63 results about "Electronics cooling" patented technology

A cooling system for an electrified vehicle includes a first cooling loop for circulating coolant for cooling at least one of power electronics and a motor / generator of the vehicle. The first coolant loop includes a heat exchanger for exchanging heat with the coolant in the first cooling loop. A second cooling loop is provided for circulating coolant for cooling a battery of the vehicle. The second cooling loop includes a coolant chiller connected to a refrigeration system of the vehicle for exchanging heat in the coolant received from the battery with the refrigeration system of the vehicle.

The invention provides an electronic cooling control method and device based on a large language model and electronic equipment, and relates to the technical field of electronic cooling control. The method comprises the following steps of: performing semantic analysis on an electronic cooling natural language instruction input by a user by a main control model through a collaborative architecture of the main control model and a sub-control model of each electronic cooling device; the main control model constructs a physical model for controlling the target electronic cooling equipment according to the semantic analysis result, and determines preliminary control parameters for controlling the target electronic cooling equipment according to the physical model and the current actual operation state of the target electronic cooling equipment; and then the target electronic cooling equipment receives the preliminary control parameters, a sub-control model of the target electronic cooling equipment analyzes the preliminary control parameters, whether the preliminary control parameters are adjusted or not is determined according to an analysis result, and intelligent control, fault prediction and natural language interaction of the electronic cooling equipment are achieved.

A three dimensional (3D) integrated circuit (IC) chip can include a multi-layer structure comprising a group of vertically stacked semiconductor layers. The multi-layer structure can include a group of processor cores distributed across the semiconductor layers, and a group of Through Silicon Vias (TSVs) arranged within the layers to facilitate electrical connections between the layers. The 3D IC chip can be optimized for thermal management based on a predictive model, enabling effective temperature control when utilized with a thermal management system that monitors and adjusts a cooling strategy of the 3D IC chip.

An electronics cooling system including an electronics magazine. The electronics magazine includes a magazine body, one or more capsule sockets, one or more interface shorings positioned within the magazine body relative to the one or more capsule sockets and a magazine heat conductive interface positioned within the magazine body relative to at least one of the one or more capsule sockets. The cooling system includes one or more electronics capsules having a capsule housing, the one or more electronics capsules includes an electronics unit within the capsule housing and a capsule cooling system. The capsule cooling system includes a capsule heat conductive interface in communication with the electronics unit.

The density and power consumption of modern integrated circuits, such as Graphic Processing Units (GPUs), Central Processing Units (CPUs), and Network Processing Units (NPUs) is growing rapidly, which necessitates designing advanced cooling systems. Existing solutions for characterizing and validating these cooling system are inadequate. A flexible, scalable Thermal Test Vehicle (TTV) is disclosed which is based on an array of power transistors, measurement / control circuitry, and onboard computer. The TTV is configured for characterizing the performance of electronic cooling solutions under a variety of operating conditions.

Apparatus, devices, systems, subsystems and methods for passively balancing and controlling coolant flow throughout complex fluidic pipe network to be implemented in electronics cooling applications. Systems, sub-systems, devices and methods for providing cooling to hardware components, and more specifically to control flow distribution between sub-systems, devices and methods for thermal management of hardware in server racks and any other hardware components or equipment for the information and communications technology (ICT) industry.

Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.

The invention belongs to the technical field of electronic product cooling, and discloses a corrugated pipe structure which comprises a corrugated pipe, the corrugated pipe comprises at least two metal layers, all the metal layers are sequentially arranged in the radial direction of the corrugated pipe, in every two adjacent metal layers, the metal layer located on the outer layer wraps the outer wall of the metal layer located on the inner layer, and the metal layer located on the outer wall wraps the metal layer located on the inner layer. And one of every two adjacent metal layers is a copper layer, and the other of every two adjacent metal layers is a stainless steel layer, so that the flexibility and the sealing performance of the corrugated pipe can be improved.

