7408 results about "Heat spreader" patented technology

The invention relates to the technical field of data processing, and provides a multi-mode water-cooling heat dissipation system and method.The thermal load urgency degree is generated by obtaining the temperature change rate and the thermal power density of a component in real time, the running state of the component is monitored, and a user scene identifier is output; comparing the temperature difference value of the cooling liquid at the inlet and outlet of the radiator with the cooling liquid flow to estimate the instantaneous heat dissipating capacity; predicting a temperature change track based on the thermal load urgency degree and the user scene identifier, calibrating the temperature change track in combination with the instantaneous heat dissipation amount, determining a candidate mode set and an optimization weight through the user scene identifier, and selecting a target heat dissipation mode; temperature distribution of different areas of the radiator is obtained according to the target heat dissipation mode so as to distribute the target rotating speed of the fan, respond to the local high heat load, control the multi-way valve to dynamically adjust the topological structure of the cooling liquid flowing path and distribute the cooling liquid flow, and deep cooperation of the fan and the cooling liquid is achieved.

The invention discloses a liquid cooling radiator cooling liquid leakage detection method and system, and relates to the technical field of equipment detection, and the method comprises the steps: obtaining the pressure reading of pressure measurement equipment; according to the pressure reading, the pressure change rate is calculated through differential operation; identifying a starting time point of a leakage event according to the pressure change rate; calculating an inherent response delay of the pressure measurement device; compensating the occurrence time sequence of the leakage event according to the inherent response delay to obtain a compensation time sequence; according to the starting time point and the compensation time sequence, the target leakage point position is determined, cooling liquid leakage detection is achieved, and accuracy is improved.

The invention provides a packaging structure and a packaging method. The package structure includes a substrate, a wafer disposed on the substrate and having a backside surface remote from the substrate, a heat sink disposed over the substrate and having a surface facing the backside surface, and a thermal interface material disposed between the wafer and the heat sink, wherein there is no organic adhesive between the wafer and the heat sink.

Provided are an integrated energy storage unit, an energy storage-power expansion pack, and an energy storage device. The integrated energy storage unit includes an integrated unit case and a first firefighting module. The integrated unit case includes a first battery box housing and a heat sink housing that are detachably connected to each other. A first battery module is fixed in the first battery box housing. An inverter circuit board is fixed in the heat sink housing. The inverter circuit board is configured for a conversion between an alternating current and a direct current and heat dissipation to an exterior environment through the heat sink housing. The first firefighting module is disposed in the integrated unit case. The first firefighting module includes a trigger mechanism, a fire-extinguishing agent storage compartment, and a release mechanism. The trigger mechanism is disposed in a firefighting detection region in the integrated unit case and configured to generate a trigger signal when a firefighting trigger condition in the firefighting detection region is met. The fire-extinguishing agent storage compartment is configured to store a fire extinguishing agent. The release mechanism is configured to, in response to the trigger signal from the trigger mechanism, release the fire extinguishing agent into a chamber where the first battery module is located.

The utility model discloses a laser with an expandable pumping source and portable laser processing equipment, and belongs to the technical field of lasers. Comprising at least one pumping source module, and the pumping source module comprises at least one pumping source body and a heat dissipation assembly; the heat dissipation assembly comprises a heat dissipation device and a heat dissipation base, the heat dissipation base is connected to one side, in the first direction, of the heat dissipation device, and the pumping source body is detachably arranged on the other side, in the first direction, of the heat dissipation base; according to the laser with the expandable pumping source, a corresponding number of pumping source modules can be matched according to the requirements of the laser with the expandable pumping source, so that the pumping source expansion of the laser is realized, and the corresponding pumping source body is cooled through the cooling assembly in the corresponding pumping source module, so that the cooling effect of the laser with the expandable pumping source is ensured, and the service life of the laser is prolonged. Meanwhile, due to the modular arrangement of the pumping source and the heat dissipation assembly, the reusability and adaptability of the pumping source module are improved, and the design and manufacturing cost is reduced.

