6842results about "Heat exchange apparatus" patented technology

A cooling system and method employing separation chutes and baffles is disclosed. The separation chutes separate the cooled air descending from a heat exchanger positioned above heat-generating equipment in an equipment room from heated air ascending from the heat-generating equipment. Separation of the airflows reduces turbulence and increases cooling efficiencies. The separation chutes are made of a variety of materials, both rigid and flexible, for a variety of applications.

Any particle adhesion onto the surface of a substrate to be processed is prevented. There is provided a substrate processing apparatus characterized by including a transfer chamber for, via a gate to which a substrate accommodating container for accommodation of the substrate is set, performing transfer of the substrate between the same and the substrate accommodating container, a processing chamber for applying a specific process to the substrate, a load-lock chamber for linking the processing chamber with the transfer chamber, and a temperature control unit for at the stage of transferring the substrate into at least one of the transfer chamber and the load-lock chamber, so as for the temperature of the substrate just before the transfer thereof to be higher than the temperature of the interior of the chamber, into which the substrate will be transferred, controlling at least one of the temperature of the substrate and the temperature of the interior of the chamber.

A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring (20) using an electronic cooling device (32) to top of a large-diameter portion (11) to effectively cool the edge ring (20) so that the temperature of the edge ring (20) is similar to that of top of a small-diameter portion (12) of a chuck body (10) to eventually improve the yield ratio while reducing the failure ratio.

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

The present disclosure relates to atomizers for an aerosol delivery device such as a smoking article. The atomizer may include a liquid transport element and a wire extending along at least a portion of a longitudinal length thereof. The wire may define contact portions configured to engage heater terminals and a heating portion configured to produce heat. The heating portion may include a variable coil spacing. In other atomizers, the wire may extend at least partially through the liquid transport element proximate the contact portions. Related inputs, cartridges, aerosol production assemblies, and methods of forming atomizers are also provided.

A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

A vapor escape membrane for use in a heat exchanging device, including a heat pipe or heat sink that runs liquid into a cooling region positioned adjacent to the heat producing device, the vapor escape membrane comprising: a porous surface for removing vapor produced from the liquid in the cooling region, the membrane configured to confine the liquid only within the cooling region. The vapor escape membrane transfers vapor to a vapor region within the heat exchanging device, wherein the membrane is configured to prevent liquid in the cooling region from entering the vapor region. The membrane is configured to include a hydrophobic surface between the membrane and the cooling region, wherein the liquid in the cooling region does not flow through the porous surface. The vapor escape membrane includes a plurality of apertures for allowing vapor to transfer therethrough, each of the apertures having a predetermined dimension.

A group of multiple hollow fibers may be shaped to introduce angular divergence among the fibers, or to introduce a selected longitudinal oscillation into the fibers. In one shaping technique, the fibers are held in parallel while upper and lower crimping assemblies of parallel crimping bars are drawn together on opposite sides of the parallel fibers. When bars of the opposing assemblies draw sufficiently close, they sandwich the fibers in between them, causing each fiber to assume a shape that oscillates as the fiber repeatedly goes over and then under successive bars. Since the crimping bars are aligned at oblique angles to the fibers, the peaks and troughs of successive fibers are offset. While in this position, the fibers are heated and then cooled to permanently retain their shapes. A different shaping technique utilizes a lattice of crisscrossing tines defining multiple apertures. In this technique, the lattice and fibers are positioned so that each fiber passes through one of the apertures. Then, the lattice and/or the fibers are slid apart or together until the lattice holds the fibers in a desired configuration, where the fibers have a prescribed outward divergence relative to each other. While in this position, the fibers are heated and then cooled to permanently retain this angular divergence.

A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly spaced from one another. A top plate covers the bottom plate with the rods compressed therebetween. Channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid. The fluid and its vapor circulate in the channels to convey heat from a warm end of the heat pipe to a cool end. The heat sink is of similar construction.

A dual screen presentation notebook having components that are integrally connected together to allow easy viewing of presentation materials without the users having to sit side by side craning their necks close together facing the same direction but instead can face opposite one another. When the dual screen presentation notebook is switched on, users can either (i) view identical or mirror images of the presentation materials or (ii) different images on the two monitor screens. The dual screen presentation notebook can be easily converted into a tablet computer and can also be used for other applications such as viewing electronic book, electronic photograph and images, videos, movies, etc.

