27 results about "Electronics cooling" patented technology

The density and power consumption of modern integrated circuits, such as Graphic Processing Units (GPUs), Central Processing Units (CPUs), and Network Processing Units (NPUs) is growing rapidly, which necessitates designing advanced cooling systems. Existing solutions for characterizing and validating these cooling system are inadequate. A flexible, scalable Thermal Test Vehicle (TTV) is disclosed which is based on an array of power transistors, measurement / control circuitry, and onboard computer. The TTV is configured for characterizing the performance of electronic cooling solutions under a variety of operating conditions.

The invention relates to a fluid supply device for an electrochemical system, comprising at least one housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) for introducing a fluid, in particular air, into the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 16i) in the fluid inlet (14a; 16b, 16b; 16c, 16c; 16d, 16d; 16e, 16e; 16f, 16f; 16 g; the time is 16 hours; 16i) arranged in the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) for supplying power to an electrochemical cell (20a; 20b; 20b; 20c, 20c; 20d, 20d; 20e, 20e; 20f, 20f; 20 g; 20 hours; 18i) for supplying fluid to a process fluid unit (18a; 18b, 18b; 18c, 18c; 18 d; 18e, 18e; 18f, 18f; 18 g; the time is 18 hours; it is proposed that the fluid supply device comprises a housing (14a; 18b) arranged in the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) of the electronic cooling unit (22a; 22b; 22c; 22c; 22 d; 22e; 22e; 22f, 22f; 22 g; the time is 22 hours; 22i) for conducting a fluid on an electronic unit (24a; 24b) of the electrochemical system by means of a fluid; 24b, 24b; 24c, 24c; 24 d; 24 d; 24e, 24e; 24f, 24f; 24 g; the time is 24 hours; 24i) of the heat exchanger (24).

Task: To provide a technique that can reduce the volume of a moisture-proof space that seals a light source module in a moisture-proof manner. Solution: A light source module 100 comprises a first laser 117 for emitting red light, a second laser 118 for emitting green light, a third laser 119 for emitting blue light, an electronic cooling module 530 for adjusting the temperature of the first laser 117, a first housing 410 in which the first laser 117 is housed, and a second housing 420 in which the second laser 118 and the third laser 119 are housed.

The utility model provides a refrigeration device of an electronic refrigeration cup, which relates to the field of insulin electronic refrigeration cups and comprises a refrigeration cup component, the refrigeration cup component comprises a shell, a top cover, an inner container and a hollow layer, the refrigeration cup component is used for providing storage space for insulin, the top cover is located at the top of the shell and movably connected with the shell, and the inner container is arranged in the shell. The inner container is located in an inner cavity of the shell and fixedly connected with the shell, the hollow layer is located between the shell and the inner container, and a refrigeration assembly is installed in an inner cavity of the top cover; the semiconductor refrigeration sheet is adopted as a refrigeration source, the refrigeration device has the advantages of being high in refrigeration efficiency and response speed, effective heat dissipation of the refrigeration assembly is guaranteed through cooperation of the cooling fin and the cooling fan, the overheating phenomenon is avoided, the service life of the device is prolonged, and the temperature control chip in the integrated control panel is combined with the temperature sensor, so that the refrigeration efficiency is improved. And the temperature in the refrigeration cup can be monitored in real time and accurately controlled, so that the effectiveness and the safety of medicines are ensured.

