5927results about "Modifications by conduction heat transfer" patented technology

A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber. The first chamber is adapted to receive a circuit board for electrical power conversion, and the metal heat sink is adapted to dissipate heat generated by the circuit board.

An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

The present invention is a robust LED display module for use in an electronic sign which display module includes a metallic housing, a heat conductive interface panel, an LED circuit board and LEDs, and a metallic mask arranged in intimate contact and association therewith, and which components operate synergistically in concert with each other in order to evenly distribute, reduce and dissipate heat along, about and within the structure of the present invention. Display uniformity is provided by the use of major metallic structures in order to prevent warpage and to protect the geometric integrity of the LED display module.

One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate / cure the adhesive.

A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

Disclosed herein is a card-type peripheral apparatus including: a case body configured to accommodate an electronic package including a circuit board between a first surface and a second surface that are opposite to each other; a first electronic package including a memory mounted on the circuit board; a second electronic package including an electronic part for controlling the memory mounted on the circuit board; a first thermal conductive material arranged inside the case body, the first thermal conductive material in contact with a surface of at least one of the first electronic package and the second electronic package; and a second thermal conductive material formed with the first surface and the second surface of the case body, wherein the first thermal conductive material and the second thermal conductive material are in contact with each other inside the case body.

Thermal management solutions for wireless power transfer systems are provided, which may include any number of features. In one embodiment, an implantable wireless power receiver includes at least one thermal layer disposed on an interior surface of the receiver configured to conduct heat from a central portion of the receiver towards edges of the receiver. The thermal layer can comprise, for example, a copper layer or a ceramic layer embedded in an acrylic polymer matrix. In some embodiments, a plurality of thermal channels can be formed within the receiver to transport heat from central regions of the receiver towards edges of the receiver via free convection. In yet another embodiment, a fluid pipe can be connected to the receiver and be configured to carry heat from the receiver to a location remote from the receiver. Methods of use are also provided.

An energy storage device for storing energy for starting an internal combustion engine of a motor vehicle includes a DC-DC converter, a plurality of capacitors connected electrically to the DC-DC converter, and a housing for containing the DC-DC converter and the capacitors. The DC-DC converter converts a voltage provided by the motor vehicle's battery to a second voltage stored by the capacitors. During an engine start cycle, energy discharges from the capacitors to the starter motor of the engine, wherein the stored voltage of the capacitors provides energy to start the engine. The capacitors are recharged by the vehicle's battery. A thermally insulated barrier separates the DC-DC converter and the capacitors. The housing may be sized and shaped substantially as that of a standard motor vehicle battery, enabling the energy storage device to be installed within the motor vehicle as a substitute for one or more of the vehicle's batteries.

Aspects of the invention provide compositions that include carbon nanotubes dispersed within nanographite particles, and that have useful thermal properties. Certain compositions have high thermal conductivities (e.g., high thermal conductivities at ambient temperature). Certain compositions have a temperature dependent thermal conductivity that reversibly increases with temperature. Certain compositions are useful for heat transfer and can be used as thermal interface material, for example, in the context of computer and / or power generating devices.

A heat sink device includes a heat sink (20) and a shielding member (30). The heat sink defines a receiving groove (220). The shielding member includes a fixing plate (322) received in the receiving groove, and a receiving portion (300) for receiving an electronic component. The heat sink device not only protects the electronic component from EMI, but also effectively dissipates heat generated by the electronic component.

The invention discloses a high-power seeker tile type active phased array antenna, and aims at providing an active phased array antenna which is small in size and low in weight and can reliably work with no requirement for temperature compensation. The high-power seeker tile type active phased array antenna is realized by the following scheme that E-type patches act as radiation array elements of a microstrip antenna array which can be extended according to integral multiples of 4x4 array scale, rectangular grid arrays are distributed on an antenna dielectric substrate, and a tile type TR component is closely connected with a heat exchanger integrally; and the microstrip antenna array is connected with the high-power transmit-receive chips of the tile type TR component to form transmit-receive channels through integration, every four high-power transmit-receive chips are connected with one TR multifunctional chip simultaneously, four TR multifunctional chips form one 4x4 subarray circuit module together, and then subsequent connection with a power distribution synthesis network is performed. Power supply, high-power pulse power modulation and amplitude-phase code control of a DC power supply and wave beam control signals are realized via a power supply modulation distributor so that directional diagram scanning of the high-power tile type active phased array antenna can be realized.

A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air. Other embodiments of the cooling system and methods of cooling are further disclosed.

A heat sink includes a base body of an electrically insulating material and one or several metallic molded parts having a mounting portion and a heat-transfer portion, wherein the heat-transfer portion is mechanically connected to the base body. The heat sink can be inserted on a printed circuit board having several heat sources that can be at different electrical potentials, wherein the mounting portions of the molded parts are soldered to respective heat sources or close to the respective heat sources.

A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate / cure the adhesive.

A cage can include a thermal plate positioned so as to be aligned with a bottom of a channel. An adjustable biasing system is provided to urge a module toward the thermal plate. The adjustable biasing system may be a riding heat sink. The thermal plate may include a fin to help increase its surface area. A housing with a card slot aligned with the channel can be provided in the cage to provide a receptacle that has a card slot aligned with the channel. A receptacle so configured allows for greater thermal energy to be removed from a module.

