6467results about "Modifications by conduction heat transfer" patented technology

Embodiments of the present invention provide a phototherapy mask designed to enhance user comfort and effectiveness during treatment. The mask comprises a shell that fits over the user's face, featuring a first opening to avoid contact with the eyes and a second opening to avoid the nose. A first pad, positioned around the edge of the first opening, rests against the skin near the peripheral eyes to control the distance between the mask and the skin, while a second pad, located at the bottom of the shell, supports the chin. These pads help maintain the mask's stability and prevent it from shifting during use. The light source assembly, installed on the shell, provides phototherapy to the skin.

A heat transfer device may be used to provide a thermal conduit from heat generating components mounted on transversely oriented circuit boards. The heat transfer device generally includes a base portion for supporting and thermally coupling with at least one heat generating component on a main circuit board and a transverse portion for supporting and thermally coupling with at least one heat generating component on a daughter circuit board that is oriented transverse to the main circuit board. The base and transverse portions may be made of a thermally conductive material with raised pedestals providing the thermal coupling with the heat generating components. The transverse portion of the heat transfer device may also be designed to facilitate connecting the daughter circuit board to the main circuit board. The heat transfer device may be used in an opto-electronic communications module, such as a broadband digital access (BDA) module used in a hybrid fiber-coaxial (HFC) network.

A liquid-cooling heat dissipation device includes a substrate, a fin assembly, a shell and a shunt component. The fin assembly is disposed on the substrate and has a plurality of channels parallelly arranged, and each of the channels has an inlet and an outlet opposite to each other. The shell is disposed on the substrate and has a liquid input port, a chamber is jointly formed by the shell and the substrate, and the chamber is located between the liquid input port and each of the inlets. The shunt component is disposed in the shell and has a plurality of manifold passages, the liquid input port is in communication with the chamber and each of the inlets through each of the manifold passages. Accordingly, the amount of fin member is increased in a fixed space to increase the heat dissipating efficiency.

The invention provides an all-silicon carbide double-sided heat dissipation module packaging method based on gradient thermal resistance optimization, and belongs to the technical field of electronic component packaging. Establishing a thermal resistance characteristic curve, and calculating a gradient thermal resistance vector to determine a heat flow path; constructing a heat dissipation temperature distribution matrix; obtaining thermal diffusion data; heat dissipation path thermal resistance is calculated by combining the thermal diffusion matrix and the temperature distribution matrix, and a thermal resistance sparse matrix is established and is dimensionally reduced into a thermal resistance low-dimensional matrix; calculating an optimal heat dissipation path parameter set; inputting the parameter set into a thermal resistance prediction deep attention network model for verification and fine tuning, and generating a final thermal resistance distribution scheme; a module structure and a material ratio are designed according to the scheme to form a sandwich structure; a silver paste sintering process is adopted to realize low thermal resistance connection and complete packaging, and the technical problems of non-uniform thermal resistance distribution and difficulty in optimizing a heat flow path in a double-sided heat dissipation structure of a silicon carbide power module in the prior art are solved.

The invention relates to the technical field of filters, in particular to an internal shielding component of a power filter, which comprises a shell, a cover plate is mounted at the top of the shell through a cross recessed countersunk head screw, and a metal partition plate is arranged on one side of the inner wall of the shell; the wave-proof sleeve is welded on one side wall of the shell, and the material of the wave-proof sleeve is light nickel-plated copper fabric; when the power supply filter is used, the problem that crosstalk coupling is formed between interference signals can be prevented, the electromagnetic compatibility in the signal transmission process between systems is solved, the anti-wave sleeve is adopted for shielding power supply input of the power supply filter, interference of an input cable on other signals is greatly restrained, and the service life of the power supply filter is prolonged. The electromagnetic compatibility problem of the whole system caused by the fact that high-frequency noise is coupled to a power line is prevented, the shielding effectiveness is improved, the problem of filtering post-stage electromagnetic interference signals is greatly restrained, meanwhile, the heat dissipation area is increased, and the heat dissipation efficiency and effect are improved.

A two-phase cold plate that includes a manifold body having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway housed within the manifold body and a vaporization structure housed within the manifold body such that the fluid pathway is disposed over the vaporization structure. The vaporization structure includes a cavity cover, a porous surface, a vapor cavity disposed between the cavity cover and the porous surface, and one or more porous feeding posts extending between the cavity cover and the porous surface. The one or more porous feeding posts fluidly coupled the fluid pathway with the porous surface of the vaporization structure and the porous surface includes a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the vaporization structure.