Cooling system for electronics, which includes: a housing (110) containing: a base section (120) with sides (121) and a bottom surface (123) that define a cavity; and a cover section (116) that encloses the base section (120) and contains cooling elements (118, 119) attached to it; electronic components; a shield (244) which is arranged in the cavity between the electronic components and the cover section (116); a vertical element arranged below the shield (244) to define a first fluid chamber between one side of the vertical element and one side of the base section (120) and a second fluid chamber between an opposite side of the vertical element and another side of the base section (120), wherein the electronic components are arranged in the second fluid chamber; and a cooling fluid (260) arranged in the cavity and having a fluid level below at least one section of the shielding (244), and either: the housing (110) is mounted at an angle of inclination relative to the horizontal; or the housing (110) is mounted parallel to the horizontal and the shielding (244) is mounted at an angle of inclination relative to the horizontal; characterized by the fact that an upper edge of the vertical element is connected to an edge of the shield (244); or that an upper edge of the vertical element and an edge of the shield (244) are arranged below the fluid level; or that a lower edge of the vertical element contains several openings to allow a fluid to flow from the first fluid chamber to the second fluid chamber; or that the vertical element contains a gate printed circuit board (gate PCB) (254); or that the electronic components comprise at least one power inverter (250), busbars (210), a current sensor (253) and a volume capacitor (224); or that the electronic components comprise: a power inverter module (250) containing several circuit breakers; a current sensor (253) which is connected to the power inverter module (250) via first busbars (210); AC busbars (128) connected to the current sensor (253); a volume capacitor (224) which is connected to the power inverter module (250) via second busbars (210); and DC busbars (132) connected to the volume capacitor (224).

A technique for recovering power from data center waste heat involves an organic Rankine cycle which includes pumping an organic working fluid through a low-temperature preheater chamber configured to exchange relatively low-temperature waste heat from low-temperature data storage devices to the organic working fluid flowing through the preheater chamber, pumping the working fluid through a high-temperature evaporator thermally coupled with the preheater chamber and configured to exchange relatively high-temperature waste heat from high-temperature CPUs to the working fluid flowing through the evaporator, and pumping the working fluid vapor from the evaporator to an expander for generating power via expansion of the working fluid. The preheater and evaporator may be directly incorporated with the enclosure box housing the various heat-generating components.

The utility model discloses an electronic cooling water pump for a vehicle, which is applied to a thermal management module of a new energy automobile and comprises a pump body, a rotating shaft, an impeller, a motor stator and a motor rotor. After entering from the liquid inlet, cooling liquid is filled in the hollow inner cavity of the pump cavity and sequentially passes through the first cooling face, the second cooling face and the third cooling face to achieve sufficient contact cooling on the permanent magnet, the motor stator, the periphery of the rotating shaft and the inner side of the pump cover, and compared with a traditional electronic water pump which can only cool two faces, the cooling effect of the electronic water pump is more sufficient, and the service life of the electronic water pump is prolonged. The temperature rise is lower, which means that the power density of the electronic water pump can be higher; or under the same power, the weight of the material can be saved. The axial length is smaller, the size is more compact, and the axial force can be exactly counteracted with the axial force generated when the impeller rotates to work, or the axial force is greatly reduced, so that the service life of the thrust sliding bearing on the rotating shaft is effectively prolonged.

An air purifier includes a housing having a vented upper surface, a motorized fan assembly positioned within an interior volume of the housing and operable for discharging a filtered airstream through the vented upper surface, a hollow top cover, and an electric circuit, e.g., wireless charging electronics. The hollow top cover at least partially defines therein an electronics bay, floor vents configured to admit a portion of the filtered airstream into the electronics bay as a cooling airstream, at least one primary exhaust port for discharging the filtered airstream to a surrounding ambient environment, and at least one secondary exhaust port for discharging the cooling airstream to the surrounding ambient environment. The electric circuit is positioned in the electronics bay within the cooling airstream.

A cooling system for an electrified vehicle includes a first cooling loop for circulating coolant for cooling at least one of power electronics and a motor / generator of the vehicle. The first coolant loop includes a heat exchanger for exchanging heat with the coolant in the first cooling loop. A second cooling loop is provided for circulating coolant for cooling a battery of the vehicle. The second cooling loop includes a coolant chiller connected to a refrigeration system of the vehicle for exchanging heat in the coolant received from the battery with the refrigeration system of the vehicle.