The invention relates to the technical field of heat dissipation performance testing, and discloses a heat dissipation performance testing system of a water-cooling radiator and a testing method of the heat dissipation performance testing system. The method comprises the steps that real-time temperature distribution data of a CPU, a DIMM and a GPU in a supercomputing server under a preset load are collected, and meanwhile the inlet temperature, the outlet temperature and flow parameters of cooling liquid of the integrated liquid cooling radiator are recorded. A three-dimensional heat conduction field model is constructed based on the data, and a local heat exchange coefficient matrix between the surface of each chip and the cooling liquid is obtained through calculation. And inputting the matrix into a fluid dynamic simulation network, and generating a turbulence intensity distribution diagram of the flowing state of the cooling liquid in the cold plate by combining a viscosity change curve of the cooling liquid and micro-channel structure parameters of the cold plate. Dividing a heat dissipation performance evaluation area according to the distribution diagram, and extracting cooling liquid flow velocity fluctuation characteristics for an area with turbulence intensity higher than a first threshold value; and marking the defect coordinates of the micro-channel structure for the region with the turbulence intensity lower than a second threshold value.

An electric vehicle including a frame; at least one ground-engaging member operatively connected to the frame; an electric motor operatively connected to the at least one ground-engaging member; an electric powerpack supported by the frame, the powerpack including: a battery pack defining a battery cooling channel; and a plurality of battery cells housed in the battery housing; a charger defining a charger cooling channel; an inverter including an inverter cooling channel, the battery cooling channel, the charger cooling channel, and the inverter cooling channel being fluidly connected together by rigid fluid connections; radiators fluidly connected to the battery cooling channel; a cooling circuit being formed at least in part by the battery cooling channel, the charger cooling channel, the inverter cooling channel, and the at least one radiator; and a pump fluidly connected to the cooling circuit for pumping liquid coolant through the cooling circuit.

The invention relates to the field of thermal flow guide path optimization, and discloses an electronic communication equipment heat dissipation method based on thermal flow guide path optimization, which comprises the following steps: arranging a plurality of thermal paths between a chip and a radiator, combining the thermal paths into a network structure in parallel and series modes, and constructing a selectable thermal flow path network structure; collecting real-time temperature and load data of each module, and constructing a multi-dimensional thermal state database in combination with historical operation records and environmental parameters; thermal resistance and module temperature of each thermal path are analyzed, priority is set according to module types and power loads, key modules correspond to specific thermal flow paths, non-key modules distribute thermal flow through remaining paths, and a thermal flow planning scheme is generated; the thermal resistance of each path is adjusted through the phase change material, and a target thermal resistance value is generated; in the chip operation process, the temperature, load and thermal resistance state of each thermal path are continuously collected, and a thermal resistance adjusting instruction is generated; the method has the advantage that the thermal management efficiency and the temperature control precision are improved.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

The invention relates to the technical field of transformers, in particular to a power electronic transformer with a shielding structure, which mainly comprises a transformer body, a radiator is fixedly mounted on the side surface of the transformer body, a cooling fan is fixedly mounted at the end part of the radiator, and a weak current box is fixedly mounted at the end part of the transformer body. Double oil mist separation is achieved through the deoiler, one is that spiral ascending airflow is formed through guiding of the jet pipe, oil mist in gas is removed according to the centrifugal demisting principle, and the other is that residual oil mist in the gas is secondarily intercepted through the filter element pipe, so that the oil mist in respiratory airflow can be effectively removed, the oil mist interception efficiency is remarkably improved, and the oil mist separation efficiency is greatly improved. Meanwhile, the elastic membrane of the buffer can absorb sudden pressure change of the oil conservator through elastic deformation, so that the pressure fluctuation amplitude is reduced when the load changes suddenly, pulverization or structural damage of the drying agent caused by strong airflow impact is avoided, it is ensured that the moisture absorption drying agent is always in a clean and stable working environment, and the efficient dehumidification capacity is maintained.

The invention relates to the technical field of aviation electromechanics, in particular to an electric ducted fan of an integrated heat dissipation structure and an aircraft. An electric ducted fan of an integrated heat dissipation structure comprises a main duct unit, a static blade unit, a movable blade unit, a motor, a heat dissipation duct unit and a heat dissipation unit. The main duct unit comprises a main duct wall; a main duct channel is arranged in the main duct wall; the stationary blade unit comprises stationary blades; the movable blade unit comprises movable blades; each heat dissipation duct unit comprises a heat dissipation duct wall; the heat dissipation duct wall is annular; a heat dissipation duct channel is formed in the heat dissipation duct wall; the radiating unit comprises a radiator; a cooling liquid flow channel and an air flow channel are arranged in the radiator; the cooling liquid flow channel is used for conducting heat of the battery; the air flow channel penetrates through the radiator in the axial direction of the heat dissipation duct channel. Therefore, the problem that the heat dissipation efficiency and the flight performance of the battery in the aircraft are difficult to consider at the same time is solved.

