78 results about "Thin film circuits" patented technology

The invention discloses a vacuum coating process suitable for an ultrathin film layer circuit board and a coating device thereof, and relates to the technical field of vacuum coating. Comprising the following steps: transferring a circuit board substrate to a vacuum chamber, inputting argon into the vacuum chamber, ionizing the argon into argon ions with positive charges, accelerating the argon ions with positive charges to move towards the surface of a target material with negative charges under the action of an electric field, and knocking out evaporated substance atoms or molecules on the surface of the target material. Positively charged argon ions bombard the surface of the target material after being accelerated by an electric field, so that molecules of an evaporation substance on the target material release high-energy particle flow with high kinetic energy, and the particles move along irregular paths in a plasma environment to effectively cover fine gaps, edges and three-dimensional surfaces of a complex structure of a circuit board, so that the surface of the target material is effectively protected. And the particles can quickly and uniformly form an ultrathin film layer on the surface of the circuit board, so that the probability of non-uniform film thickness distribution caused by vapor natural deposition film coating is reduced, and the film coating effect of the device is improved.

The present invention provides an ultrafast hydrogen response sensing structure based on an RC differential thin film circuit, belonging to the field of gas sensor technology. The structure comprises a thin film resistor hydrogen sensing unit, a voltage divider / heating thin film resistor, an RC differential thin film circuit, and four lead electrodes. The RC differential thin film circuit includes an RC differential thin film capacitor and an RC differential thin film resistor. The RC differential thin film capacitor comprises a first electrode, a dielectric layer, and a second electrode. The first lead electrode is connected to the first electrode via the voltage divider / heating thin film resistor; the second lead electrode is connected to the first electrode via the thin film resistor hydrogen sensing unit; the third lead electrode is a voltage output terminal connected to the second electrode; and the fourth lead electrode is connected to the second electrode via the RC differential thin film resistor. The present invention achieves rapid hydrogen response and concentration detection based on the peak occurrence time and peak value of the first-order derivative output curve, greatly improves the integration of the gas rapid response system, significantly reduces the system size and power consumption, and is suitable for scenarios with different hydrogen detection requirements.

The utility model discloses automatic compounding equipment for a thin film circuit board. Comprising a first circuit diaphragm feeding device, a second circuit diaphragm feeding device, an insulating diaphragm feeding device, a first circuit diaphragm punching device, a second circuit diaphragm punching device, a second circuit diaphragm punching device, a third circuit diaphragm punching device, a fourth circuit diaphragm punching device, a fifth circuit diaphragm punching device, a sixth circuit diaphragm punching device, a fifth circuit diaphragm punching device and a sixth circuit diaphragm punching device, the hot melting platform is used for realizing hot melting compounding of the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm; the diaphragm carrying device is used for placing the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm on the hot melting platform in sequence; according to the utility model, the diaphragms are accurately punched with positioning holes based on a pattern recognition method, and then are accurately compounded, so that the accurate alignment and positioning of each layer of diaphragm are realized, the alignment precision of contacts on the upper and lower layers of circuit diaphragms is better, and the yield is improved.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

The application provides a multistage bandwidth regulation photodetector assembly, which comprises a first printed circuit board, a second printed circuit board, and a first printed circuit board electrically connected with the second printed circuit board; the second printed circuit board is printed with a first open loop circuit, and the first open loop circuit comprises at least one resistor which is connected in series; a third printed circuit board is electrically connected with the second printed circuit board; the third printed circuit board is printed with a second open loop circuit, and the second open loop circuit comprises at least one capacitor which is connected in series; a photodetector is arranged on the surface of the first printed circuit board and is electrically connected with the first open loop circuit and the second open loop circuit respectively; and a thin film circuit is arranged on the surface of the first printed circuit board and is electrically connected with the photodetector. The multistage bandwidth regulation photodetector assembly has a simple structure and stable circuit connection, and the resistance and capacitance of the assembly can be actively regulated, so that the bandwidth of the assembly can be autonomously regulated.

