Solid interface contact heat exchange coefficient measurement method and apparatus based on transient method

Abstract

The invention relates to a method and a device for measuring solid interface contacted heat transfer coefficient based on a transient method. The method comprises the following steps: a lever loading device 2 is connected with a pressure turning joint 4, a centering ball 11, a low temperature sample connecting rod 6 and a low temperature sample 14 in turn from the top to the bottom; a positioning block bears pressure in advance; and a thread transmission shaft 20 pushes a high temperature sample 15 out of a heating furnace through a high temperature sample supporting rod 17, contacts and jacks up the low temperature sample 14 to transfer the pressure to the contact surface. A temperature control thermocouple 13 of the heating furnace is connected with a program control meter, the output end of the program control meter is connected in parallel and then is connected with an industrial computer 26 through an RS232 converter, a temperature detecting thermocouple 16 is connected with a preposition multi-path gate amplifier 23 and an A/D converter plate 25 in turn to acquire and process temperature signals of measured points in real time as well as compile a FORTRAN calculation module by applying a counter heat transfer arithmetic. The method has the advantages of high measuring temperature, quick acquisition and practical measuring principle, and is suitable for the research field of solid thermal processing.

Description

technical field [0001] The invention belongs to the field of solid-state thermal processing research. It is mainly used to measure the contact heat transfer coefficient of the interface during the instantaneous contact of metal solids. Background technique [0002] In the thermal processing of metal materials, the heat exchange between the mold and the workpiece directly affects the distribution of the temperature field, which in turn affects the life of the mold and the forming accuracy of the workpiece. Therefore, people have long begun to study the contact heat transfer coefficient between the metal solid interface With the development of modern industry, this research has attracted more and more attention from researchers and precision forming enterprises. At the same time, the numerical simulation technology of solid-state thermal processing has a greater demand for data on the contact heat transfer coefficient. At present, scholars at home and abroad have carried out ...

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Problems solved by technology

[0006] The existing experimental devices mostly use the steady-state method for measurement, the experimental data cannot fully meet the needs of actual production and scientific research, the temperature at the contact surface of the sample is low, there are few studies on the solid-state thermal processing process, and the temperature acquisition and data processing methods are not perfect

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