The invention relates to the technical field of optical communication, in particular to an optical module cooling system which comprises a switch shell, a PCB, a socket, a radiator and a lifter, and the PCB, the socket, the radiator and the lifter are arranged in the switch shell. A cage is arranged in the switch shell; the PCB is arranged at the bottom end of the cage; the socket is arranged in the cage and is connected with the PCB; an opening is formed in the top end of the cage; the lifter is connected with the radiator so as to drive the radiator to vertically pass through the opening; and a heat-conducting silicone grease layer is arranged on the bottom surface of the radiator. The radiator is not in direct contact with the optical module, the heat-conducting silicone grease layer is filled between the radiator and the optical module, the radiator is in hard contact with the shell of the optical module through the heat-conducting silicone grease layer, a gap between abutting faces is effectively eliminated or reduced, air reserved in the gap is reduced, and therefore heat resistance between the radiator and the shell of the optical module is reduced, and the service life of the optical module is prolonged. And the heat exchange efficiency is improved.

The utility model relates to the technical field of heat dissipation, and discloses a chip dual heat dissipation structure. The chip double-heat-dissipation structure comprises a vapor chamber which is used for being packaged on a chip and conducting heat of the chip, a middle frame is packaged on the top face of the vapor chamber, an upper cover is packaged on the middle frame, and a water inlet and a water outlet are formed in the left side and the right side of the top face of the upper cover. A plurality of integrally-formed heat dissipation fins are arranged on the bottom face of the upper cover, the bottoms of the heat dissipation fins abut against the top face of the vapor chamber, and a plurality of flow channels used for circulation of cooling liquid are formed among the heat dissipation fins. According to the dual-heat-dissipation structure of the chip, the heat of the vapor chamber is dissipated through the heat dissipation fins packaged on the vapor chamber and the cooling liquid circulating on the top cover, so that the heat absorbed by the vapor chamber can be transferred out at the first time, and the heat dissipation effect of the vapor chamber on the chip is improved.

The invention relates to an electric engine, a power device and an aircraft, and belongs to the technical field of aircraft power equipment.The electric engine comprises a power motor and a liquid cooling flow path arranged in the power motor and comprises a stator support; the heat dissipation system comprises a fan, a radiator and a heat dissipation motor, an outlet of the radiator is connected with an inlet of the liquid cooling flow path, an inlet of the radiator is communicated with an outlet of the liquid cooling flow path, and the fan is used for cooling the radiator and / or the power motor; the motor rear cover is fixedly connected with the stator bracket; and the two direct-current converters are both mounted on the motor rear cover and are both electrically connected with the heat dissipation motor. The two direct-current converters convert high-voltage direct current accessed by the electric engine into low-voltage direct current capable of being used by the heat dissipation motor, and the electricity utilization requirement of the heat dissipation motor is met. Due to the redundancy design of the two direct-current converters, when one path of low-voltage power supply breaks down, the other path of low-voltage power supply can still supply power to the heat dissipation motor in a low-voltage mode, and enough fault handling time can be provided for the whole power supply system.

The invention relates to the technical field of radiator monitoring, and particularly discloses a radiator heat dissipation performance dynamic test system, which is characterized in that a heat source simulation body is arranged on a heat transfer interface of a radiator, and a high-fidelity dynamic electric power load is applied to the heat source simulation body to simulate an actual working condition; radiating a microwave detection signal to a space where the heat source simulator is located and receiving a multi-path scattering response signal; the three-dimensional dielectric constant dynamic distribution of the heat source simulation body is reconstructed by solving the inverse scattering problem fused with the space-time constraint; according to the material dielectric constant-temperature relation mapping, three-dimensional temperature field dynamic distribution is generated; and finally, intelligently identifying and extracting a migration track and a temperature change curve of the highest temperature point in the space from the continuous time sequence temperature field data, and taking the migration track and the temperature change curve as a direct evaluation basis for the dynamic heat dissipation performance of the radiator. According to the method, lossless, full-field, real-time visualization and quantitative analysis of the migration process of the dynamic hot spots in the hidden heat source are realized, and the authenticity of the dynamic heat test is improved.