The application belongs to the technical field of display, and discloses a substrate structure, a forming method, a display panel and a substrate splicing layout structure. The substrate structure comprises at least one substrate unit, the substrate unit has a first side edge and two second side edges adjacent to and opposite to the first side edge, the first side edge is used to correspond to the direction of a chip on film circuit, and the second side edge is used to correspond to the direction of a gate driver on array circuit; the at least one substrate unit comprises a first substrate unit, the first substrate unit is provided with an alignment area and a wiring area, the alignment area is used to align an inner alignment part arranged on a mask plate, the wiring area is used to supply a common electrode line, the alignment area is arranged adjacent to one of the second side edges, and the wiring path of the wiring area is arranged to avoid the alignment area. In the application, the first substrate unit can be positioned in the GDL direction when splicing, so that the splicing is not limited by the direction, the wiring area is avoided in the first substrate unit, and it is ensured that the pixels can be normally displayed.

The present disclosure discloses a rubber dome with advanced conduction which includes a support portion, an elastic connection portion, and a pressing portion connected in sequence, the pressing portion having a columnar triggering portion at an axially inner side thereof. An axial end of the triggering portion is spaced at an axial distance b from an axially lower surface of the support portion, and an axial upper surface of the support portion is spaced at a distance h from the axially lower surface of the support portion, and b<h. The pressing portion is axially opened with a bowl-shaped groove extending to the triggering portion. The rubber dome provided by the present disclosure avoids the over-sensitivity phenomenon conventionally caused by lowering the triggering force of the thin film circuit switch by adjusting the conduction distance to make the triggering portion closer to the thin film circuit switch. By the bowl-shaped groove arrangement, it is possible to overcome the problem of large deformation force caused by simply extending the length of the triggering portion and the conduction point FP is advanced. Thus, the conduction efficiency, i.e., the conduction agility at the time of pressing is improved, and the conduction performance for corner pressing is also improved, so that the key reaction is more agile.

The utility model provides a kind of flexible film circuit board terminal size detection device based on vision module, including test bench, first light source being set on test bench, product placing plate being set in the upper of first light source, the light transmission hole is opened in the correspondence of product placing plate and first light source, the shape of the light transmission hole is adapted to the terminal shape of flexible film circuit board, second light source and vision detection device are further equipped in the upper of light transmission hole, the second light source, vision detection device are set in the just upper of light transmission hole by support, the first light source and second light source are the light of the positive and negative two sides of the flexible film circuit board terminal to be tested, provide detection light source for the vision detection device.The utility model has the beneficial effect that: effectively improve the accuracy of test.

The invention provides a key structure. The key structure comprises a bottom plate, a thin film circuit, a key cap, a lifting assembly, a telescopic assembly and a dome switch. The thin film circuit is arranged on the bottom plate. The lifting assembly is arranged between the bottom plate and the key cap. The telescopic assembly is arranged between the thin film circuit and the key cap and comprises a first sleeve, a second sleeve, a first spring and a second spring. The first sleeve is slidably connected to the key cap, and the bottom of the first sleeve is provided with a lateral protrusion. The second sleeve is rotatably and slidably connected to the key cap and sleeves the first sleeve. A notch corresponding to the lateral protrusion is formed in the bottom of the second sleeve. The first spring is arranged in the first sleeve and is in contact with the first sleeve and the key cap; the second spring is arranged in the second sleeve and is in contact with the second sleeve and the key cap. The dome switch is integrated at the bottom of the first sleeve and contacts the thin film circuit.

1. The name of the design product: ceramic substrate appearance inspection machine. 2. The use of the design product: for the defect detection of the appearance of thick film / thin film circuit, IC carrier plate, HTCC / LTCC green ceramic sheet, etc. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1.

The application provides a laser polarization degree testing device applied to the technical field of detection, which comprises a thin film circuit, the surface of the thin film circuit is provided with an electrode contact point of a laser, a laser limiting device, the laser limiting device is provided with a clamping groove on a bearing surface, a conductive assembly, the conductive assembly is arranged on the laser limiting device close to the bearing surface, the conductive assembly comprises a support structure which can move up and down along a guide rail perpendicular to the bearing surface and at least two conductive contacts, the conductive contacts are fixed to the support structure and vertically correspond to the position of the electrode contact point, a rotating table, a through hole is formed in the rotating table shaft, a polarizer is fixedly arranged on the receiving surface of the rotating table, a photodiode, the photodiode is vertically arranged in the light output direction of the polarizer, the photosensitive surface of the photodiode is coaxial with the rotating table, and a controller, the controller is electrically connected with the conductive assembly, the rotating table and the photodiode through wires. The universality and operation convenience of the device can be enhanced.

