44 results about "Thin film circuits" patented technology

The utility model discloses automatic compounding equipment for a thin film circuit board. Comprising a first circuit diaphragm feeding device, a second circuit diaphragm feeding device, an insulating diaphragm feeding device, a first circuit diaphragm punching device, a second circuit diaphragm punching device, a second circuit diaphragm punching device, a third circuit diaphragm punching device, a fourth circuit diaphragm punching device, a fifth circuit diaphragm punching device, a sixth circuit diaphragm punching device, a fifth circuit diaphragm punching device and a sixth circuit diaphragm punching device, the hot melting platform is used for realizing hot melting compounding of the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm; the diaphragm carrying device is used for placing the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm on the hot melting platform in sequence; according to the utility model, the diaphragms are accurately punched with positioning holes based on a pattern recognition method, and then are accurately compounded, so that the accurate alignment and positioning of each layer of diaphragm are realized, the alignment precision of contacts on the upper and lower layers of circuit diaphragms is better, and the yield is improved.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

The application provides a multistage bandwidth regulation photodetector assembly, which comprises a first printed circuit board, a second printed circuit board, and a first printed circuit board electrically connected with the second printed circuit board; the second printed circuit board is printed with a first open loop circuit, and the first open loop circuit comprises at least one resistor which is connected in series; a third printed circuit board is electrically connected with the second printed circuit board; the third printed circuit board is printed with a second open loop circuit, and the second open loop circuit comprises at least one capacitor which is connected in series; a photodetector is arranged on the surface of the first printed circuit board and is electrically connected with the first open loop circuit and the second open loop circuit respectively; and a thin film circuit is arranged on the surface of the first printed circuit board and is electrically connected with the photodetector. The multistage bandwidth regulation photodetector assembly has a simple structure and stable circuit connection, and the resistance and capacitance of the assembly can be actively regulated, so that the bandwidth of the assembly can be autonomously regulated.

The application belongs to the technical field of display, and discloses a substrate structure, a forming method, a display panel and a substrate splicing layout structure. The substrate structure comprises at least one substrate unit, the substrate unit has a first side edge and two second side edges adjacent to and opposite to the first side edge, the first side edge is used to correspond to the direction of a chip on film circuit, and the second side edge is used to correspond to the direction of a gate driver on array circuit; the at least one substrate unit comprises a first substrate unit, the first substrate unit is provided with an alignment area and a wiring area, the alignment area is used to align an inner alignment part arranged on a mask plate, the wiring area is used to supply a common electrode line, the alignment area is arranged adjacent to one of the second side edges, and the wiring path of the wiring area is arranged to avoid the alignment area. In the application, the first substrate unit can be positioned in the GDL direction when splicing, so that the splicing is not limited by the direction, the wiring area is avoided in the first substrate unit, and it is ensured that the pixels can be normally displayed.

The present disclosure discloses a rubber dome with advanced conduction which includes a support portion, an elastic connection portion, and a pressing portion connected in sequence, the pressing portion having a columnar triggering portion at an axially inner side thereof. An axial end of the triggering portion is spaced at an axial distance b from an axially lower surface of the support portion, and an axial upper surface of the support portion is spaced at a distance h from the axially lower surface of the support portion, and b<h. The pressing portion is axially opened with a bowl-shaped groove extending to the triggering portion. The rubber dome provided by the present disclosure avoids the over-sensitivity phenomenon conventionally caused by lowering the triggering force of the thin film circuit switch by adjusting the conduction distance to make the triggering portion closer to the thin film circuit switch. By the bowl-shaped groove arrangement, it is possible to overcome the problem of large deformation force caused by simply extending the length of the triggering portion and the conduction point FP is advanced. Thus, the conduction efficiency, i.e., the conduction agility at the time of pressing is improved, and the conduction performance for corner pressing is also improved, so that the key reaction is more agile.

