84 results about "Electronics cooling" patented technology

A cooling system for an electrified vehicle includes a first cooling loop for circulating coolant for cooling at least one of power electronics and a motor / generator of the vehicle. The first coolant loop includes a heat exchanger for exchanging heat with the coolant in the first cooling loop. A second cooling loop is provided for circulating coolant for cooling a battery of the vehicle. The second cooling loop includes a coolant chiller connected to a refrigeration system of the vehicle for exchanging heat in the coolant received from the battery with the refrigeration system of the vehicle.

The invention provides an electronic cooling control method and device based on a large language model and electronic equipment, and relates to the technical field of electronic cooling control. The method comprises the following steps of: performing semantic analysis on an electronic cooling natural language instruction input by a user by a main control model through a collaborative architecture of the main control model and a sub-control model of each electronic cooling device; the main control model constructs a physical model for controlling the target electronic cooling equipment according to the semantic analysis result, and determines preliminary control parameters for controlling the target electronic cooling equipment according to the physical model and the current actual operation state of the target electronic cooling equipment; and then the target electronic cooling equipment receives the preliminary control parameters, a sub-control model of the target electronic cooling equipment analyzes the preliminary control parameters, whether the preliminary control parameters are adjusted or not is determined according to an analysis result, and intelligent control, fault prediction and natural language interaction of the electronic cooling equipment are achieved.

A three dimensional (3D) integrated circuit (IC) chip can include a multi-layer structure comprising a group of vertically stacked semiconductor layers. The multi-layer structure can include a group of processor cores distributed across the semiconductor layers, and a group of Through Silicon Vias (TSVs) arranged within the layers to facilitate electrical connections between the layers. The 3D IC chip can be optimized for thermal management based on a predictive model, enabling effective temperature control when utilized with a thermal management system that monitors and adjusts a cooling strategy of the 3D IC chip.

A power electronics cooling assembly with a housing for power electronics. The housing is mountable to a bulkhead for separating a fire zone from a non-fire zone of a gas turbine engine. In the non-fire zone, one or more ducts extend from the bulkhead to the housing. A fluid supply and return pipes extend through the one or more ducts from the bulkhead to the housing. The fluid supply and return pipes are for carrying an ignitable fluid coolant. A heat exchange structure arranged within the housing is configured to receive the ignitable fluid coolant from the fluid supply pipe, facilitate transfer of heat from the power electronics within the housing to the ignitable fluid coolant, and output the ignitable fluid coolant to the fluid return pipe. A system, gas turbine engine assembly and an aircraft comprising the power electronics cooling assembly are also provided.

An electronics cooling system including an electronics magazine. The electronics magazine includes a magazine body, one or more capsule sockets, one or more interface shorings positioned within the magazine body relative to the one or more capsule sockets and a magazine heat conductive interface positioned within the magazine body relative to at least one of the one or more capsule sockets. The cooling system includes one or more electronics capsules having a capsule housing, the one or more electronics capsules includes an electronics unit within the capsule housing and a capsule cooling system. The capsule cooling system includes a capsule heat conductive interface in communication with the electronics unit.

An electronic cooling assembly includes a heat-generating electronic component and a fan. In some examples the fan includes a housing defining an internal volume, the housing thermally coupled to the heat-generating electronic component, and a plurality of blades disposed in the internal volume. In some examples, the fan housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.

Apparatus, devices, systems, subsystems and methods for passively balancing and controlling coolant flow throughout complex fluidic pipe network to be implemented in electronics cooling applications. Systems, sub-systems, devices and methods for providing cooling to hardware components, and more specifically to control flow distribution between sub-systems, devices and methods for thermal management of hardware in server racks and any other hardware components or equipment for the information and communications technology (ICT) industry.

