376 results about "Bisphenol F" patented technology

The invention relates to the field of coatings, in particular to a solvent-free epoxy coating and a preparation method thereof.The solvent-free epoxy coating comprises a component A and a component B; the component A comprises 40-60 parts of epoxy resin, 5-20 parts of a reactive diluent, 1-2 parts of a dispersing agent, 0.5-2 parts of a thixotropic agent, 0.5-2 parts of a defoaming agent, 30-40 parts of pigment filler, 1-2 parts of a silane coupling agent and 0.5-2 parts of a flatting agent; the epoxy resin comprises bisphenol A epoxy resin and bisphenol F epoxy resin; the reactive diluent comprises alkyl glycidyl ether and aliphatic polyether polyol; the mass ratio of the alkyl glycidyl ether to the aliphatic polyether polyol is 1: 1; and the component B comprises modified alicyclic amine and 4-(aminomethyl) octane-1, 8-diamine, and the mass ratio of the modified alicyclic amine to the 4-(aminomethyl) octane-1, 8-diamine is (5.5-10): 1. The coating has excellent mechanical property and corrosion resistance.

The invention discloses a light-moisture dual-curing underwater epoxy coating with a self-repairing function as well as a preparation method and a construction method of the light-moisture dual-curing underwater epoxy coating. The epoxy coating comprises a component A and a component B, wherein the mass ratio of the component A to the component B is (1.5-3.5): 1; the component A is prepared from the following raw materials: bisphenol F type epoxy resin, dynamic disulfide bond modified polysulfide rubber, boron nitride nanosheet and silicon carbide nanowire hybrid filler, a photoinitiator and a silane coupling agent; the component B is prepared from the following raw materials: moisture-cured polyether amine, a boric acid ester bond cross-linking agent and hydrophobic modified graphene oxide. According to the invention, a light-moisture dual-curing mechanism is adopted, ultraviolet irradiation initiates rapid surface curing, and then environmental moisture permeates to complete deep curing. The material provided by the invention has the advantages of rapid curing, excellent self-repairing function, significantly improved underwater adhesion and good thermal conductivity, and provides a new solution for rapid repairing and long-acting protection of underwater structures.

The invention discloses a preparation method of two-component microcapsule self-repairing insulation paper based on epoxy resin and polymercaptan. The preparation method comprises the following steps: (1) preparing a repairing agent microcapsule and a curing agent microcapsule by an emulsion polymerization method; (2) mixing the prepared repairing agent microcapsule and curing agent capsule to obtain a bi-component microcapsule solution, and adding the bi-component microcapsule solution into the treated paper pulp; and (3) performing papermaking, drying and calendaring on the paper pulp added with the bi-component microcapsule solution to obtain the insulation paper. According to the invention, diglycerol ether type bisphenol F epoxy resin (DGEBF) stabilized by an emulsifier is adopted as a core of a repairing agent, polythiol (PETMP) stabilized by the emulsifier is adopted as a core of a curing agent, and the emulsifier is cellulose nanofiber, so that the insulating paper with self-repairing performance is prepared. The dielectric constant, the breakdown field strength, the tensile strength, the elongation at break and the thermal stability of the insulation paper are superior to those of traditional cellulose insulation paper, and the overall performance and the service life of the insulation paper can be effectively improved.

The invention discloses benzoxazine modified epoxy resin as well as a preparation method and application thereof. The benzoxazine modified epoxy resin comprises the following components in parts by weight: 40-80 parts of benzoxazine resin, 20-60 parts of epoxy resin, 7-22 parts of a curing agent and 0-1 part of a toughening agent. The high-temperature type benzoxazine modified high-temperature type epoxy resin particularly comprises benzoxazine resin with ethynyl and / or allyl and bisphenol A type or bisphenol F type benzoxazine resin, and naphthalene type epoxy resin or bisphenol F type epoxy resin containing two or more epoxy functional groups. The high-temperature-resistant epoxy resin can be mixed for use, such as four-functionality bisphenol F epoxy resin, on the premise that the mechanical strength of the high-temperature-resistant epoxy resin is reserved, the high-temperature resistance of an epoxy resin curing system can be kept, and the dielectric constant is remarkably reduced. The curing agent further improves the mechanical properties. The preparation and curing method is simple and convenient, the raw materials are easy to obtain, and the cured material has excellent characteristics of high-temperature-resistant, high-toughness and low-dielectric materials.

