3104results about "Modifications by conduction heat transfer" patented technology

Embodiments of the present invention provide a phototherapy mask designed to enhance user comfort and effectiveness during treatment. The mask comprises a shell that fits over the user's face, featuring a first opening to avoid contact with the eyes and a second opening to avoid the nose. A first pad, positioned around the edge of the first opening, rests against the skin near the peripheral eyes to control the distance between the mask and the skin, while a second pad, located at the bottom of the shell, supports the chin. These pads help maintain the mask's stability and prevent it from shifting during use. The light source assembly, installed on the shell, provides phototherapy to the skin.

An electric wheel controller and methods for operating and manufacturing an electric wheel controller are disclosed. Embodiments include a controller forming a structural and / or load bearing component of the vehicle suspension system. Embodiments of the controller can be mounted to a wheel assembly, and in some embodiments the controller is a suspension knuckle. Embodiments include a controller with a cavity and electronic circuitry submerged in liquid coolant. During operation the coolant can absorb heat from the immersed circuitry. In some embodiments the coolant transitions to a gas and / or vapor, and can move to an upper portion of the cavity. When the coolant contacts the cooler surfaces of the cavity the coolant can transition back to a liquid and return to a pool of liquid coolant in which the circuitry is immersed. A heat sink can be connected to the controller, such as by laser soldering.

The invention belongs to the technical field of aerospace engineering, and discloses a flexible radiator which comprises a radiation assembly, the radiation assembly comprises a plurality of radiation plates which are rotationally connected in sequence, each radiation plate comprises a liquid cooling pipe set and a radiation film arranged on the liquid cooling pipe set, and cooling liquid circulates in the liquid cooling pipe set. The material density is low, the structural mass is effectively reduced, a plurality of radiant panels are rotationally connected in sequence, the radiant panels are in a folded state during emission, then a radiator with enough radiation area can be emitted under the condition that the size of a spacecraft is limited, and the heat dissipation requirement of high-power electronic equipment is met.

The invention discloses a diamond film and a preparation method and application thereof, and the preparation method comprises the steps: taking a substrate material matched with the lattice constant of a diamond film material as a substrate, and carrying out the surface treatment of the substrate; mixed reaction gas comprising 80%-95% of hydrogen, 3%-8% of methane and 2%-12% of auxiliary gas is introduced, wherein the auxiliary gas comprises at least one of argon, chlorine, hydrogen fluoride and hydrogen chloride; carrying out controlled chemical vapor deposition at 850-1000 DEG C under the pressure of not less than 21 kPa, and growing a diamond film on the surface of the substrate; and annealing the diamond film. According to the method, chemical vapor deposition is controlled through cooperation of auxiliary gas and temperature-pressure gradient, and non-corrosion high-speed growth of the high-purity monocrystal diamond film is achieved; in combination with a dynamic annealing process, lattice defects are effectively repaired, the comprehensive performance is optimized, and the reliability of the thin film serving as a heat dissipation component and other applications is remarkably improved.

A wedge-shaped manifold microchannel heat sink with micro pin fins, including a first cover plate, a second cover plate, a manifold substrate and a microchannel substrate that are sequentially arranged from top to bottom. The first cover plate is provided with a first inlet channel. The second cover plate is provided with a second inlet channel and a first outlet channel. The manifold substrate is provided with a third inlet channel and a second outlet channel. The microchannel substrate is provided with a plurality of rows of micro pin fins. A microchannel is formed between any two adjacent rows of micro pin fins.

The invention relates to the technical field of electric equipment cooling, and particularly discloses a micro-channel liquid cooling circulation system heat dissipation device with impact resistance. A transition bin; the plurality of groups of micro-channel units are distributed in the bracket at equal intervals; the heat conduction units are embedded between the adjacent micro-channel units; and the circulating adjusting unit is arranged in the transition bin. The circulation adjusting unit can be switched among three states according to heat dissipation requirements, so that the functions of mixed temperature equalization, partitioned heat dissipation and intermittent slow flow of cooling liquid are achieved; in the first state, thermal stress impact and fluid pulsation caused by local temperature difference are effectively reduced, and the thermal stability and thermal impact resistance of the system during continuous high-load operation are enhanced; in the second state, the peripheral flow path can be suspended, and the cooling liquid is concentrated in the central core area to enhance heat dissipation; and in the third state, the cooling liquid is temporarily detained in the micro-channel unit, the heat exchange time is prolonged, and the mutability of fluid flowing is slowed down.

