Hybrid immersion cooled server with integral spot and bath cooling

Abstract

A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The primary heat generating components are cooled by indirect liquid cooling provided by at least one cold plate having fins. The cold plate is coupled to a first coolant conduit that circulates a first coolant in the enclosure and supplies the cold plate. Immersion cooling is provided for secondary heat generating components through a second coolant that will be disposed inside the enclosure such as to partially submerge the cold plate and the first coolant conduit as well as the heat generating components.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]This invention relates to cooling of computing systems environments and more particularly large computing systems environments that include one or more servers.[0003]2. Description of Background[0004]The industry trend has been to continuously increase the number of electronic components inside computing systems. Given the limited footprint of many computing systems, a continuous increase in the number of heat generating components creates challenging heat dissipation issues. These issues if not dealt with adequately can harm the structural and data integrity of the computer system, making the effect felt both at a system and module level.[0005]Most electronic packages or nodes in large environments are housed in stacks disposed in frames that resemble racks or cages. Traditionally, these electronic packages have been cooled by forced air cooling using air moving devices, such as fans and blowers, selectively disposed s...

AI Technical Summary

Problems solved by technology

Given the limited footprint of many computing systems, a continuous increase in the number of heat generating components creates challenging heat dissipation issues.

These issues if not dealt with adequately can harm the structural and data integrity of the computer system, making the effect felt both at a system and module level.

As the packaging densities increase, however, the air cooling solutions are becoming more prohibitive and costly.

In addition, air cooling has other associated costs in the form of unwanted acoustic and energy consumption characteristics.

In large data centers that house many computing environments in close proximity, the heat dissipation issue is exacerbated even more.

In such cases, cooling costs and feasibility of providing air cooling have become a burden to many businesses that rely on their data centers.

The prior art currently being practiced, however, whether air cooled or water cooled is limited in its offerings.

It is a concern that current methods being used cannot adequately provide for future generation designs.

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