4389results about "Modifications by conduction heat transfer" patented technology

Embodiments of the present invention provide a phototherapy mask designed to enhance user comfort and effectiveness during treatment. The mask comprises a shell that fits over the user's face, featuring a first opening to avoid contact with the eyes and a second opening to avoid the nose. A first pad, positioned around the edge of the first opening, rests against the skin near the peripheral eyes to control the distance between the mask and the skin, while a second pad, located at the bottom of the shell, supports the chin. These pads help maintain the mask's stability and prevent it from shifting during use. The light source assembly, installed on the shell, provides phototherapy to the skin.

A heat transfer device may be used to provide a thermal conduit from heat generating components mounted on transversely oriented circuit boards. The heat transfer device generally includes a base portion for supporting and thermally coupling with at least one heat generating component on a main circuit board and a transverse portion for supporting and thermally coupling with at least one heat generating component on a daughter circuit board that is oriented transverse to the main circuit board. The base and transverse portions may be made of a thermally conductive material with raised pedestals providing the thermal coupling with the heat generating components. The transverse portion of the heat transfer device may also be designed to facilitate connecting the daughter circuit board to the main circuit board. The heat transfer device may be used in an opto-electronic communications module, such as a broadband digital access (BDA) module used in a hybrid fiber-coaxial (HFC) network.

The invention provides an all-silicon carbide double-sided heat dissipation module packaging method based on gradient thermal resistance optimization, and belongs to the technical field of electronic component packaging. Establishing a thermal resistance characteristic curve, and calculating a gradient thermal resistance vector to determine a heat flow path; constructing a heat dissipation temperature distribution matrix; obtaining thermal diffusion data; heat dissipation path thermal resistance is calculated by combining the thermal diffusion matrix and the temperature distribution matrix, and a thermal resistance sparse matrix is established and is dimensionally reduced into a thermal resistance low-dimensional matrix; calculating an optimal heat dissipation path parameter set; inputting the parameter set into a thermal resistance prediction deep attention network model for verification and fine tuning, and generating a final thermal resistance distribution scheme; a module structure and a material ratio are designed according to the scheme to form a sandwich structure; a silver paste sintering process is adopted to realize low thermal resistance connection and complete packaging, and the technical problems of non-uniform thermal resistance distribution and difficulty in optimizing a heat flow path in a double-sided heat dissipation structure of a silicon carbide power module in the prior art are solved.

The invention discloses a modular micro-nano satellite integrated power system suitable for batch production and an assembly method thereof. The integrated power system is composed of a semi-open type electric box structure and a modular circuit board. The electricity box structure comprises an electricity box upper cover and an electricity box lower cover, and a plurality of threaded holes are formed in the two sides of the electricity box upper cover and the two sides of the electricity box lower cover and used for being connected with a satellite structure cabin plate; the heat dissipation plate bodies are distributed on the two sides of the modular circuit board; the modularized circuit board is provided with a plurality of circuit boards which are respectively provided with electronic modules in a stacking arrangement. A plurality of electronic modules are integrated into an electronic system by adopting a mechanical-electrical-thermal integrated design method, the system breaks through the function limit of a traditional satellite subsystem, the defects of information exclusion and resource waste are eliminated, a satellite is used as a whole to be subjected to unified design and resource planning tradeoff from the system level, and the system performance is improved. The weight of cables and connectors between electronic modules is greatly reduced, and the effective load ratio is improved.

A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

The invention discloses a heat dissipation mechanism and an installation method thereof, a device applying the heat dissipation mechanism and a cable system. The heat dissipation mechanism is used for dissipating heat of a heat dissipation demand unit. The heat dissipation mechanism comprises an inner heat dissipation sleeve used for being connected outside the inner heat dissipation demand part in a sleeving mode, and the inner side wall of the inner heat dissipation sleeve is used for being attached to the outer side wall of the inner heat dissipation demand part; the outer heat dissipation sleeve comprises a plurality of outer heat dissipation plates, the outer heat dissipation plates are arranged at intervals in the circumferential direction of the inner heat dissipation sleeve, a heat dissipation gap is formed between each outer heat dissipation plate and the inner heat dissipation sleeve, and the outer side wall of the outer heat dissipation sleeve is used for being attached to the inner side wall of the outer sleeve body; the heat conduction pieces are connected between at least part of the outer heat dissipation plates and the inner heat dissipation sleeves; and the elastic pieces are arranged between each outer heat dissipation plate and the inner heat dissipation sleeve in an abutting mode, and each outer heat dissipation plate is configured to be capable of moving in the radial direction of the inner heat dissipation sleeve.

