731 results about "Thermal analysis" patented technology

Methods and apparatuses for circuit design to reduce power usage, such as reducing temperature dependent power usage, and / or to improve timing, such as reducing temperature dependent delay or transition time. At least one embodiment of the present invention reduces the power dissipation and improves the timing of an integrated circuit to optimize the design. A thermal analysis is used to determine the temperature dependent power dissipation of a circuit and the temperature distribution of the circuit resulting from dissipating the heat created by the temperature dependent power dissipation. Then, the components of the design are selectively transformed to reduce the power dissipation and to improve timing based on the temperature solution. The transformation may include placement changes and netlist changes, such as the change of transistor threshold voltages for cells or for blocks of the circuit chip.

A method and apparatus are provided to acquire direct thermal measurements, for example, from a LiDAR collecting vehicle or air vessel, of an overhead electrical conductor substantially simultaneous with collection of 3-dimensional location data of the conductor, and utilize temperature information derived from the direct thermal measurements in line modeling, line rating, thermal line analysis, clearance analysis, and / or vegetation management.

Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.

Thermal image data of at least a region of a face of a person is provided. The thermal image data is used to determine a physiological state of a person, e.g., anxiety. For example, anxiety may be determined by a comparison of the thermal image data to a baseline, or by comparison of thermal image data for one region of the person's face to another.

An automated custom power supply design system uses an expert system containing a set of rules, including manufacturing limitations to limit design choices and ensure feasibility and manufacturability of the design. A design interface collects specifications from a user. A complement of power components for satisfying the electrical specifications is defined and mechanical specifications for each component are provided by the system for use in creating the mechanical design. After the mechanical design is established a thermal analysis is performed and the completed design is returned to a host computer. After an order is received, a computer integrated manufacturing system generates all of the specifications required to manufacture the components for the system and the system.

A process for establishing manufacturing parameters includes computer simulating a manufacture of a laser-sintered part based on a set of manufacturing parameters, calculating a set of physical properties of the simulated manufacture, and modifying the set of manufacturing parameters based on the calculated set in order to obtain a desired set of physical properties.

A platinum / Rhodium resistance thermal probe is used as an active device which acts both as a highly localized heat source and as a detector to perform localized differential calorimetry, by thermally inducing and detecting events such as glass transitions, meltings, recystallizations and thermal decomposition within volumes of material estimated at a few mum3. Furthermore, the probe is used to image variations in thermal conductivity and diffusivity, to perform depth profiling and sub-surface imaging. The maximum depth of the sample that is imaged is controlled by generating and detecting evanescent temperature waves in the sample.

A platinum / Rhodium resistance thermal probe is used as an active device which acts both as a highly localized heat source and as a detector to perform localized differential calorimetry, by thermally inducing and detecting events such as glass transitions, meltings, recystallizations and thermal decomposition within volumes of material estimated at a few mu m3. Furthermore, the probe is used to image variations in thermal conductivity and diffusivity, to perform depth profiling and sub-surface imaging. The maximum depth of the sample that is imaged is controlled by generating and detecting evanescent temperature waves in the sample.

A method and apparatus for modeling and thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal testing of a semiconductor chip design includes calculating full-chip temperatures over the semiconductor chip design (e.g., to identify steep thermal gradients) and modeling the full-chip temperatures in accordance with a geometric multi-grid technique. The geometric multi-grid technique is tailored to determine temperatures within the semiconductor chip design based at least in part on the physical attributes or geometry of the design.

A temperature change is applied to at least a portion of a sample to be measured while measuring the thermal characteristic of a minute portion of the sample based on the temperature change by using infrared ray. There are provided a method and an apparatus which enable the thermal analysis of a minute portion of the sample.

An optimizing design method for a chassis structure of electronic equipment is disclosed, including: investigating from the point of view of mechanical, electric and thermal three-field coupling, determining the preliminary design size of the chassis, performing a mechanical analysis by using the software Ansys; converting the mesh model among the three-fields, obtaining the mesh model used for the electromagnetic and thermal analyses; setting the thermal analysis parameters, performing the thermal analysis by using the software IcePak; determining a resonance frequency of the chassis and an electric parameter of the absorbing material, performing an electromagnetic analysis by using the software FeKo; correcting the analysis result by sample testing; determining whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, modifying the preliminary CAD model, the electromagnetic analysis parameter and the thermal analysis parameter, repeating the above processes until the requirement is satisfied.

A toner including a thermoplastic resin; a colorant; a wax; and a crystalline polymer, wherein a DSC endothermic peak temperature of the wax or the crystalline polymer determined by subjecting the toner to a differential scanning calorimetric analysis is lower by not less than 2° C. than a DSC endothermic peak temperature thereof determined when only the wax or the crystalline polymer is subjected to the differential calorimetric analysis.