The invention discloses a low-temperature polyether demulsifier for oil and gas gathering and transportation and a preparation method thereof, and relates to the technical field of petrochemical engineering, and the preparation method is characterized by comprising the following steps: compounding cardanol, pentaethylenehexamine and bisphenol F according to a specific molar ratio to obtain an initiator, and carrying out formaldehyde condensation to prepare a composite initiator; epoxypropane and ethylene oxide are grafted through staged block copolymerization to form a polyether skeleton; introducing a fluorine-containing epoxy monomer to carry out terminal fluorination modification; finally, adipic acid and epichlorohydrin are subjected to chain extension crosslinking, and the demulsifier with the molecular weight being 8000-12000 Da, the fluorine content being 5.5-6.5 wt% and the PDI being smaller than or equal to 1.3 is prepared. The low-temperature demulsifying agent has the effects of realizing efficient demulsification at low temperature, improving the demulsifying efficiency and reducing the dosage through coordination of the composite initiator, super-hydrophobic permeation of the fluorinated block and accurate regulation and control of the molecular weight, solving the problems of low-temperature failure and easiness in emulsification of a traditional demulsifying agent, and meeting the requirements of low-temperature working conditions of oil and gas gathering and transportation.

The invention provides a double-component load-bearing adhesive and a preparation method thereof. The adhesive comprises a component A and a component B in a mass ratio of 1: (0.2-0.5), the component A comprises the following raw materials in parts by weight: 50 parts of epoxy resin; 20-40 parts of glass fiber, 20-40 parts of glass fiber, and 20-40 parts of glass fiber, based on 50 parts of epoxy resin; 2-10 parts of aluminum oxide; 10 to 20 parts of aluminum hydroxide; 1-13 parts of a plasticizer; 0.05 to 1 part of a modifier; wherein the epoxy resin comprises bisphenol A type epoxy resin, bisphenol F type epoxy resin and alicyclic epoxy resin; the component B comprises the following raw materials in parts by weight: 100 parts of a curing agent and 0-5 parts of an auxiliary agent based on 100 parts of the curing agent; wherein the curing agent comprises polyethylene polyamine, polyether amine, phenolic aldehyde amine and polyamide. The adhesive has excellent bonding strength, compression strength, toughness and heat resistance, and is suitable for fixing the bearing point of the LNG / LPG storage tank.

The invention relates to the technical field of nano composite materials, and particularly discloses a super wear-resistant self-lubricating carbon nano polymer and a preparation process thereof. The invention discloses a super wear-resistant self-lubricating carbon nano polymer which is prepared from the following raw materials in parts by weight: 35-50 parts of phenolic resin, 5-10 parts of bisphenol F resin, 0.2-1 part of a defoaming agent, 5-10 parts of modified phenolic resin fiber, 1-1.5 parts of pretreated graphene, 5-10 parts of polytetrafluoroethylene, 12-18 parts of nano aluminum oxide, 6-10 parts of talcum powder, 0.5-3 parts of zirconium oxide, 0.2-1 part of a flatting agent and 1-5 parts of silicon carbide. 0.2-1 part of an antioxidant, 0.2-1 part of an ultraviolet absorbent and 25-35 parts of cardanol. The super-wear-resistant self-lubricating carbon nano polymer prepared by the invention has the advantages of good toughness and good wear resistance.

Disclosed is a process for making a polyarylether sulfone "PAES" (P2) using recycled polymeric material, the process comprising: heating a reaction medium (RM) comprising recycled polymeric material comprising a polyarylether sulfone "PAES" (P1), at least one monomer (M), a basic salt-forming agent (A), and a polar aprotic solvent (S) to reach a reaction temperature of at least 150 DEG C to form the PAES (P2); and separating the formed PAES (P2) from the reaction medium. The PAES (P1) recycle ratio may be from 100 wt.% to 1 wt.%. The recycled polymeric material added to the reaction medium may further include other one or more polymers, solid fillers, and / or additives. The monomer (M) may be at least one aromatic diol monomer (AA) and / or at least one aromatic dihalogenated monomer (BB). The diol (AA) may include bisphenol A, bisphenol S, diphenol, 1, 4: 3, 6-dianhydrohexitol sugar diol, and / or tetramethyl bisphenol F, and the dihalo (BB) may include an unsulfonated and / or disulfonated dihalo diphenyl sulfone.