A mobile phone may include an enclosure. The enclosure may include a front cover, a rear cover, a housing segment coupled to the front cover and to the rear cover and including a first wall section defining at least a portion of a first side exterior surface of the mobile phone, a second wall section defining at least a portion of a second side exterior surface, and a chassis section extending between the first wall section and the second wall section. The mobile phone may further include a circuit board assembly thermally coupled to the chassis section at a thermal coupling region of the chassis section, the chassis section defining a thermal path extending from the thermal coupling region to the first wall section, and a through-hole positioned in the thermal path and configured to interrupt a flow of heat from the circuit board assembly to the first wall section.

An object of the present invention is to provide a head-up display apparatus further reduced in size, the head-up display apparatus having: an image display apparatus including a light source and a display element; and a virtual image optical system in which light emitted from the image display apparatus is reflected by a windshield or a combiner of the vehicle so that a virtual image is displayed in front of the vehicle, wherein the virtual image optical system has a concave mirror and a distortion correcting lens, and the distortion correcting lens is disposed between the image display apparatus and the concave mirror, the concave mirror is disposed in a housing including an outer case along a shape of an effective light path area of the image light from the image display apparatus, and the image display apparatus is attached to part of an outer periphery of the housing.

The invention belongs to the technical field of heat dissipation of electronic equipment, and particularly discloses an efficient heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a heat dissipation substrate tightly attached to the surface of a heating element, a vapor chamber is tightly attached to the face, away from the heating element, of the heat dissipation substrate, and heat dissipation fins and a heat dissipation fan are sequentially connected to the face, away from the heat dissipation substrate, of the vapor chamber; the vapor chamber comprises a shell, a cover plate and a liquid absorbing core, the cover plate is sealed on the shell, a vacuum cavity is formed in the cover plate, the vacuum cavity is filled with a two-phase fluid working medium, the liquid absorbing core is arranged in the vacuum cavity, the upper surface and the lower surface of the liquid absorbing core are tightly attached to the cover plate and the shell respectively, and a plurality of hollow steam cavities are formed in the liquid absorbing core. The electronic equipment comprises the efficient heat dissipation assembly. Through the synergistic effect of the heat dissipation substrate tightly attached to the heating element, the vapor chamber containing the two-phase fluid working medium and the multiple layers of heat dissipation fins, the structure compactness is guaranteed, and meanwhile efficient heat conduction and rapid heat dissipation are achieved.

The invention relates to the technical field of electricity meters, and particularly discloses a relay and an electricity meter thereof, comprising a mounting plate: a clamping frame is fixedly mounted on the front surface of the mounting plate, sliding grooves are formed in the upper and lower ends of the clamping frame, sliding plates are slidably connected to the inner sides of the sliding grooves, and heat dissipation fins of a heat conduction aluminum plate are attached to electronic components in the electricity meter. The n-pentane heat-conducting medium in the liquid storage box is heated and vaporized, the heat is absorbed, the heat dissipation capability is improved, the heat pushes the air cylinder to open the heat dissipation window, the air velocity in the electric meter is improved, the heat dissipation is enhanced, the temperature is continuously increased, and the heat-conducting medium is further vaporized, so that the inner current-conducting plate and the outer current-conducting plate are attached; and after the temperature is reduced, the heat-conducting medium is condensed, the air cylinder shrinks to block the heat dissipation window, the heat dissipation fan does not need to be automatically triggered by a temperature sensor, the consumption is reduced, the stability is improved, the cost is reduced, and the protection and moisture-proof performance is improved by the blocking window when the heat dissipation device is not used.

