25 results about "Bisphenol F" patented technology

The application relates to the technical field of paint, in particular to a two-component epoxy strong-acid-and-strong-base-resistant heavy-duty paint and a preparation method thereof, which comprises a main paint and a curing agent, the main paint contains a compounded system of bisphenol A epoxy resin and bisphenol F epoxy resin, a composite diluent, a functional filler synergized by flaky glass flake and spherical filler, a silane coupling agent and a special anti-rust pigment; the curing agent is compounded by polyamide, phenolic amine, modified alicyclic amine and modified aliphatic amine, the paint has high solid content and low VOC, has strong adhesion to various substrates, has a bottom-surface-combined function in a single coating layer, is resistant to strong acid, strong base and extreme corrosive environment, is simple to construct, is fast to cure and has a long service life.

This invention relates to the field of epoxy resin composite materials technology, specifically to an environmentally friendly epoxy resin composite material for the lining of fructose syrup storage and transportation tanks and its preparation method. The composite material of this invention consists of bisphenol F type epoxy resin, a flexible curing agent, nano-antibacterial reinforcing fillers, and additives. The flexible curing agent is a dimer acid-polyetheramine-cashew phenol Mannich base condensation polymer, and the nano-antibacterial reinforcing filler is nano-TiO2@ε-polylysine-silane coupling agent hybrid particles. The composite material of this invention possesses excellent flexibility, acid resistance, antibacterial properties, and low water absorption; it also exhibits strong adhesion, no migration of heavy metals or toxic organic antibacterial agents, and meets food contact safety regulations, making it suitable for the lining protection of fructose syrup storage and transportation tanks.

This invention discloses a micro / nano anti-corrosion coating and its preparation method, belonging to the field of marine engineering anti-corrosion technology. It includes component A and component B. Component A comprises bisphenol F type epoxy resin, cashew phenol glycidyl ether, KH560 modified zinc phosphate, aminated nano-silica, aluminum tripolyphosphate, wetting and dispersing agent, anti-settling agent, composite UV stabilizer, and composite solvent. Component B comprises 100 parts of cashew phenol modified amine curing agent. This invention, using the aforementioned micro / nano anti-corrosion coating and its preparation method, achieves ultra-long salt spray resistance in marine atmospheric, splash, and full immersion conditions; significant self-inhibition ability of corrosion propagation after scratches; ultra-high interfacial bonding strength with metal substrates; and UV yellowing resistance that overcomes the weather resistance bottleneck of the cashew phenol system. It also possesses excellent industrial practicality and economic efficiency.

The application discloses a polyoxazolidinone prepared by heterogeneous catalytic bulk polymerization and a method, and belongs to the technical field of polymer material synthesis. The method comprises the following steps: uniformly mixing an antioxidant and a polyisocyanate, vacuum drying to obtain a mixed solution; uniformly mixing cardanol diglycidyl ether and bisphenol F diglycidyl ether, vacuum drying to form an epoxide composition; adding 1-butyl-3-methyl imidazole chloride and aluminum trioxide into mesoporous silica, and baking to obtain a supported heterogeneous catalyst; fully dispersing the composition and the catalyst, and then gradually adding the mixed solution under temperature rising, so that the conversion rate of an epoxy group reaches 68-72%; then, the mixed solution is gradually added under temperature rising, so that the conversion rate of the epoxy group is improved; finally, the mixed solution is gradually added under temperature rising, so that the reaction is completed; the filtered filtrate is degassed and granulated, and polyoxazolidinone particles are obtained, so that the purity, mechanical property and thermal stability of the polyoxazolidinone are improved.

The application discloses a wind power blade structural adhesive for wind power grade CFRP reinforcing bars and a preparation method thereof, and relates to the technical field of high-performance composite material bonding for wind power blade manufacturing. The adhesive comprises component A and component B. The component A comprises the following raw materials in parts by weight: bisphenol A type epoxy resin, 40-70 parts; bisphenol F type epoxy resin, 20-40 parts; core-shell powder particle dispersion, 10-20 parts; active diluent, 5-10 parts; silane coupling agent, 0-8 parts; and filler, 20-35 parts. The component B comprises the following raw materials in parts by weight: epoxy chloropropane modified MXDA, 40-50 parts; PTMEG polyether modified amine, 20-30 parts; accelerator, 0.5-2 parts; filler, 15-25 parts; and auxiliary agent, 3-5 parts. The weight ratio of the component A to the component B is as follows: component A: component B = 100: 25-40. The prepared structural adhesive has excellent flexibility and fatigue resistance, high strength and high bonding force, excellent high and low temperature resistance, low sensitivity to climate environment, and is compatible with the wind power blade manufacturing process, and is especially suitable for structural bonding of CFRP reinforcing bars.