The invention relates to an electric propulsion heat dissipation system, a power device and an aircraft, and relates to the technical field of aircrafts. The electric propulsion cooling system comprises propellers, arms, power motors and radiators, the electric propulsion cooling system is fixedly connected to an aircraft body structure of the aircraft through the arms, the propellers are arranged at the output ends of the power motors, and the power motors are installed on the arms and can drive the propellers to rotate around the axes of the power motors. The radiator dissipates heat of the power motor through cooling liquid circulation, the vehicle arms are provided with heat dissipation grooves and air outlets, the radiator is installed in the heat dissipation grooves, and orthographic projections of blades of the propeller on the corresponding surfaces of the vehicle arms at least partially cover the radiator, so that airflow generated by the propeller can penetrate through the radiator and then enter the external space through the air outlets. According to the electric propulsion heat dissipation system, the power device and the aircraft, the problem that the lightweight design of the aircraft is affected due to the fact that a current cooling system is large in size and weight is solved.

The invention discloses a self-closed-loop microsystem air cooling heat dissipation structure based on a micropump. The self-closed-loop microsystem air cooling heat dissipation structure comprises a microchannel radiator, the micropump, a fan combination, a temperature measurement optical fiber, a control module, cooling liquid and the like. According to the invention, a heat dissipation mode of combining liquid cooling internal circulation with air cooling external circulation is adopted, the air cooling heat dissipation problem of the high-heat-flux power chip is converted into a conventional air cooling heat dissipation problem, and the air cooling heat dissipation problem of the high-heat-flux power chip in the current engineering is solved; liquid cooling internal circulation is physically isolated from the external environment, so that the risk that impurities block a flow channel in secondary heat exchange equipment is avoided, and the reliability of the equipment is improved; the micro-channel radiator adopts a three-dimensional flow channel, the size is greatly reduced, and the tree-shaped distribution network and the micro-channel heat sink are combined, so that the heat exchange capacity is improved; and a self-adaptive temperature control measure based on temperature feedback is adopted, so that the power chip works in a proper temperature range, the performance and reliability of equipment are improved, and the service life of the equipment is prolonged.

The invention relates to the technical field of gear boxes, and discloses an efficient heat dissipation gear box with a built-in magnetic fluid cooling channel, which comprises a reduction gear box, an input shaft, an output shaft, a transmission gear and a planet carrier, the magnetofluid cooling assembly comprises an annular cooling pipe filled with magnetofluid, a radiator and two sets of connecting frames, the cooling pipe is partially arranged in the reduction gear box, and the other part of the cooling pipe penetrates through the reduction gear box and extends to the outside. The radiator is fixedly arranged on the outer side of the reduction gear box to radiate the other part of the cooling pipe, the connecting frame is in transmission connection with the input shaft or the output shaft, and a permanent magnet is fixedly arranged at the outer end of the connecting frame. By means of the built-in magnetofluid cooling assembly, the permanent magnet is driven to rotate by means of the input shaft or the output shaft, magnetofluid is driven to circularly absorb heat and radiate heat through the radiator, extra power is not needed, heat transfer is fast, and no cooling dead angle exists.

The invention relates to the technical field of computer vision, and particularly discloses a copper radiator surface defect detection system based on machine vision. The system comprises a high-resolution three-dimensional image acquisition module, a point cloud preprocessing and feature enhancement module, a multi-scale defect segmentation module, a three-dimensional shape quantitative analysis module and a decision fusion and output module, and a multi-dimensional geometric feature map is generated by synchronously acquiring two-dimensional texture and three-dimensional point cloud data; and multi-scale defect segmentation and morphological deviation quantitative analysis are realized by adopting a cascade network, and finally, the type, position and grade of the defect are output by fusing the category probability and morphological parameters, so that the precision and robustness of three-dimensional defect detection are remarkably improved.

The invention belongs to the field of power equipment boxes, and particularly relates to a power equipment box with an efficient heat dissipation function, and the power equipment box comprises a power equipment box body, a metal column, a communication pipeline, a mounting plate, a communication assembly, a control assembly and a water-cooling radiator, and the control assembly comprises a controller, a mounting sleeve plate and a temperature sensor. The controller is installed on the outer wall of the power equipment box body, the installation sleeve plate is fixedly connected to the inner wall of the metal column, and the temperature sensor is installed on the inner wall of the installation sleeve plate. According to the structure of the aluminum alloy metal columns arranged in the matrix mode and the outer wall arc-shaped cooling fins, the metal columns can accurately correspond to core heating components in the box to efficiently absorb heat, the heat exchange area between the cooling fins and air is greatly expanded, the passive heat dissipation capacity is enhanced, meanwhile, cold water in the metal columns can store heat, the water temperature rising speed is delayed, and the heat dissipation efficiency is improved. The problems that in a traditional heat dissipation mode, correspondence between a metal heat dissipation part and a heating source is poor, the heat exchange area is limited, and the heat dissipation efficiency is low due to the fact that heat is absorbed only through a single medium are solved.

The invention discloses a chip packaging module structure and an electronic product, and relates to the technical field of chip packaging, the chip packaging module structure comprises a PCB, an insulating substrate, a first radiator and a second radiator; the insulation substrate is arranged on the PCB, the insulation substrate is provided with a first side and a second side, the insulation substrate is provided with a first chip in an integrated mode, the first chip is located on the second side of the insulation substrate, the insulation substrate is provided with a plurality of via holes penetrating through the first side and the second side, metal is arranged in each via hole, at least part of the via holes are conductive holes, and the first chip is arranged on the first side of the insulation substrate. The metal in the conductive hole is used as a part of an electric connection structure between the PCB and the plurality of chips; the first radiator is in thermal conduction connection with the first chip; the second radiator is arranged on the other side of the PCB, and a longitudinal heat conduction structure is formed between the second radiator and the first chip, so that the second radiator is in heat conduction connection with the first chip; the technical scheme provided by the invention aims to improve the heat dissipation efficiency.

The invention relates to the technical field of new energy automobile thermal management, and belongs to an R290 super integrated finished automobile thermal management system for a new energy automobile, the R290 thermal management system is adopted, the R290 thermal management system has excellent thermal characteristics and high low-temperature heating capacity, attenuation of low-temperature endurance mileage is reduced, energy consumption is reduced, and cost is reduced; according to the invention, the refrigerant loop is optimized, so that the filling amount of the refrigerant is minimized, and the system safety is ensured; furthermore, a heat regenerator is additionally arranged behind the system water-water heat exchanger, the supercooling section of the system can be guaranteed, the air suction superheat degree of the compressor is guaranteed, the system performance is optimized, and the service life of the compressor is prolonged. Waterways are integrated through the nine-way valve, the pipeline length used by the waterways is reduced, the use space of a cabin is increased, the pipeline cost of the waterways is saved, the low-temperature radiators are arranged in series, the situation that the heat dissipation capacity of one of the low-temperature radiators is affected due to conventional front-back arrangement is avoided, and the thermal management performance of the whole vehicle is optimized.

A lighting device assembly includes an optic assembly having a light source, a housing having a cavity in which the at least a portion of the optic assembly is received, the housing is configured to secure the lighting device assembly to a wall, a ceiling, or a surface, and a heat sink configured to couple the optic assembly to an opening of the housing that defines the cavity. The heat sink includes a hinged aiming mechanism configured to movably couple the optic assembly to the housing to allow the light source to move relative to the housing.

The invention relates to the technical field of vacuum brazing, and discloses a vacuum brazing method for a needle array radiator, which comprises the following steps of: fusing reference process parameters of a historical process knowledge base and multi-dimensional characteristic parameters of the needle array radiator to obtain brazing process characteristic parameters; performing process strategy matching on the needle array radiator to confirm a vacuum brazing strategy of the needle array radiator; a vacuum brazing strategy is applied, and a vacuum brazing furnace is driven to execute stage process operation of preheating degassing, brazing filler metal melting and spreading, diffusion bonding and controllable cooling; performing situation analysis on the real-time process data flow of the stage process operation to obtain deviation data; dynamic parameter reconstruction is conducted on the target brazing stage of the needle array radiator, and temperature regulation and control parameters and process logic parameters are obtained; the needle array radiator is subjected to circulating brazing control, and a post-welding component of the needle array radiator is obtained; the efficiency of the vacuum brazing method for the needle array radiator can be improved.

The embodiment of the application provides a kind of power conversion equipment, it is related to power electronics field.The power conversion equipment includes shell, circuit board, radiator and first heat exchanger, power cavity is formed in shell, heat dissipation cavity is formed outside shell, shell includes the partition between power cavity and heat dissipation cavity, opening is arranged on the partition, circuit board is arranged in power cavity and the side of opening has first power device;Radiator is arranged in heat dissipation cavity and includes first substrate and first heat dissipation part, first substrate is arranged at opening and is in contact with first power device, first substrate is provided with first gas-liquid passage, first heat dissipation part is provided with second gas-liquid passage communicated with first gas-liquid passage, and cooling working medium for gas-liquid conversion is arranged in first gas-liquid passage;First heat exchanger is located in power cavity or heat dissipation cavity.Through the above technical scheme, the device that can be targeted to heat seriously in power conversion equipment is cooled, so that power conversion equipment is stably operated.