The invention discloses a heat dissipation module and an optical machine, and relates to the technical field of optical machine manufacturing, the heat dissipation module comprises a heat conduction part, a semiconductor refrigeration part, a control assembly and a water absorption layer, the heat conduction part comprises a heat conduction plate and an extension section arranged on the heat conduction plate, the semiconductor refrigeration part comprises a first surface and a second surface which are oppositely arranged, and the first surface is attached to the heat conduction plate; the control assembly comprises a control panel and a chip installed on the control panel, the control panel is provided with a first through hole, and the water absorption layer is provided with a second through hole; the chip, the control panel, the water absorption layer, the heat conduction plate and the semiconductor refrigeration piece are arranged in sequence, and the extending section sequentially penetrates through the second through hole and the first through hole to be connected with the chip. The heat dissipation module has the advantage that the failure risk of an optical machine can be reduced.

The invention discloses a high-stability high-voltage power supply, and belongs to the technical field of high-voltage power supplies, the high-stability high-voltage power supply comprises a clamping assembly, the clamping assembly comprises a fixing part and a lifting part, a heat dissipation area is formed between the lifting part and the power supply, a heat dissipation assembly is arranged in the clamping assembly, and the heat dissipation assembly comprises a fixed-point heat dissipation part and an auxiliary heat dissipation part corresponding to a heat source area, and a liquid circulation system is integrated, so that multi-mode collaborative heat dissipation of the power supply is realized. Through active suction heat dissipation of the corrugated cover and contact type liquid cooling of the elastic water bag, the problem of local overheating is accurately and efficiently solved, the heat dissipation efficiency and temperature uniformity are remarkably improved, air cooling and liquid cooling work cooperatively, the overall heat dissipation capacity is enhanced, meanwhile, two-way buffering is formed through the pre-pressing water bag and the bottom elastic cushion during transportation of the same structure, and the heat dissipation efficiency is improved. And excellent anti-vibration and anti-impact protection is provided, heat dissipation and protection functions are integrated, and long-term high-stability operation of the high-voltage power supply is guaranteed.

The invention discloses a magnetofluid type silicon controlled rectifier radiator and a heat dissipation control method thereof. The radiator comprises a silicon controlled rectifier, a magnetic fluid chamber is attached to the outer side of the silicon controlled rectifier, the magnetic pole array is installed in the magnetic fluid chamber, and cooling fins are assembled outside the magnetic fluid chamber. When alternating current is introduced into the cavity where the magnetic fluid liquid chamber is located, the alternating current and the magnetic field interact to generate Lorentz force, the Lorentz force drives the magnetic fluid to form directional eddy current so as to achieve convective heat exchange on the silicon controlled rectifier, and heat absorbed by the magnetic fluid and air are subjected to heat exchange through the cooling fins. Junction temperature out-of-control caused by local hot spots of the silicon controlled rectifier can be solved, secondary damage of mechanical vibration of a heat dissipation system to welding spots is eliminated, and the highest junction temperature area of the silicon controlled rectifier is focused and cooled according to needs.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

The invention discloses a micro fluid heat dissipation device based on a shell inner wall groove structure and electronic equipment. The heat dissipation device comprises a heat absorption runner module, a heat release runner module and a driving element. The heat absorption flow channel module is of a multi-layer composite film structure. The heat release runner module comprises a sealing film and a groove runner formed in the inner side face of the electronic equipment shell. And the sealing film is fixed on the inner side surface of the shell of the electronic equipment and covers and seals the groove flow channel. The channels formed in the inner side face of the electronic equipment shell serve as heat release runners of the heat dissipation device, the heat dissipation effect of the liquid cooling heat dissipation device of the electronic equipment is improved by means of the good heat conduction performance of the electronic equipment shell and the large contact area between the electronic equipment shell and the external environment, and long-time stable operation of the electronic equipment is guaranteed. The heat absorption flow channel module adopts a multi-layer composite film structure, only one layer of film is arranged between the cooling medium and the heating element, the heat transfer path is short, and the cooling capacity of the heat dissipation device on the heating element is improved.