The present application relates to the technical field of spraying material, in particular to a special spraying material for the surface of stainless steel tile, which comprises component A raw material and component B raw material.In the present application, the component A is compounded with bisphenol F epoxy resin and E51 epoxy resin as a film forming base material, which reduces the crosslinking density and brittleness of the epoxy curing system, relieves the interface stress generated by the difference in thermal expansion coefficient between the coating and the stainless steel substrate under temperature difference alternation, the treated hexagonal boron nitride in the filler has a lamellar structure, which further enhances the barrier property in cooperation with the flaky morphology of mica iron oxide, significantly inhibits the initiation and expansion of microcracks, thereby improving the adhesion stability and protective durability of the coating under long-term outdoor service conditions.

This invention relates to the field of semiconductor packaging materials technology, specifically to a wafer adhesive, its preparation method, and its application. It comprises the following raw materials in parts by weight: 60-95 parts of matrix resin, 10-20 parts of diluent, 3-8 parts of curing agent, and 1-5 parts of additives. The matrix resin is bisphenol F type epoxy resin, naphthol type epoxy resin, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, and 2,2'-[(3,3',5,5'-tetramethylbiphenyl-4,4'-diyl)bis(oxymethylene)]bis(ethylene oxide), with a weight ratio of (6-9):(3-5):(2-3):(1-2). This wafer adhesive has advantages such as good storage stability, high light transmittance, low stress, and strong heat resistance, and is suitable for wafer-level packaging processes of high-performance semiconductor devices such as optical sensors and MEMS.

This invention relates to the field of epoxy resin self-healing materials, specifically a self-healing encapsulation material and its preparation method. This invention solves the problem of the mutual exclusion between high crosslinking density and high repair efficiency in traditional self-healing materials. The self-healing encapsulation material is prepared by mixing bisphenol A type epoxy resin, terminal epoxy-terminated hyperbranched polysiloxane, aminated mesoporous silica loaded with bisphenol F resin, and a dual-dynamic bond curing agent containing imine and disulfide bonds, followed by stepwise curing. This invention achieves deep synergy between intrinsic network exchange of dual-dynamic covalent bonds and the release of exogenous repair agents from microcapsules, and utilizes hyperbranched siloxane to impart extremely high slippage to the chain segments, effectively accelerating the physical entanglement and chemical healing of the crack interface. Simultaneously, the aminated inorganic framework ensures the mechanical strength of the system through covalent anchoring. The resulting material possesses both high mechanical strength and excellent multi-microcrack self-healing capability.

The present application belongs to the field of automatic control technology, and particularly relates to a kind of bisphenol F type epoxy resin reaction kettle temperature intelligent control method, comprising: obtaining the temperature in the kettle, stirring motor frequency and cooling water flow and carrying out denoising processing;Based on the stirring motor frequency after processing and the temperature in the kettle after processing, obtain the dynamic viscosity thermal resistance operator, the degree of heat transfer resistance caused by the viscosity change of material is quantified;Combining target set temperature and dynamic viscosity thermal resistance operator to obtain thermal inertia compensation drive operator;Based on thermal inertia compensation drive operator and static balance power to obtain heating actuator power, the input current of heating actuator is adjusted by mapping, and the cooling water flow is adjusted coordinately.The present application perceives the thermal resistance dynamics in the environment of variable viscosity and carries out feedforward compensation, solves the temperature overshoot problem caused by the large lag of reaction kettle, and improves the stability of reaction process.

The application relates to a carbon-based conductive double-sided adhesive tape for a vanadium redox flow battery and a preparation method thereof, and belongs to the technical field of conductive adhesive, which comprises a support layer and adhesive layers attached to the upper and lower surfaces of the support layer, and the support layer is a polytetrafluoroethylene porous film; the raw materials of the adhesive layers comprise a matrix, conductive fillers, an additive and a solvent; the matrix comprises a PVDF-HFP copolymer and a bisphenol F type epoxy resin; the conductive fillers are a mixture of carbon nanotubes, graphene and flaky graphite; and the additive comprises a silane coupling agent and a fluorocarbon surfactant. The conductive double-sided adhesive tape prepared by the application has low contact resistance, high adhesive peeling strength, and can resist strong acid and strong oxidation environment of pentavalent vanadium ions, and can effectively adapt to the large-scale and rapid assembly requirements of the vanadium redox flow battery stack, and reduce the production cost.

