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753 results about "Blade server" patented technology

A blade server is a stripped-down server computer with a modular design optimized to minimize the use of physical space and energy. Blade servers have many components removed to save space, minimize power consumption and other considerations, while still having all the functional components to be considered a computer. Unlike a rack-mount server, a blade server fits inside a blade enclosure, which can hold multiple blade servers, providing services such as power, cooling, networking, various interconnects and management. Together, blades and the blade enclosure form a blade system, which may itself be rack-mounted. Different blade providers have differing principles regarding what to include in the blade itself, and in the blade system as a whole.

Electronic system modules and method of fabrication

This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is used to fabricate the interconnection circuits. A polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate layers of metal and dielectric are formed on the base layer, and patterned to create an array of multi-layer interconnection circuits on the glass panel. A thick layer of polymer is deposited on the interconnection circuit, and openings formed at input / output (I / O) pad locations. Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and electronic systems are described. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server embodiment is also described.
Owner:SK HYNIX INC
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