1856 results about "Cold plate" patented technology

The invention discloses an accurate flow control method and system for a two-phase cold plate cooling data center, and relates to the technical field of two-phase cold plate cooling, and the method comprises the following steps: S1, collecting multi-mode operation monitoring data in real time, and carrying out the data preprocessing; s2, constructing a multivariable short-time-sequence prediction model, predicting the cooling demand, and performing optimization regulation and control on a cooling demand prediction result; s3, the target regulation and control flow of the cooling liquid is predicted, and flow and cooling execution measures are taken according to the target regulation and control flow prediction result; the opening degree of the valve is accurately adjusted and evaluated in real time, and accurate flow control is achieved; s4, integrating multi-mode operation monitoring data, a cooling demand prediction result, a target regulation and control flow prediction result and a valve opening accurate regulation evaluation result, and constructing a parameter optimization and safety fault-tolerant mechanism; the problems of chip safety and energy consumption risks caused by cold plate temperature overshoot and cooling capacity regulation lag under high-load fluctuation of the server are solved.

The invention discloses a dynamic flow control method for a two-phase cold plate liquid cooling system based on multi-modal sensing, and relates to the technical field of equipment cooling. Comprising the following steps: S1, collecting liquid cooling monitoring data in real time, and performing data preprocessing; s2, judging the state risk of the cold plate, carrying out signal cross validation, and taking an abnormal regulation and control measure; s3, cooling liquid flow regulation and control are carried out, and the matching degree of flow regulation and control and chip thermal load is evaluated, so that flow regulation and control correction is carried out; and S4, constructing a big data modeling and simulation feedback platform, evaluating a flow regulation and control self-healing effect, optimizing each parameter and strategy, and carrying out self-learning evolution. The problems that an existing two-phase cold plate liquid cooling system generally only depends on a single temperature signal, lacks a multi-source redundancy check mechanism, has the problems of response lag, weak local reflection capacity, high risk during failure and the like, consequently, the cooling capacity distribution and adjustment precision is insufficient, and the actual requirement of a high-heat-density data center for heat dissipation is difficult to meet are solved.

The invention discloses a cold plate-immersion liquid cooling cooperative heat dissipation method based on steam zone coupling modeling, and relates to the technical field of cooperative heat dissipation. Comprising the following steps of S1, collecting collaborative heat dissipation monitoring data of each key position in real time, and performing data preprocessing; s2, the comprehensive risk of the steam area is judged, and a risk cooling adjustment instruction is issued according to the comprehensive risk judgment result; s3, receiving a risk cooling adjustment instruction, carrying out collaborative heat dissipation, evaluating the collaborative heat dissipation capability, adjusting the rotating speed of a circulating pump and the opening degree of a valve, and requesting condensation backflow adjustment; s4, judging the adjusting quantity of condensation reflux, executing reflux adjustment and performing safety monitoring; and S5, continuously monitoring the data of each link, and carrying out anomaly detection on the state of each link to realize anomaly regulation and control. The problems that in an existing single-phase cold plate or two-phase immersion liquid cooling mode, steam accumulation is prone to occurring in a high-heat-flow scene, so that the pressure intensity is increased, the boiling point is increased, and the heat exchange efficiency is reduced, and then the operation reliability of equipment is affected are solved.

An apparatus and system for cooling a plurality of electronic devices (25, 26) disposed on a circuit board (1) are provided. The apparatus comprises a plurality of cold plates (7, 8), each cold plate (7, 8) having a thermal interface surface for cooling an electronic device (25, 26) thermally coupled thereto. The apparatus comprises a support frame to which each of the plurality of cold plates (7, 8) is attached, the support frame configured for attachment to the circuit board so as to hold the thermal interface surfaces of the plurality of cold plates (7, 8) in thermal contact with the plurality of electronic devices (25, 26). The support frame is arranged to hold the thermal interface surface of each of the plurality of cold plates (7, 8) at a different position relative to the support frame.

