Flat-panel vapor chamber

Abstract

The invention relates to a flat-panel vapor chamber which belongs to a heat radiating device of a micro electronic device and is used for heat diffusion of a power module and solving the surface deformation problem of the traditional flat-panel vapor chamber and a heat source contact surface so as to further reduce the deformation with the contact surface of a heat source part. The flat-panel vapor chamber comprises heat radiating fins and a metal cavity, wherein the metal cavity consists of a box body and a cover plate; the metal cavity is internally pumped with vacuum and filled with liquid working medium; the box body and the heat radiating fins are tightly contacted or connected into a whole; the inner wall surface of the box body is provided with capillary cores, and supporting bodies are arranged between the box body and the cover plate; the central part of the inner wall surface of the cover plate is provided with a boss, and the thickness of the boss is 0.2-2.0mm; the cross section area of the boss is larger than or equal to the contact area of the heat source; and the inner wall surface of the cover plate including the boss is provided with capillary cores. The flat-panel vapor chamber has the advantages of simple structure and convenience for manufacturing and processing, can be used for effectively reducing the surface deformation and the contact heat resistance, and has high working medium refluxing efficiency and higher working efficiency.

Description

technical field [0001] The invention belongs to a heat dissipation device of a miniature electronic device, in particular to a flat heat soaking plate, which is used for heat diffusion of a power module. Background technique [0002] In recent years, with the rapid development of the information industry, the integration of transistors has been greatly improved, and the existing electronic devices are developing in the direction of smaller, higher speed, and higher power density, which means greater heat flux density, such as insulated gate double The heat flux density of the pole transistor (IGBT) can be as high as 400W / cm 2 , if the heat dissipation problem of electronic devices is not solved well, its working temperature will be very high, and the high temperature will directly lead to the decrease of system efficiency, work instability, life reduction, thermal damage or even burning of materials and many other problems; thus the heat dissipation problem of electronic com...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a flat soaker, which solves the problem of surface deformation of the contact surface between the existing flat soaker and the heat source, so as to further reduce the contact thermal resistance of the contact surface with the heat source

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