A packaged electronic device (100) includes a package structure (120) enclosing first and second semiconductor dies (101, 102), a die attach pad (104) having a first side (130) attached to one of the dies (101, 102) and a second side (144) exposed along a side (142) of the package structure (120), and a substrate (110) including a first metal layer (118) exposed along another side (141) of the package structure (120), a second metal layer (114, 116) soldered to contacts (122, 132) of the dies (101, 102), and an isolation layer (112) extending between and separating the first and second metal layers (118, 114, 116).

A vehicular thermal management system includes an HVAC subsystem including a compressor, a heating-side expansion, an exterior heat exchanger, a cooling-side expansion valve, an evaporator, a distribution line allowing at least a portion of a refrigerant discharged from the exterior heat exchanger to be directed from the upstream side of the cooling-side expansion valve to the compressor, and a battery disposed on the distribution line. The system also includes a power electronics cooling subsystem including a power electronic component, a power electronic radiator, a power electronic pump disposed between the power electronic component and the power electronic radiator, and a bypass line allowing at least a portion of a power electronics coolant discharged from the power electronic component to bypass the power electronic radiator; and a heat exchanger including a first passage fluidly connected to the distribution line, and a second passage fluidly connected to the bypass line.

Provided is a technique by which it is possible to reduce a volume of a moisture-proof space for sealing a light source module against moisture. A light source module includes a first laser that emits red light, a second laser that emits green light, a third laser that emits blue light, an electronic cooling module that adjusts a temperature of the first laser, a first case that houses the first laser, and a second case that houses the second laser and the third laser.

A vehicle thermal management system includes a HVAC subsystem; a power electronics cooling subsystem; a plurality of heat recovery drive components; and a controller. The controller includes a required heat calculation module to calculate a required heat quantity for a heating operation of the HVAC subsystem. The controller includes a coefficient of performance (COP) calculation module to calculate a maximum COP of the HVAC subsystem in the heating mode and a heat recovery calculation module to calculate a maximum heat recovery quantity of the HVAC subsystem and a total sum of estimated heat recovery quantities recoverable from the plurality of heat sources. The controller also includes a power determination module to determine respective amounts of power input to the plurality of heat recovery drive components based on the total sum of estimated heat recovery quantities and the maximum heat recovery quantity.

The utility model discloses a server safety case applying an immersed electronic cooling liquid technology, which relates to the field of server safety cases and comprises a case body, cooling liquid is stored in the case body, a sealing curtain is arranged at an opening of the front side of the case body, and a sealing groove is arranged on the inner wall of the case body. And a first soft magnetic sheet is fixedly arranged at the edge of the sealing curtain. The first soft magnetic sheet is fixedly arranged on the outer ring of the sealing curtain, the first soft magnetic sheet can be attracted and fixed in the sealing groove, so that the sealing effect is achieved, electronic elements are isolated in the case through the sealing curtain, the case door can be connected to the case in a rotating mode, the case door can be fixed in a simple clamping mode, and the sealing effect is good. The sealing problem does not need to be considered, and based on magnetic adsorption sealing, the sealing curtain can be elastically deformed, so that impact generated when cooling liquid in the case flows can be greatly reduced, and the sealing performance of the sealing position is good.

The invention provides fluorine-containing electronic cooling liquid based on modified silicone oil, a preparation method and application, and relates to the field of phase change cooling liquid formulas, the cooling liquid comprises a component A and a component B, the component A is modified silicone oil, the component A accounts for 10-80% of the volume fraction of the fluorine-containing electronic cooling liquid, the component B is hydrofluoroether, and the component B accounts for 20-90% of the volume fraction of the fluorine-containing electronic cooling liquid; and n1 + n2 is equal to 50-70. According to the fluorine-containing electronic cooling liquid based on the modified silicone oil, the preparation method and the application, the use amount of an electronic fluorinated liquid is reduced, the cost can be effectively reduced, and the fluorine-containing electronic cooling liquid is more environment-friendly and has good heat conduction capability and phase change heat dissipation capability.

