloys, non-ferrous alloys, and superalloys, as well as non-ferrous alloys, the probe including a shank, a shoulder, and a pin disposed through the shoulder and into the shank, wherein the pin and the shoulder at least include a coating comprised of a superabrasive material, the pin and shoulder being designed to reduce stress risers, disposing a collar around a portion of the shoulder and the shank to thereby prevent movement of the shoulder relative to the shank, and incorporating thermal management by providing a thermal flow barrier between the shoulder and the shank, and between the collar and the tool.

A thin sensor for heat flux and temperature, designed for adhesive attachment to a surface, is manufactured on a flexible insulated metallic substrate. The sensor exhibits a combination of high sensitivity for heat flux and low resistance to the flow of heat. These characteristics enable it to measure heat flux at surface boundaries with improved accuracy over conventional heat flux transducers because the temperature drop produced by the sensor is very small. The response by the sensor to radiation, convection and conduction are equal. As such, the sensor can be calibrated in one mode of heat transfer and used for measurement in other modes. The high sensitivity of the sensor makes it ideal for measuring heat flow through insulating materials, and well adapted to instrumenting heat flow in buildings, detecting fires at an early stage, or remotely measuring the temperature of string and web products in industrial processing.

A composition for a Coating System (paint) which forms an insulating material being designed to both reflect infrared radiation and have reduced thermal conductivity. The coating system may be either a single Thermal Coating or may be a Thermal Coating used in combination with a Thermal Primer. The Thermal Coating is formulated using conventional techniques and a resin used in paint manufacture, but utilizes primary pigments and extender mineral pigments which preferentially reflect in the infra red area of the solar spectrum. A method of characterizing particulate materials for their infra red reflectivity is described, which provides a means for preferential selection of particulate additives based on their relative visible light and infrared reflectivity. Additionally the incorporation of hollow micro-spheres is desired to reduce thermal conductivity. The Thermal Primer is designed to provide adhesion between the Thermal Coating and the substrate on which it is applied and uses conventional techniques to achieve those properties. However it has been found advantageous to incorporate hollow micro-spheres with low thermal conductivity, such as glass, ceramic or polymeric micro-spheres and / or an extender pigment with low thermal conductivity such as calcined clay to further reduce heat flow through the Coating System.

[OBJECTS AND PROBLEMS] Relating to a mist generator capable of emitting any of chemical substances used in life, such as perfumes, pharmaceuticals and pesticides, in the form of fog or vapor. An object of the invention is to attain means for efficiently atomizing liquid, means for easily and rapidly switching the type of chemical substance emitted and a compact apparatus of good maintainability. [MEANS FOR SOLVING PROBLEMS] An apparatus comprises an ultrasonic transducer; an ultrasonic propagation medium disposed so as to fill a plane of vibration of the transducer; liquid retaining means disposed so as to be in contact with an end face of the medium; and an ultrasonic focusing reflecting mechanism (concave reflection mirror) disposed in an ultrasonic propagation path, thereby the apparatus attains discharging into air and atomization of the liquid by means of ultrasonic waves. Atomization efficiency is enhanced by the use of an ultrasonic reflection tube, and mist emission is carried out. Use is made of a compact liquid container equipped at its bottom with an ultrasonic transmission membrane. Various types of liquids can be atomized by changing the direction of ultrasonic course. Mist can be emitted by means of a thermal current as heating means. IC tag is attached to the liquid retaining means or liquid injection means.

Improved mold manifold and hot runner nozzle using thin film elements include at least one active or passive thin film element disposed along a melt channel between the manifold inlet and the hot runner nozzle. Preferably, the thin film element may comprise a thin film heater in direct contact with the molten resin and position to aid in the heat and flow management of the resin within the melt channel. Thin film temperature sensors, pressure sensors, and leak detectors may also be provided in the vicinity of the melt channel to enhance process control in the injection molding machine.

