137results about "Modifications by conduction heat transfer" patented technology

An imaging apparatus comprising a substrate including a first connector and mounting an electronic component serving as a heat source; a first metal plate covering a side surface of the substrate; a heat dissipation sheet in contact with the substrate; and a flat portion in contact with the heat dissipation sheet. The first metal plate abuts the substrate via the heat dissipation sheet and the flat portion.

This invention provides a power supply system belonging to the field of communication equipment technology. It includes two parallel subsystems, each subsystem comprising a heat sink housing and a printed circuit board (PCB) fixedly disposed within the inner cavity of the heat sink housing. The two heat sink housings are fastened together. The two PCBs are connected via a copper busbar assembly. One of the PCBs has a locking element detachably connected to one end of the copper busbar assembly. A mounting opening is provided on the side wall of one of the heat sink housings, corresponding to the locking element. A sealing plate can also be detachably connected to the mounting opening. After the sealing plate is removed from the heat sink housing, the locking element is exposed at the mounting opening. The power supply system provided by this invention allows each subsystem to function as an independent power source for reference power supply, and also enables parallel connection via the copper busbar assembly. The parallel connection of the two PCBs via the copper busbar assembly is performed at the mounting opening on the outer side wall of one of the heat sink housings, making the operation simple and convenient.

The application belongs to the field of gateway, and particularly relates to a multifunctional intelligent gateway based on AIoT technology, which comprises a box body, a box cover, a circuit board and a sound collector. The multifunctional intelligent gateway has the advantages that the heat dissipation fin is used to cool the heat conduction plate II, the heat conduction plate II is in contact with the chip on the circuit board, the heat conduction plate II absorbs the heat generated by the chip, and then the chip on the circuit board is cooled, so that the service life of the chip is guaranteed, the performance decline or burning of the chip caused by the excessively high operating temperature of the chip is avoided, the hot air is guided to each position in the box body, the air in the box body is heated, the damage of the electronic components caused by the condensation in the box body is avoided, the normal operation of the chip on the circuit board is not affected, the important element, i.e. the chip, in the gateway cannot be cooled, the working temperature of the chip in the gateway is excessively high, the service life of the chip is affected, and the chip is even burned due to overheating.

A system comprises one or more computing components arranged on a first side of a printed circuit board (PCB) within a server chassis. The system further comprises a cooling device arranged at least partially on a second side of the PCB opposite the first side. The system also comprises a thermally conductive component configured to transfer heat from the first computing component of the one or more computing components to the cooling device. The thermally conductive component has a main body coupled to the one or more computing components. The main body is approximately parallel to the PCB. The thermally conductive component further comprises a heat dissipation feature extending from the main body.The heat dissipation feature extends from the first side of the circuit board to the second side of the circuit board and is coupled to the cooling device.

An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

An electric range is provided that may include a case, a cover plate coupled to an upper side of the case and on which an object to be heated is placed, at least one heater that heats the object, the at least one heater being disposed under the cover plate, an upper bracket that is disposed under the at least one heater and supports the at least one heater, a base bracket disposed under the upper bracket and on which a printed circuit board is mounted, a heat sink mounted on the printed circuit board, an air blowing fan that is mounted on the base bracket and discharges air toward the heat sink through an outlet thereof, and an air guide that communicates with the air blowing fan, surrounds the heat sink, and forms a flow path of air cooling the heat sink.

A heat spreading element is provided and includes first and second pyrolytic graphite sheets (PGSs) arranged to form an opening between respective proximal ends thereof and a weaved PGS. The weaved PGS includes a first section disposed above the first PGS, a second section disposed below the second PGS and a weaved section extending between respective proximal ends of the first and second sections and through the opening.

Described herein is a refrigerant loop heat sink. The heat sink may be provided in contact with refrigerant tubing that is connected to an existing refrigerant loop of the heating and / or cooling appliance. The heat sink may then be provided in thermal contact with electronic components (or a printed circuit board (PCB) to which the electronic components are mounted) of the heating and / or cooling appliance). In this manner, any heat that is produced as a byproduct of the operation of the electronic components may be transferred from the electronic components into the heat sink and the refrigerant tubing. The heat may then be transferred to the refrigerant that is flowing through the refrigerant tubing to cool the electronic components. This provides an alternative to an air cooled system by which heat from the electronic components is dissipated by blowing cooler air from a fan within the heating and / or cooling appliance over the electronic components.

