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9767results about How to "Good dimensional stability" patented technology

Electronic system modules and method of fabrication

This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is used to fabricate the interconnection circuits. A polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate layers of metal and dielectric are formed on the base layer, and patterned to create an array of multi-layer interconnection circuits on the glass panel. A thick layer of polymer is deposited on the interconnection circuit, and openings formed at input / output (I / O) pad locations. Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and electronic systems are described. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server embodiment is also described.
Owner:SK HYNIX INC

Full aromatic fluorine containing transparent polyimide film and preparation method thereof

The invention relates to a full aromatic fluorine containing transparent polyimide film. Structural formula of molecule thereof is shown above, wherein -R1 is a divalent residue of fluorine containing aromatic binary primary amine, and -R2 is a divalent connecting group of aromatic binary anhydride molecule. The preparation method thereof comprises steps of adding the fluorine containing aromatic binary primary amine and strongly polar non-protonic organic solvent into a polymerizing bottle, stirring at room temperature, after being completely dissolved, adding the aromatic binary anhydride, stirring, after 3 hours reaction, obtaining transparent and thick fluorine containing aromatic polyamide acid resin solution having homogeneous phase; and using the strongly polar non-protonic organic solvent to regulate viscosity of the fluorine containing aromatic polyamide acid resin solution, forming film, heating, carrying out dehydrating hot-imidization reaction, cooling, demoulding, thus obtaining the full aromatic fluorine containing transparent polyimide film. The preparation method has mild reaction condition, simple operation and low cost and is environment friendly. The full aromatic fluorine containing transparent polyimide film has excellent mechanical property and heat tolerance and visible light transmission thereof is up to 95%.
Owner:DONGHUA UNIV
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