A method and apparatus for full-chip thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal analysis of a semiconductor chip design comprises receiving at least one input relating to a semiconductor chip design to be analyzed. The input is then processed to produce a three-dimensional thermal model of the semiconductor chip design. In another embodiment, thermal analysis of the semiconductor chip design is performed by calculating power dissipated by transistors and interconnects included in the semiconductor chip design and distributing power dissipated by the interconnects.

A method and apparatus are provided to acquire direct thermal measurements, for example, from a LiDAR collecting vehicle or air vessel, of an overhead electrical conductor substantially simultaneous with collection of 3-dimensional location data of the conductor, and utilize temperature information derived from the direct thermal measurements in line modeling, line rating, thermal line analysis, clearance analysis, and / or vegetation management.

Industrial waste derived adsorbents were obtained by pyrolysis of sewage sludge, metal sludge, waste oil sludge and tobacco waste in some combination. The materials were used as media to remove hydrogen sulfide at room temperature in the presence of moisture. The initial and exhausted adsorbents after the breakthrough tests were characterized using sorption of nitrogen, thermal analysis, XRD, ICP, and surface pH measurements. Mixing tobacco and sludges result in a strong synergy enhancing the catalytic properties of adsorbents. During pyrolysis new mineral phases are formed as a result of solid state reaction between the components of the sludges. High temperature of pyrolysis is beneficial for the adsorbents due to the enhanced activation of carbonaceous phase and chemical stabilization of inorganic phase. Samples obtained at low temperature are sensitive to water, which deactivates their catalytic centers.

A computer implemented method and system for optimizing thermal performance of a computer system. An identification of a set of processor cores associated with the computer system is made and a thermal index is requested for each of the set of processor cores to form a set of thermal indexes. Proximity information and conductive property information associated with the set of processors is loaded and software is mapped to execute on an optimal processor core form the set of processor cores based the set of thermal indexes, proximity information, and conductive property information.

The invention discloses a microwave thermogravimetric analysis (TGA) method and a device, wherein, the device comprises four parts, namely, a microwave oven, a mass measurement system, a temperature measurement system and an atmosphere adjustment system. The microwave input power can be set to a fixed value and also can set to be linked with the temperature measurement system. The mass measurement system monitors the mass variation of a test sample in real time; the temperature measurement system utilizes an infrared thermometer and a thermocouple to monitor the temperature of the test sample and the hearth in real time. The atmosphere heating can be achieved by the atmosphere adjustment system and the heating atmosphere can be air atmosphere, inert atmosphere, oxidizing atmosphere or reducing atmosphere. The device provided by the invention has the advantages of simple structure, high degree of automation and convenient operation, the invention can obtain the relation among mass, time / mass, and temperature of multiple test samples under different atmospheres in the process of microwave heating, and realizes microwave thermogravimetric analysis of the test samples with larger mass or volume.

The invention discloses a prediction method of the forecabin thermal protection system whole trajectory temperature boundary of a hypersonic velocity aircraft. The prediction method comprises the following steps: 1) according to the layout features of the forecabin thermal protection system of the hypersonic velocity aircraft, establishing a three-dimensional geometric model of the thermal protection system; 2) extracting the thermal conductivity coefficient and the emissivity of each material as feature parameters, and finishing the parametric establishment of a forecabin thermal protection system finite element model which takes the feature parameters as driving; 3) on the basis of the whole trajectory reentry process flight working condition of the aircraft, comprehensively considering thermal conductivity and thermal radiation effects to realize the transient thermal analysis of the thermal protection system in a whole trajectory process; and 4) considering material dispersibility, taking the thermal conduction coefficient and the emissivity of the material as uncertain input parameters, and finishing the analysis of the thermal protection system whole trajectory temperature boundary in the trajectory process on the basis of an interval vertex analysis method. The prediction method accurately and efficiently predicts the forecabin thermal protection system temperature boundary in the harsh reentry environment of the hypersonic velocity aircraft, and lays a foundation for the subsequent reliability rational evaluation and the uncertain optimization design of the structure.

The invention discloses a finite element method-based storage battery thermal management analysis and optimization method. The finite element method-based storage battery thermal management analysis and optimization method comprises the following steps of: acquiring parameters of a plurality of batteries and a battery pack respectively and establishing three-dimensional models of the plurality of batteries and the battery pack; performing the meshing of a definite element on the three-dimensional models of the plurality of batteries and then performing thermal field analysis after the meshing to acquire temperature field analytical results of the plurality of batteries; performing fluid mechanics meshing on the three-dimensional models of fluid in the battery pack and then after the meshing, using temperature field analytical results of the plurality of batteries as constraint conditions of the plurality of batteries in the fluid grid models in the battery pack; performing fluid mechanics calculation on the constrained grid models to acquire flow field analytical results of the storage batteries; judging whether the flow field analytical results accord with preset conditions or not; and if the flow field analytical results do not accord with the preset conditions, optimizing the design scheme of the battery pack and establishing the models again. The finite element method-based storage battery thermal management analysis and optimization method is not limited to mathematic analysis capacity, has higher adaptability and solving capacity, does not need entity models, is economic and quick in the analytical process, and has higher degree of freedom and flexibility.