The invention discloses a waste heat recovery scheduling method and system for a two-phase cold plate of a data center, and relates to the technical field of refrigeration and heat management. The waste heat recovery scheduling method and system for the two-phase cold plate of the data center comprises the following steps that S1, key thermal parameters and tail end state variables are collected through multiple types of thermal monitoring devices, and thermal state monitoring data are obtained and preprocessed; s2, on the basis of the thermal state monitoring data and in combination with an SLA configuration file, performing priority division on the heat utilization terminals, and constructing a scheduling deviation judgment mechanism to identify thermal state changes; s3, under driving of the regulation and control instruction, accessing multi-source waste heat and distributing the multi-source waste heat to each terminal scene, and evaluating a matching condition of the waste heat and a terminal demand; and S4, based on the change of the heat distribution state and the thermal state monitoring data, identifying an overload risk in combination with a multi-parameter linkage mechanism. The problems that waste heat recovery is insufficient and the energy utilization rate is limited under the light-load and multi-heat-source cooperative working condition are solved.

The invention discloses a two-phase cold plate heat dissipation control method and system based on vibration and flow coordinated regulation and control, and relates to the technical field of liquid cooling heat dissipation. The two-phase cold plate heat dissipation control method and system based on vibration and flow collaborative regulation and control comprises the steps that S1, cold plate collaborative heat dissipation data is collected in real time, and the cold plate collaborative heat dissipation data is preprocessed; s2, the heat dissipation degradation degree of the two-phase cold plate is evaluated, heat dissipation state classification judgment is executed, and a regulation and control instruction is issued; s3, executing the control instruction, evaluating the regulation and control response state of the cooling path, judging the regulation and control effect, and triggering a time-sharing coordinated regulation and control strategy; and S4, whether heat dissipation of the cooling path fails or not is judged, the thermal degradation trend of the two-phase cold plate is evaluated, and a liquid path switching strategy is executed. The problems that in an existing cold plate liquid cooling heat dissipation technology, oil films are generated by cooling liquid due to temperature changes, the oil films are prone to being attached to the inner walls of micro-pore channels, flowing is blocked, the heat exchange efficiency is reduced, and local overheating and unstable equipment performance are further caused are solved.

The invention discloses a two-phase cold plate liquid cooling ORC waste heat recovery and photovoltaic cooperative energy supply system and method, and relates to the technical field of energy management and waste heat utilization. The two-phase cold plate liquid cooling ORC waste heat recovery and photovoltaic cooperative energy supply system and method comprises the following steps that S1, thermal parameters and electric power states related to cooperative energy supply are collected, and a thermoelectric cooperative input data set is constructed and preprocessed; s2, the supply and demand difference of the high-temperature steam in the main condensation branch and the ORC branch is recognized; s3, coordinating a photovoltaic power supply structure and a cooperative energy supply sequence, and judging the matching degree of cooperative energy supply to a load; and S4, evaluating a cooling, heating and power cooperation and double-source coupling state in combination with a load matching condition and an output behavior. The problems that in an existing two-phase cold plate liquid cooling structure, high-temperature steam is not recycled, photovoltaic power generation does not participate in linkage energy supply, the power source is single, waste heat waste is serious, and energy collaboration is insufficient are solved.

The invention relates to the technical field of fusion devices, and discloses a cooling double-flow-channel structure of a nuclear fusion cold shield device, the cold shield device and a nuclear fusion device.The cooling double-flow-channel structure comprises a cold plate, a first flow channel and a second flow channel are arranged in the cold plate and are arranged in a bent mode, and the first flow channel and the second flow channel are communicated with each other; the cold plate is provided with a first inlet, a first outlet, a second inlet and a second outlet, the first inlet and the first outlet communicate with the first runner, and the second inlet and the second outlet communicate with the second runner; the first cooling pipe assembly comprises a first pipe section and a second pipe section, the first pipe section is communicated with the first inlet, and the second pipe section is communicated with the first outlet; the second cooling pipe assembly comprises a third pipe section and a fourth pipe section, the third pipe section is communicated with the second inlet, and the fourth pipe section is communicated with the second outlet. The device can be arranged in a narrow area of the cold shield device, and the overall heat shielding reliability and heat shielding performance of the cold shield device are improved.

