2588 results about "High reflectivity" patented technology

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g/m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.

The invention relates to anisotropic, reflective, magnetic flakes. In a liquid carrier and under influence of an external magnetic field, the flakes attract to one another side-by-side and form ribbons which provide higher reflectivity to a coating and may be used as a security feature for authentication of an object.

The invention generally relates to an integrated head up displaying (HUD) device including a housing that houses an active-matrix image projecting system and its accompanying electronics, and an optical combiner (for providing a see-through image thereon) connected to the housing via a retractable arm attached at one end to the main body and holds the HUD optical panel at its other end. In particular, the telescopically retractable arm allows the assembly to extend or retract for a desirable combiner height. Further, the LED backlighting array is placed within a reflective light chamber which is lined with a safe, light-weight, low cost, specular, reflective sheet for high reflectivity. The non-conductive, reflective sheet also covers the LED printed circuit board.

A semiconductor device emitting light about a predetermined wavelength comprising a structure comprising a plurality of layers, sometimes referred to as a stack, providing low resistance, high reflectivity and ohmic contacts to at least one semiconductor material.

A light emitting device comprises a novel low-loss array of conductive vias embedded in a dielectric multilayer stack, to act as an electrically-conductive, low-loss, high-reflectivity reflector layer (CVMR). In one example the CVMR stack is employed between a reflective metal bottom contact and a p-GaN semiconductor flip chip layer. The CVMR stack comprises at least (3) layers with at least (2) differing dielectric constants. The conductive vias are arranged such that localised and propagating surface plasmons associated with the structure reside within the electromagnetic stopband of the CVMR stack, which in turn inhibits trapped LED modes coupling into these plasmonic modes, thereby increasing the overall reflectivity of the CVM R. This technique improves optical light extraction and provides a vertical conduction path for optimal current spreading in a semiconductor light emitting device. A light emitting module and method of manufacture are also described.

A semiconductor light-emitting device comprises an N-type semiconductor layer, an active layer formed on the surface of the N-type semiconductor layer, a P-type semiconductor layer formed on the surface of the active layer, and a reflective layer formed on the surface of the P-type semiconductor layer. A plurality of ohmic contact blocks with electrical properties of ohmic contact are on the surface of the reflective layer adjacent to the P-type semiconductor layer, and the remaining part of the surface acts as the reflective regions with higher reflectivity, and the reflective regions can effectively reflect the light generated from the active layer.

To solve the existing problems in distributed Bragg reflectors (DBR) used in the prior art, the present invention provides a fabrication method of group III nitride based distributed Bragg reflectors (DBR) for vertical cavity surface emitting lasers (VCSELs), which suppresses the generation of cracks, and a distributed Bragg reflector with high reflectivity, broad stopband, and adaptability to optical devices such as vertical cavity surface emitting lasers, micro-cavity light emitting diodes, resonance cavity light emitting diodes and photodetectors.

A silver-based alloy thin film is provided for the highly reflective or semi-reflective coating layer of optical discs. Alloy additions to silver include zinc, aluminum, zinc plus aluminum, manganese, germanium, and copper plus manganese. These alloys have moderate to high reflectivity and reasonable corrosion resistance in the ambient environment.

Composite mirror systems include a wideband thin film interference stack having a plurality of microlayers and an optically thick layer having a refractive index greater than air but less than the smallest refractive index of the stack. The mirror systems can provide high reflectivity for light propagating in the stack and in the optically thick layer at supercritical angles, while avoiding degradation in reflectivity if dirt or other disturbances such as absorbing materials are present at the mirror backside for example due to contact with a support structure.

The invention is a light emitting diode that exhibits high reflectivity to externally incident light and high extraction efficiency for internally generated light. The light emitting diode includes a first reflecting electrode that reflects both externally incident light and internally generated light. A multi-layer semiconductor structure is in contact with the first reflecting layer and has an active region that emits the internally generated light in an emitting wavelength range. The multi-layer semiconductor structure has an absorption coefficient less than 50 cm⁻¹. A second reflecting electrode underlies the multi-layer semiconductor structure and reflects both the externally incident light and the internally generated light. An array of light extracting elements extends at least part way through the multi-layer semiconductor structure and improves the extraction efficiency for the internally generated light. The light emitting diode has a reflectivity greater than 60 percent for externally incident light in the emitting wavelength range and has an extraction efficiency greater than 40 percent.

Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.

A plurality of separate lead frames can be insert-molded in a reflector composed of a white resin having a high reflectivity to form a package for an LED device. A cavity is formed in the reflector. The cavity can have an inner circumferential surface that opens wider in an upward direction. Cups can be located in the cavity. Each cup has an outer wall that can be in the form of a cylinder with the bottom formed of each of two separate lead frames. A red LED chip and a green LED chip can be adhesively fixed to the lead frames located on the bottoms of the respective cups. The LED chips can have lower electrodes, which are electrically brought into conduction with the lead frames one by one. The LED chips can also have upper electrodes, which are electrically brought into conduction with the lead frames one by one via bonding wires. A light transmissive resin can be filled in the cavity.

A weather radar system has bright band detection and compensation. The weather radar system determines that high reflectivity in weather is a bright band and reduces an encoded return level from the bright band to compensate for it on a display. The weather radar system detects the presence of the bright band using an inference system that uses outside air temperature, aircraft altitude, and an assumed lapse rate to estimate the bright band location relative to the aircraft and uses antenna elevation to estimate bright band range to reduce the encoded radar return level on the display. The weather radar system may also detect the presence of the bright band using a detection system that uses radar estimates from normal reflectivity scan operation of the system. The weather radar system may also use an active detection process separate from a normal radar sampling process to detect the bright band.

This invention is an illumination system that incorporates a light emitting diode and a partially reflecting optical element. The light emitting diode emits internally generated light and reflects incident light with high reflectivity. The partially reflecting optical element transmits a first portion of the internally generated light and reflects a second portion of the internally generated light back to the light emitting diode, where the second portion is reflected by the light emitting diode. The partially reflecting optical element can be a non-absorbing reflecting polarizer or a wavelength conversion layer. Utilizing a partially reflecting optical element and light recycling can increase the effective brightness and the output efficiency of the illumination system.