A low-profile strip illumination device comprises a substrate supporting an elongate heat conductor and positively and negatively energized elongate rails. A plurality of spaced apart light emitting diodes (LEDs) are mounted so as to be powered by the elongate rails. The LEDs are arranged generally adjacent the elongate heat conductor so that a heat flow path is defined from each LED to the elongate heat conductor and to the environment.

A prediction type electronic thermometer having an actively controlled heater element thermally isolating the probe tip from the probe shaft. Rapid and accurate temperature measurements are made using predictive algorithms. Control circuitry reads input from the temperature sensing element to compute best heater control signals so that the temperature of the probe shaft rapidly follows changes in the temperature of the probe tip. Thermal isolation between probe shaft and tip impedes heat flow from the heater element to the tip providing more accurate measurements. Rapid and accurate management of shaft temperature allows heat from the patient being measured to be most efficiently transmitted to the temperature sensor element resulting in very fast temperature measurements.

A device and method of use for treating a medical disorder by surgically implanting into a patient at least one sensor element capable of detecting and conveying cell signals; attaching a management unit such that a micro controller of the management unit is connected to at least one sensor element; and connecting the management unit via a lead bundle to at least one treatment device. The treatment device may be an electrical stimulation device, a magnetic stimulation device, a heat transfer device, or a medication delivery device. Responsive to signals from the one or more sensor elements, mathematical algorithms of the management unit use wavelet crosscorrelation analysis to prompt delivery of at least one treatment modality, such heat transfer, current pulses, magnetic stimulation or medication. The medical disorder may arise from the brain, central nervous system or organs and tissues outside of the central nervous system.

Systems and methods are described that provide a Heat Flow Model (HFM) graph modeling methodology. Embodiments automatically translate formal HVAC system descriptions from a Building Information Model (BIM) into HFM graphs, and compile the graphs into executable FDD systems. During an engineering phase, a user interface is used to enter parameters, conditions, and switches not found in the BIM. During a runtime phase, real-time data from an HVAC control system is input to the generated FDD system (HFM graph) for fault detection and diagnosis.

The present invention harvests and utilizes fluidized bed drying technology and waste heat streams augmented by other available heat sources to dry feedstock or fuel. This method is useful in many industries, including coal-fired power plants. Coal is dried using the present invention before it goes to coal pulverizers and on to the furnace / boiler arrangement to improve boiler efficiency and reduce emissions. This is all completed in a low-temperature, open-air system. Also included is an apparatus for segregating particulate by density and / or size including a fluidizing bed having a particulate receiving inlet for receiving particulate to be fluidized. This is useful for segregating contaminants like sulfur and mercury from the product stream.

The invention discloses a fluid-solid-heat coupling triaxial servo percolation device for gas-contained coal, comprising a lifting stand, a hydraulic servo control system, an axial loading device mounted at the top of the lifting stand and a triaxial pressure chamber connected with the lower end of the axial loading device. A thermostatic water tank is arranged below the triaxial pressure chamber; a movable worktable is arranged above the thermostatic water tank; the lower end of the triaxial pressure chamber is arranged on the movable worktable; heating tubes are arranged in the thermostatic water tank; and a water inlet valve, a water drain valve and a water-bath circulating water pump are arranged outside the thermostatic water tank and are communicated with the thermostatic water tank. In the hydraulic servo control system, an axial compression loading oil pump is communicated with an oil inlet and an oil outlet by a pipeline, and a peripheral compression loading oil pump is communicated with an oil intake / drain hole by a pipeline. The fluid-solid-heat coupling triaxial servo percolation device for gas-contained coal can carry out the research of gas-contained coal percolation tests in states, such as different terrestrial stresses, different gas pressures, different temperatures, and the like and the distortion and failure characteristics of the gas-contained coal in a percolation process.

A method for manufacturing integrated circuits; particularly, a method to alter heat flow on a localized basis, when heating wafers to elevated temperatures, to achieve different processing temperatures by altering the material properties, such as emissivity, absorptivity and reflectivity, of a portion of a surface by the application of thin films of various materials.

