3908results about "Modifications by conduction heat transfer" patented technology

Embodiments of the present invention provide a phototherapy mask designed to enhance user comfort and effectiveness during treatment. The mask comprises a shell that fits over the user's face, featuring a first opening to avoid contact with the eyes and a second opening to avoid the nose. A first pad, positioned around the edge of the first opening, rests against the skin near the peripheral eyes to control the distance between the mask and the skin, while a second pad, located at the bottom of the shell, supports the chin. These pads help maintain the mask's stability and prevent it from shifting during use. The light source assembly, installed on the shell, provides phototherapy to the skin.

The invention provides an all-silicon carbide double-sided heat dissipation module packaging method based on gradient thermal resistance optimization, and belongs to the technical field of electronic component packaging. Establishing a thermal resistance characteristic curve, and calculating a gradient thermal resistance vector to determine a heat flow path; constructing a heat dissipation temperature distribution matrix; obtaining thermal diffusion data; heat dissipation path thermal resistance is calculated by combining the thermal diffusion matrix and the temperature distribution matrix, and a thermal resistance sparse matrix is established and is dimensionally reduced into a thermal resistance low-dimensional matrix; calculating an optimal heat dissipation path parameter set; inputting the parameter set into a thermal resistance prediction deep attention network model for verification and fine tuning, and generating a final thermal resistance distribution scheme; a module structure and a material ratio are designed according to the scheme to form a sandwich structure; a silver paste sintering process is adopted to realize low thermal resistance connection and complete packaging, and the technical problems of non-uniform thermal resistance distribution and difficulty in optimizing a heat flow path in a double-sided heat dissipation structure of a silicon carbide power module in the prior art are solved.

The invention discloses a modular micro-nano satellite integrated power system suitable for batch production and an assembly method thereof. The integrated power system is composed of a semi-open type electric box structure and a modular circuit board. The electricity box structure comprises an electricity box upper cover and an electricity box lower cover, and a plurality of threaded holes are formed in the two sides of the electricity box upper cover and the two sides of the electricity box lower cover and used for being connected with a satellite structure cabin plate; the heat dissipation plate bodies are distributed on the two sides of the modular circuit board; the modularized circuit board is provided with a plurality of circuit boards which are respectively provided with electronic modules in a stacking arrangement. A plurality of electronic modules are integrated into an electronic system by adopting a mechanical-electrical-thermal integrated design method, the system breaks through the function limit of a traditional satellite subsystem, the defects of information exclusion and resource waste are eliminated, a satellite is used as a whole to be subjected to unified design and resource planning tradeoff from the system level, and the system performance is improved. The weight of cables and connectors between electronic modules is greatly reduced, and the effective load ratio is improved.

A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

A mobile phone may include an enclosure. The enclosure may include a front cover, a rear cover, a housing segment coupled to the front cover and to the rear cover and including a first wall section defining at least a portion of a first side exterior surface of the mobile phone, a second wall section defining at least a portion of a second side exterior surface, and a chassis section extending between the first wall section and the second wall section. The mobile phone may further include a circuit board assembly thermally coupled to the chassis section at a thermal coupling region of the chassis section, the chassis section defining a thermal path extending from the thermal coupling region to the first wall section, and a through-hole positioned in the thermal path and configured to interrupt a flow of heat from the circuit board assembly to the first wall section.

The invention belongs to the technical field of heat dissipation of electronic equipment, and particularly discloses an efficient heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a heat dissipation substrate tightly attached to the surface of a heating element, a vapor chamber is tightly attached to the face, away from the heating element, of the heat dissipation substrate, and heat dissipation fins and a heat dissipation fan are sequentially connected to the face, away from the heat dissipation substrate, of the vapor chamber; the vapor chamber comprises a shell, a cover plate and a liquid absorbing core, the cover plate is sealed on the shell, a vacuum cavity is formed in the cover plate, the vacuum cavity is filled with a two-phase fluid working medium, the liquid absorbing core is arranged in the vacuum cavity, the upper surface and the lower surface of the liquid absorbing core are tightly attached to the cover plate and the shell respectively, and a plurality of hollow steam cavities are formed in the liquid absorbing core. The electronic equipment comprises the efficient heat dissipation assembly. Through the synergistic effect of the heat dissipation substrate tightly attached to the heating element, the vapor chamber containing the two-phase fluid working medium and the multiple layers of heat dissipation fins, the structure compactness is guaranteed, and meanwhile efficient heat conduction and rapid heat dissipation are achieved.