There is herein described energy storage systems. More particularly, there is herein described thermal energy storage systems and use of energy storable material such as phase change material in the provision of heating and/or cooling systems in, for example, domestic dwellings.

A rack has a frame for supporting one or more electronic components. A front panel and a rear panel are attached to the frame. At least one of the front panel and the rear panel comprises a vent having at least one movable louver configured to vary airflow through the vent.

A disk drive box 10 accommodates a plurality of disk drives 20 within a case 11. A side face of each of the drives 20 is provided with a heat-absorbing part 40 including a heat pipe, corresponding to heat producing area HP. The heat taken away by the heat-absorbing part 40 is transmitted to a heat sink 50 of the rear of a backboard 30 via a heat connector 60. The heat sink 50 is cooled by cooling air flowing through an air duct 7. By cooling the drive 20 with the heat pipe, clearances between the drives 20 can be substantially eliminated, and it is made unnecessary to form an opening for air cooling in the backboard 30. Thus, size reduction is possible, and it is possible to increase the degree of freedom for a wiring pattern formed on the backboard 30.

An air conditioning cooling apparatus and method which includes the steps of supplying cooling air generated from a cooling apparatus into an air passageway formed below a floor; guiding the cooling air within the air passageway into an equipment assembly disposed on the floor through an opening located in the floor; communicating the cooling air introduced into the equipment assembly into a plenum and introducing the air released from within the equipment into the plenum and communicating the released air through the cooling apparatus for cooling the released air. The method permits temperature differential between the air supplied to the air passageway and the air introduced into the plenum from the equipment assembly to be 45.degree. F. to substantially 40.degree. F. so as to reduce the power necessary for operating on the fan of the blowing apparatus. The equipment assembly utilizes an air flow control mechanism so as to substantially evenly distribute cooling air to the equipment.

In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.

A method and apparatus for embedding features and controlling material composition in a three-dimensional structure (130) is disclosed. The invention enables the control of material characteristics, within a structure (130) made from a plurality of materials, directly from computer renderings of solid models of the components. The method uses stereolithography and solid model computer file formats to control a multi-axis head (480) in a directed material deposition process (123). Material feedstock (126, 127) is deposited onto a pre-heated substrate (19). Depositions (15) in a layer-by-layer pattern, defined by solid models (141, 146), create a three-dimensional article having complex geometric details. Thermal management of finished solid articles (250-302), not available through conventional processing techniques, is enabled by embedded voids (152) and/or composite materials (126, 127), which include dissimilar metals (210, 216). Finished articles control pressure drop and produce uniform coolant flow and pressure characteristics. High-efficiency heat transfer is engineered within a solid structure by incorporating other solid materials with diverse indexes. Embedding multi-material structures (132, 134) within a normally solid component (141) produces articles with diverse mechanical properties. Laser and powder delivery systems (420, 170) are integrated in a multi-axis deposition head (480) having a focused particle beam (502) to reduce material waste.

A seal housing is provided to substantially cover at least one duct wall of vane array duct of a gas turbine engine, and one example arrangement is employed in a mid-turbine frame. The arrangement provides improved sealing of the vane array duct through the provision of a plurality of cavities extending along the duct wall. The arrangement may also include insulation tubes to assist in sealing around load transfer spokes passing through the vane array.

A metallic material of the invention which comprises, in mass %, C: not more than 0.2%, Si: 0.01-4%, Mn: 0.05-2%, P: not more than 0.04%, S: not more than 0.015%, Cr: 10-35%, Ni: 30-78%, Al: not less than 0.005% but less than 4.5%, N: 0.005-0.2%, and one or both of Cu: 0.015-3% and Co: 0.015-3%, with the balance substantially being Fe, and of which the value of 40Si+Ni+5Al+40N+10 (Cu+Co), wherein the symbols of elements represent the contents of the respective elements, is not less than 50 and has excellent corrosion resistance in an environment in which metal dusting is ready to occur and, therefore, can be utilized as or in heating furnace pipes, piping systems, heat exchanger pipes and so forth to be used in a petroleum refinery or in petrochemical plants, and can markedly improve the equipment durability and safety.

