2184results about "Modifications by conduction heat transfer" patented technology

The invention relates to the technical field of electric equipment cooling, and particularly discloses a micro-channel liquid cooling circulation system heat dissipation device with impact resistance. A transition bin; the plurality of groups of micro-channel units are distributed in the bracket at equal intervals; the heat conduction units are embedded between the adjacent micro-channel units; and the circulating adjusting unit is arranged in the transition bin. The circulation adjusting unit can be switched among three states according to heat dissipation requirements, so that the functions of mixed temperature equalization, partitioned heat dissipation and intermittent slow flow of cooling liquid are achieved; in the first state, thermal stress impact and fluid pulsation caused by local temperature difference are effectively reduced, and the thermal stability and thermal impact resistance of the system during continuous high-load operation are enhanced; in the second state, the peripheral flow path can be suspended, and the cooling liquid is concentrated in the central core area to enhance heat dissipation; and in the third state, the cooling liquid is temporarily detained in the micro-channel unit, the heat exchange time is prolonged, and the mutability of fluid flowing is slowed down.

The invention discloses a heat dissipation module and an optical machine, and relates to the technical field of optical machine manufacturing, the heat dissipation module comprises a heat conduction part, a semiconductor refrigeration part, a control assembly and a water absorption layer, the heat conduction part comprises a heat conduction plate and an extension section arranged on the heat conduction plate, the semiconductor refrigeration part comprises a first surface and a second surface which are oppositely arranged, and the first surface is attached to the heat conduction plate; the control assembly comprises a control panel and a chip installed on the control panel, the control panel is provided with a first through hole, and the water absorption layer is provided with a second through hole; the chip, the control panel, the water absorption layer, the heat conduction plate and the semiconductor refrigeration piece are arranged in sequence, and the extending section sequentially penetrates through the second through hole and the first through hole to be connected with the chip. The heat dissipation module has the advantage that the failure risk of an optical machine can be reduced.

The invention discloses a high-stability high-voltage power supply, and belongs to the technical field of high-voltage power supplies, the high-stability high-voltage power supply comprises a clamping assembly, the clamping assembly comprises a fixing part and a lifting part, a heat dissipation area is formed between the lifting part and the power supply, a heat dissipation assembly is arranged in the clamping assembly, and the heat dissipation assembly comprises a fixed-point heat dissipation part and an auxiliary heat dissipation part corresponding to a heat source area, and a liquid circulation system is integrated, so that multi-mode collaborative heat dissipation of the power supply is realized. Through active suction heat dissipation of the corrugated cover and contact type liquid cooling of the elastic water bag, the problem of local overheating is accurately and efficiently solved, the heat dissipation efficiency and temperature uniformity are remarkably improved, air cooling and liquid cooling work cooperatively, the overall heat dissipation capacity is enhanced, meanwhile, two-way buffering is formed through the pre-pressing water bag and the bottom elastic cushion during transportation of the same structure, and the heat dissipation efficiency is improved. And excellent anti-vibration and anti-impact protection is provided, heat dissipation and protection functions are integrated, and long-term high-stability operation of the high-voltage power supply is guaranteed.

The invention discloses a magnetofluid type silicon controlled rectifier radiator and a heat dissipation control method thereof. The radiator comprises a silicon controlled rectifier, a magnetic fluid chamber is attached to the outer side of the silicon controlled rectifier, the magnetic pole array is installed in the magnetic fluid chamber, and cooling fins are assembled outside the magnetic fluid chamber. When alternating current is introduced into the cavity where the magnetic fluid liquid chamber is located, the alternating current and the magnetic field interact to generate Lorentz force, the Lorentz force drives the magnetic fluid to form directional eddy current so as to achieve convective heat exchange on the silicon controlled rectifier, and heat absorbed by the magnetic fluid and air are subjected to heat exchange through the cooling fins. Junction temperature out-of-control caused by local hot spots of the silicon controlled rectifier can be solved, secondary damage of mechanical vibration of a heat dissipation system to welding spots is eliminated, and the highest junction temperature area of the silicon controlled rectifier is focused and cooled according to needs.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