A passively-cooled personal computer includes a housing, a motherboard disposed within the housing, a central processing unit (CPU) mounted on the motherboard, and a passive cooler thermally coupled to the CPU. The passive cooler includes a plurality of heat pipes and at least one set of stacked fins. The heat pipes extend through the fins and transport heat from the CPU to the fins. The set of stacked fins has a large cross-section in a horizontal plane and a small cross-section in a vertical plane.

This invention relates to the field of remote crane control technology, specifically a crane control device, comprising a cabinet, a support carrier, and a guardrail. The cabinet is mounted on the support carrier; the guardrail is also mounted on the support carrier; the support carrier is the crane's frame or trolley; a control mechanism is installed inside the cabinet, which receives control commands remotely sent from the control room; the control mechanism integrates the crane's electric hoist control unit, trolley control unit, and crane trolley control unit; it also includes: a detection mechanism installed inside the cabinet; and a protective mechanism installed inside the cabinet, used to detect if the cabinet becomes loose. This invention achieves remote control of port container cranes by controlling the movement of the trolley and crane units within the crane, as well as the movement of transported containers, through the control mechanism; and it eliminates the need for personnel to frequently climb the crane to maintain the cabinet, greatly improving the convenience of inspections.

A double-sided cooling type power module according to the present invention includes: an upper substrate including an insulating layer, an upper metal layer bonded to a top of the insulating layer, and a lower metal layer bonded to a bottom of the insulating layer; a lower substrate disposed under the upper substrate and including an insulating layer, an upper metal layer bonded to a top of the insulating layer, and a lower metal layer bonded to a bottom of the insulating layer; a spacer disposed between the upper substrate and the lower substrate and electrically connecting the upper substrate and the lower substrate; and a semiconductor chip disposed between the spacer and the upper substrate or the lower substrate, in which the insulating layers are made of a material of which a coefficient of thermal expansion is 0.8 or more and 1.2 or less times of coefficients of thermal expansion of the metal layers of the upper substrate and the lower substrate.

The application relates to the field of heat dissipation of electric control assemblies, aims to solve the problem that existing heat dissipation supports cannot simultaneously dissipate heat for multiple target pieces (such as electric control boxes), and provides a heat dissipation support and an electric control assembly. The heat dissipation support comprises multiple heat dissipation plates, a first side plate and a second side plate, and the heat dissipation plates are defined in a length direction, a width direction and a thickness direction. The multiple heat dissipation plates are arranged at intervals in the thickness direction. Each heat dissipation plate is respectively provided with a first flow channel and a second flow channel which are arranged at intervals in the width direction. The first side plate is provided with a first chamber and a second chamber which are arranged at intervals in the width direction of the heat dissipation plate. The first side plate is provided with a water inlet and a water outlet, the water inlet is communicated with the first chamber, and the water outlet is communicated with the second chamber. The second side plate is provided with multiple communication channels. The heat dissipation plates can simultaneously contact multiple target pieces on the two side surfaces, so that the target pieces can be cooled.

The application provides a container type water-cooled data center and a control method, and belongs to the technical field of temperature control. The container type water-cooled data center comprises a computing power service cabinet system, a pump station control system, a plate unit and a power distribution cabinet unit arranged in a container, and further comprises an external liquid cooling system. The computing power service cabinet system comprises a plurality of independently operated modules, each module comprises a plurality of server cabinets, each server cabinet corresponds to a power distribution branch, the plurality of power distribution branches in the same module are collected into the same power distribution bus, the plurality of power distribution buses in the plurality of modules are collected into the same power distribution bus, and the power distribution bus is provided with a current switch for controlling the power distribution bus. The liquid cooling system cools and dissipates heat for the computing power service cabinet system through circulation of a medium. The plate unit serves as a bypass branch of the liquid cooling system and undertakes the heat exchange function of the liquid cooling system in part or in whole. The pump station control system provides power for the circulation of the medium. The application has high integration, small space occupation, high density in unit space, and is safe and reliable.

