48 results about "Thermal Problem" patented technology

The invention relates to a thermal control device intended to dissipate the heat generated by a payload on a spacecraft, comprising a number of surfaces and including means for circulating a refrigerant. An evaporation zone (Z1) comprises means for circulating the refrigerant, a compression zone (Z2), a condensation zone (Z3) comprising at lEast one radiating panel, linked to a part of the means for circulating the refrigerant, including several branches and comprising means to allow or inhibit the circulation of the refrigerant within these branches so as to vary the area of the heat exchange surface in the condensation zone, a pressure reduction zone (Z4) comprising means for circulating the refrigerant. Such a device is particularly well adapted to thermal problems encountered in telecommunications satellites.

A mechanism is provided for unified management of power, performance, and thermals in computer systems. This mechanism incorporates elements to effectively address all aspects of managing computing systems in an integrated manner, instead of independently. The mechanism employs an infrastructure for real-time measurements feedback, an infrastructure for regulating system activity, component operating levels, and environmental control, a dedicated control structure for guaranteed response / preemptive action, and interaction and integration components. The mechanism provides interfaces for user-level interaction. The mechanism also employs methods to address power / thermal concerns at multiple timescales. In addition, the mechanism improves efficiency by adopting an integrated approach, rather than treating different aspects of the power / thermal problem as individual issues to be addressed in a piecemeal fashion.

A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements and optical elements mounted thereon can be electrically and optically connected by using flexible substrates that are electrically wired and optically connected. The package can be variously changed when configuring the package by the flexible substrate and the heat dissipation device and the electromagnetic shielding device are installed in the inside of the package, making it possible to solve electromagnetic wave interference problems and thermal problems occurring in the inside of the package.

The invention relates to the technical field of illuminating lamps, in particular to a stage lamp thermal system, which comprises a lighting unit, an air-in chamber, an air-blast chamber and an air-out chamber, wherein an air inlet for the system, a fan and a shunting mechanism are arranged in the air-in chamber; the shunting mechanism divides the air-in chamber into a cold zone and a hot zone, and part of the fan is in the cold zone and the other part is in the hot zone; the air inlet for the system is in the cold zone communicated with the air-blast chamber; both the cold zone and the hot zone are communicated with the air-out chamber; the air-blast chamber is communicated with the air-out chamber; and the lighting unit is arranged between the air-blast chamber and the air-out chamber. The stage lamp thermal system has the characteristics of sucking air and exhausting air forcibly, has the hot zone and the cold zone which are obvious, ensures that all subsystems in the lamp is in reasonable operating temperature range, solves the difficult thermal problems caused by that the stage lamp adopts miniaturized lighting luminaire, but the power is unceasingly boosted, prolongs the service life of the stage lamp and improves the working reliability of the luminaire.

The invention provides a heat tube and phase change material combined shell-and-tube heat exchanger. The system comprises a shell, a cooling liquid inlet, a cooling liquid outlet, a heat tube, a powerpump, a cold medium source and a heat source shell. The shell is filled with cooling liquid. The heat source shell is arranged in the shell. The heat source shell internally comprises a heat source and a phase change material. The heat source surrounds the interior of the phase change material. The evaporating end of the heat tube is arranged in the phase change material. A second temperature sensor is arranged on the surface of the heat source shell and is in data connection with a controller. The controller automatically controls the opening degree of a valve according to the detected temperature data. By controlling the temperature of the surface of the heat source shell, the temperature of the heat source is prevented from being too high or too low, and the effect of automatically controlling and saving energy is realized. Heat generated during conveying of the heat tube is used, the phase change heat transferring is realized through the liquid, and the heat exchange problem of high heat flux density can be quite well solved.

A color combining optical system which can suppress occurrence of a thermal problem and increase in size is disclosed. The color combining optical system comprises a first optical element which has a first optical film reflecting light having a first polarizing direction and transmitting light in a second polarizing direction and combines the first and second color lights by the first optical film. In addition, the optical system comprises a polarizing plate which analyzes a third color light. Furthermore, the optical system comprises a second optical element which combines, by a second optical film, the third color light transmitted through the polarizing plate with the first and second color lights combined by the first optical element.

Thermal management in three dimensional integrated circuits can be difficult. Although three dimensional integrated circuits offer multiple benefits in alleviating back-end-of-the-line (BEOL) interconnect issues by reducing the wire length and reaping resistance-capacitance (RC) quadratic benefits, the thermal issues associated with stacking high performance (and subsequently high-power consumption) dice have so far proven to be prohibitive. Disclosed are methods and devices for efficient thermal management in multilayered ICs by determining thermally dangerous regions and selectively activating them to avoid undesirable temperature effects.

The method of modeling thermal problems using a non-dimensional finite element method is a computerized method for modeling thermal systems that relies on the variational principle. The variational principle specifies the total potential of the system, given by a scalar quantity Π, which is defined by an integral form for a continuum problem. The solution of the continuum problem is a function that makes Π stationary with respect to the state variables. The governing equation of the problem is used to calculate the potential Π. The non-dimensional form of the potential is obtained by insertion of the defined non-dimensionless parameters. The element non-dimensional stiffness matrix and the non-dimensional load vectors are then obtained by invoking the stationarity of the non-dimensional potential Π with respect to a non-dimensional temperature vector {θ}.

A double-medium closed-type energy release device for valley current and normal pressure energy storage, which mainly solves the heat storage problem of the heat source of heat defrosting in the high-efficiency closed-type broadband finned tube low-temperature water vapor source absorption device, and the high-efficiency closed-type wide-band finned tube low-temperature water vapor source Although the absorption device reduces the chance of frosting by more than 98% of the traditional air source heat pump, there is still a 2% chance of frosting, and the capacity of the circulating solution that is 5 to 8 times higher than that of the built-in circulating solution of the equipment is used to store the energy of the solution and heat it for standby defrosting. The input of energy storage solution in the system is reduced, and the energy storage dual-medium closed-type energy release device with valley current and normal pressure is used to obtain the heat energy of solution energy storage heating for standby defrosting, so as to reduce the environmental impact of excessive solution in the system and realize efficient and economical application.