Heat dissipation device (104) for an electronic cooling system (100) with an electronic component (102) which generates heat in response to receiving an electric current, wherein the heat dissipation device (104) comprises: a housing (106) that is attached to the electronic component (102) and absorbs heat from the electronic component (102), wherein the housing (106) has a surface (108) that defines a chamber (110); a first liquid (116) which is contained in the chamber (110) of the housing (106) and receives heat from the housing (106), wherein the first liquid (116) has a first boiling temperature; a sorption material (120) immersed in the first liquid (116); and a second liquid (124) which is adsorbed by the sorption material (120) and has a second boiling point which is higher than the first boiling point of the first liquid (116); wherein the first liquid (116) evaporates to a first vapor (118) when the first liquid (116) reaches the first boiling temperature; and wherein the second liquid (124) is desorbed from the sorption material (120) when the second liquid (124) and the sorption material (120) reach a desorption temperature below the second boiling temperature, and wherein the second liquid (124) evaporates to a second vapor (120) when the second liquid (124) reaches the second boiling temperature.

The invention relates to a fluid supply device for an electrochemical system, comprising at least one housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) for introducing a fluid, in particular air, into the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 16i) in the fluid inlet (14a; 16b, 16b; 16c, 16c; 16d, 16d; 16e, 16e; 16f, 16f; 16 g; the time is 16 hours; 16i) arranged in the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) for supplying power to an electrochemical cell (20a; 20b; 20b; 20c, 20c; 20d, 20d; 20e, 20e; 20f, 20f; 20 g; 20 hours; 18i) for supplying fluid to a process fluid unit (18a; 18b, 18b; 18c, 18c; 18 d; 18e, 18e; 18f, 18f; 18 g; the time is 18 hours; it is proposed that the fluid supply device comprises a housing (14a; 18b) arranged in the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) of the electronic cooling unit (22a; 22b; 22c; 22c; 22 d; 22e; 22e; 22f, 22f; 22 g; the time is 22 hours; 22i) for conducting a fluid on an electronic unit (24a; 24b) of the electrochemical system by means of a fluid; 24b, 24b; 24c, 24c; 24 d; 24 d; 24e, 24e; 24f, 24f; 24 g; the time is 24 hours; 24i) of the heat exchanger (24).

Task: To provide a technique that can reduce the volume of a moisture-proof space that seals a light source module in a moisture-proof manner. Solution: A light source module 100 comprises a first laser 117 for emitting red light, a second laser 118 for emitting green light, a third laser 119 for emitting blue light, an electronic cooling module 530 for adjusting the temperature of the first laser 117, a first housing 410 in which the first laser 117 is housed, and a second housing 420 in which the second laser 118 and the third laser 119 are housed.

The utility model provides a refrigeration device of an electronic refrigeration cup, which relates to the field of insulin electronic refrigeration cups and comprises a refrigeration cup component, the refrigeration cup component comprises a shell, a top cover, an inner container and a hollow layer, the refrigeration cup component is used for providing storage space for insulin, the top cover is located at the top of the shell and movably connected with the shell, and the inner container is arranged in the shell. The inner container is located in an inner cavity of the shell and fixedly connected with the shell, the hollow layer is located between the shell and the inner container, and a refrigeration assembly is installed in an inner cavity of the top cover; the semiconductor refrigeration sheet is adopted as a refrigeration source, the refrigeration device has the advantages of being high in refrigeration efficiency and response speed, effective heat dissipation of the refrigeration assembly is guaranteed through cooperation of the cooling fin and the cooling fan, the overheating phenomenon is avoided, the service life of the device is prolonged, and the temperature control chip in the integrated control panel is combined with the temperature sensor, so that the refrigeration efficiency is improved. And the temperature in the refrigeration cup can be monitored in real time and accurately controlled, so that the effectiveness and the safety of medicines are ensured.

