171 results about "Microchannel heat sink" patented technology

Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.

An assembly for providing a concentrated, vertically stacked array of laser beams from a horizontally offset array of electrically serially-connected metallic microchannel heat sinks each bearing a laser diode bar. The heat sinks are mounted on horizontally offset planes of the manifold which has coolant channels serving adjacent heat sinks that are separated from each to increase the electrical resistance of the fluid path between adjacent ones of said heat sinks. Stepped optical deflectors re-arrange the horizontally emitted laser beams into vertical stack.

The invention provides a heat sink for flowing coolant into inlet manifold channels extending into a inlet edge of a manifold where the flow is forced downward into parallel and spaced micro-channels extending across the manifold channels and re-directing the coolant up into and out of outlet manifold channels extending into an outlet edge of the manifold and interleaved with the inlet manifold channels, and by maintaining a base-width of the micro-channels in the range of forty microns to one hundred microns, maintaining a base-height of the micro-channels in the range of two hundred microns to four hundred microns, maintaining a manifold-height through of the manifold channels in the range of one thousand microns to three thousand microns, and maintaining a manifold-width of the manifold channels in the range of three hundred and fifty microns to one thousand microns.

Systems and methods that allow for weight and size reduction of electronics components, such as transformer rectifier units (TRUs) or autotransformer rectifier units (ATRUs), by providing a fluid cooling system is utilized to provide high heat dissipation for a transformer assembly of TRUs or ATRUs by providing a thermal interface at the windings of the transformer assembly, which are the hottest spots in such assemblies. The cooling system may include a fluid-cooled winding heat sink element or “finger,” which may be a thermally conductive bar (e.g., aluminum, copper) having microchannels therein positioned between the core and windings of a transformer or between turns of the windings of a transformer. Fluid passes through the microchannels of the heat sink element to provide direct cooling to the heat generating windings of the transformers. The heat sink element may be produced by an additive manufacturing technology.

The invention relates to heat dissipation devices and discloses an enhanced heat dissipation device with pulsating flows and wavy-wall microchannels adopted. The device comprises a microchannel heat dissipation cold plate, a pulsating pump, a cooler, a liquid working medium injection pipeline and a liquid working medium return pipeline, wherein the liquid working medium injection pipeline and the liquid working medium return pipeline are used for connecting the microchannel heat dissipation cold plate, the pulsating pump and the cooler together, the microchannel heat dissipation cold plate is a rectangular thin plate and is composed of a microchannel heat sink and a microchannel heat sink cover plate, communicated liquid cavities are formed in the periphery of the microchannel heat sink, the part surrounded by the liquid cavities is divided into four equal parts by two perpendicular liquid division cavities located on the axis of symmetry of the rectangular thin plate, wavy-wall microchannels are distributed all over each equal part in the diagonal direction of the rectangular thin plate, four liquid working medium outlets are formed in the microchannel heat sink cover plate and connected with the liquid working medium return pipeline, and a liquid working medium inlet is formed in the microchannel heat sink cover plate and is connected with the liquid working medium injection pipeline. According to the device, the liquid working medium flowing path is fully optimized, and heat exchange efficiency is improved greatly.

A cooling system for light emitting diodes (LEDs) is provided that may comprise acoustic baffle members, a micro-channel heatsink that includes fins adjacent to the LEDs, and a fluid flow generator adjacent to the micro-channel heatsink that directs a fluid in a flow direction. The fluid flow generator may include an input to receive the fluid and an exit to exhaust the fluid, which may contact a surface area of the fins. The sound emitted by the fluid flow generator may be substantially cancelled by the acoustic baffle members, which may reflect the sound to a source location as reflected sound waves defined by a substantially inverted phase.

The invention discloses a steady-state method-based heat conductivity coefficient measurement device, and belongs to the technical field of physical performance tests of materials. The steady-state method-based heat conductivity coefficient measurement device comprises a main heater, an upper standard test piece, a lower standard test piece, a to-be-measured test piece holding cavity, a heat preservation layer, an upper shell, a lower shell, a heat insulation ring arranged between the upper shell and the lower shell, electric heating wires connected with a temperature compensation regulator, heating devices for thermocouple groups arranged in the upper standard test piece, the lower standard test piece and the heat preservation layer, a micro-channel cooling device, a temperature acquisition device, and a processing controller, and a pressurizing and fixing frame which consists of an upright post, a bottom plate, a lever and a weight, wherein the middle part of the lever is provided with a pressure rod. According to the steady-state method-based heat conductivity coefficient measurement device, an integrated heating device is used, meanwhile, the electric heating wires connected with the temperature compensation regulator are additionally arranged on the upper shell and the lower shell, and the main heater and the micro-channel cooling device are respectively arranged on the bottom and the top, so that the device has the characteristics that the measurement precision of a heat conductivity coefficient measurement is high, the consistency of repeated measurement and results is high, the stability is high, the measurement range is wide, the measurement can be performed under different heating conditions, and the like.