The invention discloses a high-temperature-resistant and weather-resistant epoxy resin adhesive and a preparation method thereof, and belongs to the field of epoxy resin adhesives, the adhesive can keep stable bonding strength for a long time at high temperature through the synergistic effect of hydrogenated bisphenol F type epoxy resin, silicon-containing phenyl glycidyl ether epoxy resin and a dicyandiamide-imidazole composite curing agent, and the adhesive has high temperature resistance and weather resistance. According to the present invention, the graphene aerogel is added to the silicon-containing phenyl glycidyl ether epoxy resin to meet the high temperature environment use requirement, and the silica bond in the silicon-containing phenyl glycidyl ether epoxy resin and the aging resistance of the graphene aerogel enable the adhesive to have characteristics of excellent ultraviolet aging resistance, excellent thermal cycling resistance and excellent moisture resistance, solve the performance defects of the traditional product, and be suitable for the application in the high temperature and severe environment, the method has an important practical value.

The invention provides a high-adhesion bottom filling adhesive, a preparation method thereof and a chip packaging structure, and relates to the technical field of chip packaging, the bottom filling adhesive comprises the following components by mass: 45%-64% of epoxy resin, 35%-55% of an amine curing agent, 0.1%-0.4% of an accelerator, and 0.1%-0.3% of carbon black; wherein the epoxy resin is bisphenol F type epoxy resin or bisphenol A type epoxy resin. By adjusting the formula proportion of the bottom filling glue and adopting single epoxy resin to be combined with the amine curing agent and the accelerant, the glue solution of the bottom filling glue can be quickly gelled and surface-dried on the surface of the flexible PI substrate, gap filling between the flexible PI substrate and the chip is completed, high adhesive force is achieved after curing, and packaging of the chip is achieved.

The invention relates to the technical field of fireproof plate preparation, in particular to a novel light fireproof plate and a preparation method thereof.The method comprises the steps that PVC, phenolic resin, bisphenol F glycidyl ether epoxy resin, polyamide and a foaming agent are mixed and stirred, then a plasticizer, a flame retardant and a foaming regulator are added, stirring continues to be conducted, and foaming treatment is conducted; in the foaming process, the foaming temperature difference of each measurement position is analyzed, the environment temperature of PVC foaming is intelligently controlled in combination with a PID controller, and a foam base material is obtained after foaming treatment; the method comprises the following steps: sanding and dedusting a foam base material, coating resin on the surface of the foam base material, then coating a fireproof layer to obtain an intermediate product, stacking and cold-pressing multiple layers of intermediate products, naturally curing to form a semi-finished product, cutting off redundant parts on the edge, and removing burrs to obtain the PVC foaming light fireproof plate. The problem of uneven foaming in the foaming process of fireproof plate preparation can be avoided, and the preparation quality of the fireproof plate is improved.

The present application discloses an anti-rust water-based paint for AGV forklift and a preparation method thereof, the water-based paint comprises components A, B and C, component A comprises: water-based epoxy resin, defoamer, leveling agent, wetting agent, dispersant, wear-resistant filler, rust inhibitor, anti-settling agent, deionized water; component B comprises curing agent and water; component C is zinc powder; the water-based epoxy resin is prepared by dispersing a main epoxy resin and an organosilicon-modified epoxy resin in an emulsifier solution, the main epoxy resin is a bisphenol F type epoxy resin, and the organosilicon-modified epoxy resin is prepared by reacting bisphenol A type epoxy resin, diphenyl dihydroxy silane, and silane-modified polyether under the catalysis of an organotin catalyst. The water-based paint of the present application has excellent comprehensive properties, and its paint film is superior in flexibility, hardness, low temperature resistance and wear resistance.

The invention relates to the technical field of epoxy resin, in particular to self-repairing epoxy resin and a preparation method thereof. The self-repairing epoxy resin is prepared from the following raw materials in parts by mass: 80 to 120 parts of bisphenol A type epoxy resin, 20 to 40 parts of bisphenol F type epoxy resin, 5 to 15 parts of 1, 6-hexanediol diglycidyl ether, 1 to 3 parts of 3, 5-dimethylphenylboronic acid, 1 to 5 parts of furyl maleimide, 10 to 20 parts of dodecanedioic acid, 5 to 15 parts of butanetetracarboxylic acid, 1 to 3 parts of catalyst, 10 to 15 parts of nano silicon dioxide, 1 to 2 parts of boron nitride nanosheet and 1 to 2 parts of hyperbranched polyamidoamine. The curing agent is prepared from the following components in parts by weight: 20-30 parts of epoxy resin, 1-2 parts of sulfydryl-terminated polysiloxane, 20-30 parts of amine curing agent, 5-15 parts of reinforcing filler and 0.5 According to the invention, the balance among self-repairing capability, mechanical property and heat resistance is successfully realized; in the microcrack propagation process, fracture and recombination mechanisms of dynamic covalent bonds effectively prevent further propagation of cracks.