The density and power consumption of modern integrated circuits, such as Graphic Processing Units (GPUs), Central Processing Units (CPUs), and Network Processing Units (NPUs) is growing rapidly, which necessitates designing advanced cooling systems. Existing solutions for characterizing and validating these cooling system are inadequate. A flexible, scalable Thermal Test Vehicle (TTV) is disclosed which is based on an array of power transistors, measurement / control circuitry, and onboard computer. The TTV is configured for characterizing the performance of electronic cooling solutions under a variety of operating conditions.

According to the plasma waste gas treatment device provided by the utility model, the first air cooling part and the second air cooling part are arranged and are combined with the first circulating medium cooling part, the second circulating medium cooling part and the electronic cooling part, so that the conversion from ultrahigh temperature to low temperature after the waste gas is treated by the plasma is realized; and moreover, anhydrous treatment of semiconductor tail gas can be realized, the problem of water shortage is solved, generation of waste acid water is reduced, and the application prospect is wide.

A vehicle thermal management system includes a HVAC subsystem; a power electronics cooling subsystem; a plurality of heat recovery drive components; and a controller. The controller includes a required heat calculation module to calculate a required heat quantity for a heating operation of the HVAC subsystem. The controller includes a coefficient of performance (COP) calculation module to calculate a maximum COP of the HVAC subsystem in the heating mode and a heat recovery calculation module to calculate a maximum heat recovery quantity of the HVAC subsystem and a total sum of estimated heat recovery quantities recoverable from the plurality of heat sources. The controller also includes a power determination module to determine respective amounts of power input to the plurality of heat recovery drive components based on the total sum of estimated heat recovery quantities and the maximum heat recovery quantity.

The present invention discloses a heat dissipation control method and device for a hybrid cotton picker, wherein the heat dissipation control method for the hybrid cotton picker comprises: the vehicle controller obtains the temperature information of the motor controller and the motor. The vehicle controller obtains the inlet temperature and outlet temperature of the coolant of the electronic fan radiator. The vehicle controller obtains the speed feedback of the electronic water pump and the electronic cooling fan. According to the temperature information, the inlet temperature and outlet temperature of the coolant, and the speed feedback, the working state of the electronic water pump and the electronic cooling fan is controlled. Thereby, the heat dissipation control method for the hybrid cotton picker of the present invention can flexibly adjust the working state of the cooling components according to the actual heat dissipation requirements, and effectively balance the heat dissipation effect and energy consumption.

Apparatus, devices, systems, subsystems and methods for passively balancing and controlling coolant flow throughout complex fluidic pipe network to be implemented in electronics cooling applications. Systems, sub-systems, devices and methods for providing cooling to hardware components, and more specifically to control flow distribution between sub-systems, devices and methods for thermal management of hardware in server racks and any other hardware components or equipment for the information and communications technology (ICT) industry.

Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.

The invention belongs to the technical field of electronic product cooling, and discloses a corrugated pipe structure which comprises a corrugated pipe, the corrugated pipe comprises at least two metal layers, all the metal layers are sequentially arranged in the radial direction of the corrugated pipe, in every two adjacent metal layers, the metal layer located on the outer layer wraps the outer wall of the metal layer located on the inner layer, and the metal layer located on the outer wall wraps the metal layer located on the inner layer. And one of every two adjacent metal layers is a copper layer, and the other of every two adjacent metal layers is a stainless steel layer, so that the flexibility and the sealing performance of the corrugated pipe can be improved.

Heat dissipation device (104) for an electronic cooling system (100) with an electronic component (102) which generates heat in response to receiving an electric current, wherein the heat dissipation device (104) comprises: a housing (106) that is attached to the electronic component (102) and absorbs heat from the electronic component (102), wherein the housing (106) has a surface (108) that defines a chamber (110); a first liquid (116) which is contained in the chamber (110) of the housing (106) and receives heat from the housing (106), wherein the first liquid (116) has a first boiling temperature; a sorption material (120) immersed in the first liquid (116); and a second liquid (124) which is adsorbed by the sorption material (120) and has a second boiling point which is higher than the first boiling point of the first liquid (116); wherein the first liquid (116) evaporates to a first vapor (118) when the first liquid (116) reaches the first boiling temperature; and wherein the second liquid (124) is desorbed from the sorption material (120) when the second liquid (124) and the sorption material (120) reach a desorption temperature below the second boiling temperature, and wherein the second liquid (124) evaporates to a second vapor (120) when the second liquid (124) reaches the second boiling temperature.