The invention discloses a modular micro-nano satellite integrated power system suitable for batch production and an assembly method thereof. The integrated power system is composed of a semi-open type electric box structure and a modular circuit board. The electricity box structure comprises an electricity box upper cover and an electricity box lower cover, and a plurality of threaded holes are formed in the two sides of the electricity box upper cover and the two sides of the electricity box lower cover and used for being connected with a satellite structure cabin plate; the heat dissipation plate bodies are distributed on the two sides of the modular circuit board; the modularized circuit board is provided with a plurality of circuit boards which are respectively provided with electronic modules in a stacking arrangement. A plurality of electronic modules are integrated into an electronic system by adopting a mechanical-electrical-thermal integrated design method, the system breaks through the function limit of a traditional satellite subsystem, the defects of information exclusion and resource waste are eliminated, a satellite is used as a whole to be subjected to unified design and resource planning tradeoff from the system level, and the system performance is improved. The weight of cables and connectors between electronic modules is greatly reduced, and the effective load ratio is improved.

A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

A flow chamber having an upper chamber, a lower chamber, and an actuator is described. The upper chamber includes a top wall. The actuator is located distally from the top wall. The lower chamber includes a bottom wall and a sidewall. The lower chamber receives a fluid from the upper chamber when the actuator is activated. The bottom wall has orifices and at least one cavity therein. The orifices are vertically aligned with a portion of the actuator and allow the fluid to exit the lower chamber. The at least one cavity is proximate to the sidewall and distally located from the orifices.

The invention discloses a heat dissipation mechanism and an installation method thereof, a device applying the heat dissipation mechanism and a cable system. The heat dissipation mechanism is used for dissipating heat of a heat dissipation demand unit. The heat dissipation mechanism comprises an inner heat dissipation sleeve used for being connected outside the inner heat dissipation demand part in a sleeving mode, and the inner side wall of the inner heat dissipation sleeve is used for being attached to the outer side wall of the inner heat dissipation demand part; the outer heat dissipation sleeve comprises a plurality of outer heat dissipation plates, the outer heat dissipation plates are arranged at intervals in the circumferential direction of the inner heat dissipation sleeve, a heat dissipation gap is formed between each outer heat dissipation plate and the inner heat dissipation sleeve, and the outer side wall of the outer heat dissipation sleeve is used for being attached to the inner side wall of the outer sleeve body; the heat conduction pieces are connected between at least part of the outer heat dissipation plates and the inner heat dissipation sleeves; and the elastic pieces are arranged between each outer heat dissipation plate and the inner heat dissipation sleeve in an abutting mode, and each outer heat dissipation plate is configured to be capable of moving in the radial direction of the inner heat dissipation sleeve.

The invention relates to the technical field of electronic equipment, and discloses a piezoelectric heat dissipation unit, a heat dissipation system and a piezoelectric heat dissipation fan, and the piezoelectric heat dissipation unit comprises a piezoelectric element, a vibrating diaphragm, a supporting frame, a jet flow plate, an air outlet plate and a connecting assembly. The supporting frame is provided with a cavity, and the two sides, in the first direction, of the cavity are open. The vibrating diaphragm and the jet flow plate cover the two sides of the cavity in the first direction respectively and are connected with the supporting frame, jet flow holes are formed in the jet flow plate, the piezoelectric element is attached to the side, away from the cavity in the first direction, of the vibrating diaphragm, and the air outlet plates are arranged on the side, away from the cavity in the first direction, of the jet flow plate at intervals. The edge of the air outlet plate is connected with the edge of the jet flow plate through a connecting assembly, the connecting assembly is provided with an air inlet channel, the air inlet channel is communicated with the jet flow hole, and the air outlet plate is provided with an air outlet hole communicated with the jet flow hole. The gas flow channel is reasonable in design, high in heat dissipation efficiency and suitable for heat dissipation of light and thin electronic products.

A mobile phone may include an enclosure. The enclosure may include a front cover, a rear cover, a housing segment coupled to the front cover and to the rear cover and including a first wall section defining at least a portion of a first side exterior surface of the mobile phone, a second wall section defining at least a portion of a second side exterior surface, and a chassis section extending between the first wall section and the second wall section. The mobile phone may further include a circuit board assembly thermally coupled to the chassis section at a thermal coupling region of the chassis section, the chassis section defining a thermal path extending from the thermal coupling region to the first wall section, and a through-hole positioned in the thermal path and configured to interrupt a flow of heat from the circuit board assembly to the first wall section.