The utility model provides a kind of flexible film circuit board terminal size detection device based on vision module, including test bench, first light source being set on test bench, product placing plate being set in the upper of first light source, the light transmission hole is opened in the correspondence of product placing plate and first light source, the shape of the light transmission hole is adapted to the terminal shape of flexible film circuit board, second light source and vision detection device are further equipped in the upper of light transmission hole, the second light source, vision detection device are set in the just upper of light transmission hole by support, the first light source and second light source are the light of the positive and negative two sides of the flexible film circuit board terminal to be tested, provide detection light source for the vision detection device.The utility model has the beneficial effect that: effectively improve the accuracy of test.

The invention provides a water dental floss and a control method. The water dental floss comprises a machine body, a water tank, a battery, a water pump, a nozzle, a temperature sensor, a thick film heating assembly, a liquid guide pipeline, a top cover, a WIFI communication module, a gyroscope module, an infrared distance measurement module and a control system, an infrared sensor and a gyroscope are integrated on the top cover, so that an oral cavity area is positioned; the thick film heating assembly wraps the liquid guiding pipeline, is heated through a film circuit and is matched with the tail end temperature sensor to achieve closed-loop temperature control. Individualized water pressure, temperature and time requirements are collected through the mobile terminal and transmitted to the machine body through WIFI, the gyroscope and the infrared module recognize the area and call corresponding parameters, and accurate partition control is achieved. The problems that a traditional water dental floss is single in function and cannot be individually adapted to different gingival tolerance are solved, and the cleaning efficiency and the use comfort are improved.

The invention discloses a manufacturing method of an ultra-fine and ultra-thick gold film circuit, and relates to the technical field of PCBs, and the method comprises the following steps: S1, cleaning a substrate; s2, performing double-sided sputtering of a gold seed layer on the cleaned substrate to form a gold-plated sheet; s3, photoresist is sprayed on the gold-plated sheet in a photoresist spraying mode, and exposure and development are carried out; s4, carrying out stepped electroplating on the gold-plated sheet; s5, removing redundant metal regions on the front surface by using an etching means, and etching a cutting channel on the back surface; and S6, finally, cutting is conducted along the cutting channel, and a plurality of products can be obtained. According to the scheme, after thin gold is sputtered to serve as the seed layer, the photoresist pattern is manufactured on the gold-plated sheet in a glue spraying mode, and therefore the inductor product of the superfine and ultra-thick electrode with the line width meeting the requirement of 20 + / -3 microns and the gold layer thickness meeting the requirement of 10-12 microns is manufactured, and the manufactured film inductor series product can meet the high inductance value.

The application discloses a thin film circuit ceramic single-side grinding method and relates to the field of ceramic surface fine grinding processing technology, which comprises the following steps: step one, symmetrically attaching ceramic substrates with white films to a ceramic disc smeared with paraffin wax; step two, cooling and bonding the ceramic disc after the ceramic substrates are attached, pressing the ceramic substrates and the ceramic disc by using the white film-attached rubber pad, and uniformly extruding the hot-melt paraffin wax; step three, after the cooling is completed, taking out the ceramic disc, testing the paraffin wax-attaching thickness error, comparing the ceramic disc plane with zero, and then testing the substrate thickness by using the five-point testing method on the ceramic substrate to the set tolerance fluctuation range; step four, when the disc surface of the ceramic disc reaches the set flatness, grinding is carried out according to the set fixed interval time; step five, after the grinding is completed, the thickness is retested, if the thickness is qualified, the grinding is completed, if the thickness is unqualified, the substrate is turned over by 180 degrees, the grinding is continuously carried out for the same time, and the grinding is not stopped until the thickness is qualified. The application can avoid scratches on the ceramic substrate and reduce the breakage rate.

The utility model discloses a film circuit board with an anti-sulfuration function, which comprises an upper circuit layer, a lower circuit layer, a middle interlayer, an upper anti-sulfuration coating and a lower anti-sulfuration coating, and is characterized in that the upper anti-sulfuration coating made of anti-sulfuration materials hermetically covers an upper circuit on the lower side of the upper circuit layer; a lower anti-vulcanization coating made of an anti-vulcanization material covers the lower circuit on the upper side of the lower circuit layer in a sealing manner, and the upper anti-vulcanization coating and the lower anti-vulcanization coating are respectively provided with an upper fracture and a lower fracture for exposing the upper-layer metal contact point and the lower-layer metal contact point; when the film circuit board is used in various environments, the positions, right opposite to the positions of the upper layer metal contact points, on the upper circuit layer are pressed, so that the upper layer metal contact points penetrate through the avoiding hollow-out hole positions in the middle interlayer and move downwards to be in contact with the lower layer metal contact points, and then trigger signals are generated. The operation stability of the film circuit board is effectively improved, and the service life of the film circuit board is prolonged.

This application provides a key structure, keyboard, and electronic device. The key structure includes a keycap, a support component, and a base plate. The base plate includes a thin-film circuit board. The two ends of the support component are movably connected to the base plate and the keycap, respectively. The support component includes a frustum-shaped elastomer disposed between the thin-film circuit board and the keycap. The elastomer stores energy when the keycap is pressed and resets the keycap when it is released. When the upper and lower parts of the elastomer abut against the thin-film circuit board on the base plate, the contact portion of the thin-film circuit board is triggered. A first relief groove is provided on the back of the keycap. When the elastomer is compressed and deformed, the upward protrusion of the elastomer can be accommodated in the first relief groove, reducing interference between the elastomer and the keycap and thus reducing fatigue damage to the elastomer, improving the service life of the elastomer, reducing the impact on key function caused by the thinning of the elastomer, achieving a thinner and lighter electronic device, and ensuring that the key structure has a sufficiently long key travel, thus improving the tactile feel of the key structure.

The invention discloses a method for manufacturing a thin film circuit by using green oil as a photoresist, which relates to the technical field of PCB (Printed Circuit Board) preparation, and comprises the step of printing the green oil on a substrate instead of photoresist so as to manufacture a thin film circuit product with the line width precision of 0.1 mm + / -0.01 mm and above. By adopting the scheme, the green oil is used as the photoresist instead of the photoresist, so that the thin film circuit product with the line width precision of 0.1 mm + / -0.01 mm and above can be manufactured by a low-cost process route.

The invention discloses a distributed multi-parameter sensing system and method combined with an optical transceiving integrated chip, and relates to the field of distributed optical fiber sensing, and the system comprises a temperature control optical transceiving assembly, an arbitrary waveform function generator, an upper computer, a multi-channel data acquisition instrument, an erbium-doped optical fiber amplifier, a circulator and a sensing optical fiber. The temperature control light transmitting-receiving assembly comprises a semiconductor temperature controller and a light transmitting-receiving integrated chip; the optical transceiver integrated chip comprises a tungsten copper substrate, a thin film circuit, an output single-mode fiber, a semiconductor amplifier chip, a semiconductor laser chip, an avalanche photoelectric detector chip, a photon lead waveguide structure and an input single-mode fiber. Through optical transceiver chip integration, a cooperative control structure and a related signal processing algorithm, distributed sensing with compact structure, multi-parameter synchronous decoupling and high precision coexistence is realized.

A therapeutic device used for monitoring a wound includes an external layer impermeable to gas and moisture with a periphery that adheres to a user's skin about the wound and an internal layer with a periphery adhered to the external layer creating a gaseous reservoir between the external and internal layers. The internal layer is semipermeable to allow gas to diffuse from the gaseous reservoir toward the wound, and to allow moisture to be absorbed from the wound. A spacer layer separates the external and internal layers and absorbs fluid from the wound. A bendable, flexible and stretchable, film-based circuit board is located on the internal layer and includes a processor, at least one sensor, and a wireless transceiver. A perforated inner wound layer is positioned below the circuit board and includes openings configured to allow the at least one sensor to be in communication with the wound.

A space key device comprises a substrate, a thin film circuit board located on the substrate, an elastic body located on the thin film circuit board, a key cap located at the top end of the elastic body, and a scissor foot unit and a balance reinforcing unit which are located between the substrate and the key cap. The balance reinforcing unit comprises a balance rod group, a reinforcing rod group and a middle reinforcing rod, the balance rod group is provided with a front balance rod and a rear balance rod which are pivoted between the key cap and the substrate, and the reinforcing rod group is provided with a front reinforcing rod and a rear reinforcing rod which are pivoted between the key cap and the substrate; the front reinforcing rod is located on the rear side of the front balance rod, the rear reinforcing rod is located on the front side of the rear balance rod, and the middle reinforcing rod is installed on the key cap and located between the front reinforcing rod and the rear reinforcing rod. Therefore, the structural strength of the keycap can be improved, and the thickness of the keycap can be reduced to be less than or equal to 0.5 mm, so that the overall height of the notebook computer keyboard is less than 3.6 mm.

The invention discloses a space deflection broadband microwave transmission packaging structure based on a side electrode, and the transmission structure comprises a first thin film circuit and a second thin film circuit. The first thin film circuit comprises a first substrate and a first grounding coplanar waveguide manufactured on the front surface of the first substrate; the second thin film circuit comprises a second substrate and a second grounding coplanar waveguide manufactured on the front surface of the second substrate; when a side surface first GSG electrode is further manufactured on the side surface of the first substrate, the second thin film circuit is arranged on one side of the back surface of the first substrate, and the second grounding coplanar waveguide is communicated with the side surface first GSG electrode; or, when a side face second GSG electrode is further manufactured on the side face of the second substrate, the first thin film circuit is arranged on one side of the back face of the second substrate, and the first grounding coplanar waveguide is communicated with the side face second GSG electrode. A high-frequency signal transmission mode field can be kept stable, parasitic inductance can be avoided, and the overall high-frequency transmission loss of the structure is reduced.

The present invention provides a novel LCP extruded film in which the molecular orientation and internal strain of the thermoplastic liquid crystal polymer are sufficiently reduced, and the anisotropy of the dimensional change rate is significantly reduced compared to conventional films, as well as an LCP stretched film, insulating material for circuit boards, and metal foil-clad laminates using the same. [Solution] An LCP extruded film containing a thermoplastic liquid crystal polymer and having a thickness of 15 μm to 300 μm, wherein the degree of orientation α1 (%) including the exposed film surface S1 and the degree of orientation α2 (%) including the film surface S2 located 5 μm deep from the film surface S1, which is exposed by etching the film surface S1 in the thickness direction, satisfy the relationship -4.0 ≤ [(α2 - α1) / α1] × 100 ≤ 0.0, and the coefficient of linear expansion in the MD direction and TD direction at 23 to 200°C, as measured by the TMA method in accordance with JIS K7197, is in the range of -30 to 55 ppm / K.

The utility model provides a kind of test device and flexible film circuit board supporting multiple flexible film circuit board test, belong to test structure field.The utility model supporting multiple flexible film circuit board test test device includes control cabinet, is set above control cabinet more than one parallelly arranged test bin, the operation button for controlling test is equipped on the test bin, product placement site for placing product to be tested and the radio frequency receiving module capable of being electrically connected with product to be tested signal output end are equipped in each test bin, the press plate is equipped above the product placement site, and the test probe for testing product is set on the press plate, the press plate, test probe vicinity is also equipped with the crimping piece for pressing product to be tested, the driving structure for realizing electrically connected with product to be tested is also equipped in the test bin, driving press plate vertical motion is driven.The utility model can carry out the test of multiple flexible film circuit board simultaneously, reduces test cost, effectively improves test efficiency.

To provide an adhesive composition and an adhesive film for circuit connection which can provide a circuit connection structure that makes connection resistance between opposing electrodes less likely to increase even under high-temperature and high-humidity conditions, and a circuit connection structure and a method for manufacturing the same.SOLUTION: An adhesive film for circuit connection contains a resin component containing a thermoplastic resin, a radical-polymerizable compound and a radical polymerization initiator, and conductive particles, and contains a cyclopolymerizable monomer as the radical-polymerizable compound.SELECTED DRAWING: None

A thin-film circuit connector assembly is described, comprising a plug module and a receptacle module detachably attached to the plug module. The plug module includes: a first thin-film circuit including a first flexible body having a first signal path and at least one first ground path disposed thereon; a first coaxial adapter assembly including a first conductor and a first coaxial adapter; and a first housing having a first front aperture in which the first conductor is positioned. The receptacle module includes: a second thin-film circuit including a second flexible body having a second signal path and at least one second ground path disposed thereon; a second coaxial adapter assembly including a second conductor and a second coaxial adapter; and a second housing having a second front aperture in which the second coaxial adapter is positioned.

The invention provides a wafer detector and a wafer surface resistivity detection method. Relates to the field of semiconductor wafer manufacturing and measurement. The wafer detector includes: a back plate; the source meter module is arranged on the back plate; the flexible substrate is arranged on one side of the back plate in a protruding manner; the probe array module is arranged on the side, away from the back plate, of the flexible substrate, and the probe array module comprises a plurality of probe units arranged in an array mode; the thin film circuit module is laid on the flexible substrate and is configured to electrically connect the plurality of probe units with the source meter module; wherein under the condition that the back plate moves to a target position, the flexible substrate is deformed under the action of external force, so that the plurality of probe units and the wafer to be measured are in electric contact at the same time, and the source meter module measures the resistivity of a plurality of point locations to be measured on the wafer to be measured through the plurality of probe units.

The display device comprises a flexible display panel, a back shell, a first support, a chip on film, a circuit board and a fixing plate, the flexible display panel is arranged on one side of the back shell, the flexible display panel comprises opposite first and second ends and opposite light-emitting and back sides, the first support is movably connected with the flexible display panel, the first end of the flexible display panel is bent to the back side of the flexible display panel through the first support, the first support forms support for the flexible display panel in the bending area, one end of the chip on film is connected with the flexible display panel, the other end of the chip on film is connected with the circuit board, the fixing plate is arranged between the circuit board and the flexible display panel, one end of the fixing plate is fixedly connected with the first end of the flexible display panel, and the other end of the fixing plate is fixedly connected with the circuit board, the fixing plate is provided with a protruding portion, the protruding portion abuts against the back shell, and the height of the protruding portion between the fixing plate and the back shell is greater than the maximum thickness of the circuit board.

Thin-film element with positive resistance coefficient (100, 100a), comprising: a substrate plate (110); a thin-film circuit (120) provided on the aforementioned substrate plate (110) and comprising two circuit solder pads (122); and two conductors (130) cut from a conductor frame (24) and comprising two front-end solder pads (132), wherein the two aforementioned front-end solder pads (132) are each soldered to the two aforementioned circuit solder pads (122), wherein the two aforementioned conductors (130) extend outside the aforementioned substrate plate (110) and wherein the thickness of each of the two aforementioned front-end solder pads (132) is identical to the thickness of the part extending outside the aforementioned substrate plate (110).

A key device of a backlight keyboard comprises a substrate, a thin film circuit board, a flexible circuit board, a key cap, a supporting module, at least one induction resistor and a light-emitting part. The thin film circuit board is arranged on the substrate and can generate a trigger signal after being pressed. The flexible circuit board comprises a lower laid copper circuit sheet arranged above the film circuit board, a base material sheet arranged above the lower laid copper circuit sheet, and an upper laid copper circuit sheet arranged above the base material sheet. And the key cap is positioned above the flexible circuit board and has light transmission. The supporting module comprises an elastic body which is arranged above the flexible circuit board and elastically supports and abuts against the key cap. And the inductive resistor is arranged on the upper copper laying circuit sheet. And the light-emitting part is arranged on the upper laid copper circuit sheet and can directly project light to the key cap.

The utility model provides a luminous keyboard which comprises a backlight module, a film circuit board arranged above the backlight module, a substrate arranged above the film circuit board and provided with a plurality of first openings, a polyester film arranged above the substrate, and a plurality of key units arranged on the substrate. The polyester film is formed with a plurality of second openings facing the first openings, respectively. Each key unit comprises a supporting module, a key cap and an elastic piece. Each elastic piece is provided with an elastic body which abuts between the key cap and the polyester film, and a protruding column which extends downwards from the elastic body and faces the film circuit board. By integrating and modularizing the film circuit board and the backlight module and arranging the film circuit board and the backlight module below the substrate, the film circuit board can be prevented from being holed so as to improve the water resistance and salt mist corrosion resistance of the film circuit board.