The invention relates to a fluid supply device for an electrochemical system, comprising at least one housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) for introducing a fluid, in particular air, into the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 16i) in the fluid inlet (14a; 16b, 16b; 16c, 16c; 16d, 16d; 16e, 16e; 16f, 16f; 16 g; the time is 16 hours; 16i) arranged in the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) for supplying power to an electrochemical cell (20a; 20b; 20b; 20c, 20c; 20d, 20d; 20e, 20e; 20f, 20f; 20 g; 20 hours; 18i) for supplying fluid to a process fluid unit (18a; 18b, 18b; 18c, 18c; 18 d; 18e, 18e; 18f, 18f; 18 g; the time is 18 hours; it is proposed that the fluid supply device comprises a housing (14a; 18b) arranged in the housing (14a; 14b; 14b; 14c, 14c; 14 d; 14e, 14e; 14f, 14f; 14 g; the time is 14 hours; 14i) of the electronic cooling unit (22a; 22b; 22c; 22c; 22 d; 22e; 22e; 22f, 22f; 22 g; the time is 22 hours; 22i) for conducting a fluid on an electronic unit (24a; 24b) of the electrochemical system by means of a fluid; 24b, 24b; 24c, 24c; 24 d; 24 d; 24e, 24e; 24f, 24f; 24 g; the time is 24 hours; 24i) of the heat exchanger (24).

Task: To provide a technique that can reduce the volume of a moisture-proof space that seals a light source module in a moisture-proof manner. Solution: A light source module 100 comprises a first laser 117 for emitting red light, a second laser 118 for emitting green light, a third laser 119 for emitting blue light, an electronic cooling module 530 for adjusting the temperature of the first laser 117, a first housing 410 in which the first laser 117 is housed, and a second housing 420 in which the second laser 118 and the third laser 119 are housed.

The utility model provides a refrigeration device of an electronic refrigeration cup, which relates to the field of insulin electronic refrigeration cups and comprises a refrigeration cup component, the refrigeration cup component comprises a shell, a top cover, an inner container and a hollow layer, the refrigeration cup component is used for providing storage space for insulin, the top cover is located at the top of the shell and movably connected with the shell, and the inner container is arranged in the shell. The inner container is located in an inner cavity of the shell and fixedly connected with the shell, the hollow layer is located between the shell and the inner container, and a refrigeration assembly is installed in an inner cavity of the top cover; the semiconductor refrigeration sheet is adopted as a refrigeration source, the refrigeration device has the advantages of being high in refrigeration efficiency and response speed, effective heat dissipation of the refrigeration assembly is guaranteed through cooperation of the cooling fin and the cooling fan, the overheating phenomenon is avoided, the service life of the device is prolonged, and the temperature control chip in the integrated control panel is combined with the temperature sensor, so that the refrigeration efficiency is improved. And the temperature in the refrigeration cup can be monitored in real time and accurately controlled, so that the effectiveness and the safety of medicines are ensured.