A portable worksite monitoring and communication device, including a weatherproof sealed container, further comprising, a container portion having an internal cavity, a removable cover arranged to lockably seal the internal cavity, and a heat sink opening, a heat sink apparatus sealably secured within the heat sink opening, a plurality of electronic connectors, a computing device in communication with a cellular modem, the cellular modem in communication with a cloud network, the computing device in communication with the plurality of electronic connectors, a display in communication with the computing device, and, a plurality of communication configurations in communication with the computing device, wherein the heat sink apparatus is arranged to programmably activate or automatically activate.

The invention discloses a heat dissipation method for a high-power device in a logging instrument, and relates to the technical field of heat dissipation of logging instruments. The heat dissipation management system is realized based on a heat dissipation management system, and the heat dissipation management system comprises a heat conduction module which adopts a heat pipe or a heat plate made of a high-heat-conductivity-coefficient material and is used for rapidly conducting heat generated by a high-power device to a heat dissipation module; and the heat dissipation module comprises a plurality of heat dissipation fins and / or fans which work in parallel, the heat dissipation fins improve the heat dissipation efficiency by increasing the heat dissipation area, and the fans enhance air flow through forced convection to promote heat exchange. The heat pipe or the heat plate made of the high-heat-conductivity-coefficient material is adopted, heat is quickly conducted to the heat dissipation module, and accumulation of the heat at a source is effectively reduced; the control module dynamically adjusts a heat dissipation strategy according to real-time temperature monitoring data, such as the fan rotating speed and fluid circulation, and it is ensured that the heat dissipation effect is matched with the actual requirement.

Various novel heat exchange components which are designed and / or configured to effectively and efficiently dissipate thermal energy (heat) away from a heat source are described. The heat exchange component structures may be a composite formed of two or more distinct types of materials including a thermally conductive material and a solid state (SS) Martensitic transformation (MT) phase change material (PCM). The thermally conductive material may be configured so as to form or provide for: (i) a heat receiving section configured to be in contact with a heat source so as to receive thermal energy from the heat source, and (ii) a thermal energy spreading section configured to pull thermal energy away from the heat receiving section and distribute it into and / or throughout the entire the heat exchange structure, especially, into and / or through the SS MT PCM.

An object of the present invention is to provide a head-up display apparatus further reduced in size, the head-up display apparatus having: an image display apparatus including a light source and a display element; and a virtual image optical system in which light emitted from the image display apparatus is reflected by a windshield or a combiner of the vehicle so that a virtual image is displayed in front of the vehicle, wherein the virtual image optical system has a concave mirror and a distortion correcting lens, and the distortion correcting lens is disposed between the image display apparatus and the concave mirror, the concave mirror is disposed in a housing including an outer case along a shape of an effective light path area of the image light from the image display apparatus, and the image display apparatus is attached to part of an outer periphery of the housing.

The invention belongs to the technical field of heat dissipation of electronic equipment, and particularly discloses an efficient heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a heat dissipation substrate tightly attached to the surface of a heating element, a vapor chamber is tightly attached to the face, away from the heating element, of the heat dissipation substrate, and heat dissipation fins and a heat dissipation fan are sequentially connected to the face, away from the heat dissipation substrate, of the vapor chamber; the vapor chamber comprises a shell, a cover plate and a liquid absorbing core, the cover plate is sealed on the shell, a vacuum cavity is formed in the cover plate, the vacuum cavity is filled with a two-phase fluid working medium, the liquid absorbing core is arranged in the vacuum cavity, the upper surface and the lower surface of the liquid absorbing core are tightly attached to the cover plate and the shell respectively, and a plurality of hollow steam cavities are formed in the liquid absorbing core. The electronic equipment comprises the efficient heat dissipation assembly. Through the synergistic effect of the heat dissipation substrate tightly attached to the heating element, the vapor chamber containing the two-phase fluid working medium and the multiple layers of heat dissipation fins, the structure compactness is guaranteed, and meanwhile efficient heat conduction and rapid heat dissipation are achieved.

The invention relates to the technical field of electricity meters, and particularly discloses a relay and an electricity meter thereof, comprising a mounting plate: a clamping frame is fixedly mounted on the front surface of the mounting plate, sliding grooves are formed in the upper and lower ends of the clamping frame, sliding plates are slidably connected to the inner sides of the sliding grooves, and heat dissipation fins of a heat conduction aluminum plate are attached to electronic components in the electricity meter. The n-pentane heat-conducting medium in the liquid storage box is heated and vaporized, the heat is absorbed, the heat dissipation capability is improved, the heat pushes the air cylinder to open the heat dissipation window, the air velocity in the electric meter is improved, the heat dissipation is enhanced, the temperature is continuously increased, and the heat-conducting medium is further vaporized, so that the inner current-conducting plate and the outer current-conducting plate are attached; and after the temperature is reduced, the heat-conducting medium is condensed, the air cylinder shrinks to block the heat dissipation window, the heat dissipation fan does not need to be automatically triggered by a temperature sensor, the consumption is reduced, the stability is improved, the cost is reduced, and the protection and moisture-proof performance is improved by the blocking window when the heat dissipation device is not used.