The invention relates to a marine epoxy resin composite material. The marine epoxy resin composite material is characterized by comprising the following components in parts by mass: 100 parts of epoxy resin, 20-30 parts of a curing agent, 100-120 parts of a reinforcing material, 2050 parts of hollow microsphere filler and 5-15 parts of a flame retardant, the epoxy resin is one or a mixture of two of bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyphenol type glycidyl ether epoxy resin or aliphatic glycidyl ether epoxy resin. When in use, the marine epoxy resin composite material disclosed by the invention has the advantages of excellent comprehensive performance, corrosion resistance, flame retardance, water resistance, high strength, light weight and the like, still has excellent performance retention rate after being soaked in water for several days, and is more suitable for complex and severe working conditions on a ship.

The invention discloses a bisphenol F degradation gene cluster bpf and application thereof. The strain DN12 is separated and can degrade the BPF and grow by taking the BPF as the unique carbon source and energy. On the basis, a BPF degradation gene cluster bpf is obtained from the strain DN12 by adopting whole genome and comparative transcriptome sequencing analysis. Three different degrading enzymes (two-component oxidase BpfAB, monooxygenase BpfC and hydrolase BpfD) are found in the gene cluster and can catalyze gradual degradation of BPF, and a simple aromatic ring compound p-hydroxybenzoic acid is generated.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention relates to the technical field of building materials for concrete, in particular to a high-performance two-component epoxy pouring adhesive for underwater cracks of concrete and a preparation method of the high-performance two-component epoxy pouring adhesive for the underwater cracks of the concrete. The epoxy pouring adhesive which is low in viscosity, high in underwater bonding strength, free of whitening underwater, excellent in mechanical property, high in chemical corrosion resistance and super-hydrophobic is prepared by taking epoxy resin as a main component, taking bisphenol A epoxy resin, bisphenol F epoxy resin and an epoxy coupling agent as well as adopting a specially-made modified amine curing agent and an amino coupling agent as curing agent components. The method can be used for repair engineering of various concrete underwater crack environments and concrete wet crack environments.

The invention provides bisphenol type benzoxazine resin and a preparation method thereof, and relates to the field of materials, the benzoxazine resin is diallyl bisphenol F type benzoxazine resin, and the benzoxazine resin is terminated by a phenolic group to form a benzoxazine group or terminated by an amino group to form a benzoxazine group. According to the bisphenol type benzoxazine resin provided by the technical scheme provided by the invention, bisphenol F is used as a phenol raw material, but the bisphenol type benzoxazine resin which is good in stability and better in dielectric property, strength and elongation at break is accidentally obtained.

The invention provides an ammonia-free halogen-free high-flame-retardant phenolic moulding plastic. The ammonia-free halogen-free high-flame-retardant phenolic moulding plastic is prepared from the following raw materials: dimethylene ether type thermosetting phenolic resin, hydroxymethyl type thermosetting phenolic resin, bisphenol F phenolic resin, cellulose, glass fibers, a flame retardant, a curing accelerator and a release agent. The invention also provides a preparation method of the ammonia-free halogen-free high-flame-retardant phenolic moulding plastic. The prepared and molded product is ammonia-free and halogen-free, has the advantages of high flame retardance, high temperature resistance, good mechanical strength and excellent electrical performance, and can meet the requirements of high-end electronic and electric appliance accessory materials.

The invention discloses PCB (printed circuit board) through hole plugging resin which is prepared from the following raw materials in parts by weight: 35-100 parts of epoxy resin composition, 5-15 parts of curing agent, 1-10 parts of curing accelerator and 0.1-5 parts of assistant. By adopting the combination of the bisphenol A epoxy resin, the bisphenol F epoxy resin and the trifunctional epoxy resin, the prepared hole plugging resin is easy to plug holes, not easy to sag and excellent in hole plugging performance. The thermosetting resin composition is used for permanently filling the through hole in the printed circuit board, has the properties of low viscosity, easiness in hole filling, good sagging resistance and high glass transition temperature, not only can meet the requirements of an existing vacuum hole filling machine, but also can meet the hole filling requirements on high efficiency and high cost performance in a complex printed circuit board.

The invention belongs to the technical field of automatic control, and particularly relates to an intelligent temperature control method for a bisphenol F type epoxy resin reaction kettle, which comprises the following steps: acquiring the temperature in the kettle, the frequency of a stirring motor and the flow of cooling water, and carrying out de-noising treatment; obtaining a dynamic viscosity thermal resistance operator based on the processed frequency of the stirring motor and the processed temperature in the kettle, and quantifying the heat transfer obstruction degree caused by the viscosity change of the material; obtaining a thermal inertia compensation driving operator by combining the target set temperature and the dynamic viscosity thermal resistance operator; the power of the heating actuator is obtained based on the thermal inertia compensation driving operator and the static balance power, and the input current of the heating actuator is adjusted through mapping and the cooling water flow is cooperatively adjusted. By sensing the thermal resistance dynamic state in a variable viscosity environment and performing feedforward compensation, the problem of temperature overshoot caused by large lag of the reaction kettle is solved, and the stability of the reaction process is improved.

The embodiment of the invention provides a plastic-coated steel pipe and a plastic coating process thereof, and relates to the technical field of plastic-coated steel pipes. The plastic-coated steel pipe comprises a steel pipe base body, a metal transition layer, an inner anticorrosive coating, a fiber reinforced winding layer and an outer protective coating are sequentially arranged on the outer surface of the steel pipe base body from inside to outside, and the metal transition layer is a nickel-chromium-aluminum-yttrium alloy layer and is formed on the surface of the steel pipe base body through a supersonic plasma spraying process. And the inner anticorrosive coating is formed by a mixture of bisphenol F type epoxy resin and novolac epoxy resin, and is doped with silicon nitride and zirconium oxide composite nanoparticles subjected to surface treatment. By arranging a multi-stage composite structure of the metal transition layer, the high-temperature-resistant anti-corrosion coating, the fiber reinforcement layer and the self-repairing outer layer and arranging the detachable heat insulation sheath, the interface bonding strength, heat resistance, mechanical damage resistance and corrosion resistance of the plastic-coated steel pipe are improved; and the service life of the composite material in high-temperature, strong-corrosion and complex construction environments is effectively prolonged.

The present invention provides a highly weather-resistant adhesive and a preparation method thereof. The raw material components include, by weight, 20 to 80 parts of a resin mixture, 5 to 30 parts of an active diluent, 20 to 60 parts of an inorganic filler, 0.1 to 10 parts of an initiator, and 0.1 to 5 parts of an auxiliary agent; the resin mixture includes bisphenol A epoxy resin, bisphenol F epoxy resin, and polyurethane-modified epoxy resin. The polyurethane-modified epoxy resin can improve the flexibility and weather resistance of the adhesive. The polyurethane-modified epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, and the inorganic filler form a stable three-dimensional network cross-linked structure, which has the characteristics of high weather resistance and high adhesion, and has a high Tg, can work stably for a long time in low and high temperature environments, and has a wider application.

The invention discloses an adhesive tape with high stripping stability and a preparation process thereof. The adhesive tape comprises a PET (Polyethylene Terephthalate) base material subjected to corona treatment, an acrylic acid pressure-sensitive adhesive layer, a release layer and an antistatic liquid coating. The acrylic pressure-sensitive adhesive layer is composed of acrylate monomers, saturated polyester resin, bisphenol F, bisphenol A epoxy resin and amino resin. The preparation process comprises the steps of corona pretreatment of the polyethylene glycol terephthalate base material, coating of the antistatic liquid, coating of the pressure-sensitive adhesive, compounding of the release layer and curing treatment. The stripping force change rate of the adhesive tape after damp-heat aging and low-temperature aging is smaller than 5% and is far lower than the industrial standard, and the adhesive tape has excellent stripping stability, antistatic property and weather resistance and is suitable for the fields of electronic product protection, automobile paint spraying shielding and the like.

A conductive epoxy composition is disclosed comprising an epoxy resin, a low-viscosity hydrocarbon diluent, silver, and graphene. The one-part formulation provides enhanced electrical conductivity, mechanical strength, and process stability. The epoxy resin may include resorcinol diglycidyl ether, diglycidyl ether of Bisphenol A, or Bisphenol F. The hydrocarbon diluent may include glycidyl-ether-family resins having defined carbon-chain characteristics and molecular weights. Silver may be present in particulate, flake, nanoparticle, or coated forms at about 55-90 wt. %, while graphene may be present at 0.03-0.3 wt. % with dimensions of 1-10 μm and surface areas of 400-2,000 m2 / g. Optional additives include solvents, ionic liquids, latent curing agents, and strength enhancers to optimize curing and adhesion.