Cooling system for electronics, which includes: a housing (110) containing: a base section (120) with sides (121) and a bottom surface (123) that define a cavity; and a cover section (116) that encloses the base section (120) and contains cooling elements (118, 119) attached to it; electronic components; a shield (244) which is arranged in the cavity between the electronic components and the cover section (116); a vertical element arranged below the shield (244) to define a first fluid chamber between one side of the vertical element and one side of the base section (120) and a second fluid chamber between an opposite side of the vertical element and another side of the base section (120), wherein the electronic components are arranged in the second fluid chamber; and a cooling fluid (260) arranged in the cavity and having a fluid level below at least one section of the shielding (244), and either: the housing (110) is mounted at an angle of inclination relative to the horizontal; or the housing (110) is mounted parallel to the horizontal and the shielding (244) is mounted at an angle of inclination relative to the horizontal; characterized by the fact that an upper edge of the vertical element is connected to an edge of the shield (244); or that an upper edge of the vertical element and an edge of the shield (244) are arranged below the fluid level; or that a lower edge of the vertical element contains several openings to allow a fluid to flow from the first fluid chamber to the second fluid chamber; or that the vertical element contains a gate printed circuit board (gate PCB) (254); or that the electronic components comprise at least one power inverter (250), busbars (210), a current sensor (253) and a volume capacitor (224); or that the electronic components comprise: a power inverter module (250) containing several circuit breakers; a current sensor (253) which is connected to the power inverter module (250) via first busbars (210); AC busbars (128) connected to the current sensor (253); a volume capacitor (224) which is connected to the power inverter module (250) via second busbars (210); and DC busbars (132) connected to the volume capacitor (224).

Thermal connector (1) for conducting heat from a device generating heat (2) located in a housing (8) to a cooling module (3), the thermal connector (1) comprising a main body (4) including a support portion (5) and a heat transfer element (6) in contact with the support portion (5), wherein the main body (4) comprises a coupling interface (17) for being coupled in a removable way with the housing (8) of the device (2).

A technique for recovering power from data center waste heat involves an organic Rankine cycle which includes pumping an organic working fluid through a low-temperature preheater chamber configured to exchange relatively low-temperature waste heat from low-temperature data storage devices to the organic working fluid flowing through the preheater chamber, pumping the working fluid through a high-temperature evaporator thermally coupled with the preheater chamber and configured to exchange relatively high-temperature waste heat from high-temperature CPUs to the working fluid flowing through the evaporator, and pumping the working fluid vapor from the evaporator to an expander for generating power via expansion of the working fluid. The preheater and evaporator may be directly incorporated with the enclosure box housing the various heat-generating components.

An electronics cooling system including an electronics magazine. The electronics magazine includes a magazine body, one or more capsule sockets, one or more interface shorings positioned within the magazine body relative to the one or more capsule sockets and a magazine heat conductive interface positioned within the magazine body relative to at least one of the one or more capsule sockets. The cooling system includes one or more electronics capsules having a capsule housing, the one or more electronics capsules includes an electronics unit within the capsule housing and a capsule cooling system. The capsule cooling system includes a capsule heat conductive interface in communication with the electronics unit.

A technique for recovering power from data center waste heat involves an organic Rankine cycle which includes pumping an organic working fluid through a low-temperature preheater chamber configured to exchange relatively low-temperature waste heat from low-temperature data storage devices to the organic working fluid flowing through the preheater chamber, pumping the working fluid through a high-temperature evaporator thermally coupled with the preheater chamber and configured to exchange relatively high-temperature waste heat from high-temperature CPUs to the working fluid flowing through the evaporator, and pumping the working fluid vapor from the evaporator to an expander for generating power via expansion of the working fluid. The preheater and evaporator may be directly incorporated with the enclosure box housing the various heat-generating components.

The utility model discloses an electronic cooling water pump for a vehicle, which is applied to a thermal management module of a new energy automobile and comprises a pump body, a rotating shaft, an impeller, a motor stator and a motor rotor. After entering from the liquid inlet, cooling liquid is filled in the hollow inner cavity of the pump cavity and sequentially passes through the first cooling face, the second cooling face and the third cooling face to achieve sufficient contact cooling on the permanent magnet, the motor stator, the periphery of the rotating shaft and the inner side of the pump cover, and compared with a traditional electronic water pump which can only cool two faces, the cooling effect of the electronic water pump is more sufficient, and the service life of the electronic water pump is prolonged. The temperature rise is lower, which means that the power density of the electronic water pump can be higher; or under the same power, the weight of the material can be saved. The axial length is smaller, the size is more compact, and the axial force can be exactly counteracted with the axial force generated when the impeller rotates to work, or the axial force is greatly reduced, so that the service life of the thrust sliding bearing on the rotating shaft is effectively prolonged.