An electric wheel controller and methods for operating and manufacturing an electric wheel controller are disclosed. Embodiments include a controller forming a structural and / or load bearing component of the vehicle suspension system. Embodiments of the controller can be mounted to a wheel assembly, and in some embodiments the controller is a suspension knuckle. Embodiments include a controller with a cavity and electronic circuitry submerged in liquid coolant. During operation the coolant can absorb heat from the immersed circuitry. In some embodiments the coolant transitions to a gas and / or vapor, and can move to an upper portion of the cavity. When the coolant contacts the cooler surfaces of the cavity the coolant can transition back to a liquid and return to a pool of liquid coolant in which the circuitry is immersed. A heat sink can be connected to the controller, such as by laser soldering.

The invention provides a shell, a preparation method thereof and electronic equipment. The shell provided by the embodiment of the invention comprises fiber cloth; the graphene coating is coated on the periphery of a part of the fiber cloth; the surface of the fiber cloth and the surface of the graphene coating are wrapped with the resin layer. The shell provided by the embodiment of the invention has relatively high rigidity and heat conductivity coefficient, and does not affect the transmission of electromagnetic wave signals.

The invention provides head-mounted equipment. The head-mounted equipment comprises a shell, a heat source device, a radiator and a cooling fan, an accommodating space is formed in the shell; the heat source device is arranged in the accommodating space; one side of the radiator is connected with the heat source device, and the other side of the radiator is connected with the shell through a heat-conducting medium; an air outlet of the cooling fan corresponds to the radiator and is used for taking away heat around the radiator through airflow. According to the head-mounted device provided by the embodiment of the invention, through two combined heat dissipation modes of connecting the radiator with the shell and blowing away the heat around the radiator by using the heat dissipation fan, the heat dissipation efficiency can be greatly improved, heat accumulation in the head-mounted device can be well solved, the rotating speed of the fan can be improved, and better man-machine temperature rise and noise experience can be achieved.

The invention belongs to the technical field of aerospace engineering, and discloses a flexible radiator which comprises a radiation assembly, the radiation assembly comprises a plurality of radiation plates which are rotationally connected in sequence, each radiation plate comprises a liquid cooling pipe set and a radiation film arranged on the liquid cooling pipe set, and cooling liquid circulates in the liquid cooling pipe set. The material density is low, the structural mass is effectively reduced, a plurality of radiant panels are rotationally connected in sequence, the radiant panels are in a folded state during emission, then a radiator with enough radiation area can be emitted under the condition that the size of a spacecraft is limited, and the heat dissipation requirement of high-power electronic equipment is met.

A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.

A cooling system assembly may include a heatsink unit and a water block unit. The heatsink unit is configured to enable a first cooling liquid to undergo a phase-change. The heatsink unit includes a heat pipe heatsink comprising a first thermal transfer surface and a second thermal transfer surface. The second thermal transfer surface is opposite the first thermal transfer surface. The first thermal transfer surface is configured to enable a heat to be transported from at least one packaged integrated circuit to the heat pipe heatsink. The water block unit is configured to enable a second cooling liquid to flow through the water block unit. The water block unit is thermally coupled to the second thermal transfer surface. The second thermal transfer surface is configured to enable the heat to be further transported from the heat pipe heatsink to the water block unit.

The invention discloses a diamond film and a preparation method and application thereof, and the preparation method comprises the steps: taking a substrate material matched with the lattice constant of a diamond film material as a substrate, and carrying out the surface treatment of the substrate; mixed reaction gas comprising 80%-95% of hydrogen, 3%-8% of methane and 2%-12% of auxiliary gas is introduced, wherein the auxiliary gas comprises at least one of argon, chlorine, hydrogen fluoride and hydrogen chloride; carrying out controlled chemical vapor deposition at 850-1000 DEG C under the pressure of not less than 21 kPa, and growing a diamond film on the surface of the substrate; and annealing the diamond film. According to the method, chemical vapor deposition is controlled through cooperation of auxiliary gas and temperature-pressure gradient, and non-corrosion high-speed growth of the high-purity monocrystal diamond film is achieved; in combination with a dynamic annealing process, lattice defects are effectively repaired, the comprehensive performance is optimized, and the reliability of the thin film serving as a heat dissipation component and other applications is remarkably improved.