The invention relates to the technical field of epoxy resin coatings, in particular to a radiation-resistant self-repairing epoxy resin coating and a preparation method thereof. The radiation-resistant self-repairing epoxy resin coating comprises the following raw materials: a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is (50-70): (40-50): (10-20); the component A comprises the following raw materials in parts by mass: 50-60 parts of bisphenol F epoxy resin, 8-12 parts of calix [5] arene, 1-2 parts of zinc acetylacetonate and 15-20 parts of a solvent; the component B is prepared from the following raw materials in parts by mass: 30 to 40 parts of octamethylcyclotetrasiloxane, 5 to 10 parts of gamma-aminopropyltriethoxysilane, 1 to 3 parts of vanillin, 0.5 to 1 part of a catalyst and 0.1 to 0.3 part of p-toluenesulfonic acid; and the component C is an amine curing agent.

The invention provides a high-flexibility low-temperature fast curing powder coating for reinforcing steel bars as well as a preparation method and application thereof, and belongs to the technical field of powder coatings. The powder coating comprises the following components in parts by mass: 180-200 parts of high-toughness epoxy resin, 45-48 parts of a high-toughness phenolic curing agent, 6-8 parts of a flatting agent, 2-4 parts of a brightener, 1-2 parts of benzoin and 55-70 parts of pigment filler. The high-toughness epoxy resin is obtained by polymerizing bisphenol F diglycidyl ether, 1, 10-decanediol, glyceryl monobutyrate, hexamethylene diisocyanate, dodecanedioic acid, triglycidyl p-aminophenol and the like; the high-toughness phenolic curing agent is obtained by polymerizing bisphenol F diglycidyl ether, 1, 4-butanediol diglycidyl ether and bisphenol F. The coating is used for low-temperature rapid curing molding on the surface of the reinforcing steel bar to obtain a coating, and has excellent bending resistance and corrosion resistance.

The invention relates to the field of resin coatings, and particularly discloses a coating containing a resin composition as well as a preparation method and application of the coating. The coating containing the resin composition is prepared from the following raw materials: the resin composition, a curing agent and an auxiliary material mixture, and the weight ratio of the resin composition to the curing agent to the auxiliary material mixture is 100: (30-50): (50-150). Wherein the resin composition is formed by compounding triglycidyl isocyanurate, bisphenol F type episulfide resin and tetraglycidyl amine type epoxy resin. The preparation method comprises the following steps: respectively adding the auxiliary material mixture into the resin composition and the curing agent according to a certain ratio, uniformly mixing, and then mixing to finally obtain the coating containing the resin composition, the test shows that the coating has good bonding strength, high temperature resistance, acid corrosion resistance, rapid cooling resistance and rapid heating performance, the surface drying time meets the construction requirement, and the coating has good application prospects. The coating can be applied to the inner wall coating of the wet desulphurization chimney.

The invention discloses flame-retardant electrical epoxy resin and a preparation method thereof in the field of epoxy resin. The flame-retardant electrical epoxy resin is prepared from the following components in parts by weight: 70 to 80 parts of bisphenol F epoxy resin, 20 to 30 parts of alicyclic epoxy resin, 20 to 40 parts of benzoxazine resin monomer, 50 to 70 parts of curing agent and 0.5 to 1.5 parts of curing accelerator. Through the functionalized benzoxazine resin monomer containing the diphosphorus structure, optimization of epoxy resin formula components and improvement of a preparation process, synergistic improvement of flame retardance, electrical insulation performance, heat resistance and mechanical performance is achieved.

The invention provides an antistatic epoxy packaging film and a preparation method thereof, and a filter chip packaging structure, and relates to the technical field of filter chip packaging, the antistatic epoxy packaging film comprises the following components by mass: 46%-60% of silica, 17%-25% of epoxy resin, 2%-5% of phenoxy resin, 18%-24% of a phenolic curing agent, 0.3%-0.5% of an imidazole accelerator, and 0.2%-0.3% of carbon black; the epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50000-53000, and the phenolic aldehyde curing agent is composed of solid phenolic resin and liquid phenolic resin; the antistatic epoxy resin packaging film is prepared by introducing the antistatic epoxy resin and adopting a specific formula proportion, the antistatic epoxy packaging film has excellent antistatic property and mechanical property, and after a filter chip is packaged, filter products which are packaged perfectly and qualified can be quickly screened out through a sorting machine.