The embodiment of the invention provides a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation of electronic equipment. The liquid cooling heat dissipation device comprises a liquid separator, a liquid cooling device and a liquid cooling device, wherein the liquid separator is used for being arranged in a case; a plurality of liquid passing holes are formed in the elastic piece at intervals, and the liquid separator is connected with one side of the elastic piece; one side of each cold plate is connected with the other side of the corresponding elastic part, the other side of each cold plate is used for abutting against a part to be cooled, and a cooling space is formed between each cold plate and the liquid separator through the corresponding liquid passing hole; a liquid inlet and a liquid outlet are formed in the positions, located on the two sides of each cooling space, of the liquid separator. According to the liquid cooling heat dissipation device and the electronic equipment, the convenience of plugging and unplugging the to-be-cooled part is improved.

The invention relates to the technical field of aluminum alloy materials, and provides a high-thermal-conductivity 6xxx aluminum alloy, a preparation method thereof and an electronic product structural part. Wherein the 6xxx aluminum alloy comprises the following components in percentage by mass: 0.3 to 0.5 percent of Mg, 0.2 to 0.35 percent of Si, 0.08 to 0.12 percent of Ce, less than or equal to 0.10 percent of Cu, less than or equal to 0.15 percent of Fe, less than or equal to 0.05 percent of Mn, less than or equal to 0.10 percent of Zn, less than or equal to 0.05 percent of Ti, less than or equal to 0.15 percent of total impurities and the balance of Al; and Mg / Si is in the range of 1.3 to 1.5. According to the 6xxx aluminum alloy and the preparation method thereof, the content and the mass ratio of Si and Mn are accurately regulated and controlled, meanwhile, a trace Ce element is added, the thermal conductivity and the anodic oxidation performance of the 6xxx aluminum alloy are improved, solid solution and aging processes are further matched, the beta ''phase and the grain size are controlled, and the alloy has the excellent anodic oxidation performance while having the high thermal conductivity.

The invention discloses a jack connecting terminal, which comprises an inner conductor provided with a jack for connecting a plug, and the inner conductor comprises a first connecting section which is a plurality of connecting sheets uniformly distributed along the axis of the jack; and a second connection section; the outer conductor wraps the first connecting section and the second connecting section, a first opening is formed in the position, corresponding to the connecting sheet, of the outer conductor at the first connecting section, and an abutting sheet used for abutting against the connecting sheet is connected to the first opening; the shell is connected to the outer conductor, and the shell and the outer conductor are arranged in a clamped mode; an adjusting mechanism is arranged on the shell and used for driving the abutting piece to move between the first position and the second position. When the abutting piece moves from the first position to the second position, the abutting piece is used for driving one end of the connecting piece to deviate towards the axis direction of the jack. The problems that in the prior art, high conductivity and high mechanical strength cannot be met, and good heat dissipation capacity is not achieved can be effectively solved.

A bracket, a module assembly, and an electronic device, so as to improve position stability of the module in the electronic device. Two first limiting parts arranged opposite to each other are arranged at two ends of the bracket, a second limiting part is arranged on at least one side of the bracket, and the two first limiting parts and the second limiting part are enclosed to form a mounting position for mounting the module. Both the first limiting parts and the second limiting part may limit the module, so as to limit in all directions and ensure position stability of the module in the bracket. The bracket is further fixed to the electronic device through fixing parts, so that the position stability of the module in the electronic device may be improved.