Cooling system for electronics, which includes: a housing (110) containing: a base section (120) with sides (121) and a bottom surface (123) that define a cavity; and a cover section (116) that encloses the base section (120) and contains cooling elements (118, 119) attached to it; electronic components; a shield (244) which is arranged in the cavity between the electronic components and the cover section (116); a vertical element arranged below the shield (244) to define a first fluid chamber between one side of the vertical element and one side of the base section (120) and a second fluid chamber between an opposite side of the vertical element and another side of the base section (120), wherein the electronic components are arranged in the second fluid chamber; and a cooling fluid (260) arranged in the cavity and having a fluid level below at least one section of the shielding (244), and either: the housing (110) is mounted at an angle of inclination relative to the horizontal; or the housing (110) is mounted parallel to the horizontal and the shielding (244) is mounted at an angle of inclination relative to the horizontal; characterized by the fact that an upper edge of the vertical element is connected to an edge of the shield (244); or that an upper edge of the vertical element and an edge of the shield (244) are arranged below the fluid level; or that a lower edge of the vertical element contains several openings to allow a fluid to flow from the first fluid chamber to the second fluid chamber; or that the vertical element contains a gate printed circuit board (gate PCB) (254); or that the electronic components comprise at least one power inverter (250), busbars (210), a current sensor (253) and a volume capacitor (224); or that the electronic components comprise: a power inverter module (250) containing several circuit breakers; a current sensor (253) which is connected to the power inverter module (250) via first busbars (210); AC busbars (128) connected to the current sensor (253); a volume capacitor (224) which is connected to the power inverter module (250) via second busbars (210); and DC busbars (132) connected to the volume capacitor (224).

A technique for recovering power from data center waste heat involves an organic Rankine cycle which includes pumping an organic working fluid through a low-temperature preheater chamber configured to exchange relatively low-temperature waste heat from low-temperature data storage devices to the organic working fluid flowing through the preheater chamber, pumping the working fluid through a high-temperature evaporator thermally coupled with the preheater chamber and configured to exchange relatively high-temperature waste heat from high-temperature CPUs to the working fluid flowing through the evaporator, and pumping the working fluid vapor from the evaporator to an expander for generating power via expansion of the working fluid. The preheater and evaporator may be directly incorporated with the enclosure box housing the various heat-generating components.

An electronics cooling system including an electronics magazine. The electronics magazine includes a magazine body, one or more capsule sockets, one or more interface shorings positioned within the magazine body relative to the one or more capsule sockets and a magazine heat conductive interface positioned within the magazine body relative to at least one of the one or more capsule sockets. The cooling system includes one or more electronics capsules having a capsule housing, the one or more electronics capsules includes an electronics unit within the capsule housing and a capsule cooling system. The capsule cooling system includes a capsule heat conductive interface in communication with the electronics unit.

A technique for recovering power from data center waste heat involves an organic Rankine cycle which includes pumping an organic working fluid through a low-temperature preheater chamber configured to exchange relatively low-temperature waste heat from low-temperature data storage devices to the organic working fluid flowing through the preheater chamber, pumping the working fluid through a high-temperature evaporator thermally coupled with the preheater chamber and configured to exchange relatively high-temperature waste heat from high-temperature CPUs to the working fluid flowing through the evaporator, and pumping the working fluid vapor from the evaporator to an expander for generating power via expansion of the working fluid. The preheater and evaporator may be directly incorporated with the enclosure box housing the various heat-generating components.

The utility model discloses an electronic cooling water pump for a vehicle, which is applied to a thermal management module of a new energy automobile and comprises a pump body, a rotating shaft, an impeller, a motor stator and a motor rotor. After entering from the liquid inlet, cooling liquid is filled in the hollow inner cavity of the pump cavity and sequentially passes through the first cooling face, the second cooling face and the third cooling face to achieve sufficient contact cooling on the permanent magnet, the motor stator, the periphery of the rotating shaft and the inner side of the pump cover, and compared with a traditional electronic water pump which can only cool two faces, the cooling effect of the electronic water pump is more sufficient, and the service life of the electronic water pump is prolonged. The temperature rise is lower, which means that the power density of the electronic water pump can be higher; or under the same power, the weight of the material can be saved. The axial length is smaller, the size is more compact, and the axial force can be exactly counteracted with the axial force generated when the impeller rotates to work, or the axial force is greatly reduced, so that the service life of the thrust sliding bearing on the rotating shaft is effectively prolonged.