It exhibits excellent stretchability during stretching, thereby reducing anisotropy and anisotropy in dimensional change rates. A stretchable LCP extruded film capable of producing heat-shrinkable LCP stretched films with a small tail value. We provide things like [unclear / etc.]. [Solution] An LCP extruded film for stretching treatment containing a thermoplastic liquid crystal polymer, and a constant temperature bath Tensile test (compliant with JIS K7161-1:2014, 200℃, tensile speed 200 mm / m) In the stress-strain curve measured in, the T of the LCP extruded film for stretching treatment The yield strength X (MPa) and fracture strength Y (MPa) in direction D satisfy the following equation (1). LCP extruded film for stretching. 0.75 ≤ breaking point strength Y / yield point strength X ≤ 1.50 ···(1)

The invention discloses a low-cost preparation method of a gold-plated thin film circuit, and belongs to the field of integrated circuit manufacturing, and the method comprises the following steps: S1, forming a seed layer on the surface of a substrate, forming a first intermediate product, enabling the seed layer to comprise a bottoming metal layer and a diffusion barrier metal layer, enabling the bottoming metal layer to cover the substrate, and enabling the diffusion barrier metal layer to cover the first intermediate product; the diffusion barrier metal layer covers the bottoming metal layer, and the thickness of the seed layer is marked as H1; s2, the first intermediate product is subjected to pattern conversion to form a second intermediate product with a patterned gold layer, the thickness of the patterned gold layer is H2, the thickness of gold required by the customer is recorded as Hcustomer, and H2 = Hcustomer; s3, an intermediate product III with an additional layer is formed, the thickness of the additional layer is H3, the additional layer is formed on the gold layer, and the thickness of the additional layer is recorded as H3; and S4, forming a gold-plated thin film circuit, which comprises the following steps: S41, performing dry etching to remove the seed layer and the additional layer which are not covered by the patterned gold layer. The manufacturing cost of the gold-plated film circuit can be reduced.

A visual keyboard comprises a face shell, at least one containing hole is formed in the face shell, and at least one key made of light-transmitting materials is arranged in the containing hole and can reciprocate up and down relative to the containing hole. The display module is arranged below the surface shell and is used for providing visual images for a user through the keys; the reset module comprises a first magnet and a second magnet, a first groove is formed in at least one side close to the accommodating hole, and the first magnet is arranged in the first groove; the key comprises a plurality of side faces, at least one side face of the key is provided with a second groove, the second magnet is arranged in the second groove, when the key is not pressed, the top face of the key is higher than the top face of the face shell, the key is kept in an initial state through the magnetic force between the first magnet and the second magnet, and when a user presses the key, the magnetic force provides force for resetting the key. According to the embodiment of the utility model, additional mechanical elastic elements are not needed, a traditional elastic film structure is replaced, and the problems of aging and abrasion of elastic materials and low triggering precision and short service life of a film circuit are avoided.

The invention relates to the technical field of data processing, in particular to a thin film circuit board display technology processing system which comprises the steps that a deformation field reconstruction module collects substrate strain and micro-displacement data to generate a four-dimensional deformation tensor; the multi-physics coupling module simulates molecular conformational change based on the tensor and is coupled with an electromagnetic equation, and an impedance fluctuation output time-varying topological graph is calculated; the genetic optimization calculation module optimizes material parameters by taking the picture tearing distortion degree as a fitness function, and generates a signal offset prediction model; the virtual twin compensation module locates a high-risk area according to the model and the topological graph, and outputs an anti-tear coded signal; the dynamic verification module captures a display picture, extracts edge continuity and chromatic aberration characteristics, and triggers parameter re-calibration when deviation exceeds a threshold value. The closed-loop mechanism realizes cooperative control of physical deformation perception, signal offset prediction, time sequence compensation reconstruction and dynamic feedback calibration, significantly inhibits signal transmission asynchronization, and eliminates picture tearing distortion.