The invention provides a water dental floss and a control method. The water dental floss comprises a machine body, a water tank, a battery, a water pump, a nozzle, a temperature sensor, a thick film heating assembly, a liquid guide pipeline, a top cover, a WIFI communication module, a gyroscope module, an infrared distance measurement module and a control system, an infrared sensor and a gyroscope are integrated on the top cover, so that an oral cavity area is positioned; the thick film heating assembly wraps the liquid guiding pipeline, is heated through a film circuit and is matched with the tail end temperature sensor to achieve closed-loop temperature control. Individualized water pressure, temperature and time requirements are collected through the mobile terminal and transmitted to the machine body through WIFI, the gyroscope and the infrared module recognize the area and call corresponding parameters, and accurate partition control is achieved. The problems that a traditional water dental floss is single in function and cannot be individually adapted to different gingival tolerance are solved, and the cleaning efficiency and the use comfort are improved.

The invention discloses a manufacturing method of an ultra-fine and ultra-thick gold film circuit, and relates to the technical field of PCBs, and the method comprises the following steps: S1, cleaning a substrate; s2, performing double-sided sputtering of a gold seed layer on the cleaned substrate to form a gold-plated sheet; s3, photoresist is sprayed on the gold-plated sheet in a photoresist spraying mode, and exposure and development are carried out; s4, carrying out stepped electroplating on the gold-plated sheet; s5, removing redundant metal regions on the front surface by using an etching means, and etching a cutting channel on the back surface; and S6, finally, cutting is conducted along the cutting channel, and a plurality of products can be obtained. According to the scheme, after thin gold is sputtered to serve as the seed layer, the photoresist pattern is manufactured on the gold-plated sheet in a glue spraying mode, and therefore the inductor product of the superfine and ultra-thick electrode with the line width meeting the requirement of 20 + / -3 microns and the gold layer thickness meeting the requirement of 10-12 microns is manufactured, and the manufactured film inductor series product can meet the high inductance value.

The application discloses a thin film circuit ceramic single-side grinding method and relates to the field of ceramic surface fine grinding processing technology, which comprises the following steps: step one, symmetrically attaching ceramic substrates with white films to a ceramic disc smeared with paraffin wax; step two, cooling and bonding the ceramic disc after the ceramic substrates are attached, pressing the ceramic substrates and the ceramic disc by using the white film-attached rubber pad, and uniformly extruding the hot-melt paraffin wax; step three, after the cooling is completed, taking out the ceramic disc, testing the paraffin wax-attaching thickness error, comparing the ceramic disc plane with zero, and then testing the substrate thickness by using the five-point testing method on the ceramic substrate to the set tolerance fluctuation range; step four, when the disc surface of the ceramic disc reaches the set flatness, grinding is carried out according to the set fixed interval time; step five, after the grinding is completed, the thickness is retested, if the thickness is qualified, the grinding is completed, if the thickness is unqualified, the substrate is turned over by 180 degrees, the grinding is continuously carried out for the same time, and the grinding is not stopped until the thickness is qualified. The application can avoid scratches on the ceramic substrate and reduce the breakage rate.