An electric wheel controller and methods for operating and manufacturing an electric wheel controller are disclosed. Embodiments include a controller forming a structural and / or load bearing component of the vehicle suspension system. Embodiments of the controller can be mounted to a wheel assembly, and in some embodiments the controller is a suspension knuckle. Embodiments include a controller with a cavity and electronic circuitry submerged in liquid coolant. During operation the coolant can absorb heat from the immersed circuitry. In some embodiments the coolant transitions to a gas and / or vapor, and can move to an upper portion of the cavity. When the coolant contacts the cooler surfaces of the cavity the coolant can transition back to a liquid and return to a pool of liquid coolant in which the circuitry is immersed. A heat sink can be connected to the controller, such as by laser soldering.

The invention provides a shell, a preparation method thereof and electronic equipment. The shell provided by the embodiment of the invention comprises fiber cloth; the graphene coating is coated on the periphery of a part of the fiber cloth; the surface of the fiber cloth and the surface of the graphene coating are wrapped with the resin layer. The shell provided by the embodiment of the invention has relatively high rigidity and heat conductivity coefficient, and does not affect the transmission of electromagnetic wave signals.

The invention provides head-mounted equipment. The head-mounted equipment comprises a shell, a heat source device, a radiator and a cooling fan, an accommodating space is formed in the shell; the heat source device is arranged in the accommodating space; one side of the radiator is connected with the heat source device, and the other side of the radiator is connected with the shell through a heat-conducting medium; an air outlet of the cooling fan corresponds to the radiator and is used for taking away heat around the radiator through airflow. According to the head-mounted device provided by the embodiment of the invention, through two combined heat dissipation modes of connecting the radiator with the shell and blowing away the heat around the radiator by using the heat dissipation fan, the heat dissipation efficiency can be greatly improved, heat accumulation in the head-mounted device can be well solved, the rotating speed of the fan can be improved, and better man-machine temperature rise and noise experience can be achieved.

The invention belongs to the technical field of aerospace engineering, and discloses a flexible radiator which comprises a radiation assembly, the radiation assembly comprises a plurality of radiation plates which are rotationally connected in sequence, each radiation plate comprises a liquid cooling pipe set and a radiation film arranged on the liquid cooling pipe set, and cooling liquid circulates in the liquid cooling pipe set. The material density is low, the structural mass is effectively reduced, a plurality of radiant panels are rotationally connected in sequence, the radiant panels are in a folded state during emission, then a radiator with enough radiation area can be emitted under the condition that the size of a spacecraft is limited, and the heat dissipation requirement of high-power electronic equipment is met.

A cooling system assembly may include a heatsink unit and a water block unit. The heatsink unit is configured to enable a first cooling liquid to undergo a phase-change. The heatsink unit includes a heat pipe heatsink comprising a first thermal transfer surface and a second thermal transfer surface. The second thermal transfer surface is opposite the first thermal transfer surface. The first thermal transfer surface is configured to enable a heat to be transported from at least one packaged integrated circuit to the heat pipe heatsink. The water block unit is configured to enable a second cooling liquid to flow through the water block unit. The water block unit is thermally coupled to the second thermal transfer surface. The second thermal transfer surface is configured to enable the heat to be further transported from the heat pipe heatsink to the water block unit.

The invention discloses a diamond film and a preparation method and application thereof, and the preparation method comprises the steps: taking a substrate material matched with the lattice constant of a diamond film material as a substrate, and carrying out the surface treatment of the substrate; mixed reaction gas comprising 80%-95% of hydrogen, 3%-8% of methane and 2%-12% of auxiliary gas is introduced, wherein the auxiliary gas comprises at least one of argon, chlorine, hydrogen fluoride and hydrogen chloride; carrying out controlled chemical vapor deposition at 850-1000 DEG C under the pressure of not less than 21 kPa, and growing a diamond film on the surface of the substrate; and annealing the diamond film. According to the method, chemical vapor deposition is controlled through cooperation of auxiliary gas and temperature-pressure gradient, and non-corrosion high-speed growth of the high-purity monocrystal diamond film is achieved; in combination with a dynamic annealing process, lattice defects are effectively repaired, the comprehensive performance is optimized, and the reliability of the thin film serving as a heat dissipation component and other applications is remarkably improved.