The invention discloses a heat dissipation system, electronic equipment, a control method of the heat dissipation system and a program product, and relates to the technical field of computer heat dissipation, the heat dissipation system comprises a cold plate, a negative pressure assembly, a condenser, a data acquisition module and a control module, the inlet end of the negative pressure assembly communicates with the outlet end of the cold plate, and the negative pressure assembly is used for forming a negative pressure environment; the condenser is used for exchanging heat with the outside, the outlet end of the condenser communicates with the inlet end of the cold plate, the air inlet end of the condenser communicates with the air outlet end of the negative pressure assembly, and the liquid inlet end of the condenser communicates with the liquid outlet end of the negative pressure assembly; the control module is at least used for outputting a control signal for adjusting the negative pressure assembly according to the heating element data information collected by the data collection module. The technical problem of poor heat dissipation effect at present is solved, the boiling point of the phase change working medium and the pressure of the whole heat dissipation system are reduced, the temperature of the heating element is dynamically adjusted, and the heat dissipation efficiency and reliability are improved.

The invention discloses a computing node and a server, and relates to the technical field of servers, the computing node comprises a cold plate tray, a mainboard and a functional device, the mainboard is carried on the cold plate tray so as to dissipate heat through the cold plate tray, the functional device is fixed on the cold plate tray and is electrically connected with the mainboard, the cold plate tray is provided with a groove, and the groove is formed in the cold plate tray. The groove is located in the side, away from the main board, of the cold plate tray and used for being matched with a partition plate of the server. The cold plate tray integrates the functions of a tray and a cold plate, so that the thickness space of the computational node is saved. And the functional device is fixed on the cold plate tray and is electrically connected with the mainboard, so that the layout of the components is simplified, too tight arrangement among the components is avoided, and the blocking problem of a heat dissipation channel is reduced. The cold plate tray is provided with a groove, so that the influence of the thickness of a partition plate between the computing nodes on the height direction of the server is counteracted. Therefore, according to the computing node, the computing expansion capability and the heat dissipation efficiency are improved.

The embodiment of the invention provides a server and a liquid cooling hard disk frame. The server comprises at least two cold plates which are oppositely arranged at intervals, an inlet water segregator and an outlet water segregator, cooling cavities are integrally formed in the cold plates, and cooling liquid flows in the cooling cavities; an accommodating cavity is formed between the at least two cold plates and is used for inserting a hard disk module, so that the heat of the hard disk module is transferred to the cooling liquid in the cooling cavity; the inlet end of the cooling cavity is communicated to the flow channel of the inlet water segregator, so that cooling liquid flows into the cooling cavity from the inlet water segregator; the outlet end of the cooling cavity is communicated to a flow channel of the outlet water segregator, so that cooling liquid flowing through the cooling cavity is collected through the outlet water segregator; wherein the at least two cold plates are connected between the inlet water segregator and the outlet water segregator. According to the server and the liquid-cooled hard disk frame provided by the invention, the thickness of the cold plate can be reduced, and the deployment density of the hard disk is improved while the heat dissipation efficiency is ensured.

The present disclosure proposes a liquid cooling system with leak protection and method for cooling liquid leak protection. The liquid cooling system is adapted to a server system including a rack and a server. The liquid cooling system includes: a cooling distribution unit (CDU), a liquid detector, a local leak management device and a central leak management device. The CDU distributes coolant to a cold plate disposed inside the server through a manifold and a water valve. The liquid detector is disposed inside the sever and configured to generate a server leakage event. The local leak management device is disposed inside the rack and configured to control the sever to shutdown after data archiving, close the water valve and output a server leak notification after receiving the event. The central leak management device controls the CDU to reduce a flow rate distributed to the cold plate based on the notification.