An MIM preparation method for an ultrahigh heat-conducting composite material based on diamonds and red copper. The method comprises the preparation of a mixture, internal mixing granulation, injection molding, and degreasing sintering. By means of the MIM process, not only can uniform mixing and high-density molding of diamonds and a red copper powder be achieved, thereby effectively overcoming the technical problems of non-uniform dispersity, low density, etc. during the preparation of a high-heat-conductivity composite material by means of a traditional process, but the shape and size of a product can also be accurately controlled, particularly during the production of a sheet material having a thickness of less than 1 mm; moreover, the heat conductivity (the heat conductivity thereof being up to 500-800 W / (m·K)) thereof is significantly improved and is significantly higher than that of a traditional metal material. In addition, by optimizing MIM process parameters and selecting raw materials having higher cost effectiveness, the present invention effectively reduces the production cost, such that large-scale use of the high heat-conducting composite material based on diamonds and red copper becomes possible, thereby satisfying the high-standard requirements of high-performance electronic equipment for heat dissipation materials.

The invention discloses a modular radiator with a detachable function, which comprises a radiating machine box, a radiating unit seat is arranged in the radiating machine box, a radiating unit is arranged on the radiating unit seat, and the radiating unit seat and the radiating unit seat are fixed together through an insulating screw; a controller for controlling the heat dissipation unit seat and the heat dissipation unit, and a power supply wiring unit are arranged outside the heat dissipation machine box; an air inlet grille and an exhaust grille are mounted at the two ends of the heat dissipation machine box; channel modules are installed in a top cover and a bottom cover which are fixedly installed on the upper portion and the lower portion of the heat dissipation machine box, the channel modules are in butt joint, and sealing gaskets are arranged at joints. Through staggered work and modular design, efficient heat dissipation and convenient maintenance are achieved. The device can be flexibly arranged, air leakage is prevented, and the heat dissipation process is accurately regulated and controlled. Meanwhile, fan driving is abandoned, noise is reduced, and the device is suitable for scenes with strict noise requirements.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

Various embodiments of the disclosure relate to a heat radiating structure and an electronic device including the same. According to various embodiments of the disclosure, it is possible to provide an electronic device including: a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a third surface enclosing an internal space between the first surface and the second surface, wherein at least one portion of the third surface faces a third direction different from the first direction and the second direction, wherein a first opening is formed in the first surface, and a second opening is formed in the third surface; a substrate disposed in the internal space; an electronic component disposed on at least one surface of the substrate; and a mesh member disposed in the internal space and disposed adjacent to the first opening and the second opening.

A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

The invention provides a heat dissipation composite material and a preparation method and application thereof. The heat dissipation composite material comprises a bonding layer, an insulating breathable layer, a heat conduction layer and a heat conduction diffusion layer which are sequentially arranged from bottom to top. Wherein the bonding layer is obtained by mixing and reacting a polymer matrix material, a composite filler and a molecular bridging agent, the insulating breathable layer is a porous insulating material, the heat conduction layer is a graphene film, and the heat conduction diffusion layer is prepared from porous matrix composite heat conduction nanoparticles. According to the invention, through combination and structural design of each layer of material, a synergistic effect of a multi-layer structure is realized, firm and stable bonding of the heat dissipation composite material and a heating electronic device is realized, the heat dissipation efficiency and insulation air permeability of the heat dissipation composite material are remarkably improved, and the heat dissipation requirement of high-power-density electronic equipment can be met.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The embodiment of the invention provides a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation of electronic equipment. The liquid cooling heat dissipation device comprises a liquid separator, a liquid cooling device and a liquid cooling device, wherein the liquid separator is used for being arranged in a case; a plurality of liquid passing holes are formed in the elastic piece at intervals, and the liquid separator is connected with one side of the elastic piece; one side of each cold plate is connected with the other side of the corresponding elastic part, the other side of each cold plate is used for abutting against a part to be cooled, and a cooling space is formed between each cold plate and the liquid separator through the corresponding liquid passing hole; a liquid inlet and a liquid outlet are formed in the positions, located on the two sides of each cooling space, of the liquid separator. According to the liquid cooling heat dissipation device and the electronic equipment, the convenience of plugging and unplugging the to-be-cooled part is improved.

The invention relates to the technical field of heat dissipation, and discloses a wick, a vapor chamber and electronic equipment. The liquid absorption core can be compatible with the advantages of different capillary structures through lap joint coupling of the different capillary structures, for example, the first capillary structure and the third capillary structure have high capillary force, and therefore the requirement for the liquid return speed is met. The second capillary structure has high porosity so as to meet the requirement for the evaporation speed. Therefore, the liquid absorption core can achieve the design of the optimal capillary force, the minimum liquid flow resistance and the minimum steam flow resistance, so that the performance of the vapor chamber is optimal, and the heat dissipation requirement of electronic equipment is met.

