This specification describes techniques for manufacturing an electronic 
system module. The module includes flexible multi-layer 
interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making 
liquid crystal display, LCD, panels is used to fabricate the 
interconnection circuits. A 
polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate 
layers of 
metal and 
dielectric are formed on the base layer, and patterned to create an array of multi-layer 
interconnection circuits on the glass panel. A thick layer of 
polymer is deposited on the interconnection circuit, and openings formed at input / output (I / O) pad locations. 
Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using 
flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and 
electronic systems are described. Module packaging 
layers are provided for hermetic sealing and for 
electromagnetic shielding. A 
blade server embodiment is also described.