The inventive method consists in: modeling for thermal analysis of heating and temperature rise of the main shaft, using a cylindrical-coordinate system for the temperature distribution of the axially symmetric structure and determining the boundary condition; calculating friction heat and power loss of front and back bearings of main shaft in a state of different speeds and different pretightening forces; determining the relation of axial shifting of the bearing with the pretightening forces; according to the above calculated data, choosing material for making double-layer bushing and making length different double-layer bushing size of the sleeve because the extension volume of the bushing heat expansion depends on the length of the sleeve.

A method and apparatus for full-chip thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal analysis of a semiconductor chip design comprises receiving at least one input relating to a semiconductor chip design to be analyzed. The input is then processed to produce a three-dimensional thermal model of the semiconductor chip design. In another embodiment, thermal analysis of the semiconductor chip design is performed by calculating power dissipated by transistors and interconnects included in the semiconductor chip design and distributing power dissipated by the interconnects.

The invention relates to a solid phase extract sampling bottle and heat analysis device in the field of sample measuring technology. It is a liquid-solid extraction and gas-solid absorption technology, which is used to pre-treat gas sample, liquid sample and isotropy sample and to extract and collect the objecting component, especially in color analysis and instrumental analysis. The solid phase extract sampling bottle and heat analysis device comprises an extract sampling bottle which is like a cylinder with one open end and one sealed end as bottom, and a casing and one layer extracting fixed phase on the middle part of the cylinder's inner wall, a heat analysis device and an extract sampling bottle cleaning device.

The very thin, high carbon wire is 0.05 to 0.50 mm in diameter and comprises, in mass %, 0.90-1.20% of C, 0.05-1.2% of Si, 0.2-1.0% of Mn, and 0.0050% or less of N, with the balance being iron and impurities. In a differential scanning thermal analysis curve A of the steel wire, the steel wire has an exothermic peak X in the temperature range of 60° to 130° C., and a maximum height h of the exothermic peak X relative to a reference line Y joining the point of 60° C. and the point of 130° C. in the differential scanning thermal analysis curve is set at 5 μW / mg or more. The very thin, high carbon steel wire is free of delamination in high-speed stranding and superior in both strength and ductility.

The invention discloses a volatile organic matter continuous monitor which mainly comprises an absorption and thermal analysis device, a gas chromatography column, an ionizing detector and an electronic six-way valve. The electronic six-way valve is connected with a sampling pipeline, a gas carrier pipeline and a gas calibrating pipeline of a mainframe; the absorption and thermal analysis device is provided with a bracket; an absorption pipe and a condensing pipe are arranged on the bracket; an axial flow fan is arranged at one side of the bracket; the input end of the absorption pipe is connected with a sample gas inlet through the electronic six-way valve; the output end of the absorption pipe is connected with one air pump through the electronic six-way valve; the input end of the condensing pipe is connected with the electronic six-way valve; the absorption pipe is also connected with the air carrier pipeline; the input end of the gas chromatography column is connected with the output end of the condensing pipe; and the input end of the ionizing detector is connected with the output end of the gas chromatography column. The volatile organic matter continuous monitor has the advantages of small size, simple structure, low running and maintaining cost, and strong maneuverability; moreover, the volatile organic matter continuous monitor is suitable for continuously and automatically monitoring the air in urban and pollution source areas.

The invention belongs to the technical field of environmental protection, and particularly relates to an industrial waste salt system and method. The industrial waste salt system comprises a waste salt pretreatment unit, a waste salt thermal analysis device, a high temperature dust removal unit, an oil and gas condensing unit, a gas purification unit, a liquid purification and recovery unit, a burner, an evaporation and crystallization unit, and a salt slag waste heat recovery unit. The industrial waste salt system and method is complete in harmless treatment, high in resource recovery rate, and low in treatment energy consumption, and the recovery rate of the waste salt after the treatment of the system can reach 80%.

Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout. The IC design layout includes several wiring layers in some embodiments. The IC design layout includes a substrate that has at least one through-silicon via (“TSV”). The method divides the IC design layout into a set of elements. The method identifies a temperature distribution for the IC design layout by using the set of elements. In some embodiments, at least one element includes a metal component and a non-metal component. The non-metal component is silicon in some embodiments, and a dielectric in other embodiments.