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999 results about "Contact heat" patented technology

Contact with heat is the contact of a body part, or whole body, with a heat source. The heat source can be a naked flame, hot gases, steam or any other form of heat with a temperature that can cause burns (1st degree, 2nd degree, or 3rd degree).

Multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric, preparation method and application

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g/m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.
Owner:DONGHUA UNIV

Fire-proof and heat-insulating composite fabric with multi-stage expansion and heat dissipation, preparation method and application

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g / m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.
Owner:DONGHUA UNIV

High efficiency heat removal system for rack mounted computer equipment

An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets.
This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.
This invention covers the design of the heat transfer components within the chassis of rack mounted computer server and the heat transfer system components external to the server within rack enclosure, as well as the external cooling system components necessary to connect to existing fluid based heat transfer and removal systems and processes.
Owner:NEUDORFER JULIUS

Setting phase change energy storage material with high-thermal conductivity and preparation method thereof

The invention relates to a setting phase change energy storage material with high-thermal conductivity and a preparation method thereof, belonging to the field of phase change heat storage materials. The setting phase change energy storage material with high-thermal conductivity is characterized by containing 65-90 percent by mass of paraffin substances as a phase-change material, 9-34 percent by mass of high-density polyethylene as a support material and 1-7 percent by mass of expanded graphite as a heat conduction intensifier; a method for adding a proper amount of expanded graphite to paraffin/high-density polyethylene in a molten state is adopted to enable the heat conductivity of the setting phase change material to be increased to 1.35W/(m.K) or higher. The method comprises the following steps of: heating to melt the paraffin substances with the mass percent of 65-90 percent, and heating to enable the temperature of the liquid paraffin to reach 120-190 DEG C; adding high-density polyethylene with the mass percent of 9-34 percent and the expanded graphite with the mass percent of 1-7 percent to the liquid paraffin, and then melting and evenly stirring in vacuum; putting the mixture in a hot mould for pressing and molding; taking the mixture from the mould after naturally cooling. The setting phase change material has high thermal conductivity, does not need to be packaged in containers and can directly contact heat-transfer media.
Owner:UNIV OF SCI & TECH OF CHINA

Automotive adsorption heat pump

An adsorber unit has an outer shell, a plurality of internal tubes extending through the shell for carrying heat transfer fluid, each tube having outwardly projecting fins along its entire length, and a solid adsorbent material in the shell surrounding the tubes such that the fins project into the adsorbent material, the fins being of a material (e.g., metal) of higher thermal conductivity than the adsorbent material. Metal wool loosely packed inside the tubes, or internal radial fins swaged into the tubes, increase internal surface area thereby enhancing convective heat transfer. Metal wool loosely packed between the external fins, or fine wire metal coils lightly squeezed between the external fins, further increase external surface area of the heat exchanger in contact with the adsorbent thereby enhancing contact heat transfer. Performance is enhanced because the external fins and wool or wire coils transport heat more efficiently to all regions of the adsorbent, and permit less non-adsorbent heat exchanger material (e.g., metal) to be used for a given amount of adsorbent. Two or more such units are used in an adsorption heat pump. This design utilizes existing components (e.g., shell-&-tube heat exchanger, internally and externally finned tubing, and metal wool or wire coils) in a novel manner heretofore untried. In one exemplary embodiment, automobile air conditioning, exhaust heat is used to power such an air conditioner. The significant additional power used by the mechanical compressor of an automobile (12%-17% during commuting for subcompact to midsize cars) can be nearly eliminated by powering the air conditioner with otherwise wasted exhaust heat. The adsorbent is heated and cooled by light oil (called Heat Transfer Fluid, HTF) which in turn is heated and cooled by exhaust and fresh air. Such indirect heating and cooling achieves the required efficiency, and allows using phase change material (e.g., wax) to store and therefore fully utilize exhaust heat. A refrigerant reservoir is included which provides immediate cooling after start-up of a cold engine, while the exhaust system and heat pump are still heating up in order to start pumping refrigerant. Eliminating the mechanical compressor increases fuel mileage by 14-18% for midsize, compact, MS and subcompact cars, or 4.6-6.0% annually, given a four-month cooling season.
Owner:LAMBERT MICHAEL A +1