The utility model discloses an immersed liquid cooling heat dissipation system device, which relates to the technical field of liquid cooling heat dissipation equipment and comprises a condensation cooling coil assembly, a heat exchanger, a compressor, a refrigerant pipeline and an expansion valve which are sequentially connected in series through the refrigerant pipeline. The condensation cooling coil assembly, the compressor, the heat exchanger and the expansion valve are connected in series to form a refrigeration cycle system; an intermediate heat exchanger is mainly reduced, the heat exchange efficiency is improved, the electronic cooling liquid is directly conveyed outdoors for heat exchange, and a natural cold source is utilized as much as possible to cool the electronic cooling liquid. When the environment temperature is high, the electronic cooling liquid is cooled in an auxiliary mode through refrigeration of the compressor, and it is ensured that the electronic cooling liquid is dissipated in time.

An air purifier includes a housing having a vented upper surface, a motorized fan assembly positioned within an interior volume of the housing and operable for discharging a filtered airstream through the vented upper surface, a hollow top cover, and an electric circuit, e.g., wireless charging electronics. The hollow top cover at least partially defines therein an electronics bay, floor vents configured to admit a portion of the filtered airstream into the electronics bay as a cooling airstream, at least one primary exhaust port for discharging the filtered airstream to a surrounding ambient environment, and at least one secondary exhaust port for discharging the cooling airstream to the surrounding ambient environment. The electric circuit is positioned in the electronics bay within the cooling airstream.

A cooling system for an electrified vehicle includes a first cooling loop for circulating coolant for cooling at least one of power electronics and a motor / generator of the vehicle. The first coolant loop includes a heat exchanger for exchanging heat with the coolant in the first cooling loop. A second cooling loop is provided for circulating coolant for cooling a battery of the vehicle. The second cooling loop includes a coolant chiller connected to a refrigeration system of the vehicle for exchanging heat in the coolant received from the battery with the refrigeration system of the vehicle.

The invention relates to the field of cooling liquid, in particular to a composition, a preparation method and application thereof and electronic cooling liquid. The composition is prepared from a hexafluoropropylene oligomer, perfluorocyclohexane, fluoropyridine and an antioxidant. The composition has the advantages of high stability, low viscosity, high thermal conductivity and low cost, and can be used as an electronic cooling liquid.

The utility model discloses a 3D printer extrusion device with electronic cooling and high integration level, and relates to the technical field of 3D printers, the device comprises a front shell, a rear shell, a drag chain frame and a hardware support, the rear shell and the front shell abut against each other; the drag chain frame is arranged between the front shell and the rear shell; the hardware bracket is arranged at the bottom of the drag chain frame; the cooling assembly comprises a control panel, the control panel is arranged on one side of the rear shell, a main body plastic part is installed in the rear shell, a heat conduction aluminum block is arranged on one side of the main body plastic part, a TEC electronic cooling piece is installed on one side of the heat conduction aluminum block, and an extrusion assembly for extruding material wires is arranged on one side of the rear shell. The 3D printer integrates the functions of various 3D printers, namely a double-gear process extrusion function, a material cutting cutter function, an RGB indicator lamp function, a model blowing function and a laser sensor leveling function. The electronic cooling function of the throat pipe is actively controlled; and the integration and equipment adaptability of the extrusion device of the 3D printer are greatly improved under the limited volume.

An aircraft light unit is disclosed herein. The aircraft light unit includes a housing having a first side and an opposing second side, a light coupled to the first side of the housing, a circuit board assembly coupled to second side of the housing, a thermoelectric cooler coupled to the circuit board assembly and configured to dissipated heat from the circuit board assembly, and a heat sink disposed over the thermoelectric cooler and configured to dissipate heat from the thermoelectric cooler.