The invention relates to a graphene radiating apparatus. The radiating apparatus comprises a first radiating layer (10) and a substrate (20), wherein the substrate (20) adopts a two-dimensional or three-dimensional structure and is provided with a first surface and a second surface opposite to the first surface, wherein the radiating layer (10) arranged on the first surface is formed by porous graphene, at least one kind of polymer and / or a compound formed by polymer monomers; and a multi-layer structure at least including a first film layer (210), a second film layer (220), a third film layer (230), a fourth film layer (240) and a fifth film layer (250) is arranged on the second surface. The invention also relates to a preparation method for the graphene radiating apparatus. The graphene radiating apparatus provided by the invention has the advantages of simple structure, high thermal conductivity and thermal dissipation, and wide application range.

A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate / cure the adhesive. The two heat sink plates are connected together to form a rigid frame.

PCT No. PCT / FR96 / 00150 Sec. 371 Date Aug. 21, 1997 Sec. 102(e) Date Aug. 21, 1997 PCT Filed Jan. 30, 1996 PCT Pub. No. WO96 / 26631 PCT Pub. Date Aug. 29, 1996Method for fabricating thermally cooled electronic cards. A card of any kind is covered with a rigid heat sink shaped to fit the card and is attached thereto. The heat sink is formed in such a way that it fits as closely as possible the shape of the printed circuit. The printed circuit has components on one or both faces so that it is possible to increase the surface thermal coupling between the sink and the board. An optical sensor using a laser beam may be used.

The present invention relates to a passive layer including graphene for the attenuation of near-field electromagnetic waves and heat dissipation. The passive layer blocks electromagnetic waves radiated from an external electronic device or prevents electromagnetic waves generated in an electronic device from emitting to the outside. The passive layer is designed to reduce interference between transmission circuits of a device in the near-field region or influence such as malfunction caused by external electromagnetic waves. The present invention also relates to an electromagnetic device and a circuit board, each including the passive layer.

A receptacle connector defines a port. The port is provided with spring fingers that are configured to engage a mating module. The spring fingers are thermally coupled to a heat transfer plate that can be configured to provide part of a cage that defines the port. Fins can be mounted on or integrated into the heat transfer plate. In operation, thermal energy from an inserted module is transferred from the module to spring fingers and then to the heat transfer plate and then to a thermal dissipation system.

A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

A cage can include a thermal plate positioned so as to be aligned with a bottom of a channel. An adjustable biasing system is provided to urge a module toward the thermal plate. The adjustable biasing system may be a riding heat sink. The thermal plate may include a fin to help increase its surface area. A housing with a card slot aligned with the channel can be provided in the cage to provide a receptacle that has a card slot aligned with the channel. A receptacle so configured allows for greater thermal energy to be removed from a module.

A thermal management system for cooling a heat source onboard an aircraft that has a frame and a skin coupled to the frame such that the skin has a first segment and a second segment includes a first network of heat pipes coupled in conductive heat transfer with the heat source and the first segment of skin. The first network of heat pipes is configured to heat the first segment of skin using heat from the heat source. The thermal management system further includes a second network of heat pipes coupled in conductive heat transfer with the heat source and the second segment of skin. The second network of heat pipes is configured to heat the second segment of skin using heat from the heat source. The thermal management system is configured to selectively deactivate the first network of heat pipes and the second network of heat pipes.

A thermal management system for a heat generating electrical component and a method of making such a thermal management system. Additive manufacturing is used to form at least a portion of the thermal management system as a unitary, monolithic structure. Such a structure maximizes heat transfer by reducing or eliminating thermal interfaces between the components of the thermal management system. The use of additive manufacturing also allows for the production of varying thermal management system geometries that are not possible with conventional methods.

A system and method for mounting an electronic display is disclosed herein. A rear cover mounting bracket may contain a rear plate and a sidewall which surrounds a perimeter of the plate. A plurality of mounting holes may be placed within the plate to allow fastening the rear plate to a vertical surface. An electronic display assembly module may contain a thermal plate where the attachment of the rear cover mounting bracket to the module creates a plenum which can house one or more electronic components. In a preferred embodiment, the rear plate contains a pair of hooks and the module contains a pair of corresponding cylinders which can be engaged with the hooks so that the module can hang from the hooks.

A combination assembly of LED and heat sink includes a heat sink having a substrate and a plurality of fins, a circuit board provided on the substrate and at least one LED unit provided on the heat sink and electrically connected to the circuit board. The heat of the LED unit may be transmitted to the heat sink directly for heat transmission. The present invention has a greater heat transmission efficiency.

A system and method for mounting an electronic display is disclosed herein. A rear cover mounting bracket may contain a rear plate and a sidewall which surrounds a perimeter of the plate. A plurality of mounting holes may be placed within the plate to allow fastening the rear plate to a vertical surface. An electronic display assembly module may contain a thermal plate where the attachment of the rear cover mounting bracket to the module creates a plenum which can house one or more electronic components. In a preferred embodiment, the rear plate contains a pair of hooks and the module contains a pair of corresponding cylinders which can be engaged with the hooks so that the module can hang from the hooks.