The present invention relates to an integrated vision acquisition module for tunnel apparent defects, mainly used for solving the problems in existing detection devices of low integration level, complex debugging, low acquisition accuracy, poor environmental adaptability and the like. The vision acquisition module consists of a mounting back plate, a housing, a machine vision system, an integrated control system, a heat dissipation mechanism, a protective mechanism, and a wire arrangement mechanism. The machine vision system is encapsulated inside the mounting back plate and the housing, the heat dissipation mechanism is mounted on the back of the mounting back plate, the protective mechanism functions among the mechanisms of the vision acquisition module, and the integrated control system and the wire arrangement mechanism are mounted in the center of the front of the mounting back plate. The vision acquisition module uses a modular design, can implement accurate digital imaging of tunnel full-sections, has an overall protection grade of IP65 and good heat dissipation performance while maintaining a high degree of modularity, is adapted to different tunnel profile sections, and can complete rapid and non-contact detection of apparent defects in tunnel lining such as cracks, water leakage, and exfoliation and defects in ancillary facilities such as signal mechanisms, optical cables, and communication cables.

Embodiments of the present disclosure include systems and methods for attaching components to integrated circuits and devices thereby produced. In one example a heat sink is attached to an integrated circuit with a thermal interface material, such as solder. In some embodiments the laser is applied to the heat sink, and the heat from the heat sink heats the solder and the integrated circuit to a sufficient temperature to form an intermetallic bond between the integrated circuit and the solder and between the heat sink and the solder. In some embodiments the heat sink includes a base and cooling fins, and a laser is applied to a portion of the base between two cooling fins. In some embodiments the laser is moved across the base. In some embodiments the integrated circuit is immersed in liquid coolant and the liquid coolant absorbs heat from the integrated circuit and heat sink.

The invention relates to the technical field of aluminum alloy materials, and provides a high-thermal-conductivity 6xxx aluminum alloy, a preparation method thereof and an electronic product structural part. Wherein the 6xxx aluminum alloy comprises the following components in percentage by mass: 0.3 to 0.5 percent of Mg, 0.2 to 0.35 percent of Si, 0.08 to 0.12 percent of Ce, less than or equal to 0.10 percent of Cu, less than or equal to 0.15 percent of Fe, less than or equal to 0.05 percent of Mn, less than or equal to 0.10 percent of Zn, less than or equal to 0.05 percent of Ti, less than or equal to 0.15 percent of total impurities and the balance of Al; and Mg / Si is in the range of 1.3 to 1.5. According to the 6xxx aluminum alloy and the preparation method thereof, the content and the mass ratio of Si and Mn are accurately regulated and controlled, meanwhile, a trace Ce element is added, the thermal conductivity and the anodic oxidation performance of the 6xxx aluminum alloy are improved, solid solution and aging processes are further matched, the beta ''phase and the grain size are controlled, and the alloy has the excellent anodic oxidation performance while having the high thermal conductivity.

Embodiments of the present disclosure include apparatuses and methods for mounting an electronic component, including an integrated circuit that generates heat during operation, to a component of a vehicle suspension system, such as a suspension knuckle. Some embodiments include mounting the electronic component inside a cavity that contains coolant. In some embodiments the electronic component is immersed in liquid coolant that absorbs heat from the electronic component and transfers the heat to the suspension component where the heat can be transferred to the external environment. In some embodiments the liquid coolant transitions to a gas and / or vapor, and can condense back to a liquid after transferring heat to the suspension component. In some embodiments the electronic component is connected to a heat sink, such as by soldering, and the heat sink can include cooling fins that are immersed in the coolant.