A computing device and a vehicle are applied to the field of intelligent terminals, and the computing device comprises a heat dissipation device and a circuit board. The heat dissipation device comprises a first cold plate and a second cold plate, and the first cold plate and the second cold plate are arranged in a stacked mode. The circuit board is clamped between the first cold plate and the second cold plate, the circuit board comprises a first surface and a second surface which are oppositely arranged in the thickness direction of the heat dissipation device, the first surface is provided with at least one first heating device, and the second surface is provided with at least one second heating device. The first cold plate is in heat-conducting connection with at least one first heating device, and the second cold plate is in heat-conducting connection with at least one second heating device. The first cold plate and the second cold plate of the heat dissipation device are used for achieving double-face heat dissipation of the circuit board, the heat dissipation efficiency is greatly improved, the heat dissipation problem of the circuit board with concentrated high-power-consumption devices is solved, and the heat management stability and safety of the computing equipment are improved. And moreover, double-sided heat dissipation is beneficial to reducing the layout area of the circuit board, and the integration level of the computing equipment is improved.

The invention relates to the technical field of liquid cooling, and discloses a cooling liquid distribution assembly for a heat dissipation plate and the heat dissipation plate, the cooling liquid distribution assembly for the heat dissipation plate comprises a heat dissipation fan, a liquid cooling pump and a cooling liquid distribution assembly for the heat dissipation plate, the cooling liquid distribution assembly for the heat dissipation plate comprises a plurality of distribution assemblies, and a pipe frame and an air bin are arranged on the upper portion and the lower portion in each distribution assembly respectively; heat is exchanged with the heat exchange pipe, so that the heat is conducted into the air bin through the temperature guide columns above the temperature guide pieces, expansion gas in the air bin is heated and expanded, then the corrugated air bag is promoted to expand to push the extrusion roller to slide on the inclined guide rail, and the corrugated air bag is reset by the reset spring when contracting. At the moment, the sliding position of the extrusion roller can be shrunk along with expansion of the corrugated air bag, then the extrusion degree of the elastic rubber pipe is changed, the flow of cooling liquid passing through the elastic rubber pipe is adjusted, on the basis that the equipment cost is not increased, it is ensured that heat can be evenly dissipated out of equipment, cooling liquid is automatically distributed for cooling plates with different heat, and the cooling effect is improved. And the heat dissipation is uniform.

A thermal bridge for a thermally conductive transport of heat includes: a heat release portion having: a joining surface; a heat release surface spaced from the joining surface; and a first material component of the thermal bridge from the joining surface to the heat release surface. The heat release portion releases heat from the joining surface to the heat release surface in a thermally conductive manner and releases the heat at the heat release surface. The thermal bridge includes a heat absorption section connected to the heat release section at the joining surface in a material-locking manner as a material-locking connection, the heat absorption section including: a heat contact surface moldable by contact pressure; and from the joining surface up to the heat contact surface, a second material component of the thermal bridge built up by additive melt layering, the second material component being different from the first material component.

An electric wheel controller and methods for operating and manufacturing an electric wheel controller are disclosed. Embodiments include a controller forming a structural and / or load bearing component of the vehicle suspension system. Embodiments of the controller can be mounted to a wheel assembly, and in some embodiments the controller is a suspension knuckle. Embodiments include a controller with a cavity and electronic circuitry submerged in liquid coolant. During operation the coolant can absorb heat from the immersed circuitry. In some embodiments the coolant transitions to a gas and / or vapor, and can move to an upper portion of the cavity. When the coolant contacts the cooler surfaces of the cavity the coolant can transition back to a liquid and return to a pool of liquid coolant in which the circuitry is immersed. A heat sink can be connected to the controller, such as by laser soldering.

The invention discloses a heat dissipation device and communication equipment, and relates to the field of heat dissipation and communication. A heat dissipation device comprises a first heat dissipation assembly and a connecting pipeline. The first heat dissipation assembly comprises at least one first heat conduction piece, the first heat conduction piece is provided with a medium channel, and the connecting pipeline is communicated with the medium channel; the first heat conduction piece comprises a heat conduction face which is used for making contact with a device to be subjected to heat dissipation. The communication equipment comprises the heat dissipation device. The problem that the heat dissipation effect of a current heat dissipation mode is poor can be solved.