The invention relates to a micro-channel radiator, belongs to the technical field of the radiator, and discloses a micro-channel radiator with disturbed flow structures in horizontal and vertical directions; the micro-channel radiator is characterized in that disturbed flow structures are arranged on three or four wall surfaces in the micro-channel radiator; the disturbed flow structure on the upper wall surface and the disturbed flow structure on the lower wall surface are arranged in a staggered manner to play a heat dissipation intensifying effect in the vertical direction; the disturbed flow structure on the left wall surface and the disturbed flow structure on the right wall surface are arranged in a staggered manner to play a heat dissipation intensifying effect in the horizontal direction; the disturbed flow structure on the upper wall surface and one of the disturbed flow structures on the left wall surface or the right wall surfaces can be mutually spliced on the same verticalsurface; and the disturbed flow structure on the lower wall surface and one of the disturbed flow structures on the left wall surface or the right wall surfaces can be mutually spliced on the same vertical surface. By virtue of the micro-channel radiator, the convection and heat transfer effects can be intensified synchronously in the horizontal and vertical directions, so that fluid temperatureuniformity and speed uniformity in the micro-channel can be improved, and the heat dissipation effect of the radiator can be intensified.

The invention provides a micro-channel radiator for dissipating heat of a power electronic device. The micro-channel radiator comprises an upper-layer cover board, a radiator outer wall, an internal flow channel structure, a heat dissipation working medium, a working medium inlet and a working medium outlet. The upper-layer cover board is connected a chip with heat to be dissipated, and the upper-layer cover board is in contact with the internal flow channel structure. Heat of the chip with heat to be dissipated is transmitted into the heat dissipation working medium through the upper-layer cover board and the internal flow channel structure and brought out through the heat dissipation working medium. The working medium outlet is formed in the inner side of the outer wall of the radiator. The working medium inlet is formed in the side, away from the position of the working medium outlet, of an eccentric position. According to the micro-channel radiator for dissipating heat of the power electronic device, the fresh heat dissipation working medium which has the lowest temperature is led into the radiator from the center area of a heat dissipation face which has the highest temperature, improvement of the heat exchange efficiency of the radiator is facilitated, the micro-channel radiator is constructed with selected metal materials with a high heat conduction rate, the heat dissipation efficiency is high, in addition, the manufacturing technology is mature, and the micro-channel radiator is easy to achieve.

The invention discloses a lotus-type regular porous metal microchannel heat sink using a liquid metal working medium for an electronic component with high heating flux or a semiconductor laser, and belongs to a heat-dissipation device of a microelectronic device. The lotus-type regular porous metal microchannel heat sink solves the problems that inlet and outlet pressure drop is high, a structure is complicated, the processing is difficult, and the cost is high in the existing microchannel heat sink, and an excellent heat-dissipation effect can be obtained. The lotus-type regular porous metal microchannel heat sink is characterized in that a microchannel module 3, a micro pump 6 and a far-end heat-dissipation device 7 are connected by pipelines to form a closed circuit, wherein the core of the microchannel module is a porous material formed in a manner that cylindrical air holes obtained by a metal-gas eutectic directional solidification method are directionally arranged in a metal matrix, and the liquid working medium is low-melting-point liquid metal or an alloy. The lotus-type regular porous metal microchannel heat sink is simple in structure, simple and convenient in manufacturing technology, convenient to mount, small in inlet and outlet pressure drop, and high in heat-dissipation efficiency, and is suitable for the electronic component with the high heating flux or a laser diode arrayed heat-dissipation device.

