151 results about "Thin film circuits" patented technology

An antenna device comprises a transparent substrate and a plurality of antenna units arranged on the transparent substrate. Each antenna unit comprises an antenna electrode, a grounding electrode, a thin film circuit structure, a redistribution structure and a wafer. The redistribution line comprises a digital signal connecting pad, an analog signal connecting pad, a radio frequency signal connecting pad and an antenna signal connecting pad. The wafer is bonded to the digital signal pads, the analog signal pads, the radio frequency signal pads and the antenna signal pads. The digital signal connecting pad and the analog signal connecting pad are arranged in the first joint area. The radio frequency signal connecting pad and the antenna signal connecting pad are arranged in the second bonding area.

The invention discloses a diamond on-chip integrated laser and a preparation method thereof, and relates to the technical field of integrated optics, and the on-chip integrated laser comprises a high-power semiconductor laser, a diamond substrate and a waveguide. Wherein the same diamond substrate is divided into a laser integration area and a waveguide integration area; the high-power semiconductor laser is integrated in the laser integration area of the diamond substrate through a thin film circuit; the waveguide is integrated in the waveguide integration area and comprises a waveguide material layer, diamond films are evenly plated on the upper portion and the lower portion of the waveguide material layer and the surfaces of the two sides, in non-laser coupling with the high-power semiconductor laser, of the waveguide material layer, and the end, not plated with the diamond films, of the waveguide material layer is aligned with a light outlet of the high-power semiconductor laser. According to the invention, the luminous efficiency of the integrated optical chip is improved, the thermal crosstalk problem of the chip is solved, and the stable output of the whole laser is ensured.

The utility model relates to an image reading machine which can integrate a picture or a drawn pattern with voice made aiming at a story which occurs in the picture or the drawn pattern or is worthy of being memorized, and carries a previous memory event. The photo album comprises a host box and a plurality of photo album pages recording photos of previous commemorative events or patterns drawn by individuals, and a main control circuit board with a voice recording module and a storage module and a voice player are arranged in the host box. A user stores voice instructions or voice annotations made for photos or patterns in the storage module through the voice recording module, and each photo album page is provided with a voice starting key electrically connected with the main control circuit board through a thin film circuit. After a user presses the voice starting key, the main control circuit board plays voice instructions or voice annotations which are stored in the storage module and correspond to the photo album page through the voice player. When a memory purchaser browses a certain album page, the memory purchaser can be fully aroused to the events recorded in the image data through visual sense and auditory sense.

The invention provides a two-dimensional resistive sensor array suitable for measurement in a high-temperature environment, and belongs to the technical field of sensors, the resistive sensor array comprises a substrate, an array circuit and an insulation protection layer, the array circuit comprises a front sensor array and a back terminal circuit, the front sensor array comprises a transverse wire, a longitudinal wire, a sensor unit and a node insulating layer, the sensor unit is a dual-electrode sensor, electrodes at the two ends of the sensor unit are connected with the transverse wire and the longitudinal wire respectively, the node insulating layer is used for insulating the crossed part of the transverse wire and the longitudinal wire, and the resistance type sensor array is a thick film or thin film circuit; the number of external connection ports can be greatly reduced while a large number of two-dimensional distribution physical parameter fields are measured, measurement under various high-temperature, high-pressure and high-vibration severe environments can be achieved through the manufacturing material and the packaging technology, and the influence caused by invasion of a measured object is reduced to the maximum extent.

The invention discloses a vacuum coating process suitable for an ultrathin film layer circuit board and a coating device thereof, and relates to the technical field of vacuum coating. Comprising the following steps: transferring a circuit board substrate to a vacuum chamber, inputting argon into the vacuum chamber, ionizing the argon into argon ions with positive charges, accelerating the argon ions with positive charges to move towards the surface of a target material with negative charges under the action of an electric field, and knocking out evaporated substance atoms or molecules on the surface of the target material. Positively charged argon ions bombard the surface of the target material after being accelerated by an electric field, so that molecules of an evaporation substance on the target material release high-energy particle flow with high kinetic energy, and the particles move along irregular paths in a plasma environment to effectively cover fine gaps, edges and three-dimensional surfaces of a complex structure of a circuit board, so that the surface of the target material is effectively protected. And the particles can quickly and uniformly form an ultrathin film layer on the surface of the circuit board, so that the probability of non-uniform film thickness distribution caused by vapor natural deposition film coating is reduced, and the film coating effect of the device is improved.

