175 results about "Electronics cooling" patented technology

An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring (20) using an electronic cooling device (32) to top of a large-diameter portion (11) to effectively cool the edge ring (20) so that the temperature of the edge ring (20) is similar to that of top of a small-diameter portion (12) of a chuck body (10) to eventually improve the yield ratio while reducing the failure ratio.

An electronic cooling apparatus has a cabinet which is open at the front and rear sides thereof and accommodates plural electronic devices each having a fan, and a rear door which is provided with an evaporator. Air blown by the fan is cooled by the evaporator and then returned to a room. An expansion valve and control. A drain pan with an extension portion having hole portions through which refrigerant pipes extend is provided. A drain hose discharges drain water from the drain pan. An exhaust heat temperature detecting unit and a control for controlling the refrigerant supply to the evaporator are provided. When the exhaust heat temperature is equal to or less than a set exhaust temperature, the controller stops the refrigerant supply to the evaporator. When the exhaust heat temperature exceeds the set temperature, the controller starts the refrigerant supply.

A filter for an electronics cooling unit of a telecommunications base station, the electronics cooling unit adapted to receive fresh air into a housing of the cooling unit through an opening communicating with the external environment. The filter includes a structural support configured to be mounted to said housing, a gasket sealingly engaging the structural support and adapted to engage the housing; and a filter media supported by the structural support, the filter media being free of a membrane type layer and including a fiber entanglement selected to prevent ingress of water sufficient to pass a salt fog test consistent with GR-487-CORE and in accordance with ASTM B 117.

The invention discloses a fuel cell whole vehicle thermal management system, which is characterized by comprising a power electronic cooling system, a fuel cell cooling system, a power cell thermal management system and an air conditioning system. One side of the thermoelectric conversion device and the power battery thermal management system form a power battery coolant circuit, and the other side is connected in series with the coolant circuit of the power electronic cooling system; The thermoelectric device is arranged in the air conditioning system and is in contact with the coolant flowing out of the air conditioning compressor of the air conditioning system and the coolant flowing through the cab evaporator or the battery refrigeration exchanger, respectively. The whole heat management system of the fuel cell vehicle integrates different heat management subsystems of the whole vehicle and realizes cooling of the power electronic system by using the semiconductor material throughheat conversion mode; the whole heat management system of the fuel cell vehicle integrates different heat management subsystems of the whole vehicle. In the same way, the regenerative effect of the air conditioning system is realized, the liquid impact phenomenon of the air conditioning compressor is avoided, and the energy efficiency ratio and the service life of the air conditioning system are improved.

A filter for an electronics cooling unit of a telecommunications base station, the electronics cooling unit adapted to receive fresh air into a housing of the cooling unit through an opening communicating with the external environment. The filter includes a structural support configured to be mounted to said housing, a gasket sealingly engaging the structural support and adapted to engage the housing; and a filter media supported by the structural support, the filter media being free of a membrane type layer and including a fiber entanglement selected to prevent ingress of water sufficient to pass a salt fog test consistent with GR-487-CORE and in accordance with ASTM B 117.

A micropump including one or more microchannels for receiving a fluid and a plurality of electrodes arranged on a diaphragm and energized in a manner to provide an enhanced electrohydrodynamic flow of fluid through the one or more microchannels. The micropump may be used for pumping a working fluid for removing heat from a heat-generating electronic component or for delivery of a drug, medicine, or other treatment agent as or in a fluid to a patient.

A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.

A slot filler for usage in a rack cabinet can accept a plurality of stacked electronic devices. The cabinet has an air inlet and exit on mutually opposing sides and a plurality of slots capable of securing the stacked electronic devices. The slot filler comprises a blanking panel capable of covering an entry opening of a slot that is unoccupied by an electronic device, and a body coupled to the blanking panel that emulates dimensions of an electronic device and has a thickness selected so that clearance between the slot filler and an adjacent electronic device leaves an air flow gap from the air inlet to exit that is sufficiently small to create an air flow resistance preventing air from re-circling toward the air inlet.

The present invention is related to preventing dust agglomeration on a sharp electrode which is used for generating corona. According to certain aspects, the invention includes a dust shroud which decreases or prevents dust accumulation on the sharp electrodes. The dust shroud changes the gas flow path so as to reduce the amount of gas passing near the sharp electrode. An advantage of the shroud is that it prevents dust from building up on the electrodes. The shroud is a simple, passive addition to the electrostatic pump, such that the pump is otherwise able to operate normally throughout its life. In embodiments, the shroud can be used to protect a corona electrode used in heat sink applications especially in electronics cooling. It can also be used in electrostatic precipitators for cleaning dust or chemical or microbe particles from air.