The utility model provides an optical module cold plate type liquid cooling assembly and network switching equipment, and relates to the technical field of network equipment heat dissipation. The optical module cold plate type liquid cooling assembly comprises a cold plate main body which extends along a first direction and comprises a first side and a second side which are opposite to each other; the floating heat conduction blocks are connected to the first side of the cold plate body and can float in the second direction perpendicular to the first direction; the floating heat conduction blocks are arranged at intervals in the first direction and are used for making contact with the optical modules sequentially arranged in the first direction. The heat conduction pad is arranged between the cold plate main body and the floating heat conduction block and is in contact with the cold plate main body and the floating heat conduction block; and the at least one liquid cooling pipe is arranged on the second side of the cold plate main body. The optical module cold plate type liquid cooling assembly is in close contact with the optical module inserted into the connector of the network switching equipment, heat generated during operation of the optical module can be smoothly and timely led out, the heat dissipation efficiency is high, and the heat dissipation effect is good.

The invention discloses a heat dissipation control method and device for a single-phase immersed liquid cooling charging pile and a medium, and relates to the technical field of battery thermal management, and the method comprises the steps: carrying out the high-precision scanning and dynamic feature extraction of a built-in fiber grating array of a cold plate according to a partition flow control signal, and obtaining a temperature field matrix and a dynamic thermal feature set; performing multi-dimensional fusion analysis and electrochemical coupling analysis on the temperature field matrix and the dynamic thermal feature set to generate a thermal coupling parameter set; performing real-time risk quantitative evaluation and risk topological mapping on the thermal coupling parameter set, and outputting a risk topological data set; and performing cooling intensity dynamic modulation according to the risk topology data set, and obtaining a partition flow redistribution instruction. According to the invention, fine monitoring of the cold plate-battery interface contact thermal resistance is realized through a high-precision pressure field reconstruction technology, the accuracy and reliability of pressure distribution detection are significantly improved, and the local overheating risk caused by an assembly gap is effectively eliminated.

A battery pack assembly includes a frame, a composite cold plate and at least one battery cell. The frame includes a tray and exhaust channels communicated with the outside and arranged on two opposite sides of the tray. The composite cold plate is arranged on the tray. The composite cold plate includes a flow passage plate, and a concave rib-convex rib structure is formed on the surface of the flow passage plate. A concave rib is arranged between every two adjacent convex ribs. Cold plate flow passages are defined by concave ribs and the tray, and are communicated with the exhaust channels. The battery cell is arranged on the composite cold plate. Poles of the battery cell face the composite cold plate. A first explosion-proof valve is provided on the side of the battery cell facing the composite cold plate, and is communicated with the cold plate flow passages.

The invention provides a novel open type micro-channel radiator structure and method, and belongs to the field of electronic device heat dissipation, the novel open type micro-channel radiator structure comprises a cover plate and a micro-channel cold plate, the cover plate is provided with a cover plate liquid inlet and a cover plate liquid outlet, a groove is arranged below the cover plate, a cover plate inlet liquid collection area is arranged in the groove close to the cover plate liquid inlet, and a cover plate outlet liquid collection area is arranged in the groove close to the cover plate liquid outlet. A cover plate outlet liquid collecting area is arranged in the groove close to the cover plate liquid outlet, and a cover plate reducing manifold is arranged between the cover plate inlet liquid collecting area and the cover plate outlet liquid collecting area; a concave structure corresponding to the cover plate groove is arranged above the micro-channel cold plate, the micro-channel cold plate comprises a cold plate inlet liquid collecting area and a cold plate outlet liquid collecting area, and micro-channel ribs are arranged between the cold plate inlet liquid collecting area and the cold plate outlet liquid collecting area. The invention provides a novel open type micro-channel radiator structure and a preparation method thereof, and aims at solving the problems that an existing micro-channel radiator is insufficient in heat exchange capacity and poor in flow stability, so that the heat dissipation performance of the novel open type micro-channel radiator structure is remarkably improved. And an innovative solution is provided for design and manufacturing of the micro-channel radiator.