A wedge-shaped manifold microchannel heat sink with micro pin fins, including a first cover plate, a second cover plate, a manifold substrate and a microchannel substrate that are sequentially arranged from top to bottom. The first cover plate is provided with a first inlet channel. The second cover plate is provided with a second inlet channel and a first outlet channel. The manifold substrate is provided with a third inlet channel and a second outlet channel. The microchannel substrate is provided with a plurality of rows of micro pin fins. A microchannel is formed between any two adjacent rows of micro pin fins.

A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The heat pipe set is adapted for thermal coupling to the heat source, the heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set.

The invention relates to the technical field of electric equipment cooling, and particularly discloses a micro-channel liquid cooling circulation system heat dissipation device with impact resistance. A transition bin; the plurality of groups of micro-channel units are distributed in the bracket at equal intervals; the heat conduction units are embedded between the adjacent micro-channel units; and the circulating adjusting unit is arranged in the transition bin. The circulation adjusting unit can be switched among three states according to heat dissipation requirements, so that the functions of mixed temperature equalization, partitioned heat dissipation and intermittent slow flow of cooling liquid are achieved; in the first state, thermal stress impact and fluid pulsation caused by local temperature difference are effectively reduced, and the thermal stability and thermal impact resistance of the system during continuous high-load operation are enhanced; in the second state, the peripheral flow path can be suspended, and the cooling liquid is concentrated in the central core area to enhance heat dissipation; and in the third state, the cooling liquid is temporarily detained in the micro-channel unit, the heat exchange time is prolonged, and the mutability of fluid flowing is slowed down.

The present disclosure discloses a depilator including a cold compressing portion, a heat sink assembly and a heat conducting plate which are located away from the cold compressing portion. The heat conducting plate includes a main heat absorbing portion and a heat outputting portion. The main heat absorbing portion is in contact with the cold compressing portion, to absorb heat of the cold compressing portion. The heat outputting portion is in contact with the heat sink assembly, to conduct the heat to the heat sink assembly. The depilator defines a cooling channel. The depilator comprises a housing; the housing defines at least one cooling inlet and at least one cooling outlet; the cooling channel is formed between the at least one cooling inlet and the at least one cooling outlet; the heat of the heat sink assembly is dissipated through the cooling channel and the at least one cooling outlet.

A cooling apparatus, comprising a mainboard and a cooling fan, where the novel cooling apparatus comprises: a heat sink, provided on the mainboard and affixed to one end of a vent of the cooling fan. The heat sink comprises: a groove, used for accommodating a heat-generating component provided on the mainboard; cooling fins, distributed within the heat sink and arranged on two sides of the groove. A venting and cooling channel is constituted between the interior of the heat sink and the vent of the cooling fan. The beneficial effect of the technical solution is such that, with other heat-generating components placed in the heat sink, the space in the heat sink is fully utilized, the fan is utilized to cool the heat sink and the heat-generating components therein, thus increasing the utilization rate of the fan, increasing the cooling efficiency, and effectively utilizing space.

The invention discloses a heat dissipation module and an optical machine, and relates to the technical field of optical machine manufacturing, the heat dissipation module comprises a heat conduction part, a semiconductor refrigeration part, a control assembly and a water absorption layer, the heat conduction part comprises a heat conduction plate and an extension section arranged on the heat conduction plate, the semiconductor refrigeration part comprises a first surface and a second surface which are oppositely arranged, and the first surface is attached to the heat conduction plate; the control assembly comprises a control panel and a chip installed on the control panel, the control panel is provided with a first through hole, and the water absorption layer is provided with a second through hole; the chip, the control panel, the water absorption layer, the heat conduction plate and the semiconductor refrigeration piece are arranged in sequence, and the extending section sequentially penetrates through the second through hole and the first through hole to be connected with the chip. The heat dissipation module has the advantage that the failure risk of an optical machine can be reduced.

The invention relates to the field of live broadcast equipment, in particular to an outdoor live broadcast platform. An outdoor live broadcast platform comprises a back plate, the front side of the back plate is provided with a curve fitting the back of a human body, the back plate comprises an upper back plate and a lower back plate which are rotatably connected with each other, two adjustable straps are symmetrically fixed between the upper back plate and the lower back plate, and the lower back plate is rotatably connected with two supporting parts. The lower back plate is provided with clamping grooves corresponding to the two supporting parts. Wherein the other end of one supporting part is rotationally connected with a mobile phone holder, and the other end of the other supporting part is rotationally connected with a clamp. The rear side of the upper back plate and the rear side of the lower back plate are each fixedly connected with an elastic band, a supporting plate is arranged on the rear side of the lower back plate, an elastic block is arranged above the upper back plate, and holes corresponding to the elastic blocks are formed in the supporting plate. According to the invention, the live broadcast equipment can be fixed during mobile live broadcast, so that a user can perform other live broadcast operations conveniently.

