Micro-channel radiator for dissipating heat of power electronic device

Abstract

The invention provides a micro-channel radiator for dissipating heat of a power electronic device. The micro-channel radiator comprises an upper-layer cover board, a radiator outer wall, an internal flow channel structure, a heat dissipation working medium, a working medium inlet and a working medium outlet. The upper-layer cover board is connected a chip with heat to be dissipated, and the upper-layer cover board is in contact with the internal flow channel structure. Heat of the chip with heat to be dissipated is transmitted into the heat dissipation working medium through the upper-layer cover board and the internal flow channel structure and brought out through the heat dissipation working medium. The working medium outlet is formed in the inner side of the outer wall of the radiator. The working medium inlet is formed in the side, away from the position of the working medium outlet, of an eccentric position. According to the micro-channel radiator for dissipating heat of the power electronic device, the fresh heat dissipation working medium which has the lowest temperature is led into the radiator from the center area of a heat dissipation face which has the highest temperature, improvement of the heat exchange efficiency of the radiator is facilitated, the micro-channel radiator is constructed with selected metal materials with a high heat conduction rate, the heat dissipation efficiency is high, in addition, the manufacturing technology is mature, and the micro-channel radiator is easy to achieve.

Description

technical field [0001] The invention relates to the fields of power device heat dissipation technology and high-efficiency heat exchange technology, in particular to a microchannel heat sink for power electronic device heat dissipation. Background technique [0002] With the rapid development of technology, the high density and miniaturization of electronic devices has become a trend. Especially for high-power devices, heat dissipation has become an urgent problem to be solved. Due to the miniaturization of devices, the miniaturization of radiators has also become a trend. Microchannels are favored due to their high surface-to-volume ratio and excellent heat dissipation properties. [0003] Existing microchannel heat sinks generally use one side to lead in and the other side to lead out in a circular way. There is a common law that the temperature distribution of the chip rises gradually along the flow direction of the cooling medium, which does not correspond to the distrib...

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Problems solved by technology

[0004] After searching the prior art, it was found that R.H.W.Pijnenburg et al. designed a parallel micro-channel cooling in silicon in the article "Integrated micro-channel cooling in silicon" published in Solid-State Device Research conference, 2004.ESSDERC2004.Proceeding of the34th European, 129-132. Multiple micro-channels are arranged, but there is still the problem of uneven temperature distribution. The position distribution of the inlet does not match the distribution of the heat source, and the uneven temperature distribution is not conducive to the stable operation of the chip.

[0005] Dorin Lelea designed a multi-inlet structure in the article "The tangential micro-heat sink with multiple fluid inlets" published in International Communications in Heat and Mass Transfer39(2012) 190–195, although multi-inlets and multi-outlets are beneficial to fluid working fluids Discharge as soon as possible and is conducive to the uniform distribution of temperature, but multi-inlet and multi-outlet are not easy to achieve in micro-machining technology, the author did not give a complete micro-radiator structure design in the article, and did not make the corresponding radiator entity, so There is no guiding significance in process realization

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