The utility model discloses a film circuit board with an anti-sulfuration function, which comprises an upper circuit layer, a lower circuit layer, a middle interlayer, an upper anti-sulfuration coating and a lower anti-sulfuration coating, and is characterized in that the upper anti-sulfuration coating made of anti-sulfuration materials hermetically covers an upper circuit on the lower side of the upper circuit layer; a lower anti-vulcanization coating made of an anti-vulcanization material covers the lower circuit on the upper side of the lower circuit layer in a sealing manner, and the upper anti-vulcanization coating and the lower anti-vulcanization coating are respectively provided with an upper fracture and a lower fracture for exposing the upper-layer metal contact point and the lower-layer metal contact point; when the film circuit board is used in various environments, the positions, right opposite to the positions of the upper layer metal contact points, on the upper circuit layer are pressed, so that the upper layer metal contact points penetrate through the avoiding hollow-out hole positions in the middle interlayer and move downwards to be in contact with the lower layer metal contact points, and then trigger signals are generated. The operation stability of the film circuit board is effectively improved, and the service life of the film circuit board is prolonged.

The utility model discloses a laser etching automation device for a film circuit board, comprising a main body assembly which comprises a sorting device, a conveyor belt, a circuit board main body and a lifting moving device; the anti-damage assembly comprises a suction adjusting device, a first suction cup, a second suction cup and a third suction cup, the bottom of the suction adjusting device is sequentially and movably connected with the first suction cup, the second suction cup and the third suction cup from inside to outside, and the distribution density of the first suction cup, the second suction cup and the third suction cup is gradually reduced; the anti-damage assembly further comprises first suction holes and second suction holes, sixteen first suction holes are formed in the suction face of the first suction cup, and eight second suction holes are formed in the suction face of the second suction cup. According to the utility model, the suction force can be gradually reduced from inside to outside, so that the device is suitable for the easily deformed edge part of the film circuit board, and the film circuit board is prevented from being damaged.

This application provides a key structure, keyboard, and electronic device. The key structure includes a keycap, a support component, and a base plate. The base plate includes a thin-film circuit board. The two ends of the support component are movably connected to the base plate and the keycap, respectively. The support component includes a frustum-shaped elastomer disposed between the thin-film circuit board and the keycap. The elastomer stores energy when the keycap is pressed and resets the keycap when it is released. When the upper and lower parts of the elastomer abut against the thin-film circuit board on the base plate, the contact portion of the thin-film circuit board is triggered. A first relief groove is provided on the back of the keycap. When the elastomer is compressed and deformed, the upward protrusion of the elastomer can be accommodated in the first relief groove, reducing interference between the elastomer and the keycap and thus reducing fatigue damage to the elastomer, improving the service life of the elastomer, reducing the impact on key function caused by the thinning of the elastomer, achieving a thinner and lighter electronic device, and ensuring that the key structure has a sufficiently long key travel, thus improving the tactile feel of the key structure.

The invention discloses a method for manufacturing a thin film circuit by using green oil as a photoresist, which relates to the technical field of PCB (Printed Circuit Board) preparation, and comprises the step of printing the green oil on a substrate instead of photoresist so as to manufacture a thin film circuit product with the line width precision of 0.1 mm + / -0.01 mm and above. By adopting the scheme, the green oil is used as the photoresist instead of the photoresist, so that the thin film circuit product with the line width precision of 0.1 mm + / -0.01 mm and above can be manufactured by a low-cost process route.

The invention discloses a distributed multi-parameter sensing system and method combined with an optical transceiving integrated chip, and relates to the field of distributed optical fiber sensing, and the system comprises a temperature control optical transceiving assembly, an arbitrary waveform function generator, an upper computer, a multi-channel data acquisition instrument, an erbium-doped optical fiber amplifier, a circulator and a sensing optical fiber. The temperature control light transmitting-receiving assembly comprises a semiconductor temperature controller and a light transmitting-receiving integrated chip; the optical transceiver integrated chip comprises a tungsten copper substrate, a thin film circuit, an output single-mode fiber, a semiconductor amplifier chip, a semiconductor laser chip, an avalanche photoelectric detector chip, a photon lead waveguide structure and an input single-mode fiber. Through optical transceiver chip integration, a cooperative control structure and a related signal processing algorithm, distributed sensing with compact structure, multi-parameter synchronous decoupling and high precision coexistence is realized.

To provide a resin film with high flexibility and recoverability, having sufficient stiffness near room temperature, and exhibiting minimal change in mechanical characteristics depending on temperature.SOLUTION: A resin film comprising a resin having segments of Chemical Formula 1 and Chemical Formula 2, the resin film being characterized in that a storage modulus E'(25) at 25°C is 10 MPa or more, and storage moduli E'(0) at 0°C and E'(50) at 50°C satisfy the following formulae: 1.0≥E'(25) / E'(0)≥0.20 and 1.0≥E'(50) / E'(25)≥0.20.SELECTED DRAWING: Figure 1

A therapeutic device used for monitoring a wound includes an external layer impermeable to gas and moisture with a periphery that adheres to a user's skin about the wound and an internal layer with a periphery adhered to the external layer creating a gaseous reservoir between the external and internal layers. The internal layer is semipermeable to allow gas to diffuse from the gaseous reservoir toward the wound, and to allow moisture to be absorbed from the wound. A spacer layer separates the external and internal layers and absorbs fluid from the wound. A bendable, flexible and stretchable, film-based circuit board is located on the internal layer and includes a processor, at least one sensor, and a wireless transceiver. A perforated inner wound layer is positioned below the circuit board and includes openings configured to allow the at least one sensor to be in communication with the wound.

A space key device comprises a substrate, a thin film circuit board located on the substrate, an elastic body located on the thin film circuit board, a key cap located at the top end of the elastic body, and a scissor foot unit and a balance reinforcing unit which are located between the substrate and the key cap. The balance reinforcing unit comprises a balance rod group, a reinforcing rod group and a middle reinforcing rod, the balance rod group is provided with a front balance rod and a rear balance rod which are pivoted between the key cap and the substrate, and the reinforcing rod group is provided with a front reinforcing rod and a rear reinforcing rod which are pivoted between the key cap and the substrate; the front reinforcing rod is located on the rear side of the front balance rod, the rear reinforcing rod is located on the front side of the rear balance rod, and the middle reinforcing rod is installed on the key cap and located between the front reinforcing rod and the rear reinforcing rod. Therefore, the structural strength of the keycap can be improved, and the thickness of the keycap can be reduced to be less than or equal to 0.5 mm, so that the overall height of the notebook computer keyboard is less than 3.6 mm.

The present invention provides a key structure with a display function. The key structure includes a thin film circuit board, an elastic element layer, an elastic key frame, and a display module. The elastic element layer is located above the thin film circuit board and includes a plurality of separated elastic elements. The elastic key frame is adjacent to the plurality of elastic elements and includes a plurality of openings corresponding to the plurality of elastic elements. The display module is located above the elastic element layer and the elastic key frame. The display module includes a circuit substrate and a plurality of light-emitting elements, the plurality of light-emitting elements being located above the circuit substrate. The lower surface of the circuit substrate faces the elastic element layer and the elastic key frame.

The invention discloses an antenna device. The antenna device comprises a circuit substrate, a plurality of beam forming wafers and a plurality of radio frequency front-end wafers, the circuit substrate comprises a substrate, a plurality of antenna electrodes, a thin film circuit structure and a redistribution structure. The antenna electrode array is arranged in an antenna array area on the substrate. The thin film circuit structure is located on the substrate. The redistribution structure is located on the thin film circuit structure. The beamforming wafers are arrayed in the antenna array region on the substrate and bonded to the redistribution structure. The radio frequency front-end wafers are arranged in the antenna array area on the substrate and are connected to the redistribution structure. The radio frequency front-end wafers are respectively in signal connection with the antenna electrodes, and the radio frequency front-end wafers are electrically connected with the beam forming wafers.

The invention discloses a thin film circuit preparation method, device, system and equipment, and the method comprises the steps: selecting a blank substrate corresponding to a circuit demand based on the circuit demand of a circuit product, and the circuit demand comprises the unit circuit size, front and back surface unit circuit patterns and side surface unit circuit patterns of a thin film circuit; performing hole cavity cutting on the blank substrate according to the size of the unit circuit to obtain a hole cavity substrate; performing front and back photoetching treatment on the hole cavity substrate according to the front and back unit circuit patterns to obtain a photoetching film circuit substrate; determining a target cutting width based on the side unit circuit pattern; and performing laser cutting on the side surface of the photoetching film circuit substrate based on the target cutting width to obtain a target film circuit substrate. The problem that in an existing substrate side face photoetching technology, the rate of finished products is low due to the fact that the side face metal patterning technological process is complex and the photoetching processing control precision of thin lines is low is solved.