The invention discloses a high-stability high-voltage power supply, and belongs to the technical field of high-voltage power supplies, the high-stability high-voltage power supply comprises a clamping assembly, the clamping assembly comprises a fixing part and a lifting part, a heat dissipation area is formed between the lifting part and the power supply, a heat dissipation assembly is arranged in the clamping assembly, and the heat dissipation assembly comprises a fixed-point heat dissipation part and an auxiliary heat dissipation part corresponding to a heat source area, and a liquid circulation system is integrated, so that multi-mode collaborative heat dissipation of the power supply is realized. Through active suction heat dissipation of the corrugated cover and contact type liquid cooling of the elastic water bag, the problem of local overheating is accurately and efficiently solved, the heat dissipation efficiency and temperature uniformity are remarkably improved, air cooling and liquid cooling work cooperatively, the overall heat dissipation capacity is enhanced, meanwhile, two-way buffering is formed through the pre-pressing water bag and the bottom elastic cushion during transportation of the same structure, and the heat dissipation efficiency is improved. And excellent anti-vibration and anti-impact protection is provided, heat dissipation and protection functions are integrated, and long-term high-stability operation of the high-voltage power supply is guaranteed.

A power conversion apparatus is disclosed. The power conversion apparatus according to one aspect of the present disclosure may include: a housing including an upper part, a lower part disposed in parallel with the upper part, a first side part connecting the upper part with the lower part, and a second side part disposed in parallel with the first side part; a plurality of transistors disposed adjacent to the first side part inside the housing; a heat sink disposed on one side of the plurality of transistors and providing a passage through which air introduced from the outside moves; and a plurality of capacitors disposed in front of the heat sink, wherein the plurality of capacitors may be disposed to be spaced apart from each other so that air introduced from the outside of the housing moves to the heat sink.

The invention discloses a magnetofluid type silicon controlled rectifier radiator and a heat dissipation control method thereof. The radiator comprises a silicon controlled rectifier, a magnetic fluid chamber is attached to the outer side of the silicon controlled rectifier, the magnetic pole array is installed in the magnetic fluid chamber, and cooling fins are assembled outside the magnetic fluid chamber. When alternating current is introduced into the cavity where the magnetic fluid liquid chamber is located, the alternating current and the magnetic field interact to generate Lorentz force, the Lorentz force drives the magnetic fluid to form directional eddy current so as to achieve convective heat exchange on the silicon controlled rectifier, and heat absorbed by the magnetic fluid and air are subjected to heat exchange through the cooling fins. Junction temperature out-of-control caused by local hot spots of the silicon controlled rectifier can be solved, secondary damage of mechanical vibration of a heat dissipation system to welding spots is eliminated, and the highest junction temperature area of the silicon controlled rectifier is focused and cooled according to needs.

The embodiment of the invention discloses electronic equipment and a pressing type pop-up locking assembly, the pressing type pop-up locking assembly can be applied to electronic equipment such as a mobile phone, a tablet personal computer and a notebook computer, is used for realizing switching of working modes of a specific function module in the electronic equipment, and can increase applicable scenes of the function module in the electronic equipment. The pressing type pop-up locking assembly comprises a mounting table unit and at least one locking release unit. The mounting table unit comprises a table body and an elastic reset piece, and the table body is switched among a release position, a first locking position and a first pressing position in the first direction. The lock release unit includes a locking mechanism and an unlocking mechanism. The locking mechanism comprises a first locking block and a first elastic piece; the first locking block is switched between the second locking position and the first avoiding position in the second direction. The unlocking mechanism comprises an unlocking block, and the unlocking block drives the first locking block to move to the first avoiding position. The pressing type pop-up locking assembly is novel in structural design, easy to operate and high in interactivity.