A wedge-shaped manifold microchannel heat sink with micro pin fins, including a first cover plate, a second cover plate, a manifold substrate and a microchannel substrate that are sequentially arranged from top to bottom. The first cover plate is provided with a first inlet channel. The second cover plate is provided with a second inlet channel and a first outlet channel. The manifold substrate is provided with a third inlet channel and a second outlet channel. The microchannel substrate is provided with a plurality of rows of micro pin fins. A microchannel is formed between any two adjacent rows of micro pin fins.

A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The heat pipe set is adapted for thermal coupling to the heat source, the heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set.

The invention relates to the technical field of electric equipment cooling, and particularly discloses a micro-channel liquid cooling circulation system heat dissipation device with impact resistance. A transition bin; the plurality of groups of micro-channel units are distributed in the bracket at equal intervals; the heat conduction units are embedded between the adjacent micro-channel units; and the circulating adjusting unit is arranged in the transition bin. The circulation adjusting unit can be switched among three states according to heat dissipation requirements, so that the functions of mixed temperature equalization, partitioned heat dissipation and intermittent slow flow of cooling liquid are achieved; in the first state, thermal stress impact and fluid pulsation caused by local temperature difference are effectively reduced, and the thermal stability and thermal impact resistance of the system during continuous high-load operation are enhanced; in the second state, the peripheral flow path can be suspended, and the cooling liquid is concentrated in the central core area to enhance heat dissipation; and in the third state, the cooling liquid is temporarily detained in the micro-channel unit, the heat exchange time is prolonged, and the mutability of fluid flowing is slowed down.

The present disclosure discloses a depilator including a cold compressing portion, a heat sink assembly and a heat conducting plate which are located away from the cold compressing portion. The heat conducting plate includes a main heat absorbing portion and a heat outputting portion. The main heat absorbing portion is in contact with the cold compressing portion, to absorb heat of the cold compressing portion. The heat outputting portion is in contact with the heat sink assembly, to conduct the heat to the heat sink assembly. The depilator defines a cooling channel. The depilator comprises a housing; the housing defines at least one cooling inlet and at least one cooling outlet; the cooling channel is formed between the at least one cooling inlet and the at least one cooling outlet; the heat of the heat sink assembly is dissipated through the cooling channel and the at least one cooling outlet.

A receptacle assembly includes a receptacle cage having a channel separator received in the cavity between the side walls separating the cavity into upper and lower module channels receiving corresponding pluggable modules. The receptable assembly includes a thermal transport assembly coupled to the receptacle cage having an upper cooling module, a lower cooling module and a cold plate at the rear of the receptacle cage. The upper cooling module is located in a top opening of the cage to thermally couple to the upper pluggable module. The lower cooling module is loaded into the separator chamber to thermally coupled to the lower pluggable module plugged into the lower module chamber.

A cooling apparatus, comprising a mainboard and a cooling fan, where the novel cooling apparatus comprises: a heat sink, provided on the mainboard and affixed to one end of a vent of the cooling fan. The heat sink comprises: a groove, used for accommodating a heat-generating component provided on the mainboard; cooling fins, distributed within the heat sink and arranged on two sides of the groove. A venting and cooling channel is constituted between the interior of the heat sink and the vent of the cooling fan. The beneficial effect of the technical solution is such that, with other heat-generating components placed in the heat sink, the space in the heat sink is fully utilized, the fan is utilized to cool the heat sink and the heat-generating components therein, thus increasing the utilization rate of the fan, increasing the cooling efficiency, and effectively utilizing space.

The invention discloses a heat dissipation module and an optical machine, and relates to the technical field of optical machine manufacturing, the heat dissipation module comprises a heat conduction part, a semiconductor refrigeration part, a control assembly and a water absorption layer, the heat conduction part comprises a heat conduction plate and an extension section arranged on the heat conduction plate, the semiconductor refrigeration part comprises a first surface and a second surface which are oppositely arranged, and the first surface is attached to the heat conduction plate; the control assembly comprises a control panel and a chip installed on the control panel, the control panel is provided with a first through hole, and the water absorption layer is provided with a second through hole; the chip, the control panel, the water absorption layer, the heat conduction plate and the semiconductor refrigeration piece are arranged in sequence, and the extending section sequentially penetrates through the second through hole and the first through hole to be connected with the chip. The heat dissipation module has the advantage that the failure risk of an optical machine can be reduced.