The invention provides a light source module which can reduce the volume of a moisture-proof space for moisture-proof sealing of the light source module. A light source module (100) is provided with: a first laser (117) configured so as to emit red light; a second laser (118) configured to emit green light; a third laser (119) configured so as to emit blue light; an electronic cooling module (530) that adjusts the temperature of the first laser (117); a first housing (410) that houses the first laser (117); and a second housing (420) that houses the second laser (118) and the third laser (119).

A technique for recovering power from data center waste heat involves an organic Rankine cycle that includes pumping an organic working fluid through a low-temperature preheater chamber configured to exchange relatively low-temperature waste heat from low-temperature data storage devices to the organic working fluid flowing through the preheater chamber, pumping the working fluid through a high-temperature evaporator thermally coupled to the preheater chamber and configured to exchange relatively high-temperature waste heat from high-temperature CPUs to the working fluid flowing through the evaporator, and pumping working fluid vapor from the evaporator to an expander to generate power via expansion of the working fluid. The preheater and evaporator can be incorporated directly with a housing cabinet that houses various heat-generating components.

A refrigeration unit including a refrigeration circuit, a mounting plate, a power electronics device thermally coupled to the mounting plate, and a heat sink thermally coupled to the mounting plate and to a component of the refrigeration circuit. The heat sink is configured to transfer waste heat from the mounting plate to the component of the refrigeration circuit.

The position identification assembly comprises a shell, a rotating assembly and a magnetic ring, the shell is provided with a plurality of cavities and through holes communicated with the cavities, the rotating assembly comprises a rotating shaft, a stator and a rotor, the rotating shaft is arranged in the cavities of the shell, and the rotor is arranged in the middle of the rotating shaft. The stator is arranged between the rotor and the inner side wall of the shell and is used for driving the rotor to rotate, and the magnetic ring is arranged at the left end part of the rotating shaft and is fixedly connected with the rotating shaft, so that the magnetic ring and the rotor jointly form a structure for reflecting the position change of the rotor through the magnetic field effect of the magnetic ring and preventing the magnetic ring from axially slipping. The problems that in the prior art, the relative position of the magnetic ring and the rotor of the electronic cooling oil pump is not accurately positioned, so that the control precision is poor, and axial falling prevention of the rotor is not considered are solved.

A modular computing and cooling system is described. For example, an apparatus may comprise a physical interface for a modular computing and cooling system and an electronic cooling cartridge for insertion into the physical interface and removal from the physical interface. The electronic cooling cartridge may comprise an internal electronic component, an internal cooling component for thermal management of the internal electronic component using a cooling fluid, a set of internal connectors to connect the internal electronic component and the internal cooling component to an external electronic component and an external cooling component, respectively, of the modular computing and cooling system, and a closed container encapsulating the internal electronic component, the internal cooling component, and the set of internal connectors. Other embodiments are described and claimed.

This invention belongs to the field of semiconductor refrigeration technology, and relates to a positioning, pressing, and fixing fixture for a micro electronic refrigeration chip and its usage method. It includes a lower base and an upper pressing block; the lower base has a claw opening, a positioning pin hole, a guide height limiting pin hole, and a positioning groove, with a vacuum hole within the positioning groove; the upper pressing block includes a pressing block base, on which a claw mechanism, a product pressing block, and a pressure adjustment and locking mechanism are mounted; the lower surface of the pressing block base is also fixed with a positioning pin that mates with the positioning pin hole and a guide height limiting pin that mates with the guide height limiting pin hole; the product pressing block is connected to the pressing block base through the pressure adjustment and locking mechanism, and the claw mechanism is used to engage with the claw opening to press and fix the upper pressing block onto the lower base. This invention solves the problems of low accuracy, complex operation, and unstable welding quality caused by inconsistent reflow soldering pressure in existing technologies.