A low-profile strip illumination device comprises a substrate supporting an elongate heat conductor and positively and negatively energized elongate rails. A plurality of spaced apart light emitting diodes (LEDs) are mounted so as to be powered by the elongate rails. The LEDs are arranged generally adjacent the elongate heat conductor so that a heat flow path is defined from each LED to the elongate heat conductor and to the environment.

A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.

A thermodynamic system for waste heat recovery, using an organic rankine cycle is provided which employs a single organic heat transferring fluid to recover heat energy from two waste heat streams having differing waste heat temperatures. Separate high and low temperature boilers provide high and low pressure vapor streams that are routed into an integrated turbine assembly having dual turbines mounted on a common shaft. Each turbine is appropriately sized for the pressure ratio of each stream.

A circuit board assembly includes a substantially planar shaped printed circuit board (PCB) having a first side and a second side separated by a determined thickness. At least one electrically operable component, typically an LED element, is secured to a selected one of first and second sides of the PCB board, the component generating at least one of a thermal flow pattern and an electromagnetic field. A three-dimensional encapsulant is in-molded around the printed circuit board in such a fashion as to substantially embed the electrically operable component. The encapsulant provides selective heat conductive management of the thermal flow pattern and electromagnetic management of the electromagnetic fields generated by the component.

A lead assembly and a method of making a lead are provided. The method of making a multi-contact lead assembly comprises providing conductive contacts located at an end of a lead body, disposing conductive wires in conductor lumens formed in the lead body, and connecting the conductive wires to the conductive contacts. The method further includes placing spacers between pairs of conductive contacts and inserting monofilament in at least a portion of at least one of the conductor lumens not occupied by the conductor wires. The method also includes reflowing at least one of the spacers or monofilament into at least one portion of at least one of the conductor lumens by heating the spacers and monofilament to a temperature to cause thermal flow or melting of at least one of the spacers or monofilament.

A device for isolating a heat sensitive component includes a heat sink positioned adjacent to the heat sensitive component. The heat sink has a stepped thermal response to an applied heat. The heat sink may include two or more thermally decoupled masses. Thermal decoupling may be achieved by positioning a nanoporous material positioned between the two masses. The heat sensitive component and the heat sink may be positioned inside a container such as a Dewar-like flask and connected to the container with a connector. The connector may function as a thermal isolator that impedes the flow of heat into the interior of the container. In one embodiment, the connector includes at least one bridge portion having a reduced cross-sectional area and / or a longitudinally elongated opening to impede heat flow. Nanoporous material may be positioned in the container at locations that assist in thermally isolating the heat sink and heat sensitive components.

An apparatus for use with radical sources for supplying radicals during semiconductor processing operations is provided. The apparatus may include a stack of plates or components that form a faceplate assembly. The faceplate assembly may include a radical diffuser plate, a precursor delivery plate, and a thermal isolator interposed between the radical diffuser plate and the precursor delivery plate. The faceplate assembly may have a pattern of radical through-holes with centerlines substantially perpendicular to the radical diffuser plate. The thermal isolator may be configured to regulate heat flow between the radical diffuser plate and the precursor delivery plate.

An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

A grill pan structure with convection heating is provided to make uniformly heating within the oven. The grill pan structure includes a heat flow layer and at least one support plate. The heat flow layer includes at least one hole for a heat source to pass through for roasting. Also, the heat flow layer includes at least one recess to receive the dropped oils of the foods during roasting. The first support plate further includes at least one inclined guiding surface to guide the dropped oil to the recess. Therefore, uniformly heating for roasting foods and eliminate from turning over the foods during roasting are achieved. And the oven is still clean after roasting, which is convenient to use.

A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conductive path and permitting sufficient heat flow from said chip to said cap to maintain steady state operation of said semiconductor chip. The preferred silicone adhesive comprises a primerless, two-part polysiloxane-based adhesive made by reacting polydimethyl siloxane, an organosilicon compound, a polysiloxane, and a silane, in the presence of a catalyst.