Edge ring cooling module for semi-conductor manufacture chuck

a cooling module and semi-conductor technology, applied in electrical devices, heat exchange devices, light and heating devices, etc., can solve the problems of high failure probability in wafer processing semiconductor manufacturing progress, inability to cool the above edge ring, etc., to reduce the failure ratio, improve the yield ratio, and effectively cool the edge ring

Inactive Publication Date: 2014-09-18
TECHEST
View PDF12 Cites 247 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0015]The edge ring cooling module for semiconductor manufacturing chuck in this invention forcibly exhausts the heat of edge ring (20) using electronic cooling device (32) to top of the above large-diameter portion (11) to

Problems solved by technology

But the cooling device is supplied to the above chuck body (10) only thus cannot cool the above edge ring (20) enough.
Top surface temperature of edge ring (20) is uneven to cause high failure probabi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Edge ring cooling module for semi-conductor manufacture chuck
  • Edge ring cooling module for semi-conductor manufacture chuck
  • Edge ring cooling module for semi-conductor manufacture chuck

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021]Hereafter, the invention is described in detail by the attached drawings.

[0022]FIG. 3 or FIG. 5 illustrates the edge ring cooling module for semiconductor manufacturing chuck according to this invention showing ESC Claim example to fix wafer using static electricity.

[0023]In the same way as before, the above ESC consists of chuck body (10), composed of disc-shaped large-diameter portion (11) and small-diameter portion (12) upwardly projected from top center of the above large-diameter portion (11) to form a disc shape of smaller diameter compared to the above large-diameter portion (11), and edge ring (20) inserted to the outside of the above small-diameter portion (12).

[0024]Then electrostatic generator and cooling device are furnished to the above chuck body (10), not shown in the drawings, to generate static electricity to the above chuck body (10), fix the wafer on top of the chuck body and effectively cool the chuck body (10) heated by plasma in the semiconductor manufact...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring (20) using an electronic cooling device (32) to top of a large-diameter portion (11) to effectively cool the edge ring (20) so that the temperature of the edge ring (20) is similar to that of top of a small-diameter portion (12) of a chuck body (10) to eventually improve the yield ratio while reducing the failure ratio.

Description

FIELD OF THE INVENTION[0001]This invention is in reference to the new structure of edge ring cooling module for semiconductor manufacturing chuck designed to effectively cool the edge ring equipped in semiconductor manufacturing chuck.DISCUSSION OF RELATED ART[0002]As shown in FIG. 1 and FIG. 2, semiconductor manufacturing electro static chuck (ESC) usually consists of chuck body (10), composed of disc-shaped large-diameter portion (11) and small-diameter portion (12) upwardly projected from top center of the above large-diameter portion (11) to form a disc shape of smaller diameter compared to the above large-diameter portion (11), and edge ring (20) inserted to the outside of the above small-diameter portion (12). The above chuck body (10) is furnished with electrostatic generator, not shown in the drawings, to generate static electricity to the above chuck body (10) and fix the wafer on top of the small-diameter portion (12).[0003]ESC configuration is described well in a number o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67
CPCH01L21/67103H01L21/67109H01L21/6831H01L21/68735H01L21/687
Inventor IM, CHAE ILJANG, CHEOL WON
Owner TECHEST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap