The invention relates to a
semiconductor packaging structure and a packaging method thereof, and belongs to the technical field of
semiconductor devices.The
semiconductor packaging structure comprises a substrate, a
chip, a radiator and a packaging shell, and further comprises an
alloy needle matrix arranged below the radiator and a heated self-deformation fin arranged between the upper surface of the
chip and the packaging shell; needle bodies of the
alloy needle matrixes penetrate through the through holes in the substrate, needle tips of the
alloy needle matrixes directly make contact with the back faces of the chips through the heat conduction springs, the heated self-deformation fins are unfolded through heating and abut against the top of the radiator, a double-channel vertical heat dissipation
system is constructed, heat conduction paths from the chips to the radiator are directly broken through, and the double paths work in parallel. It is ensured that heat is vertically transmitted to the radiator through the shortest path, loss of traditional transverse heat
diffusion is avoided, and the problems of
thermal resistance accumulation caused by series connection of multiple
layers of media, interface
shear stress and
micro cracks caused by mismatch of material
thermal expansion coefficients of an existing semiconductor packaging structure are solved. And the problems of heat dissipation path failure and local high temperature of the
chip caused thereby are solved.