Edge ring cooling module for semi-conductor manufacture chuck

Abstract

An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring (20) using an electronic cooling device (32) to top of a large-diameter portion (11) to effectively cool the edge ring (20) so that the temperature of the edge ring (20) is similar to that of top of a small-diameter portion (12) of a chuck body (10) to eventually improve the yield ratio while reducing the failure ratio.

Description

FIELD OF THE INVENTION[0001]This invention is in reference to the new structure of edge ring cooling module for semiconductor manufacturing chuck designed to effectively cool the edge ring equipped in semiconductor manufacturing chuck.DISCUSSION OF RELATED ART[0002]As shown in FIG. 1 and FIG. 2, semiconductor manufacturing electro static chuck (ESC) usually consists of chuck body (10), composed of disc-shaped large-diameter portion (11) and small-diameter portion (12) upwardly projected from top center of the above large-diameter portion (11) to form a disc shape of smaller diameter compared to the above large-diameter portion (11), and edge ring (20) inserted to the outside of the above small-diameter portion (12). The above chuck body (10) is furnished with electrostatic generator, not shown in the drawings, to generate static electricity to the above chuck body (10) and fix the wafer on top of the small-diameter portion (12).[0003]ESC configuration is described well in a number o...

AI Technical Summary

Benefits of technology

The present invention provides an edge ring cooling module for a new structure of semiconductor manufacturing chuck. The module features a lower thermal conductivity ring and an electronic cooling device fixed on top of it. An upper thermal conductivity ring is fixed on top of the electronic cooling device to form a cooling system. The lower thermal conductivity ring is inserted into the small-diameter portion of the chuck and fixed to the top of the large-diameter portion and the edge ring. The lower and upper thermal conductivity rings are thermally separated from the small-diameter portion to improve cooling efficiency. The cooling module is made of ceramic, zirconium, or quartz to prevent plasma impact. The invention effectively cooling the edge ring to reduce temperature and improve yield ratio while reducing failure ratio.

Problems solved by technology

But the cooling device is supplied to the above chuck body (10) only thus cannot cool the above edge ring (20) enough.

Top surface temperature of edge ring (20) is uneven to cause high failure probability in wafer-processing semiconductor manufacturing progress.

The problem arises in all types of semiconductor manufacturing chucks equipped with edge ring on the top besides the above mentioned ESC.

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