The invention discloses a brazing tool and method for a plate-fin radiator. Comprising a lower stainless steel foil (2), a lower temperature measuring plate (3), a lower stainless steel plate (4), a lower process aluminum plate (5) and a lower perforated plate (6) which are sequentially laid on the bottom face of a radiator (1) to be brazed, and an upper stainless steel foil (7), an upper temperature measuring plate (8), an upper stainless steel plate (9), an upper process aluminum plate (10) and an upper perforated plate (11) which are sequentially laid on the top face of the radiator (1) to be brazed. And more than one through hole (12) is distributed on each of the upper perforated plate and the lower perforated plate. The problem that the heat capacity of a brazing tool, the brazing gap and the pressing force of the tool are in contradictory relation is fundamentally solved.

A liquid cooling device including a water cooling head, a heat dissipation module, and a two-phase cooling component. The water cooling head includes a base plate and a water cooling shell. An accommodating slot is defined on the water cooling shell. The heat dissipation module includes a heat sink set and a supporting plate. A perforation is defined on the heat sink set. The heat sink set is positioned on the water cooling head. The two-phase cooling component includes an evaporation section and a condensation section. The evaporation section is positioned in the accommodating slot, and the condensation section passes through the perforation. Therefore, the heat dissipation efficiency of the liquid cooling system is improved.

The invention relates to the technical field of MEMS radiator processing, in particular to a processing method of an MEMS radiator, which comprises the following steps of: 1, manufacturing an air inlet grid opening, a gas advection bin body, a vibration upper opening binding ring, a piezoelectric vibrator, a flexible circuit board, a vibrator amplification layer, a gas beam dense hole layer and an impact platform according to the size; 2, the flexible circuit board and the piezoelectric vibrator form a circuit piezoelectric vibrator through reflow soldering; 3, the air inlet advection bin body, the vibration upper opening binding ring, the circuit piezoelectric vibrator, the vibrator amplification layer, the air beam dense hole layer and the impact platform are assembled from top to bottom. According to the machining method of the MEMS radiator, firstly, solder paste is printed on a flexible circuit board steel mesh to lead welding spots, the flexible circuit board steel mesh and the piezoelectric vibrator are placed into a clamp together to be fixed, and then the flexible circuit board steel mesh is welded to the piezoelectric vibrator; the circuit piezoelectric vibrator prepared by the method is reliable and durable, and welding spots are not easy to fall off, so that the piezoelectric vibrator can have better stability in high-frequency vibration.

The invention relates to a heat transfer system (10) with a heat source (14) and a heat sink (50), wherein the heat source (14) has a heat discharge arrangement (34) for heat discharge from the heat source (14) by means of a working fluid (12), wherein within the heat discharge arrangement (34) the working fluid (12) can be thermally coupled or coupled to the heat source (14), and wherein by means of the working fluid (12) the heat source (14) can be thermally coupled or coupled to the heat sink (50).A high and defined heat transfer over a large operating temperature range can be achieved by the heat transfer arrangement (34) comprising at least two stages arranged parallel in terms of flow, a first stage (36) and a second stage (42), for heat transfer from the heat source (14) to the working fluid (12), wherein the stages (36, 42) are designed such that they have a different thermal resistance between the heat source (14) and the working fluid (12).

The invention discloses a power module. The power module comprises a direct current busbar, a radiator, an IGBT module I and an IGBT module II, the IGBT module I and the IGBT module II are respectively arranged on a mounting surface I and a mounting surface II of the radiator; the direct-current busbar comprises a direct-current busbar I, a direct-current busbar II, a direct-current busbar III and a direct-current busbar IV; the two ends of a fourth direct-current busbar are connected with the first IGBT module and the second IGBT module respectively, and the middle of the fourth direct-current busbar is connected with the middle of a third direct-current busbar. The two ends of the direct current busbar III are respectively connected with the direct current busbar I and the direct current busbar II; the direct current busbar I and the mounting surface I as well as the direct current busbar II and the mounting surface II are oppositely arranged and parallel to each other; the first direct current capacitor assembly is connected with the first direct current busbar, and the second direct current capacitor assembly is connected with the second direct current busbar. The influence of stray inductance is reduced by optimizing a current path, and the voltage spike at the switching moment is reduced due to the reduction of the stray inductance, so that the switching loss is reduced.