The invention relates to a flow-dividing annular micro-channel radiator, which is mainly composed of a circular micro-rib plate, a circular flow dividing structure and a cover plate. The special flowdividing structure of the radiator is formed by annular micro-channels on the micro-rib plate and flow dividing channels on the flow dividing structure. The diameter of the circular flow dividing structure is less than that of the circular micro-rib plate, and an annular channel formed by the circular flow dividing structure and the circular micro-rib plate serve as a primary flow dividing channel, thereby effectively solving a problem of uneven primary flow dividing caused by a stagnation effect of a cooling working medium at the tail end of the flow dividing channel. Secondary flow dividingchannels are of a gradually shrinking structure, which can also weaken the influences of fluid stagnation inside the flow dividing channel and increase the uniformity of flow distribution between overflowing channels. The flow-dividing annular micro-channel radiator further improves the problem of nonuniform flow distribution on the basis of reserving advantages of the micro-channel flow dividingstructure, and has high heat exchange capacity and heat exchange limit. The flow-dividing annular micro-channel radiator is compact in structure and good in heat exchange capacity, and has excellent application prospects in the aspect of cooling for high heating equipment such as electronic chips, lasers and rectifiers.

A complex heat pipe controller, making method and application consisting of the heat conductive controller and heating controller, which contains single substance or composite working medium, normal and/or closed cavity with changed and/or same section, the cavity can have only one closed loop, integral and/or auxiliary fins. Said invention also provides heat pipe heat column controller, complex heat pipe air cooling controller, complex heat pipe liquid cooling controller, complex heat pipe micro channel radiator, complex heat pipe fog jetting controller, complex heat pipe phase change material controller, and complex heat pipe controller with low cost, high reliability, high quality and long service life.

The invention discloses a microchannel heat radiator. A microchannel and a shunting network are arranged in the microchannel heat radiator, a surface is provided with a liquid inlet and a liquid outlet, and an external surface of the microchannel is provided with a metal layer. According to the microchannel heat radiator provided by the invention, the surface of the microchannel heat radiator is provided with the metal layer, thus, a grounding requirement of a high-frequency system is satisfied well, arranging a deep TSV hole on the microchannel heat radiator is also avoided, processing difficulty and manufacturing cost of the microchannel heat radiator are reduced, and reliability of integration density of a circuit and reliability of a structure are guaranteed; with the metal layer, upper and lower surfaces of the microchannel heat radiator provided by the invention are flat and have no cavity, so, a plurality of high heat-flux density chips can be integrated on the surfaces of the microchannel heat radiator, and the circuits can be designed flexibly under the premise of guaranteeing heat dissipation performance of products.

A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins extend radially inwardly a second length from an outer periphery and extend axially a second height from the top surface of the base. A confining plate extends radially above the fins and is spaced below the bottom surface of the lid whereby coolant fluid flows from an inlet opening of the lid through the center opening of the confining plate and radially outwardly through the fins and upward around the outer edge of the confining plate and into the space above the confining plate to an outlet opening. A nozzle having a throat is disposed above the lid and extends below the lid to the confining plate. A flow diverter extends upwardly from the top surface of the base and into and through the throat of the nozzle.

The invention discloses a radiating system. The radiating system comprises a microchannel heat-sink system, a micropump device, a power supplying system and a power supply device, wherein the microchannel heat-sink system is used for contacting with a heating part to cool the heating part; the micropump device is connected with the pipeline of the radiating system to consume the electric power provided by the power supply device to provide a circulating power for working fluid in the radiating system; the power supplying system generates additional electric energy by using the afterheat of the working fluid to supply the micropump device; and the power supply device is provided with an additional power supply and a power supply merged by the power supplying system so as to merge the electric energy generated by the power supplying system into the additional power supply and supply power for the micropump device jointly through a series circuit. The radiating device of the radiating system has the advantages of high heat exchange intensity and adaptive characteristic and is applied to the heating parts with small size and high heat-flow density, such as electronic devices, laser devices and the like.

A micro-channel heat sink comprises an upper cover layer and a cooling layer. The cooling layer comprises at least one inlet fluid tank, a plurality of micro-channels, and at least one outlet fluid tank. The inlet fluid tank can store and deliver the working fluids, and the outlet fluid tank collects the heated working fluid flowing through the plurality of micro-channels. The plurality of micro-channels are disposed between the inlet fluid tank and the outlet fluid tank, wherein the cross sectional area of each of the micro-channels increases along the direction towards the outlet fluid tank.