The invention relates to the field of live broadcast equipment, in particular to an outdoor live broadcast platform. An outdoor live broadcast platform comprises a back plate, the front side of the back plate is provided with a curve fitting the back of a human body, the back plate comprises an upper back plate and a lower back plate which are rotatably connected with each other, two adjustable straps are symmetrically fixed between the upper back plate and the lower back plate, and the lower back plate is rotatably connected with two supporting parts. The lower back plate is provided with clamping grooves corresponding to the two supporting parts. Wherein the other end of one supporting part is rotationally connected with a mobile phone holder, and the other end of the other supporting part is rotationally connected with a clamp. The rear side of the upper back plate and the rear side of the lower back plate are each fixedly connected with an elastic band, a supporting plate is arranged on the rear side of the lower back plate, an elastic block is arranged above the upper back plate, and holes corresponding to the elastic blocks are formed in the supporting plate. According to the invention, the live broadcast equipment can be fixed during mobile live broadcast, so that a user can perform other live broadcast operations conveniently.

The invention discloses a high-stability high-voltage power supply, and belongs to the technical field of high-voltage power supplies, the high-stability high-voltage power supply comprises a clamping assembly, the clamping assembly comprises a fixing part and a lifting part, a heat dissipation area is formed between the lifting part and the power supply, a heat dissipation assembly is arranged in the clamping assembly, and the heat dissipation assembly comprises a fixed-point heat dissipation part and an auxiliary heat dissipation part corresponding to a heat source area, and a liquid circulation system is integrated, so that multi-mode collaborative heat dissipation of the power supply is realized. Through active suction heat dissipation of the corrugated cover and contact type liquid cooling of the elastic water bag, the problem of local overheating is accurately and efficiently solved, the heat dissipation efficiency and temperature uniformity are remarkably improved, air cooling and liquid cooling work cooperatively, the overall heat dissipation capacity is enhanced, meanwhile, two-way buffering is formed through the pre-pressing water bag and the bottom elastic cushion during transportation of the same structure, and the heat dissipation efficiency is improved. And excellent anti-vibration and anti-impact protection is provided, heat dissipation and protection functions are integrated, and long-term high-stability operation of the high-voltage power supply is guaranteed.

A power conversion apparatus is disclosed. The power conversion apparatus according to one aspect of the present disclosure may include: a housing including an upper part, a lower part disposed in parallel with the upper part, a first side part connecting the upper part with the lower part, and a second side part disposed in parallel with the first side part; a plurality of transistors disposed adjacent to the first side part inside the housing; a heat sink disposed on one side of the plurality of transistors and providing a passage through which air introduced from the outside moves; and a plurality of capacitors disposed in front of the heat sink, wherein the plurality of capacitors may be disposed to be spaced apart from each other so that air introduced from the outside of the housing moves to the heat sink.

The invention discloses a magnetofluid type silicon controlled rectifier radiator and a heat dissipation control method thereof. The radiator comprises a silicon controlled rectifier, a magnetic fluid chamber is attached to the outer side of the silicon controlled rectifier, the magnetic pole array is installed in the magnetic fluid chamber, and cooling fins are assembled outside the magnetic fluid chamber. When alternating current is introduced into the cavity where the magnetic fluid liquid chamber is located, the alternating current and the magnetic field interact to generate Lorentz force, the Lorentz force drives the magnetic fluid to form directional eddy current so as to achieve convective heat exchange on the silicon controlled rectifier, and heat absorbed by the magnetic fluid and air are subjected to heat exchange through the cooling fins. Junction temperature out-of-control caused by local hot spots of the silicon controlled rectifier can be solved, secondary damage of mechanical vibration of a heat dissipation system to welding spots is eliminated, and the highest junction temperature area of the silicon controlled rectifier is focused and cooled according to needs.