The application discloses an environmentally-friendly submerged electronic cooling liquid, which contains long-chain hydrofluoroolefin 5,5,6,6,7,7,-heptafluoro-4,4-bis(trifluoromethyl)-1-heptene, and further contains one or more than two of type I hexafluoropropylene trimer, perfluorocycloalkene 1,3,3,4,4,5,5-heptafluoro-2-(perfluoroprop-2-yl)cyclopent-1-ene and 3,3,4,4,5,5-hexafluoro-1,2-bis(perfluoroprop-2-yl)cyclopent-1-ene; and the preparation method of the electronic cooling liquid is as follows: adding one, two or three of type I hexafluoropropylene trimer and perfluorocycloalkene into the long-chain hydrofluoroolefin and stirring. The electronic cooling liquid of the application introduces C=C double bond structure or / and cyclic structure into fluorine-containing compounds, reduces dielectric constant and GWP100 value, improves the electrical signal stability of the used electronic components, and reduces the damage to the environment; and the preparation method is simple and easy to realize.

The invention belongs to the technical field of new energy automobiles, and discloses an electronic cooling fan which comprises an air guide part, a shell, a movable blade and a stationary blade, the air guide part comprises a connecting part and an air guide part, the air guide part is of an annular structure, the connecting part is fixedly connected with the inner side of the air guide part, the stationary blade is fixedly connected with the shell, and the movable blade is rotationally connected with the stationary blade. The connecting part is clamped between the movable blade and the fixed blade and fixedly connected with the fixed blade, the air guide part is located between the fixed blade and the movable blade, the air guide part and the movable blade are coaxially arranged, and the end, away from the connecting part, of the air guide part extends towards the fixed blade. By additionally arranging the air guide part, main airflow can be accurately guided to the periphery of the stationary blade under the low-pressure working condition, the main flow field path is optimized, airflow turbulence and flowing loss are reduced, and therefore the efficiency of the electronic cooling fan is improved; under the high-pressure working condition, the air guide part can effectively block excessive airflow adsorbed by the negative pressure area, vortex generation and development are restrained, and the noise problem under the high-pressure working condition is solved by optimizing a flow field path, restraining vortex and other key links.

The invention relates to a pump module (10) for an electronics cooling system, particularly for computer server electronics. The module comprises at least one pump support (22), a pump (12) having an inlet (14) and an outlet (16), and a first connector (18) adapted to connect the inlet of the pump (12) to a fluid reservoir of the electronics cooling system. According to the invention, the first connector (18) has a locking ring (20), and the pump module (10) further comprises a device for moving the locking ring (20) of the first connector (18). The invention relates to an electronics cooling system comprising at least one pump module (10) as described above and an electronics cooling system module. [Fig. 1]

Systems and methods for providing an electronic cooling apparatus comprising a chassis having an internal space that is sized / shaped to receive / structurally support circuit card(s). The internal space defined by sidewalls with a channel formed therein in which a coolant is disposed. The coolant is in thermal communication with the circuit card(s) via the sidewall(s) when the circuit card(s) is(are) disposed in the chassis. A refrigerant-based cooling system is disposed in the chassis and comprises an evaporator having inlet / outlet ports coupled to the channel of the chassis to define a first closed-loop channel for the coolant within the chassis. The evaporator facilitates heat transfer from the coolant to a refrigerant flowing through a second closed-loop channel of the chassis at least partially defined by the evaporator. A pump is disposed in the chassis and configured to cause the coolant to flow through the first closed-loop channel.

An electronics cooling system including an electronics magazine. The electronics magazine includes a magazine body, one or more capsule sockets, one or more interface shorings positioned within the magazine body relative to the one or more capsule sockets and a magazine heat conductive interface positioned within the magazine body relative to at least one of the one or more capsule sockets. The cooling system includes one or more electronics capsules having a capsule housing, the one or more electronics capsules includes an electronics unit within the capsule housing and a capsule cooling system. The capsule cooling system includes a capsule heat conductive interface in communication with the electronics unit.