The utility model discloses an immersed liquid cooling heat dissipation system device, which relates to the technical field of liquid cooling heat dissipation equipment and comprises a condensation cooling coil assembly, a heat exchanger, a compressor, a refrigerant pipeline and an expansion valve which are sequentially connected in series through the refrigerant pipeline. The condensation cooling coil assembly, the compressor, the heat exchanger and the expansion valve are connected in series to form a refrigeration cycle system; an intermediate heat exchanger is mainly reduced, the heat exchange efficiency is improved, the electronic cooling liquid is directly conveyed outdoors for heat exchange, and a natural cold source is utilized as much as possible to cool the electronic cooling liquid. When the environment temperature is high, the electronic cooling liquid is cooled in an auxiliary mode through refrigeration of the compressor, and it is ensured that the electronic cooling liquid is dissipated in time.

An air purifier includes a housing having a vented upper surface, a motorized fan assembly positioned within an interior volume of the housing and operable for discharging a filtered airstream through the vented upper surface, a hollow top cover, and an electric circuit, e.g., wireless charging electronics. The hollow top cover at least partially defines therein an electronics bay, floor vents configured to admit a portion of the filtered airstream into the electronics bay as a cooling airstream, at least one primary exhaust port for discharging the filtered airstream to a surrounding ambient environment, and at least one secondary exhaust port for discharging the cooling airstream to the surrounding ambient environment. The electric circuit is positioned in the electronics bay within the cooling airstream.

A cooling system for an electrified vehicle includes a first cooling loop for circulating coolant for cooling at least one of power electronics and a motor / generator of the vehicle. The first coolant loop includes a heat exchanger for exchanging heat with the coolant in the first cooling loop. A second cooling loop is provided for circulating coolant for cooling a battery of the vehicle. The second cooling loop includes a coolant chiller connected to a refrigeration system of the vehicle for exchanging heat in the coolant received from the battery with the refrigeration system of the vehicle.

The invention relates to the field of cooling liquid, in particular to a composition, a preparation method and application thereof and electronic cooling liquid. The composition is prepared from a hexafluoropropylene oligomer, perfluorocyclohexane, fluoropyridine and an antioxidant. The composition has the advantages of high stability, low viscosity, high thermal conductivity and low cost, and can be used as an electronic cooling liquid.

The utility model discloses a 3D printer extrusion device with electronic cooling and high integration level, and relates to the technical field of 3D printers, the device comprises a front shell, a rear shell, a drag chain frame and a hardware support, the rear shell and the front shell abut against each other; the drag chain frame is arranged between the front shell and the rear shell; the hardware bracket is arranged at the bottom of the drag chain frame; the cooling assembly comprises a control panel, the control panel is arranged on one side of the rear shell, a main body plastic part is installed in the rear shell, a heat conduction aluminum block is arranged on one side of the main body plastic part, a TEC electronic cooling piece is installed on one side of the heat conduction aluminum block, and an extrusion assembly for extruding material wires is arranged on one side of the rear shell. The 3D printer integrates the functions of various 3D printers, namely a double-gear process extrusion function, a material cutting cutter function, an RGB indicator lamp function, a model blowing function and a laser sensor leveling function. The electronic cooling function of the throat pipe is actively controlled; and the integration and equipment adaptability of the extrusion device of the 3D printer are greatly improved under the limited volume.

An aircraft light unit is disclosed herein. The aircraft light unit includes a housing having a first side and an opposing second side, a light coupled to the first side of the housing, a circuit board assembly coupled to second side of the housing, a thermoelectric cooler coupled to the circuit board assembly and configured to dissipated heat from the circuit board assembly, and a heat sink disposed over the thermoelectric cooler and configured to dissipate heat from the thermoelectric cooler.

A housing assembly (11) for a battery module (10), comprising an electronics housing (12) for electronics components having an electronics cooling channel opening (13), and comprising a battery housing (15) for battery cells having a first battery cooling channel opening (16) and a second battery cooling channel opening (17), wherein, in an assembled state of the housing assembly (11), the electronics cooling channel opening (13) is positioned adjacently to the first battery cooling channel opening (16), and a drip edge (20) partially surrounding the electronics cooling channel opening (13) is formed on the electronics cooling channel opening (13), wherein the drip edge (20) extends beyond the electronics cooling channel opening (13) in an opening direction of the electronics cooling channel opening (13). The invention also relates to an electronics housing (12), a battery housing (15), and a battery module (10).