This invention relates to the field of polymer materials technology, and discloses a reprocessable epoxy-based glass polymer material and its preparation method. The material comprises bisphenol F epoxy resin, phenyl glycidyl ether, triethylenetetramine, 1,4-phenylenediboric acid, and anhydrous zinc chloride or anhydrous ferric chloride. In the system, bisphenol F epoxy resin and triethylenetetramine crosslink to form a rigid main framework; phenyl glycidyl ether introduces suspended segments to reduce steric hindrance; 1,4-phenylenediboric acid constructs a dynamically covalent network with interface reconstruction; and metal salts form a physical coordination network that inhibits segment slip at room temperature. The preparation method includes steps such as prepolymerization, azeotropic dehydration condensation, metal coordination, and phase separation precipitation hot pressing. This invention constructs an epoxy-boronate hybrid network, enabling the material to possess high elastic modulus and fracture strength at room temperature, while allowing for pulverization and reprocessing through topological exchange of dynamic bonds under heating conditions at 100°C.

This invention relates to the field of epoxy resin coating technology, specifically to a high-shield epoxy glass flake anti-corrosion coating and its preparation process. This invention overcomes the problem in existing epoxy glass flake anti-corrosion coatings that cannot simultaneously achieve both anti-corrosion performance and adhesion performance. The anti-corrosion coating of this invention is obtained by mixing an epoxy active component and a modified curing agent. The epoxy active component is a mixed epoxy resin of bisphenol A and bisphenol F, with the introduction of a polyurethane-modified epoxy prepolymer and a reactive UV absorber for toughening and chain extension, combined with polydopamine-modified glass flakes and silanized graphene oxide. The modified curing agent is a cashew phenolic amine modified with a silane coupling agent. Through a segmented cooling and stirring process, the glass flakes are arranged in an orderly layered manner within the coating, resulting in a coating with excellent shielding and anti-corrosion properties, suitable for long-term protection of steel structures in extreme corrosive environments.

The application relates to the technical field of paint, in particular to a high-solid heavy-duty modified epoxy paint and a preparation method thereof, which comprises a main paint and a curing agent, the main paint contains bisphenol A epoxy resin, bisphenol F epoxy resin, toughened epoxy resin, active diluent, functional filler and special anti-rust pigment, and the curing agent is a polyamide and modified alicyclic amine compound system, the paint has a solid content of greater than or equal to 90%, a VOC of less than or equal to 100 g / L, a single-coat film forming thickness of 500 micrometers, and excellent flexibility, fast drying property, cathode peeling resistance and long-acting corrosion resistance.

This invention relates to the field of carbon fiber surface treatment and composite material technology, and discloses a sizing agent and a carbon fiber composite material and its preparation method. The disclosed sizing agent, by weight parts, comprises: 25-35 parts of a low-hydroxyl-type moisture-resistant epoxy resin, 8-15 parts of an epoxy-terminated acylhydrazone-PAI prepolymer, 15-25 parts of epoxy silane-modified lignin, 6-10 parts of phytosterol polyoxyethylene ether, 2-5 parts of a diamine-containing urea dynamic crosslinking agent, and 50-60 parts of water; the low-hydroxyl-type moisture-resistant epoxy resin is selected from at least one of bisphenol S epoxy resin and bisphenol F epoxy resin. The sizing agent emulsion provided by this invention has good stability, and the carbon fiber exhibits low moisture regain after sizing; its reinforced composite material has high shear strength retention, high impact strength recovery, and low water absorption under humid and hot environments, making it suitable for extreme humid and hot environments such as aerospace and marine engineering.

The application discloses a partition functionalized underfill adhesive for large-area AI chip packaging and a preparation method, and belongs to the technical field of electronic packaging materials. The partition functionalized underfill adhesive is sequentially divided into a center region, a transition region and an edge region from inside to outside along a chip bonding surface. The center region is compounded by bisphenol F-naphthalene type epoxy resin and AlN@BN core-shell fillers, and has high modulus, low thermal expansion coefficient and high thermal conductivity. The edge region is compounded by epoxy-silicone interpenetrating network polymer and elastic core-shell fillers, and has low modulus and high elasticity. The transition region is obtained by gradient mixing of the center and edge adhesives, realizes continuous transition of mechanical and thermal properties, and eliminates interface mutation. The application also provides a corresponding preparation method. After the partition functionalized underfill adhesive is packaged, the chip warping amount is less than 20 mu m, the temperature cycle reliability is significantly improved, the HBM stacking and glass / organic substrate can be adapted, and the application is suitable for high-power large-area AI chip packaging.