The present invention provides an ultrafast hydrogen response sensing structure based on an RC differential thin film circuit, belonging to the field of gas sensor technology. The structure comprises a thin film resistor hydrogen sensing unit, a voltage divider / heating thin film resistor, an RC differential thin film circuit, and four lead electrodes. The RC differential thin film circuit includes an RC differential thin film capacitor and an RC differential thin film resistor. The RC differential thin film capacitor comprises a first electrode, a dielectric layer, and a second electrode. The first lead electrode is connected to the first electrode via the voltage divider / heating thin film resistor; the second lead electrode is connected to the first electrode via the thin film resistor hydrogen sensing unit; the third lead electrode is a voltage output terminal connected to the second electrode; and the fourth lead electrode is connected to the second electrode via the RC differential thin film resistor. The present invention achieves rapid hydrogen response and concentration detection based on the peak occurrence time and peak value of the first-order derivative output curve, greatly improves the integration of the gas rapid response system, significantly reduces the system size and power consumption, and is suitable for scenarios with different hydrogen detection requirements.

The utility model discloses a key structure of a keyboard, which comprises a key cap 30, a bottom plate 50, an X-shaped support 40 arranged between the key cap 30 and the bottom plate 50, a layer of thin film circuit switch 10 arranged on the bottom plate 50, and a silica gel key 20 arranged between the key cap 30 and the thin film circuit switch 10, and the key cap 30 and the silica gel key 20 are of an integrally formed structure based on a bijection technology. According to the novel key structure, the technological process can be reduced in the keyboard key assembling process, and the product yield is effectively improved.

The utility model discloses automatic compounding equipment for a thin film circuit board. Comprising a first circuit diaphragm feeding device, a second circuit diaphragm feeding device, an insulating diaphragm feeding device, a first circuit diaphragm punching device, a second circuit diaphragm punching device, a second circuit diaphragm punching device, a third circuit diaphragm punching device, a fourth circuit diaphragm punching device, a fifth circuit diaphragm punching device, a sixth circuit diaphragm punching device, a fifth circuit diaphragm punching device and a sixth circuit diaphragm punching device, the hot melting platform is used for realizing hot melting compounding of the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm; the diaphragm carrying device is used for placing the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm on the hot melting platform in sequence; according to the utility model, the diaphragms are accurately punched with positioning holes based on a pattern recognition method, and then are accurately compounded, so that the accurate alignment and positioning of each layer of diaphragm are realized, the alignment precision of contacts on the upper and lower layers of circuit diaphragms is better, and the yield is improved.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

The application provides a multistage bandwidth regulation photodetector assembly, which comprises a first printed circuit board, a second printed circuit board, and a first printed circuit board electrically connected with the second printed circuit board; the second printed circuit board is printed with a first open loop circuit, and the first open loop circuit comprises at least one resistor which is connected in series; a third printed circuit board is electrically connected with the second printed circuit board; the third printed circuit board is printed with a second open loop circuit, and the second open loop circuit comprises at least one capacitor which is connected in series; a photodetector is arranged on the surface of the first printed circuit board and is electrically connected with the first open loop circuit and the second open loop circuit respectively; and a thin film circuit is arranged on the surface of the first printed circuit board and is electrically connected with the photodetector. The multistage bandwidth regulation photodetector assembly has a simple structure and stable circuit connection, and the resistance and capacitance of the assembly can be actively regulated, so that the bandwidth of the assembly can be autonomously regulated.

The application belongs to the technical field of display, and discloses a substrate structure, a forming method, a display panel and a substrate splicing layout structure. The substrate structure comprises at least one substrate unit, the substrate unit has a first side edge and two second side edges adjacent to and opposite to the first side edge, the first side edge is used to correspond to the direction of a chip on film circuit, and the second side edge is used to correspond to the direction of a gate driver on array circuit; the at least one substrate unit comprises a first substrate unit, the first substrate unit is provided with an alignment area and a wiring area, the alignment area is used to align an inner alignment part arranged on a mask plate, the wiring area is used to supply a common electrode line, the alignment area is arranged adjacent to one of the second side edges, and the wiring path of the wiring area is arranged to avoid the alignment area. In the application, the first substrate unit can be positioned in the GDL direction when splicing, so that the splicing is not limited by the direction, the wiring area is avoided in the first substrate unit, and it is ensured that the pixels can be normally displayed.

The present disclosure discloses a rubber dome with advanced conduction which includes a support portion, an elastic connection portion, and a pressing portion connected in sequence, the pressing portion having a columnar triggering portion at an axially inner side thereof. An axial end of the triggering portion is spaced at an axial distance b from an axially lower surface of the support portion, and an axial upper surface of the support portion is spaced at a distance h from the axially lower surface of the support portion, and b<h. The pressing portion is axially opened with a bowl-shaped groove extending to the triggering portion. The rubber dome provided by the present disclosure avoids the over-sensitivity phenomenon conventionally caused by lowering the triggering force of the thin film circuit switch by adjusting the conduction distance to make the triggering portion closer to the thin film circuit switch. By the bowl-shaped groove arrangement, it is possible to overcome the problem of large deformation force caused by simply extending the length of the triggering portion and the conduction point FP is advanced. Thus, the conduction efficiency, i.e., the conduction agility at the time of pressing is improved, and the conduction performance for corner pressing is also improved, so that the key reaction is more agile.

The utility model provides a kind of flexible film circuit board terminal size detection device based on vision module, including test bench, first light source being set on test bench, product placing plate being set in the upper of first light source, the light transmission hole is opened in the correspondence of product placing plate and first light source, the shape of the light transmission hole is adapted to the terminal shape of flexible film circuit board, second light source and vision detection device are further equipped in the upper of light transmission hole, the second light source, vision detection device are set in the just upper of light transmission hole by support, the first light source and second light source are the light of the positive and negative two sides of the flexible film circuit board terminal to be tested, provide detection light source for the vision detection device.The utility model has the beneficial effect that: effectively improve the accuracy of test.

The utility model discloses a welding device for a thin film circuit, which relates to the technical field of flexible circuit board welding and comprises a thin film circuit board, a plurality of welding spots are arranged at the top end of the thin film circuit board, and the rear end of each welding spot is respectively connected with a lead. The top of the rear end of the thin film circuit board is slidably connected with a welding auxiliary positioning support. The rear end of the welding auxiliary positioning support is slidably connected with a displacement support. The top end of the displacement bracket is fixedly connected with a driving cylinder; the front end of the driving cylinder is fixedly connected with a cylinder push plate; a transverse moving base is slidably connected to the top end of the welding auxiliary positioning support, and an LED mounting plate is mounted at the top of the front end of the film circuit board. Meanwhile, when the adjusting device is used, two different adjusting modes of coarse adjusting and fine adjusting are adopted, two different adjusting modes are achieved, the adjusting precision is higher, meanwhile, when an adjusting device in the prior art goes wrong, the adjusting device can assist in adjusting, and the adjusting device is practical and more convenient to use.

The invention provides a key structure. The key structure comprises a bottom plate, a thin film circuit, a key cap, a lifting assembly, a telescopic assembly and a dome switch. The thin film circuit is arranged on the bottom plate. The lifting assembly is arranged between the bottom plate and the key cap. The telescopic assembly is arranged between the thin film circuit and the key cap and comprises a first sleeve, a second sleeve, a first spring and a second spring. The first sleeve is slidably connected to the key cap, and the bottom of the first sleeve is provided with a lateral protrusion. The second sleeve is rotatably and slidably connected to the key cap and sleeves the first sleeve. A notch corresponding to the lateral protrusion is formed in the bottom of the second sleeve. The first spring is arranged in the first sleeve and is in contact with the first sleeve and the key cap; the second spring is arranged in the second sleeve and is in contact with the second sleeve and the key cap. The dome switch is integrated at the bottom of the first sleeve and contacts the thin film circuit.

The present invention discloses an electronic device and a manufacturing method thereof. The manufacturing method comprises: providing a substrate; forming a thin film circuit on the substrate, the thin film circuit comprising at least one thin film transistor and at least one conductive circuit; forming at least one first connection pad on the substrate, the first connection pad being electrically connected to the thin film transistor through the conductive circuit; arranging the substrate on a driving circuit board, the driving circuit board comprising at least one second connection pad, wherein the second connection pad is adjacent to the first connection pad and is arranged corresponding to the first connection pad; and forming a conductive member covering at least part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member.

The present invention discloses a miniaturized circulator, and relates to the technical field of electronic components. The present invention includes a dielectric substrate, a thin film circuit board, a copper plate, an alumina ceramic sheet, a yttrium iron garnet ferrite disc, and ST epoxy glue. The thin film circuit board is arranged on the top of the dielectric substrate, the copper plate is located on the top of the thin film circuit board, and the ferrite is located on the top of the copper plate. The preparation method of the miniaturized circulator includes the following steps: raw material selection, ferrite preparation, and circulator preparation. The present invention is a miniaturized circulator. The ST epoxy glue is used to bond the yttrium iron garnet ferrite disc to the alumina ceramic sheet, the copper plate to the thin film circuit board, and the ferrite to the copper plate. As the temperature rises, the viscosity between the various components of the circulator is normally distributed, which reflects the high temperature resistance of the ST epoxy glue, thereby improving the heat resistance of the circulator. The ferrite is prepared by the yttrium iron garnet ferrite disc and the alumina ceramic sheet, so that the circulator receiver is in a sensitive state.

1. The name of the design product: ceramic substrate appearance inspection machine. 2. The use of the design product: for the defect detection of the appearance of thick film / thin film circuit, IC carrier plate, HTCC / LTCC green ceramic sheet, etc. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1.

The application provides a laser polarization degree testing device applied to the technical field of detection, which comprises a thin film circuit, the surface of the thin film circuit is provided with an electrode contact point of a laser, a laser limiting device, the laser limiting device is provided with a clamping groove on a bearing surface, a conductive assembly, the conductive assembly is arranged on the laser limiting device close to the bearing surface, the conductive assembly comprises a support structure which can move up and down along a guide rail perpendicular to the bearing surface and at least two conductive contacts, the conductive contacts are fixed to the support structure and vertically correspond to the position of the electrode contact point, a rotating table, a through hole is formed in the rotating table shaft, a polarizer is fixedly arranged on the receiving surface of the rotating table, a photodiode, the photodiode is vertically arranged in the light output direction of the polarizer, the photosensitive surface of the photodiode is coaxial with the rotating table, and a controller, the controller is electrically connected with the conductive assembly, the rotating table and the photodiode through wires. The universality and operation convenience of the device can be enhanced.

The invention provides a water dental floss and a control method. The water dental floss comprises a machine body, a water tank, a battery, a water pump, a nozzle, a temperature sensor, a thick film heating assembly, a liquid guide pipeline, a top cover, a WIFI communication module, a gyroscope module, an infrared distance measurement module and a control system, an infrared sensor and a gyroscope are integrated on the top cover, so that an oral cavity area is positioned; the thick film heating assembly wraps the liquid guiding pipeline, is heated through a film circuit and is matched with the tail end temperature sensor to achieve closed-loop temperature control. Individualized water pressure, temperature and time requirements are collected through the mobile terminal and transmitted to the machine body through WIFI, the gyroscope and the infrared module recognize the area and call corresponding parameters, and accurate partition control is achieved. The problems that a traditional water dental floss is single in function and cannot be individually adapted to different gingival tolerance are solved, and the cleaning efficiency and the use comfort are improved.