The invention discloses a jack connecting terminal, which comprises an inner conductor provided with a jack for connecting a plug, and the inner conductor comprises a first connecting section which is a plurality of connecting sheets uniformly distributed along the axis of the jack; and a second connection section; the outer conductor wraps the first connecting section and the second connecting section, a first opening is formed in the position, corresponding to the connecting sheet, of the outer conductor at the first connecting section, and an abutting sheet used for abutting against the connecting sheet is connected to the first opening; the shell is connected to the outer conductor, and the shell and the outer conductor are arranged in a clamped mode; an adjusting mechanism is arranged on the shell and used for driving the abutting piece to move between the first position and the second position. When the abutting piece moves from the first position to the second position, the abutting piece is used for driving one end of the connecting piece to deviate towards the axis direction of the jack. The problems that in the prior art, high conductivity and high mechanical strength cannot be met, and good heat dissipation capacity is not achieved can be effectively solved.

The invention relates to the field of electronic thermal management. The invention provides an electric field driven liquid metal heat dissipation plate and application thereof.The heat dissipation plate comprises a heat dissipation plate body, a closed pipeline, a first electrode plate, a second electrode plate and a power module, the closed pipeline is located in the heat dissipation plate body, liquid metal is arranged in the closed pipeline, and the first electrode plate and the second electrode plate are arranged outside the closed pipeline; the power supply module is arranged along the closed pipeline and is electrically connected with the first electrode plate and the second electrode plate. The heat dissipation plate is applied to thermal management of high-power electronic equipment or vehicles. Through combination of high thermal conductivity of the liquid metal and electric field driven flowing, the liquid metal actively flows under the action of an electric field, heat of a high-temperature area is conveyed to a low-temperature area, overall thermal diffusion is accelerated, the heat dissipation efficiency is improved, and the requirement for efficient and stable thermal management in a high-heat-flux scene is met.

The invention provides a laminated micro-channel heat sink based on a composite material rhombic fin array, and belongs to the technical field of heat dissipation of electronic equipment. The problem that the high-power and high-heat-flux heat dissipation requirements of electronic equipment are difficult to meet is solved. The device comprises a copper box body, a heated substrate and a laminated micro-channel assembly, cooling working medium circulation openings are formed in the two sides of the copper box body respectively, the laminated micro-channel assembly comprises multiple layers of diamond / copper composite material substrates, and the multiple layers of diamond / copper composite material substrates are arranged in a laminated mode in the vertical direction; rhombic fin arrays which are regularly distributed are machined on the surface of each layer of diamond / copper composite material substrate to form micro-channel layers, the adjacent micro-channel layers are connected, the heated substrate is made of diamond / copper composite materials, the heated substrate is connected with the laminated micro-channel assembly, the copper box body is connected with the heated substrate, and the laminated micro-channel assembly is located in the copper box body. The radiator is mainly used for radiating electronic equipment.

A bracket, a module assembly, and an electronic device, so as to improve position stability of the module in the electronic device. Two first limiting parts arranged opposite to each other are arranged at two ends of the bracket, a second limiting part is arranged on at least one side of the bracket, and the two first limiting parts and the second limiting part are enclosed to form a mounting position for mounting the module. Both the first limiting parts and the second limiting part may limit the module, so as to limit in all directions and ensure position stability of the module in the bracket. The bracket is further fixed to the electronic device through fixing parts, so that the position stability of the module in the electronic device may be improved.

The invention belongs to the technical field of optical communication, and relates to a miniature capillary heat conductor, miniature high-heat-density equipment and a heat conductor installation method, and the heat conductor comprises a shell and a heat conduction module packaged in the shell; the heat conduction module comprises a first heat conduction block, a second heat conduction block, a third heat conduction block and a fourth heat conduction block, each of the first heat conduction block, the second heat conduction block, the third heat conduction block and the fourth heat conduction block comprises a plurality of layers of microcirculation units, and each microcirculation unit is filled with a phase change working medium; the microcirculation unit comprises a heat absorption area, an evaporation area and a heat dissipation area which are communicated in sequence, the heat absorption area is used for making contact with the back face of the chip to conduct heat, the evaporation area extends downwards and outwards from the heat absorption area to the heat dissipation area, the heat dissipation area is used for dissipating heat to the back face of the PCB, the area of the heat dissipation area is larger than that of the heat absorption area, and the heat dissipation area is located on the outer side of the heat absorption area; the beneficial effect of the invention is that the technical problem that the heat conduction efficiency is not ideal because the existing optical module conducts heat through the PCB via hole on the back of the chip is solved.

A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. The particulate filler material can have a higher bulk thermal conductivity than that of the metallic carrier material and can be wetted by the metallic carrier material, providing a bulk thermal conductivity of the composite thermal-interface material that is higher than that of the carrier material without the particulate filler material. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.