The application provides a high-heat-resistance self-repairing epoxy resin based on a dynamic disulfide bond, a preparation method thereof, a fiber-reinforced composite material and application, and belongs to the technical field of intelligent composite materials. The preparation method comprises the following steps: S1. mixing bisphenol F diglycidyl ether and 4,4'-methylene di(N,N-diglycidyl aniline), heating and stirring until the mixture is uniform to obtain a mixed epoxy base; S2. mixing the mixed epoxy base with a curing agent 4,4'-diamino diphenyl disulfide, heating and stirring until the mixture is uniform, and then performing vacuum degassing treatment to obtain a prepolymer; and S3. performing a stepwise temperature rising curing reaction on the prepolymer to obtain the high-heat-resistance self-repairing epoxy resin. The high-heat-resistance self-repairing epoxy resin prepared by the application not only retains the inherent high strength and process stability of high-performance epoxy resins, but also is endowed with excellent intelligent damage repair function, the Tg of the high-heat-resistance self-repairing epoxy resin is much higher than that of conventional self-repairing materials, and the mechanical properties, heat resistance and high-efficiency self-repairing capability are simultaneously considered.

This invention relates to a salt spray resistant and anti-aging curing coating and its preparation method, belonging to the field of coating technology. The coating includes modified epoxy resin, ternary nanocomposite filler, composite light stabilizer, hydrophobic eutectic solvent, polysiloxane-modified aromatic amine curing agent, and bio-based polyurethane curing agent. The modified epoxy resin is prepared by reacting bisphenol F epoxy resin, KH-560 silane coupling agent, and tetrabutylammonium bromide, followed by the addition of bi-terminated epoxy silicone oil, 3,3'-dithiodipropionic acid, and p-toluenesulfonic acid, and then by adding pentaerythritol phosphate and antioxidant 1010. The polysiloxane-modified aromatic amine curing agent is prepared by reacting m-phenylenediamine as a matrix, KH-560 silane coupling agent, diphenylsilanediol, and dibutyltin dilaurate. The bio-based polyurethane curing agent is prepared by reacting castor oil-modified polyol, isophorone diisocyanate, dibutyltin dilaurate, dimethylolpropionic acid, and trimethylolpropane.

The application belongs to the technical field of packaging materials, and particularly relates to an epoxy resin composite material for electronic packaging bottom filling and a preparation method thereof; wherein the epoxy resin composite material for electronic packaging bottom filling comprises the following raw materials in parts by weight: 20-40 parts of bisphenol F type epoxy resin, 30-40 parts of composite filler, 50-70 parts of modified epoxy resin, 8-15 parts of butyl glycidyl ether, and 0.5-2 parts of silane coupling agent; the modified epoxy resin introduces a naphthalene ring structure and a siloxane side chain, and the molecular structure is optimized through hindered phenol modification, so that the stability and stress adjustment capacity of the resin are improved; the composite filler is subjected to multiple modification treatments of mechanical chemical alloying, surface activation and phosphate ester grafting, so that the uniform dispersion of the two components is realized, the compatibility with the resin system is more significantly improved, filler aggregation is effectively avoided, and the interfacial bonding force of the composite material is enhanced.

The application relates to the technical field of pipeline repair, and discloses a pipeline trenchless repair material and a preparation method thereof. The repair material is a two-component solvent-free thixotropic fluid, which is composed of component A and component B. The component A takes bisphenol A type and bisphenol F type liquid epoxy resin as a matrix, and is matched with hydrophilic fumed silica and quartz powder to build a thixotropic network. The component B contains a reaction product of tall oil fatty acid and triethylenetetramine, benzyl alcohol, an alicyclic amine curing agent, an aromatic amine curing agent and a tertiary amine accelerator. The amine curing system and the thixotropic adjustment are compounded, so that the problems of easy flow hanging in vertical surface construction and low bonding strength on a wet base surface of the existing material are effectively solved. The material has excellent thixotropy, wet surface bonding strength and chemical corrosion resistance, is dense after curing, has low shrinkage, and has no solvent residue, and is particularly suitable for trenchless in-situ repair construction of underground drainage pipelines.