An electronic device is provided. The electronic device includes a display including a first area and a second area, a first housing forming a first space positioned on a rear surface of the first area, a second housing forming a second space positioned on a rear surface of the second area, a hinge assembly for causing the first area and the second area to be in a first state of forming substantially the same plane or to be in a second state of facing each other, and a plurality of front heat conduction members forming a heat conduction path between the hinge assembly and the display.

A liquid cooling system comprising a printed circuit board, a gasket seated on a top side of the printed circuit board gasket encircling one or more components on the printed circuit board, an enclosure on the gasket and fastened against the printed circuit board to form a sealed chamber, and a transfer liquid within the sealed chamber contacting one or more components mounted on the printed circuit board to provide cooling for the one or more components.

A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board.

This application provides an inverter device. The inverter device includes an inverter circuit, a housing, a first component, and a second component. The inverter circuit includes a circuit substrate, a switching device, and a through-hole device. Pins of the switching device and pins of the through-hole device are mounted on a same surface of the circuit substrate. The inverter circuit is mounted in a cavity formed by the housing. A surface, facing the circuit substrate, of a bottom plate of the housing includes a supporting component. A body of the switching device is carried on the supporting component. The first component is located between the body of the switching device and the supporting component, and the first component is made of a thermally conductive insulation material. The second component is configured to connect the body of the switching device to the supporting component. The pins of the switching device and the pins of the through-hole device are mounted on the same surface of the circuit substrate, and the first component and the second component are disposed. Therefore, in this application, the inverter device can be manufactured through a convenient manufacturing process, and heat dissipation of the switching device in the inverter device can also be ensured.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

An electrical system having a bus bar for use as a cooling element comprises: an electrical component (101b, 101d, 101e) such as a capacitor and / or a battery element; and at least one bus bar (102a, 102d) arranged to electrically connect the two or more poles of the electrical component to each other. The bus bar is tubular to allow a cooling medium, such as air or a cooling liquid, to flow through the bus bar. Since the bus bar is tubular, an inner surface and an outer surface thereof can be used as a cooling surface of the bus bar. Therefore, the cooling area of the bus bar can be increased without excessively increasing the space required by the bus bar. In addition, one or more tubular bus bars may facilitate flow management of the cooling medium.

To provide a heat diffusion member capable of suppressing the generation of localized a high temperature portion on the surface of a casing of an electronic device incorporating a heating element, and capable of reducing the temperature of the heating element by 2°C or more.SOLUTION: A heat diffusion member is a laminate made up of multiple layers including a low thermal conductivity layer and a high thermal conductivity layer. The low thermal conductivity layer is composed of a low thermal conductivity material sheet with a thermal conductivity of 0.13 to 0.34 W / m K and a specific heat of 0.9 to 1.67 J / g K. The high thermal conductivity layer is composed of a graphite sheet whose in-plane thermal conductivity in the high thermal conductivity layer is 1500 W / m K or more.SELECTED DRAWING: Figure 1

A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end abuts against a pressing member.

A cold plate includes a housing having a surface that provides a thermal interface for cooling an electronic device, a channel within the housing proximate to the surface for liquid coolant to flow through the channel such that heat received by the thermal interface is transferred to the liquid coolant, and a coolant port extending outside the housing for communicating the liquid coolant to and / or from the channel. A cross-sectional area from the coolant port to an outlet of the channel can be no greater than a cross-sectional area of the channel at the outlet. Fins and / or fins can be disposed within the channel proximate to the coolant port. The coolant port can allow the liquid coolant to enter and / or exit the channel in a direction perpendicular to the surface. The coolant port can include a separate swivel fluid connector, thereby allowing adjustment of a direction of a tube coupled to the coolant port.

An electric system comprises electrical components (101b, 101d, 101e) such as capacitors and / or battery elements, and at least one busbar (102a, 102d) arranged to connect two or more of poles of the electrical components electrically to each other. The busbar is tubular to allow cooling medium, such as air or cooling liquid, to flow through the busbar. As the busbar is tubular, its inner surface and its outer surface can act as cooling surfaces of the busbar. Therefore, the cooling area of the busbar can be increased without excessively increasing the room needed by the busbar. Furthermore, the tubular one or more busbars may facilitate flow management of the cooling medium.