A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. The particulate filler material can have a higher bulk thermal conductivity than that of the metallic carrier material and can be wetted by the metallic carrier material, providing a bulk thermal conductivity of the composite thermal-interface material that is higher than that of the carrier material without the particulate filler material. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

The invention discloses a liquid cooling heat dissipation system for electronic equipment, the electronic equipment comprises a shell and a heating component, the shell is internally provided with an accommodating cavity, the heating component is arranged in the accommodating cavity, and the liquid cooling heat dissipation system comprises a first liquid cooling plate arranged in the accommodating cavity and connected with the heating component; the first liquid cooling plate is provided with a first liquid inlet, a first liquid outlet and a first cavity communicated with the first liquid inlet and the first liquid outlet; the refrigeration module is arranged in the accommodating cavity and is far away from the heating component, and the refrigeration module is provided with a second liquid inlet, a second liquid outlet and a second cavity communicated with the second liquid inlet and the second liquid outlet; the micropump is provided with a liquid inlet end and a liquid outlet end which are communicated with each other, the liquid inlet end of the micropump is communicated with the first liquid inlet, and the liquid outlet end of the micropump is communicated with the second liquid inlet; the first liquid outlet is communicated with the second liquid outlet, so that the first cavity and the second cavity form a fluid channel, and a liquid cooling working medium is arranged in the fluid channel.

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

The invention discloses a controller heat dissipation water channel, and relates to the technical field of controller heat dissipation, the controller heat dissipation water channel comprises a lower shell, the two corners of the lower sides of the left and right ends of the lower shell are connected with mounting seats, the upper end of the lower shell is connected with an upper shell through bolts, and the bottom of an inner cavity of the lower shell is connected with a circuit board through bolts; a heat dissipation cavity is formed in the upper end of the upper shell in a front-back penetrating mode, a plurality of heat dissipation pieces are connected to the interiors of the left side and the right side of the upper end of the upper shell, and a collection piece is connected to the middle of the heat dissipation pieces. Cooling liquid absorbs heat in the circulation process and is dissipated through the cooling fins, the cooling liquid absorbs the heat in the heat absorption cavity and then is evenly distributed to the cooling fins through the communication pipeline, meanwhile, airflow in the heat dissipation cavity rapidly takes away the heat, an efficient heat exchange path is formed, local overheating is avoided, heat dissipation uniformity is improved, and long-time stable operation of the controller is guaranteed.

Disclosed are a middle frame assembly and an electronic device including same. The middle frame assembly includes an inner frame and an outer frame arranged on an outer periphery of the inner frame, where the inner frame includes a first metal material, the outer frame includes a second metal material, and a density of the first metal material is lower than a density of the second metal material. According to the present disclosure, a weight of the middle frame assembly can be reduced, and further, a weight of the electronic device can be reduced, thereby improving portability, and keeping an appearance of the electronic device with a high-grade gloss and feel.

An electronic apparatus includes a first chassis in which a motherboard mounted with a processing device is mounted, a second chassis provided adjacent to the first chassis, a hinge device that relatively rotatably connects the first chassis to the second chassis, an electrical component that is provided in the first chassis and generates heat, a plate-shaped thermal module that is provided in the first chassis and is thermally connected to the electrical component to radiate heat, and a graphite sheet provided to extend from the first chassis to the second chassis. A connection edge portion of the first chassis is made of a heat conductive material, the thermal module is provided with a heat pipe along the connection edge portion, and the graphite sheet is thermally connected to the heat pipe and the connection edge portion by being laminated and interposed therebetween.

The invention relates to the technical field of server heat dissipation, in particular to a combined heat dissipation device of a server, which comprises a cabinet body with a mounting space, and a circulating air duct, a first air inlet of the circulating air duct and a first air outlet of the circulating air duct are arranged on one side in the mounting space; the circulating fan is lower than the first air inlet; the supporting layers are arranged in the mounting space in the height direction, each supporting layer is provided with a supporting face, the supporting faces are provided with air passing holes, auxiliary fans are arranged below the supporting layers, radiators are arranged on the upper sides of the auxiliary fans, and electronic refrigeration pieces are arranged on the radiators; and a plurality of first temperature sensors are arranged on each supporting layer. The heat dissipation device has the advantages that a new heat dissipation means is applied to heat dissipation of server equipment, and the defects that traditional server heat dissipation mainly depends on a forced air cooling technology or cold air is forcibly manufactured for cooling by matching the forced air cooling technology with an air conditioning refrigeration technology are overcome.