Systems and methods are provided for cooling an electronics rack, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and configured to provide system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger associated with the rack for cooling air passing through the rack. A controller monitors the system coolant and automatically shuts off flow of system coolant through the heat exchanger, using at least one isolation valve, upon detection of failure at one of the MCUs, while allowing the remaining operational MCU to provide system coolant to the electronics subsystem for liquid cooling thereof.

An electronic chassis distributes fluids to adjacent chassis and electronic modules housed within the chassis. Provision is made for the detection, containment, and removal of liquid spilled within the chassis. The fluids may be used as coolants, and provision is made for heat exchanger modules to be included within the chassis. Provision is further made to include fluid sensors and actuators, allowing for monitoring and control of fluid distribution by a controller.

An index of air re-circulation in a data center having one or more racks is determined to identify the level of heated air re-circulation into cooling fluid delivered to the one or more racks. The one or more racks comprise inlets and outlets and are positioned along a cool aisle and a hot aisle. The index is calculated by dividing the enthalpy rise due to infiltration of heated air into the cool aisle and the total enthalpy rise of the heated air from the outlets of the one or more racks.

A turbine shroud assembly includes forward and aft hangers, an axisymmetric plenum assembly, ceramic shroud segments, ceramic spacers, and forward and aft rope seals. The plenum assembly supplies impingement cooling to the shroud and the hangers. The impingement cooling to the forward and aft hangers is controlled independently to improve blade tip clearance. The rope seals are radially inward from the hangers and reduce cooling flow leakage. The turbine shroud assembly can operate in a higher temperature environment using less cooling flow than the prior art.

A thermal interface material includes a mechanically compliant vertically aligned nanofiber film and a binder material for joining the nanofibers of the film to the surfaces of two substrates. Preferably, the binder material comprises a non-hydrocarbon-based material such as a metallic eutectic with a melting temperature below a nanofiber thermal damage threshold temperature of the film. The film is grown on a substrate which is then bonded to another substrate by the binder material in an adhesion process that may include pressure and heat. Alternatively, the film may be released from the substrate to produce a stand-alone thermal tape which may later be placed between two substrates and bonded.

A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating device is coupled to at least one of the attachment points and to the first fin. The force-generating device is configured to exert a force that keeps the heat sink securely coupled to the retainer when the force-generating device is coupled to the attachment points.

A heat exchanger exchange-tube cleaning lance positioning system that includes a three axis cleaning lance positioning mechanism that is attachable to the end of a heat exchanger and that is controlled by a lance position computer controller that determines the locations of each of the openings of the exchange-tubes of the heat exchanger by analyzing an image signal generated by a camera mounted to the three axis cleaning lance positioning mechanism and then positions a connected exchange tube cleaning lance into and through each of the exchange-tube passageways to clean the exchange-tube passageways automatically.

Methods and apparatus for extracting stored thermal energy using a combined internal and external melt cycle are disclosed. The present invention relates, in one aspect, to a heat exchange system which uses both an internal melt cycle and an external melt cycle to extract stored thermal energy. The heat exchange system includes a thermal energy storage medium and a heat exchanger which is in communication with the thermal energy storage medium. The heat exchanger is arranged to hold a heat exchange liquid and to facilitate the indirect transfer of heat between the heat exchange liquid and the thermal energy storage medium. The heat exchange system further includes a fluid supply which provides a fluid which directly contacts the thermal energy storage medium to transfer heat between the fluid and the thermal energy storage medium.

A wash down filtered fan apparatus for cooling and filtering a cabinet enclosure housing electromechanical equipment and sensitive electronics is provided consisting of an intake housing and exhaust housing. A blower mounted within an intake housing induces ambient air for cooling while a plurality of downwardly angled baffles provide protection at both intake and exhaust ports preventing the threat of detrimental external elements consisting of dust, residue, rain, pressurized water and other splashing liquids from penetrating such apparatus and cabinet enclosure housing.

Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.