This disclosure provides an electronic device, including a mid-frame structure, a flexible display module, a heat dissipation assembly, and a heat transfer plate. The mid-frame structure includes a first frame and a second frame, with a pivot mechanism between the first and second frames. The first and second frames are rotatable around the pivot mechanism. A control module is disposed within either the first or second frame, and the first and second frames form an accommodating space. The flexible display module is located within the accommodating space. The heat dissipation assembly includes a first heat sink and a second heat sink, with the first heat sink located between the flexible display module and the first frame, and the second heat sink located between the flexible display module and the second frame. The heat transfer plate is located on the side of the pivot mechanism facing the flexible display module. The edge of the first heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module, and the edge of the second heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module. Embodiments of this disclosure can achieve uniform heat dissipation throughout the device, reducing the overall temperature rise.

A robot torso 100, in particular for a legged robot, comprising a housing wall 1 with an inner surface and an outer surface, and at least one unit integrated into the housing wall 1. The at least one unit is selected from the list consisting of a cooling unit 200 for cooling a heat source 11 inside the torso 100, a sensor unit 300, or a face sensor unit 400. The at least one unit comprises a heat source arranged inside the torso 100 and thermally coupled to the housing wall 1, and a heat sink arranged outside the torso 100 and thermally coupled to the housing 1 wall for cooling the heat source. The housing wall 1 is essentially hermetically sealing the torso 100.

The application provides an electronic device, which comprises a screen, a middle frame and a back cover which are sequentially and fixedly arranged in a first direction. A containing space is formed between the screen and the middle frame. A heat source and a heat dissipation structure are arranged in the containing space. The heat dissipation structure comprises a first vapor chamber, a heat conduction sheet and a second vapor chamber which are sequentially arranged in the first direction. The first vapor chamber is thermally coupled with the heat source, the second vapor chamber is thermally coupled with the screen, and the two sides of the heat conduction sheet are thermally coupled with the first vapor chamber and the second vapor chamber respectively. Alternatively, the heat conduction sheet is thermally coupled with the heat source, the second vapor chamber is thermally coupled with the screen, and the two sides of the first vapor chamber are thermally coupled with the heat conduction sheet and the second vapor chamber respectively. The heat dissipation structure is arranged in the three-layer structure, so that the arrangement of the heat dissipation structure is flexible, the internal space of the electronic device is fully utilized, and the heat dissipation capacity is good. Meanwhile, the heat passes through several layers of vapor chambers and is evenly distributed to all parts of the electronic device, so that the heat dissipation capacity is further enhanced.

To provide a BDU device and a battery pack.SOLUTION: The present application discloses a BDU device and a battery pack. The BDU device includes a housing, a heating element and a heat conductive plate. One end of the housing is provided with an opening. The heating element is disposed in the housing. The heat conductive plate is provided with a first side and a second side opposite to each other, the first side is located in the opening and is thermally coupled with the heating element, and the second side is located outside the housing.SELECTED DRAWING: Figure 1

The present application relates to a kind of display screen light source setting method, comprising the following steps: first, making LED light source, the LED light source includes penetrating part, light source part and several electric pins, second, making LED lamp plate, the LED lamp plate includes lamp plate surface, device connection surface and several insertion holes, third, several LED light source is correspondingly inserted in the several insertion holes of the LED lamp plate, the penetrating part of each LED light source is inserted in one insertion hole, the outer side of the penetrating part is contacted with the inner hole wall of the insertion hole, a fastening structure is formed by the outer side and the inner hole wall, the several electric pins of each LED light source are connected on the device connection surface of the LED lamp plate, and the light source part of each LED light source is protruded outside the lamp plate surface of the LED lamp plate.

This application discloses an electronic device and a control method for the electronic device. The electronic device includes: a housing, a display screen, and a circuit board; the housing and the display screen form a receiving cavity, the circuit board is disposed within the receiving cavity, a first heat-conducting element is disposed on the side of the circuit board facing the display screen, and a second heat-conducting element is disposed on the side of the circuit board facing the housing, the thermal conductivity of the first heat-conducting element and the second heat-conducting element are adjustable; when the ambient temperature of the electronic device is higher than a first temperature, the thermal conductivity of the first heat-conducting element is adjusted to be lower than the thermal conductivity of the second heat-conducting element; when the ambient temperature of the electronic device is lower than a second temperature, the thermal conductivity of the first heat-conducting element is adjusted to be greater than the thermal conductivity of the second heat-conducting element; the first temperature is higher than the second temperature.