The invention discloses a manufacturing method of an ultra-fine and ultra-thick gold film circuit, and relates to the technical field of PCBs, and the method comprises the following steps: S1, cleaning a substrate; s2, performing double-sided sputtering of a gold seed layer on the cleaned substrate to form a gold-plated sheet; s3, photoresist is sprayed on the gold-plated sheet in a photoresist spraying mode, and exposure and development are carried out; s4, carrying out stepped electroplating on the gold-plated sheet; s5, removing redundant metal regions on the front surface by using an etching means, and etching a cutting channel on the back surface; and S6, finally, cutting is conducted along the cutting channel, and a plurality of products can be obtained. According to the scheme, after thin gold is sputtered to serve as the seed layer, the photoresist pattern is manufactured on the gold-plated sheet in a glue spraying mode, and therefore the inductor product of the superfine and ultra-thick electrode with the line width meeting the requirement of 20 + / -3 microns and the gold layer thickness meeting the requirement of 10-12 microns is manufactured, and the manufactured film inductor series product can meet the high inductance value.

The utility model discloses a Ku frequency band 50W slide glass type power amplifier, which belongs to the technical field of microwave and millimeter wave and comprises two GaN power amplifier chips, an input thin film circuit, an output thin film circuit, four power resistance loads, four large chip capacitors, sixteen small chip capacitors, a slide glass and the like. The saturation output power of the GaN power amplifier chip is 45.5 dBm (namely 35W); the input film circuit is composed of an improved Gysel power divider and a power supply microstrip. The output thin film circuit is composed of an improved Gysel power combiner and a power supply microstrip. The power resistance load can bear a continuous wave signal with the power of 20W; the capacitance of the large chip is 1000pF, and the capacitance of the small chip is 100pF; all the components are soldered on a slide glass in an eutectic manner and are interconnected through a gold belt or a gold wire. The Ku frequency band 50W power amplifier module has the characteristics of small volume, light weight, good heat dissipation and simple structure, and solves the problems of large volume and heavy weight of the existing Ku frequency band 50W power amplifier module.

The application discloses a thin film circuit ceramic single-side grinding method and relates to the field of ceramic surface fine grinding processing technology, which comprises the following steps: step one, symmetrically attaching ceramic substrates with white films to a ceramic disc smeared with paraffin wax; step two, cooling and bonding the ceramic disc after the ceramic substrates are attached, pressing the ceramic substrates and the ceramic disc by using the white film-attached rubber pad, and uniformly extruding the hot-melt paraffin wax; step three, after the cooling is completed, taking out the ceramic disc, testing the paraffin wax-attaching thickness error, comparing the ceramic disc plane with zero, and then testing the substrate thickness by using the five-point testing method on the ceramic substrate to the set tolerance fluctuation range; step four, when the disc surface of the ceramic disc reaches the set flatness, grinding is carried out according to the set fixed interval time; step five, after the grinding is completed, the thickness is retested, if the thickness is qualified, the grinding is completed, if the thickness is unqualified, the substrate is turned over by 180 degrees, the grinding is continuously carried out for the same time, and the grinding is not stopped until the thickness is qualified. The application can avoid scratches on the ceramic substrate and reduce the breakage rate.

The utility model discloses a film circuit board with an anti-sulfuration function, which comprises an upper circuit layer, a lower circuit layer, a middle interlayer, an upper anti-sulfuration coating and a lower anti-sulfuration coating, and is characterized in that the upper anti-sulfuration coating made of anti-sulfuration materials hermetically covers an upper circuit on the lower side of the upper circuit layer; a lower anti-vulcanization coating made of an anti-vulcanization material covers the lower circuit on the upper side of the lower circuit layer in a sealing manner, and the upper anti-vulcanization coating and the lower anti-vulcanization coating are respectively provided with an upper fracture and a lower fracture for exposing the upper-layer metal contact point and the lower-layer metal contact point; when the film circuit board is used in various environments, the positions, right opposite to the positions of the upper layer metal contact points, on the upper circuit layer are pressed, so that the upper layer metal contact points penetrate through the avoiding hollow-out hole positions in the middle interlayer and move downwards to be in contact with the lower layer metal contact points, and then trigger signals are generated. The operation stability of the film circuit board is effectively improved, and the service life of the film circuit board is prolonged.