The invention discloses a composite cold plate-phase change cold storage coupled liquid cooling server heat dissipation device, which comprises a composite plate assembly, the composite plate assembly comprises a cold plate seat, a cold plate module, a phase change cooling module, an input port, an output port and an assembling mechanism, the cold plate seat is internally provided with a supporting and lining groove, and the supporting and lining groove is internally provided with a supporting and lining groove; the phase change cooling module is installed at the lower end of the cold plate module in an embedded mode, the input port and the output port are installed on the upper end face of the cold plate module, the lower end face of the cold plate module is movably connected with the upper end face of the supporting and lining groove, and the cold plate module is connected with an inner cavity of the cold plate base in a sleeved mode. A first connecting pipe is installed between the circulating pump and the output port and used for circulating cooling liquid in the circulating pump, and the cold storage assembly comprises a liquid storage box, a cover plate, cooling fins and a cooling fan. Through the coupling design of the composite cold plate and the phase change material, efficient absorption, dynamic buffering and multi-stage recovery of heat of the server are achieved, and the bottleneck of traditional liquid cooling heat dissipation is broken through.

The invention provides a liquid cooling leakage detection system and a liquid cooling cabinet, and relates to the technical field of data center cooling. The system comprises a cabinet liquid leakage detection system, a server liquid leakage detection system and a liquid cooling control system, the cabinet liquid leakage detection system comprises a cabinet bottom plate detection sensor array arranged at the bottom of the liquid cooling cabinet and used for monitoring the liquid accumulation state in the liquid cooling cabinet in real time and generating a liquid accumulation signal; the server liquid leakage detection system comprises a cold plate detection unit of a cold plate arranged in the liquid cooling server and used for monitoring the cooling liquid leakage state of the cold plate in real time and generating a leakage signal of the cold plate; and the liquid cooling control system is in communication connection with the cabinet liquid leakage detection system and the server liquid leakage detection system, and is used for receiving and responding to the liquid accumulation signal and the leakage signal of the cold plate, generating alarm information and triggering a control instruction of corresponding control processing. According to the invention, the accuracy of liquid leakage detection is improved, so that the probability of missed detection is reduced.

A server rack assembly is disclosed. The server rack assembly includes: a housing in which a rack is enclosed; a first server disposed on the rack and configured to support a heat-generating electronic device, the first server having a cold plate disposed on the heat-generating electronic device and a pump fluidically communicating with the cold plate via a liquid distribution loop; and a first coolant distribution unit (CDU) configured to be assembled to the first server. The first CDU is configured to be in contact with the liquid distribution loop and comprises an inlet and an outlet.

The invention relates to the technical field of heat dissipation performance testing, and discloses a heat dissipation performance testing system of a water-cooling radiator and a testing method of the heat dissipation performance testing system. The method comprises the steps that real-time temperature distribution data of a CPU, a DIMM and a GPU in a supercomputing server under a preset load are collected, and meanwhile the inlet temperature, the outlet temperature and flow parameters of cooling liquid of the integrated liquid cooling radiator are recorded. A three-dimensional heat conduction field model is constructed based on the data, and a local heat exchange coefficient matrix between the surface of each chip and the cooling liquid is obtained through calculation. And inputting the matrix into a fluid dynamic simulation network, and generating a turbulence intensity distribution diagram of the flowing state of the cooling liquid in the cold plate by combining a viscosity change curve of the cooling liquid and micro-channel structure parameters of the cold plate. Dividing a heat dissipation performance evaluation area according to the distribution diagram, and extracting cooling liquid flow velocity fluctuation characteristics for an area with turbulence intensity higher than a first threshold value; and marking the defect coordinates of the micro-channel structure for the region with the turbulence intensity lower than a second threshold value.

The utility model belongs to the field of server heat dissipation, particularly relates to a high-efficiency heat exchange type server liquid cooling heat dissipation system, and aims to solve the problems that existing air cooling heat dissipation is limited by low air heat conduction efficiency, heat generated in a server cannot be taken away quickly, the stability and the service life of the server are affected, and the service life of the server is influenced. In order to solve the problem that the position of a heat dissipation device cannot be adjusted according to different types of servers, the utility model provides the following scheme that the heat dissipation device comprises a server main body and a circulating box, a cold plate and a cooling pipe are arranged in the server main body, the upper surface of the circulating box is fixedly connected with a circulating pump, and the liquid inlet end of the circulating pump is fixedly communicated with a liquid pumping pipe; according to the liquid cooling heat dissipation device, the liquid cooling heat dissipation technology is adopted, the high heat conductivity of cooling liquid is achieved, heat of key components in the server can be rapidly and efficiently absorbed and taken away, the working temperature of the server is remarkably reduced, the service life of the server is prolonged, the service life of the server is prolonged, the service life of the server is prolonged, and the service life of the server is prolonged. And the system stability and service life are improved.