High efficiency heat removal system for rack mounted computer equipment

An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets.This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.This invention covers the design of the heat transfer components within the chassis of rack mounted computer server and the heat transfer system components external to the server within rack enclosure, as well as the external cooling system components necessary to connect to existing fluid based heat transfer and removal systems and processes.
Owner:NEUDORFER JULIUS

Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof

The invention discloses a thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof. Thick copper circuit layers in the circuit board, which contact with heat-conducting insulation layers, are partially embedded into the contacting heat-conducting insulation layers from contact faces. In the manufacture of the structure, the thick copper circuit layers are manufactured by a mode of etching both faces of an ultra-thick copper foil respectively, and the problem of circuit etching of the ultra-thick copper foil is solved; prepregs with high resin content are adopted as the heat-conducting insulation layers, the laminated heat-conducting insulation layers are partially filled into the circuit clearances of the thick copper circuit layers, the height of the thick copper circuit layers arranged at both faces of the circuit board and exposed out of the circuit board is effectively lowered, and the problem of solder resisting of the circuit of the ultra-thick copper foil is solved; the manufacturing process is the prior art and has low cost; and the copper thickness of the circuit layers is greater than 6oz, and the invention has favorable heat conductivity, electric signal interference shielding property and superior supervoltage loading property.
Owner:昆山华升电路板研发基地有限公司

Solid interface contact heat exchange coefficient measurement method and apparatus based on transient method

The invention relates to a method and a device for measuring solid interface contacted heat transfer coefficient based on a transient method. The method comprises the following steps: a lever loading device 2 is connected with a pressure turning joint 4, a centering ball 11, a low temperature sample connecting rod 6 and a low temperature sample 14 in turn from the top to the bottom; a positioning block bears pressure in advance; and a thread transmission shaft 20 pushes a high temperature sample 15 out of a heating furnace through a high temperature sample supporting rod 17, contacts and jacks up the low temperature sample 14 to transfer the pressure to the contact surface. A temperature control thermocouple 13 of the heating furnace is connected with a program control meter, the output end of the program control meter is connected in parallel and then is connected with an industrial computer 26 through an RS232 converter, a temperature detecting thermocouple 16 is connected with a preposition multi-path gate amplifier 23 and an A/D converter plate 25 in turn to acquire and process temperature signals of measured points in real time as well as compile a FORTRAN calculation module by applying a counter heat transfer arithmetic. The method has the advantages of high measuring temperature, quick acquisition and practical measuring principle, and is suitable for the research field of solid thermal processing.
Owner:DALIAN UNIV OF TECH

Flat-panel vapor chamber

The invention relates to a flat-panel vapor chamber which belongs to a heat radiating device of a micro electronic device and is used for heat diffusion of a power module and solving the surface deformation problem of the traditional flat-panel vapor chamber and a heat source contact surface so as to further reduce the deformation with the contact surface of a heat source part. The flat-panel vapor chamber comprises heat radiating fins and a metal cavity, wherein the metal cavity consists of a box body and a cover plate; the metal cavity is internally pumped with vacuum and filled with liquid working medium; the box body and the heat radiating fins are tightly contacted or connected into a whole; the inner wall surface of the box body is provided with capillary cores, and supporting bodies are arranged between the box body and the cover plate; the central part of the inner wall surface of the cover plate is provided with a boss, and the thickness of the boss is 0.2-2.0mm; the cross section area of the boss is larger than or equal to the contact area of the heat source; and the inner wall surface of the cover plate including the boss is provided with capillary cores. The flat-panel vapor chamber has the advantages of simple structure and convenience for manufacturing and processing, can be used for effectively reducing the surface deformation and the contact heat resistance, and has high working medium refluxing efficiency and higher working efficiency.
Owner:HUAZHONG UNIV OF SCI & TECH
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