The invention discloses a graphene film / copper hot-pressing composite directional high-thermal-conductivity material as well as a preparation method and application of the graphene film / copper hot-pressing composite directional high-thermal-conductivity material. The preparation method comprises the following steps: punching a graphene film to form a plurality of hole structures; blade-coating copper paste on the surface to form a liquid film; the copper paste comprises copper powder, a coupling agent and an organic phase; stacking a plurality of layers; carrying out hot pressing treatment on the circulating laminated structure; and slicing to obtain the graphene film / copper hot-pressing composite oriented high-thermal-conductivity material. When copper powder particles are embedded into the hole structure, the whole hole structure is filled with the copper powder particles, the copper powder particles can transversely enter gaps between graphene sheet layers, a three-dimensional interlocking structure is formed through the sintering effect, resin contained in the copper paste can be subjected to a carbonization reaction in the glue discharging stage, a carbon skeleton is formed, and therefore the three-dimensional interlocking structure is formed. And the infiltration process between the copper powder and the graphene sheet layer is facilitated, and finally the heat conduction performance and the mechanical performance of the graphene film / copper hot-pressing composite oriented high-heat-conduction material are remarkably improved.

An electronic apparatus includes a CPU provided in a first chassis and generating heat, a plate-shaped vapor chamber provided in the first chassis and thermally connected to the CPU to radiate heat, and two heat pipes protruding and extending from the vapor chamber at positions separated from each other. A graphite sheet that is thinner than the vapor chamber is thermally connected to the two heat pipes. A battery device having three cells is provided in the first chassis, and the heat pipe extends into a groove portion formed between the cells.

Disclosed are a heat-dissipating plate and a display device, the heat-dissipating plate includes a heat-dissipating plate body; a heat-dissipating microcavity embedded in the heat-dissipating plate body; and a heat dissipation working medium filled inside the heat-dissipating microcavity. The heat-dissipating microcavity includes a heat absorption tank, a liquid collection tank arranged at intervals with the heat absorption tank, and a capillary micro channel group between the heat absorption tank and the liquid collection tank and communicating with the heat absorption tank and the liquid collection tank, and the capillary micro channel group includes a plurality of capillary micro channels arranged at intervals.

The invention relates to a composite heat dissipation device integrating temperature equalization and liquid cooling, which comprises a liquid cooling plate cover plate, a composite upper cover and a temperature equalization plate lower shell which are sequentially arranged from top to bottom, the top of the temperature equalization plate lower shell is provided with an evaporation chamber, the peripheries of the composite upper cover and the temperature equalization plate lower shell are hermetically connected to form a vacuum cavity, and the bottom surface of the liquid cooling plate cover plate is provided with a recess. The periphery of the liquid cooling plate cover plate and the periphery of the composite upper cover are connected in a sealed mode to form a liquid cooling cavity, and the liquid cooling plate cover plate is provided with a cooling liquid inlet and a cooling liquid outlet. The lower surface of the composite upper cover is punched towards the upper surface to form a plurality of strip-shaped convex hulls; a first capillary structure covers the inner wall of the uniform temperature plate lower shell; and a second capillary structure covers the inner wall of the strip convex hull and / or the lower surface of the composite upper cover. The design is reasonable and ingenious, the functions of the upper cover of the vapor chamber and the fins of the liquid cooling plate are integrated, deep integration of the upper cover and the fins is achieved, the interface thermal resistance is effectively reduced, the structural strength is enhanced, and the manufacturing process is simplified.

A heat dissipation system includes an annular radiator and two flow guide baffles. Each flow guide baffle has a connected end and a free end opposite to each other. The connected ends of the two flow guide baffles are connected to the annular radiator. The two flow guide baffles and the annular radiator surround a heat source area. The heat source area has a lateral opening. The lateral opening is formed by the free ends of the two flow guide baffles, and is located in two sides of the heat source area with the annular radiator respectively.