The invention discloses a space deflection broadband microwave transmission packaging structure based on a side electrode, and the transmission structure comprises a first thin film circuit and a second thin film circuit. The first thin film circuit comprises a first substrate and a first grounding coplanar waveguide manufactured on the front surface of the first substrate; the second thin film circuit comprises a second substrate and a second grounding coplanar waveguide manufactured on the front surface of the second substrate; when a side surface first GSG electrode is further manufactured on the side surface of the first substrate, the second thin film circuit is arranged on one side of the back surface of the first substrate, and the second grounding coplanar waveguide is communicated with the side surface first GSG electrode; or, when a side face second GSG electrode is further manufactured on the side face of the second substrate, the first thin film circuit is arranged on one side of the back face of the second substrate, and the first grounding coplanar waveguide is communicated with the side face second GSG electrode. A high-frequency signal transmission mode field can be kept stable, parasitic inductance can be avoided, and the overall high-frequency transmission loss of the structure is reduced.

The utility model relates to the technical field of circuit film conveying equipment, and particularly discloses a circuit film feeding device with a chip removal function, which comprises a machine body, a circuit film stacking part is arranged at one end of the machine body, and a vibration chip removal conveyor is arranged on one side of the circuit film stacking part. A conveyor is arranged on the side, away from the circuit film stacking part, of the vibration chip removing conveyor, the vibration chip removing conveyor comprises a roller frame connected with the machine body, a driving roller and a driven roller are installed on the roller frame, a plurality of elastic conveying strips are wound around the driving roller and the driven roller, and a chip falling area is formed between every two adjacent elastic conveying strips; according to the circuit film feeding device, the film circuit board slightly bounces on the surfaces of the elastic conveying strips, vibration is generated in the conveying process of the film circuit board, therefore, chips on the surface of the film circuit board fall off from a chip falling area, and the situation that the product quality is reduced due to the fact that the chips are covered in the subsequent film covering process is prevented.

The present invention provides a novel LCP extruded film in which the molecular orientation and internal strain of the thermoplastic liquid crystal polymer are sufficiently reduced, and the anisotropy of the dimensional change rate is significantly reduced compared to conventional films, as well as an LCP stretched film, insulating material for circuit boards, and metal foil-clad laminates using the same. [Solution] An LCP extruded film containing a thermoplastic liquid crystal polymer and having a thickness of 15 μm to 300 μm, wherein the degree of orientation α1 (%) including the exposed film surface S1 and the degree of orientation α2 (%) including the film surface S2 located 5 μm deep from the film surface S1, which is exposed by etching the film surface S1 in the thickness direction, satisfy the relationship -4.0 ≤ [(α2 - α1) / α1] × 100 ≤ 0.0, and the coefficient of linear expansion in the MD direction and TD direction at 23 to 200°C, as measured by the TMA method in accordance with JIS K7197, is in the range of -30 to 55 ppm / K.

The invention discloses a novel thin film circuit LED street lamp heat dissipation device in the technical field of lighting equipment. The novel thin film circuit LED street lamp heat dissipation device comprises a main body unit, dustproof units arranged on the two sides of the main body unit and a street lamp unit arranged in the main body unit. The main body unit comprises a shell, a motor arranged in the shell and a transmission part transversely arranged in the shell, and one end of the transmission part is connected with the motor. The dustproof units are arranged in the heat dissipation holes, the dustproof units can be opened or closed according to use requirements, when the street lamp dissipates heat, the heat dissipation holes are opened, it is ensured that hot air inside the street lamp and cold air outside the street lamp can be normally exchanged and circulated, stable proceeding of heat dissipation work is not hindered, and when heat dissipation is not conducted, the heat dissipation holes are closed, so that the heat dissipation efficiency is improved. Therefore, external dust and impurities are effectively prevented from entering the street lamp, the safety of elements in the street lamp is guaranteed, and the service life of the street lamp is prolonged.