A packaged electronic device (100) includes a package structure (120) enclosing first and second semiconductor dies (101, 102), a die attach pad (104) having a first side (130) attached to one of the dies (101, 102) and a second side (144) exposed along a side (142) of the package structure (120), and a substrate (110) including a first metal layer (118) exposed along another side (141) of the package structure (120), a second metal layer (114, 116) soldered to contacts (122, 132) of the dies (101, 102), and an isolation layer (112) extending between and separating the first and second metal layers (118, 114, 116).

A vehicular thermal management system includes an HVAC subsystem including a compressor, a heating-side expansion, an exterior heat exchanger, a cooling-side expansion valve, an evaporator, a distribution line allowing at least a portion of a refrigerant discharged from the exterior heat exchanger to be directed from the upstream side of the cooling-side expansion valve to the compressor, and a battery disposed on the distribution line. The system also includes a power electronics cooling subsystem including a power electronic component, a power electronic radiator, a power electronic pump disposed between the power electronic component and the power electronic radiator, and a bypass line allowing at least a portion of a power electronics coolant discharged from the power electronic component to bypass the power electronic radiator; and a heat exchanger including a first passage fluidly connected to the distribution line, and a second passage fluidly connected to the bypass line.

Provided is a technique by which it is possible to reduce a volume of a moisture-proof space for sealing a light source module against moisture. A light source module includes a first laser that emits red light, a second laser that emits green light, a third laser that emits blue light, an electronic cooling module that adjusts a temperature of the first laser, a first case that houses the first laser, and a second case that houses the second laser and the third laser.

Devices and methods for providing cooling to electronics equipment is provided herein. A cooling manifold includes a first substrate having a first hole. A layer of nano-particles is disposed between the first substrate and an electronics surface associated with the electronics equipment. The layer of nano-particles defines a seal between the first substrate and the electronics surface, and further defines a channel extending within the seal. After an application of heat, the layer of nano-particles forms the seal such that the device is fluid impermeable, so as to allow a coolant fluid to enter through the first hole to flow through the channel to reduce or remove the heat generated by the electronics equipment associated with the electronics surface.

The present application provides an electronic cooling control method, device, and electronic device based on a large language model, which relates to the technical field of electronic cooling control. Through the collaborative architecture of the main control model and the sub-control models of each electronic cooling device, the main control model performs semantic parsing on the natural language instructions of electronic cooling input by the user; the main control model constructs a physical model for controlling the target electronic cooling device according to the semantic parsing result, and determines the preliminary control parameters for controlling the target electronic cooling device according to the physical model and the current actual operating state of the target electronic cooling device; further, when the target electronic cooling device receives the preliminary control parameters, the sub-control model of the target electronic cooling device analyzes the preliminary control parameters, and determines whether to adjust the preliminary control parameters according to the analysis result, so as to realize the intelligent control, fault prediction, and natural language interaction of the electronic cooling device.

The utility model discloses a dehumidification machine core fixing structure which comprises a heat dissipation plate, a water condensation piece, an electronic refrigeration piece, a flow guide disc and a fixing base. The heat dissipation plate is provided with an assembly area, and the assembly area is provided with an insertion hole and a first screw hole; the flow guide disc is provided with insertion columns, the insertion columns are connected into the insertion holes to be assembled on the heat dissipation plate, and the flow guide disc is provided with a bonding layer so that the flow guide disc can be bonded and fixed to the assembling area. The front end of the disc cavity is open; the fixing seats are mounted on the two sides of the water condensation piece, and the fixing seats and the water condensation piece partially extend into the disc cavity; the fixing seat is provided with a second screw hole, and the heat dissipation plate is connected with the fixing seat so that the second screw hole can be matched with the first screw hole. The fixing seat is provided with a screw, and the screw penetrates through the first screw hole and the second screw hole at the same time to lock the fixing seat on the heat dissipation plate; the electronic refrigeration sheet is placed in the assembly area, and the electronic refrigeration sheet is connected with the water condensation piece so as to be tightly pressed on the heat dissipation plate through the water condensation piece. The device has the advantages of simple structure, compact matching, reasonable design and the like; therefore, the device is a product with excellent technical and economical performance.