The invention discloses a method for improving precision and reliability of a thin film circuit pattern on the surface of a ceramic substrate, and belongs to the field of microwave components, and the method comprises the steps of substrate pretreatment, photoresist pattern preparation, thin film preparation through magnetron sputtering, metal film layer electroplating thickening, photoresist removal and the like. Magnetron sputtering and electroplating are carried out on the ceramic substrate carrying the photoresist pattern, the target thin film circuit pattern is prepared, a traditional wet etching process method is replaced, the side edge corrosion phenomenon is avoided, and the prepared thin film circuit pattern is high in reliability, high in consistency and high in line precision.

A pixel unit includes a thin film circuit unit and a light emitting device. The thin film circuit unit includes a first driving device having a first terminal, a second terminal, and a control terminal. The first terminal can receive a first signal. The control terminal can receive a second signal to control on / off of the first driving device for allowing the first signal transmitted to the second terminal. The light emitting device includes a plurality of light-emitting elements connected in series and connected to the second terminal, wherein a total voltage of the plurality of light-emitting elements is not less than ⅓ of a saturation voltage of the first driving device.

The invention relates to a thin film circuit board which comprises a layered plate structure and an additional substrate combined to the outer side of the layered plate structure. The circuit switch is arranged in a compressible space in the layered plate structure. The layered plate structure is provided with a first ventilation channel which is communicated with the compressible space. The additional substrate is provided with a second ventilation channel which is communicated with the first ventilation channel through a through hole in the layered plate structure. The second ventilation channel is also communicated with the outside of the film circuit board. Therefore, the compressible space is communicated with the outside of the thin film circuit board through the first ventilation channel, the through hole and the second ventilation channel. The compressible space is communicated with the channel outside the thin film circuit board, and the path length of the compressible space is lengthened due to the existence of the second ventilation channel, so that the opportunity that the switch contact of the circuit switch is affected by external chemical substances (such as oxidation, vulcanization and the like) can be greatly reduced.

The utility model discloses a laser etching automation device for a film circuit board, comprising a main body assembly which comprises a sorting device, a conveyor belt, a circuit board main body and a lifting moving device; the anti-damage assembly comprises a suction adjusting device, a first suction cup, a second suction cup and a third suction cup, the bottom of the suction adjusting device is sequentially and movably connected with the first suction cup, the second suction cup and the third suction cup from inside to outside, and the distribution density of the first suction cup, the second suction cup and the third suction cup is gradually reduced; the anti-damage assembly further comprises first suction holes and second suction holes, sixteen first suction holes are formed in the suction face of the first suction cup, and eight second suction holes are formed in the suction face of the second suction cup. According to the utility model, the suction force can be gradually reduced from inside to outside, so that the device is suitable for the easily deformed edge part of the film circuit board, and the film circuit board is prevented from being damaged.

This application provides a key structure, keyboard, and electronic device. The key structure includes a keycap, a support component, and a base plate. The base plate includes a thin-film circuit board. The two ends of the support component are movably connected to the base plate and the keycap, respectively. The support component includes a frustum-shaped elastomer disposed between the thin-film circuit board and the keycap. The elastomer stores energy when the keycap is pressed and resets the keycap when it is released. When the upper and lower parts of the elastomer abut against the thin-film circuit board on the base plate, the contact portion of the thin-film circuit board is triggered. A first relief groove is provided on the back of the keycap. When the elastomer is compressed and deformed, the upward protrusion of the elastomer can be accommodated in the first relief groove, reducing interference between the elastomer and the keycap and thus reducing fatigue damage to the elastomer, improving the service life of the elastomer, reducing the impact on key function caused by the thinning of the elastomer, achieving a thinner and lighter electronic device, and ensuring that the key structure has a sufficiently long key travel, thus improving the tactile feel of the key structure.