This invention provides an elastic epoxy resin grouting material, its preparation method, and its application. The elastic epoxy resin grouting material comprises a first component and a second component. The first component includes: bisphenol F type epoxy resin, epoxy resin reactive diluent, alcohol-based inactive diluent, reactive phase separation toughening agent, and interface treatment agent. The second component includes: a quaternary Mannich reaction curing agent, a chain extender, a compound curing aid, and an amine moisture stabilizer. The quaternary Mannich reaction curing agent is prepared by a Mannich reaction of cashew nut shell phenol, N-aminoethyl piperazine, paraformaldehyde, and polypropylene glycol diglycidyl ether, and has the structure shown in formula (I): (I) where n is 5~10. The reactive phase separation toughening agent includes any one of carboxyl-terminated butadiene nitrile rubber, amino-terminated butadiene nitrile rubber, and polyethersulfone. The compound curing aid includes a tertiary amine curing agent and an organic acid.

This invention relates to the field of curtain wall construction technology and discloses a method for preventing loosening of aluminum profile connection nodes in curtain walls. The method includes the following steps: preparing component A and component B of a chemical sealing composition. Component A comprises a prepolymer of carboxyl-terminated butadiene-acrylonitrile rubber and bisphenol F type epoxy resin, bisphenol F type liquid epoxy resin, an azeotropic solvent, KH-560 coupling agent, flake zinc powder, and fumed silica. Component B comprises a phenolic amine curing agent and an accelerator. The bonding surfaces and bolt holes of the aluminum profile components are cleaned. A neoprene rubber pad is embedded between the metal interfaces. Fastener assembly and calibration are performed using a fastener pair. Initial pre-tightening is performed according to the design torque, followed by a static pause to release stress and then cross-tightening. The two components are mixed, coated onto the nodes, and cured. This invention combines step-by-step fastening with in-situ chemical cross-linking locking, utilizing rubber pads to block electrical pathways, and employing sacrificial anode protection with zinc powder, thus solving the problems of preventing loosening of dissimilar metal interfaces and galvanic cell corrosion under wind loads and temperature changes.

The application provides a high-temperature-resistant epoxy system, a preparation method and application thereof, and belongs to the field of advanced materials. The high-temperature-resistant epoxy system comprises the following raw materials in parts by weight: bisphenol F epoxy resin 5-35 parts, trifunctional epoxy resin 5-25 parts, tetrafunctional epoxy resin 5-25 parts, curing agent 40-80 parts, and accelerator 0.2-10 parts. The epoxy system of the application adopts epoxy resins with different functionalities, adjusts the crosslinking density of the epoxy system through formula design, realizes the purpose of simultaneously improving the glass transition temperature (T g ) and thermal stability of the epoxy system, and the prepared epoxy system has excellent flowability, processability and long-term temperature resistance, so that the epoxy system has a wide application prospect in the field of high-temperature-resistant sealing materials.

This invention belongs to the field of epoxy resin technology, specifically relating to a low-viscosity, high-penetration epoxy resin adhesive, its preparation method, and its application. The prepared low-viscosity, high-penetration epoxy resin adhesive comprises the following components in parts by weight: 45-55 parts bisphenol F type epoxy resin, 15-20 parts bis((3,4-epoxycyclohexyl)methyl)adipate, 25-35 parts curing agent, 5-15 parts reactive diluent, 3-8 parts toughening agent, 0.5-1 part nano-silica, 0.5-2 parts siloxane coupling agent, 1-2 parts accelerator, and 0-0.5 parts penetrant. The preparation method includes the following steps: S1. Mixing and dehydration; S2. Ultrasonic dispersion for 20 min to obtain a mixture; S3. Heating the accelerator to 60℃ to melt, then adding the nano-silica and stirring for 1 h before adding it to the mixture obtained in step S2, and mixing evenly; S4. Curing and degassing to obtain the product. The low-viscosity, high-penetration epoxy resin prepared by this invention has low viscosity, high tensile strength, and high penetration depth, which can meet the needs of multiple application scenarios. The preparation method is simple and easy to industrialize.

A curable resin composition which has high light sensitivity and good touch dryness and can obtain good flexibility, welding heat resistance and cross-sectional shapes, a dry film, a cured product and an electronic component. The curable resin composition comprises: (A) a carboxyl-containing resin having a bisphenol F backbone, (B) a photopolymerization initiator, (C) a photosensitive monomer, (D) an epoxy resin, and (E) an inorganic filler, wherein the photopolymerization initiator (B) comprises: (B1) an aminoacetophenone-based photopolymerization initiator, and (B2) a benzophenone-based photopolymerization initiator; and the photosensitive monomer (C) comprises: (C1) a di(meth)acrylate having a polypropylene glycol backbone.