The invention provides a shell, a preparation method thereof and electronic equipment. The shell provided by the embodiment of the invention comprises fiber cloth; the graphene coating is coated on the periphery of a part of the fiber cloth; the surface of the fiber cloth and the surface of the graphene coating are wrapped with the resin layer. The shell provided by the embodiment of the invention has relatively high rigidity and heat conductivity coefficient, and does not affect the transmission of electromagnetic wave signals.

The invention provides head-mounted equipment. The head-mounted equipment comprises a shell, a heat source device, a radiator and a cooling fan, an accommodating space is formed in the shell; the heat source device is arranged in the accommodating space; one side of the radiator is connected with the heat source device, and the other side of the radiator is connected with the shell through a heat-conducting medium; an air outlet of the cooling fan corresponds to the radiator and is used for taking away heat around the radiator through airflow. According to the head-mounted device provided by the embodiment of the invention, through two combined heat dissipation modes of connecting the radiator with the shell and blowing away the heat around the radiator by using the heat dissipation fan, the heat dissipation efficiency can be greatly improved, heat accumulation in the head-mounted device can be well solved, the rotating speed of the fan can be improved, and better man-machine temperature rise and noise experience can be achieved.

The invention relates to the technical field of cables, and provides a low-voltage power supply cable which comprises a plurality of conductive cables, each conductive cable comprises a plurality of stranded conductors, and each stranded conductor is coated with an insulating layer; the plurality of insulating layers are arranged on the inner side of the inner lining layer, the plurality of stranded conductors are all arranged inside the inner lining layer, the space between the inner lining layer and the plurality of insulating layers is filled with a filling layer, the outer part of the inner lining layer is coated with a sheath layer, the end part of each sheath layer is slidably sleeved with the butt-joint cylinder, the stringing assembly is arranged on the butt-joint cylinder, and the heat dissipation assembly is arranged on the inner lining layer. A conductive frame is arranged between every two opposite butt joint cylinders, a conductive assembly is installed on each conductive frame, and a heat dissipation assembly is installed on each conductive assembly. Through the above technical scheme, the problems that in the prior art, due to the fact that high current density is prone to occurring at the butt joint position of two cables, the local temperature of a contact point rises, and the heat dissipation effect is poor are solved. And a gap is generated between the two cables, so that the current transmission performance is influenced.

A heatsink for cooling an electric component of a power equipment can include a plurality of convective surfaces spaced away from and overlapping each other, and a first rivet connecting the convective surfaces to each other. The power equipment can be a lawnmower, a snow blower, a pressure washer, a tiller, a hedge trimmer, a string trimmer, a power saw, a fluid pump, a portable cooler, an E-Bikes and a scooter.

The invention belongs to the technical field of aerospace engineering, and discloses a flexible radiator which comprises a radiation assembly, the radiation assembly comprises a plurality of radiation plates which are rotationally connected in sequence, each radiation plate comprises a liquid cooling pipe set and a radiation film arranged on the liquid cooling pipe set, and cooling liquid circulates in the liquid cooling pipe set. The material density is low, the structural mass is effectively reduced, a plurality of radiant panels are rotationally connected in sequence, the radiant panels are in a folded state during emission, then a radiator with enough radiation area can be emitted under the condition that the size of a spacecraft is limited, and the heat dissipation requirement of high-power electronic equipment is met.

The invention belongs to the technical field of semiconductor function testing devices, and discloses a semiconductor function testing device based on mechatronics, which comprises a box body, two box doors hinged to one side of the box body, a controller arranged on one side of the upper box door, an observation window arranged below the controller, and a fixed block fixedly connected in the box body. A partition plate is fixedly connected to the top of the fixing block, a high-temperature cavity is formed in one side of the partition plate, a low-temperature cavity is formed in the other side of the partition plate, and a heating block is fixedly installed on the inner wall of the top of the high-temperature cavity. The two semiconductors are placed in the box body to be tested respectively, and the two semiconductors can be converted after being subjected to high-temperature and low-temperature testing, so that the two semiconductors do not need to be taken out independently, the high-temperature and low-temperature testing can be completed, and the semiconductors are kept dry; and water vapor in high-temperature air is prevented from being quickly condensed into water mist to be adhered to a semiconductor, so that the test effect is not influenced.

A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.