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Photocuring and thermocuring conductive adhesive and preparation method

A thermal curing, conductive adhesive technology, applied in the field of conductive adhesive, can solve the problems of low bonding strength, reduce thermal stress, etc., achieve high bonding strength, reduce thermal stress, overcome the effect of low bonding strength

Active Publication Date: 2011-07-20
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a light-curing and heat-curing conductive adhesive and a preparation method. This light-curing and heat-curing conductive adhesive overcomes the shortcoming of low bonding strength caused by ultraviolet light curing due to insufficient curing, and also overcomes It can effectively reduce the thermal stress and avoid the drift of LED chips, liquid crystal materials, thin film circuits, PCB circuit boards and Destruction of glass substrates, improving device reliability and yield

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Put 7 parts of epoxy acrylic resin and 3 parts of trimethylolpropane triacrylate into a three-necked flask with stirring, and stir at 47-50°C for 1 hour. Add 0.002 parts of p-hydroxyanisole, add 0.5 parts of 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinebenzylphenyl) butanone, and stir for 2 hours at 45-48°C in the dark, Filtration and discharge is composition (a).

[0022] Put 9 parts of bisphenol A epoxy resin and 1 part of 1,4 butanediol diglycidyl ether into a three-necked flask, stir at 70-75°C for 1 hour, cool to 30°C, add 0.6 part and 0.1 part of phenyldimethylurea, stirred for 1 hour. The stirred and mixed material is uniformly dispersed with a three-roller machine to form the composition (b).

[0023] Put 10 parts of composition (a) and 10 parts of composition (b) into a planetary mixer that can be vacuumed, at a temperature of 30-35 ° C, stir and mix for 1 hour in the dark, then add 80 parts of bright silver powder, Under a vacuum state with a relative vacu...

Embodiment 2

[0025] Put 5 parts of epoxy acrylic resin, 3 parts of polyurethane acrylate and 2 parts of tripropylene glycol diacrylate into a three-necked flask with stirring, and stir at 47-50°C for 1 hour. Add 0.015 parts of p-hydroxyanisole, add 0.4 parts of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, stir for 2 hours at 45-48°C in the dark, filter and discharge, and obtain the composition (c).

[0026] Put 6 parts of bisphenol A type epoxy resin, 3 parts of bisphenol F type epoxy resin and 1 part of glycerol triglycidyl ether into a three-necked flask, stir at 70-75°C for 1 hour, cool to 30°C, add Ultrafinely pulverize 0.6 part of dicyandiamide and 0.1 part of 2,4-toluene bis-dimethylurea, and stir for 1 hour. The stirred and mixed material is uniformly dispersed with a three-roller machine to form the composition (d).

[0027] Put 15 parts of composition (c) and 8 parts of composition (d) into a planetary mixer that can be vacuumed, at a temperature of 30-35 ° C, stir and mix ...

Embodiment 3

[0029] Put 7 parts of epoxy acrylic resin, 1 part of polyester acrylate and 2 parts of trimethylolpropane trimethacrylate into a three-necked flask with stirring, and stir at 45-47°C for 1 hour. Add 0.005 parts of 2,6-di-tert-butyl-4-methylphenol, add 0.5 parts of isoendylthioxanthone, stir for 2 hours at 45-48°C in the dark, filter and discharge, and obtain composition (e) .

[0030] Put 8 parts of bisphenol F type epoxy resin, 1 part of novolac type epoxy resin and 1 part of phenyl glycidyl ether into a three-necked flask, stir at 65-70°C for 1 hour, cool to 30°C, add superfine crushed bis 0.7 part of cyanamide and 0.1 part of 3-(p-chlorophenyl)-1,1 dimethylurea were stirred for 1 hour. The stirred and mixed material is uniformly dispersed with a three-roller machine to form the composition (f).

[0031] Put 16 parts of composition (c) and 5 parts of composition (d) into a planetary mixer that can be vacuumed, at a temperature of 30-35°C, stir and mix for 1 hour in the dar...

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Abstract

The invention discloses a photocuring and thermocuring conductive adhesive, which is prepared by mixing photosensitive high polymer, diluent monomer, conducting particles, photoinitiator, polymerization inhibitor, epoxy resin, epoxy active diluting agent, latent curing agent and latent promoting agent, grinding the mixture, and stirring and dispersing in a planetary manner. The curing temperature of the product is low, and deep curing can be realized; after being cured, the adhesive has high adhesiveness and high solvent resistance; and the adhering strength is high, the resistivity is low, and the requirements of microelectronic packaging technique for LED chips, liquid crystal materials, glass substrates, thin film circuits, PCB circuit boards and the like can be met.

Description

technical field [0001] The invention relates to conductive glue, in particular to a light-cured and heat-cured conductive glue. Background technique [0002] Traditional conductive connections generally use metal welding, and metal welding requires a relatively high temperature, especially after using lead-free soldering, the welding temperature has increased by more than 30°C compared to the original. High temperature welding will lead to material deformation, damage to components, stress concentration, loss and leakage of electromagnetic signals, etc. In addition to meeting the two most basic requirements of conductivity and bonding, conductive adhesives also have many advantages, such as being able to cure at lower temperatures or even room temperature, avoiding the above shortcomings of metal welding. [0003] As a new process, conductive adhesive bonding is widely used and has become an important new material in the electronics industry. Traditional conductive adhesiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/10C09J175/14C09J167/06C09J163/00C09J163/02C09J163/04C09J11/04C09J9/02
Inventor 黄剑滨彭代勇
Owner 东莞市新懿电子材料技术有限公司
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