The invention discloses underwater multi-load constant-temperature sealing bin equipment, and relates to the technical field of underwater detection equipment, and the underwater multi-load constant-temperature sealing bin equipment comprises a cylindrical sealing bin main body and a heat conduction assembly; two corresponding sealing cover assemblies are installed on the left side and the right side of the cylindrical sealing bin body, and a detection assembly is installed at the left end of the sealing cover assembly on the left side. Unified installation of multiple types of detection modules can be achieved through integrated design, and the problems that in a traditional scheme, due to the single function, the number of mounting positions is large, and the load of a submersible is heavy are solved. The heat dissipation efficiency is effectively improved through a five-stage heat conduction mechanism and a net-shaped rib heat bridge structure, and the problems of temperature fluctuation and equipment overheating faults caused by passive heat dissipation are solved. A double-sealing interface is formed by the trapezoidal seam allowance and the sealing rubber ring, so that the waterproof reliability in a high-pressure environment is enhanced, and the leakage risk is reduced; and meanwhile, the universality of equipment is improved by virtue of standardized mounting surface design, and the multi-scene deployment cost is reduced.

A liquid cooling device including a water cooling head, a heat dissipation module, and a two-phase cooling component. The water cooling head includes a base plate and a water cooling shell. An accommodating slot is defined on the water cooling shell. The heat dissipation module includes a heat sink set and a supporting plate. A perforation is defined on the heat sink set. The heat sink set is positioned on the water cooling head. The two-phase cooling component includes an evaporation section and a condensation section. The evaporation section is positioned in the accommodating slot, and the condensation section passes through the perforation. Therefore, the heat dissipation efficiency of the liquid cooling system is improved.

A three-dimensional vapor chamber module is configured to be thermally coupled to a heat source. The three-dimensional vapor chamber module includes a first vapor chamber, a second vapor chamber, at least one first heat pipe and a plurality of boiling enhancement structures. The first vapor chamber has a first fluid chamber, and the first vapor chamber is configured to be thermally coupled to the heat source. The second vapor chamber has a second fluid chamber. The first heat pipe has a first fluid channel, and the first fluid channel communicates with the first fluid chamber and the second fluid chamber. The boiling enhancement structures are respectively disposed on the first vapor chamber and the second vapor chamber.

Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. An illustrative cage receptacle assembly is described to include a cage body, a first heat dissipation unit disposed proximate to a bottom side of the cage body and configured to remove heat from the bottom side of the cage body, and a second heat dissipation unit disposed proximate to a top side of the cage body and configured to remove heat from the top side of the cage body.

A printed circuit board assembly for an information handling system includes a carrier frame. The carrier frame to hold a system motherboard and other components. The carrier frame includes a main portion, first and second wing portions, and multiple mounting components. The main portion has a top surface and a bottom surface. The first and second wing portions extend from opposite ends of the main portion. The first and second wing portions have the top surface and the bottom surface. The system motherboard and the other components are in physical communication with the top surface. The mounting components extend from the bottom surface and securely and removably connect the carrier frame within the information handling system.

The invention provides an air-cooled array surface structure adopting a vapor chamber frame, which comprises a vapor chamber array surface frame, an antenna cover, a receiving and transmitting assembly, an antenna, a shell, a connector, a temperature monitoring unit, an array surface distribution plate, a high-power-consumption functional module, a low-power-consumption functional module, a temperature control module, a large-air-volume axial flow fan, an internal turbulent flow fan and a semiconductor refrigerator, a semiconductor refrigerator cold end, a semiconductor refrigerator hot end, a loop heat pipe, a loop heat pipe cold end, a loop heat pipe hot end, an air duct cover plate, a rear cover plate, a rear cover plate external groove, a rear cover plate internal groove, a sealing rope, a fan protective cover, captive screws and trunnions are included. According to the design of the invention, the array surface heat dissipation mode is changed from liquid cooling to air cooling, the design requirements of light weight and low cost of the array surface structure are realized, and the effect of the heat dissipation system and the redundancy design is verified step by step in the high-temperature environment test process to meet the requirements.