The present application provides a two-phase cold plate liquid cooling system and a control method. According to the present application, for parts which are cooled in series by the two-phase cold plate liquid cooling system, after a first evaporator cools a previous part, on the basis of the heat transfer requirements of a part cooled by a second evaporator, the quality of a refrigerant output from the first evaporator is adjusted to prevent the quality of the refrigerant from being too low or too high, and thus the refrigerant entering the second evaporator has proper quality, namely, the refrigerant entering the second evaporator has proper boiling point and heat exchange capacity, so that corresponding parts can be cooled to proper temperature, and large temperature difference between upstream and downstream parts is avoided. The solution solves the problem of the temperature of downstream parts in the series being lower than the temperature of upstream parts in the series, improves the temperature uniformity of multiple parts cooled in series, and then solves the problems of pressure oscillation, circulation stagnation and circulation reverse flow in the system, greatly improving the temperature uniformity of heat sources connected in series and the reliability of a series-parallel system.

The invention provides a 3He internal circulation device for a dilution refrigerator and the dilution refrigerator, and relates to the technical field of dilution refrigerators. The dilution refrigerator is provided with a mixing chamber and an evaporation chamber, the 3He internal circulation device comprises at least one pair of circulation main bodies and a driving mechanism, the at least one pair of circulation main bodies are arranged between a first-stage cold disc and a second-stage cold disc which are distributed at intervals in the vertical direction, the temperature of the first-stage cold disc is located in a first temperature zone, and the temperature of the second-stage cold disc is located in a second temperature zone; each circulating main body has a first state in which the circulating main body moves downwards to be in contact with the second-stage cold disc, is cooled to a second temperature zone and adsorbs 3He steam from the evaporation chamber, and a second state in which the circulating main body moves upwards to be in contact with the first-stage cold disc, is heated to the first temperature zone and releases the 3He steam to the mixing chamber. The driving mechanism is suitable for driving the two circulating main bodies in each pair to move in the vertical direction so as to be switched between a first state and a second state, and the two circulating main bodies are kept in different states so as to form a 3He steam inner circulating passage.

The invention discloses a corrosion circulation test device, and relates to the technical field of liquid cooling servers, the corrosion circulation test device comprises a cooling liquid circulation system, a flow control assembly, a temperature control assembly, a liquid monitoring assembly and a control system, the cooling liquid circulation system is used for realizing circulation flow of cooling liquid, the flow control assembly is used for controlling the flow change of the cooling liquid, and the temperature control assembly is used for controlling the flow change of the cooling liquid. The temperature control assembly is used for controlling temperature changes of the cooling liquid, the liquid monitoring assembly is used for monitoring parameter indexes of the cooling liquid, and the control system is used for achieving a control effect. According to the embodiment of the invention, the real working condition of the liquid cooling server can be simulated, and the corrosion cycle test device can comprehensively verify the whole cold plate in the liquid cooling server, so that the purpose of verifying the whole cold plate under the condition of simulating the real working condition is achieved, the corrosion resistance of the cold plate can be comprehensively evaluated, and the test efficiency is improved. Therefore, the test result better fits the real situation.

The invention provides a shunting network simulation model construction method and system for a liquid cooling cold plate, and the method comprises the steps: S1, obtaining the distribution positions of IT equipment elements, building a two-dimensional IT simulation plane, S2, obtaining the constraint conditions of the cold plate, building a two-dimensional network simulation plane, carrying out the heat source grade marking of the two-dimensional network simulation plane, and carrying out the heat source grade marking of the two-dimensional network simulation plane. The method comprises the following steps: performing unit division on a two-dimensional network simulation plane and performing shunting network connection in a step S3 to generate a plurality of three-dimensional shunting network models, performing analogue simulation in a step S4, performing discrimination operation, executing a step S5 or a step S6 based on the discrimination operation, if the step S5 is executed, generating a plurality of improved three-dimensional shunting network models based on a shunting improved model, and if the step S5 is executed, performing shunting network connection on the improved three-dimensional shunting network models. And S4, if the step S6 is executed, sorting output is carried out on the three-dimensional shunting network model based on the judgment operation, a designer can refer to the three-dimensional shunting network model to design the shunting network of the liquid-cooling cold plate, and the research and development rate is improved.