A method for cooling an electronic component includes: providing an electronic component and a cooling device to cool the electronic component; determining the heat generating ability of the electronic component; and driving operation of the cooling device to cool the electronic component based on the heat generating ability of the electronic component. An apparatus and/or an electronics cooling device are provided based on the method.

A plate is thermally coupled to a heat generating device and thermally coupled to two heat pipes. Each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. One or more additional heat pipes can be coupled to the plate. A heat spreader can be in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.

A circulation pipe for a coolant is connected to a fuel cell. A pump and a heat exchanger are connected to the circulation pipe. A bypass pipe is connected in parallel with the pump. An ion exchanger is connected to the bypass pipe. An electronic cooling device is connected to the bypass pipe on an upstream side of the ion exchanger. The coolant, which is supplied to the ion exchanger, is cooled by the electronic cooling device to a predetermined temperature, so that the ion-exchange resins are prevented from being abnormally heated by the coolant.

A method and apparatus for actively cooling a device, space or circuit board are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid in a closed loop, at least two heat exchangers and a fluid driver.

The invention discloses a high efficient photo-bioreactor for the culture of photosynthetic bacteria, which consists of a control system, a transparent cylindrical barrel body, an internal light source, an internal modulator tube sleeve brush, a water circulation flow guide device, a heating device and an electronic cooling device. The photo-bioreactor is characterized in that: the system is totally sealed; the internal light source and an external natural light source can be utilized simultaneously, the internal light source is arranged at the centre of the barrel body and protected by a quartziferous modulator tube sleeve, and the outer wall of which is provided with the lift type annular brush; the water circulation flow guide device is positioned at one side of the barrel body and comprises a mini submerged pump and a water circulation guide pipe; the lower end of the water circulation guide pipe is connected with a pump and the 1/3 upper part is provided with a column of water circulation outlets, direction of which is not vertical to the tangent plane of the barrel wall at the closer side, thus ensuring liquid in the reactor is fully stirred under anaerobic conditions; and the heating device and the cooling device are integrated in the water circulation guide pipe. The photo-bioreactor has convenient operation, low cost and safe production and can fulfill high efficient and continuous culture of photosynthetic bacteria.

An electronics cooling fan comprises at least one collapsible fan blade driven by centrifugal force to extend radially as the fan spins and driven by elastic force to retract as spinning slows or stops.

An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.

A novel electronics cooling method and system is disclosed. A very flexible and efficient operation of an electronics cooling system (10) is achieved by controlling circulation of a cooling medium in a closed system (40) containing an evaporator (13), a condenser (14), an ejector (11) and control valves (15-18). Specifically, the system is continuously allowed to operate in the most appropriate mode by controlling the valves (15-18) of the system (10) based on detected heat load and/or detected heat transfer conditions. By automatically adapting the mode of operation of the system based on the actual prevailing conditions, a unique flexibility is obtained with regard to the cooling mode in which the system will be operated. This means that the cooling capacity will be constantly optimized and that the investment cost as well as the cost for operating the system will be reduced compared to known systems having equal maximum cooling capacity.

The present invention relates to an integrated cooling system for a vehicle. The system includes an engine cooling loop having a first fluid configured for circulation through an engine of the vehicle and a power electronics cooling loop having a second fluid configured for circulation through at least one power electronics component of the vehicle. The engine cooling loop is fluidly isolated from, and in thermal communication with, the power electronics cooling loop.

A novel method to prepare an advanced thermoelectric material has hierarchical structures embedded with nanometer-sized voids which are key to enhancement of the thermoelectric performance. Solution-based thin film deposition technique enables preparation of stable film of thermoelectric material and void generator (voigen). A subsequent thermal process creates hierarchical nanovoid structure inside the thermoelectric material. Potential application areas of this advanced thermoelectric material with nanovoid structure are commercial applications (electronics cooling), medical and scientific applications (biological analysis device, medical imaging systems), telecommunications, and defense and military applications (night vision equipments).

An exemplary evaporating unit for cooling a heat emitting device includes a cooling circuit having a stack of evaporating units arranged alternately with heat emitting devices. Each evaporating unit is connected to a condenser and includes a first inlet channel, a first plurality of evaporation channels, and a first outlet channel. The evaporating unit is designed for pre-heating the cooling fluid flowing therein.