The invention discloses an electromagnetic shielding method for a high-density integrated wireless audio module, and the method comprises the steps: employing a metal material with good conductivity and corrosion resistance, such as aluminum alloy and copper alloy, to cover the outer surface of the module, and enabling the outer metal shielding layer to be used for isolating external electromagnetic interference; the thickness of the outer metal shielding layer is generally 0.3 mm to 1 mm, it is ensured that external electromagnetic radiation can be effectively reflected or absorbed, and the outer metal shielding layer is located between the outer metal shielding layer and the inner conductive coating and is made of a material with high-frequency absorption performance, such as a ferrite material, a conductive polymer or a carbon-based material. The thickness of the wave-absorbing layer can be designed according to the electromagnetic characteristics of a working frequency band and is generally 0.5 mm to 2 mm, so that high-frequency noise can be effectively attenuated. By adopting a multi-layer shielding structure and an intelligent heat dissipation design, electromagnetic interference is effectively reduced, miniaturization and light weight of the wireless audio module are maintained, and compared with the prior art in which a large number of expensive shielding materials are needed, the wireless audio module has the advantages that the selection of the shielding materials and the intelligent heat dissipation design are optimized.

A body sheet of a vapor chamber includes a plurality of first land parts. A first-sheet outer face of the first sheet includes a first bond region, and a first space region. The first bond region overlaps each first land part. The first space region overlaps the space part. The vapor chamber includes a bend region where the vapor chamber is bent along a bend line that extends in a direction crossing the first direction in plan view. The maximum dimension defined between the first bond region and the first space region in the thickness direction of the first sheet is defined as a first maximum dimension. When viewed in a direction parallel to the bend line, the first maximum dimension in the bend region is greater than the first maximum dimension in a region other than the bend region.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

The invention discloses a micro fluid heat dissipation device based on a shell inner wall groove structure and electronic equipment. The heat dissipation device comprises a heat absorption runner module, a heat release runner module and a driving element. The heat absorption flow channel module is of a multi-layer composite film structure. The heat release runner module comprises a sealing film and a groove runner formed in the inner side face of the electronic equipment shell. And the sealing film is fixed on the inner side surface of the shell of the electronic equipment and covers and seals the groove flow channel. The channels formed in the inner side face of the electronic equipment shell serve as heat release runners of the heat dissipation device, the heat dissipation effect of the liquid cooling heat dissipation device of the electronic equipment is improved by means of the good heat conduction performance of the electronic equipment shell and the large contact area between the electronic equipment shell and the external environment, and long-time stable operation of the electronic equipment is guaranteed. The heat absorption flow channel module adopts a multi-layer composite film structure, only one layer of film is arranged between the cooling medium and the heating element, the heat transfer path is short, and the cooling capacity of the heat dissipation device on the heating element is improved.

An MIM preparation method for an ultrahigh heat-conducting composite material based on diamonds and red copper. The method comprises the preparation of a mixture, internal mixing granulation, injection molding, and degreasing sintering. By means of the MIM process, not only can uniform mixing and high-density molding of diamonds and a red copper powder be achieved, thereby effectively overcoming the technical problems of non-uniform dispersity, low density, etc. during the preparation of a high-heat-conductivity composite material by means of a traditional process, but the shape and size of a product can also be accurately controlled, particularly during the production of a sheet material having a thickness of less than 1 mm; moreover, the heat conductivity (the heat conductivity thereof being up to 500-800 W / (m·K)) thereof is significantly improved and is significantly higher than that of a traditional metal material. In addition, by optimizing MIM process parameters and selecting raw materials having higher cost effectiveness, the present invention effectively reduces the production cost, such that large-scale use of the high heat-conducting composite material based on diamonds and red copper becomes possible, thereby satisfying the high-standard requirements of high-performance electronic equipment for heat dissipation materials.

The invention discloses a modular radiator with a detachable function, which comprises a radiating machine box, a radiating unit seat is arranged in the radiating machine box, a radiating unit is arranged on the radiating unit seat, and the radiating unit seat and the radiating unit seat are fixed together through an insulating screw; a controller for controlling the heat dissipation unit seat and the heat dissipation unit, and a power supply wiring unit are arranged outside the heat dissipation machine box; an air inlet grille and an exhaust grille are mounted at the two ends of the heat dissipation machine box; channel modules are installed in a top cover and a bottom cover which are fixedly installed on the upper portion and the lower portion of the heat dissipation machine box, the channel modules are in butt joint, and sealing gaskets are arranged at joints. Through staggered work and modular design, efficient heat dissipation and convenient maintenance are achieved. The device can be flexibly arranged, air leakage is prevented, and the heat dissipation process is accurately regulated and controlled. Meanwhile, fan driving is abandoned, noise is reduced, and the device is suitable for scenes with strict noise requirements.