The invention relates to the technical field of AI cluster servers, in particular to a low-temperature running AI cluster server and a using method thereof.The method comprises the following steps that S1, the AI cluster server running at the low temperature through a cold plate is obtained, the cold plate is internally provided with a multi-parameter sensor unit for detecting temperature T, pH value, conductivity EC, suspended particle concentration SC and oxidation reduction potential ORP data influencing the performance of the cooling liquid; s2, carrying out noise removal and abnormal value processing on the obtained data of the temperature T, the pH value, the conductivity EC, the suspended particle concentration SC and the oxidation reduction potential ORP; s3, dividing the data set preprocessed in the step 2 into a training set and a test set, and constructing an LSTM model.According to the method, the health state of the cooling liquid in the AI cluster server running at the low temperature can be accurately and timely monitored and predicted, the time node of liquid cooling replacement can be accurately judged to the maximum extent, and the accuracy of liquid cooling replacement is improved. The stable operation of the server is further ensured; and the maintenance cost and risk are reduced.

A structure for protecting an electronic component from coolant leaking from a liquid cooling system is disclosed. The liquid cooling system has a manifold collecting and supplying coolant to a cold plate via inlet and outlet tubes. The cold plate is mounted over a heat-generating component on a circuit board. The structure includes a drip tray having a top surface and a length approximately the distance between the manifold and the cold plate. The drip tray includes a trough for collection of leaking coolant. The tray is inserted between the circuit board and the inlet and outlet tubes.

The embodiment of the invention provides a storage device, system and method based on liquid cooling, a storage medium and electronic equipment, and relates to the field of hardware design, and the storage device comprises a memory connector which is used for being connected with a mainboard of a server; the memory module is used for storing data, the memory module is connected with the memory connector according to preset pin configuration, the memory module comprises a plurality of memory particles, and the memory particles are horizontally placed on the memory module; the cold plate is used for absorbing heat generated by the memory module, and the cold plate is horizontally connected with the memory module. By the adoption of the scheme, the technical problem that in the related technology, the running speed of the memory module is low is solved.

Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the integrated cooling assembly includes a semiconductor device and a cold plate attached to the semiconductor device. The cold plate has a perimeter sidewall, a top portion and pairs of opposing cavity sidewalls. The perimeter sidewall extends downwardly from the top portion to a backside of the semiconductor device to define a perimeter of the cold plate. Each pair of opposing cavity sidewalls extends downwardly from the top portion towards the backside of the semiconductor device to define a coolant chamber volume therebetween. A distance between each pair of opposing cavity sidewalls in a direction parallel with the backside of the semiconductor device defines a width of a corresponding coolant chamber volume and a spacing between adjacent coolant chamber volumes, wherein the ratio of width to spacing is about 1:1.

The embodiment of the invention provides a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation of electronic equipment. The liquid cooling heat dissipation device comprises a liquid separator, a liquid cooling device and a liquid cooling device, wherein the liquid separator is used for being arranged in a case; a plurality of liquid passing holes are formed in the elastic piece at intervals, and the liquid separator is connected with one side of the elastic piece; one side of each cold plate is connected with the other side of the corresponding elastic part, the other side of each cold plate is used for abutting against a part to be cooled, and a cooling space is formed between each cold plate and the liquid separator through the corresponding liquid passing hole; a liquid inlet and a liquid outlet are formed in the positions, located on the two sides of each cooling space, of the liquid separator. According to the liquid cooling heat dissipation device and the electronic equipment, the convenience of plugging and unplugging the to-be-cooled part is improved.