977 results about "Bisphenol F" patented technology

A curable composition comprises epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, polyfunctional (meth)acrylate, dicyandiamide and photoinitiator. The curable composition is useful for preparing treated backings and coated abrasive articles.

Disclosed are Bisphenol A (BPA), Bisphenol F, Bisphenol A diglycidyl ether (BADGE), and Bisphenol F diglycidyl ether (BFDGE)-free coating compositions for metal substrates including an under-coat composition containing a polyester (co)polymer, and an under-coat cross-linker; and an over-coat composition containing a poly(vinyl chloride) (co)polymer dispersed in a substantially nonaqueous carrier liquid, an over-coat cross-linker, and a functional (meth)acrylic (co)polymer. Also provided is a method of coating a metal substrate using the BPA, BPF, BADGE and BFDGE-free coating system to produce a hardened protective coating useful in fabricating metal storage containers. The coated substrate is particularly useful in fabricating multi-part foodstuffs storage containers with “easy-open” end closures.

The invention discloses a method for synthesizing dihydroxy diphenyl methane with high 4, 4' site content by one stage process, relates to a method for synthesizing bisphenol F with high 4, 4' site content and provides a method for synthesizing dihydroxy diphenyl methane with high 4, 4' site content by one stage process, which reduces dosage of phenol and production cost and has yield of more than 60 percent. The method comprises the following steps: adding the phenol into a container provided with an electric stirrer, a thermometer and a reflux condensation tube, heating the phenol in water bath, adding phosphoric acid after the phenol is fully melted, stirring the mixture, and fully mixing the phenol and the phosphoric acid to obtain mixed solution; adding formaldehyde solution into the mixed solution, separating acid after reaction, neutralizing an oil phase by sodium bicarbonate, separating water and an organic phase, decompressing and distilling the mixed solution, removing the phenol and the water, and cooling, crystallizing and filtering the mixed solution to obtain products.

The invention relates to a chemical method for preparing organic silicon modified epoxy resin, aiming to solve the technical problems that the compatibility is not good and the efficiency is low in a modification process of organic silicon epoxy resin. The chemical method comprises the following steps of: adding epoxy resin (one of bisphenol A epoxy resin and bisphenol F epoxy resin), hydroxyl-terminated methyl phenyl polysiloxane (with the use amount of 20-50% of the mass of the epoxy resin) and a catalyst (which is 1-5% of the total mass of two components including the epoxy resin and the hydroxyl-terminated methyl phenyl polysiloxane) into a reactor; uniformly agitating and gradually raising the temperature to 60-140 DEG C, and reacting for 4-6 hours; after the reaction, lasting under the condition of 120-130 DEG C/5-10 mmHg for 0.5 hours; and desorbing low-boiling-point compounds, which are generated in the reaction, in vacuum to obtain the organic silicon modified epoxy resin.

The invention discloses a synthesis method for bisphenol F, in which aluminium chloride, titanium tetrachloride and modified cation exchange resin are adopted as catalysts, and phenyl hydroxide and formaldehyde are adopted as raw materials. The invention has the technical effects as follows: the aluminium chloride, the titanium tetrachloride and the modified cation exchange resin are adopted for catalysis to synthesize the bisphenol F, and the resin catalyst is easy to separate and recover and can be used repeatedly; 2, a recrystallization and reduced pressure distillation combined separation technology is adopted for coproduction of high-purity bisphenol F and common bisphenol F products, the maximum yield of the bisphenol F reaches 90 percent, the content of 4, 4'-bisphenol F in a dimethyl benzene recrystallization product reaches 93.5 percent, reduced pressure distillation after-products are mainly other two isomers, and the separation of the 4, 4'-bisphenol F is realized effectively; 3, the requirement for the concentration of the formaldehyde raw material is not strict while the traditional one stage process require that the concentration of formaldehyde is above 40 percent; and 4, the synthesis technology is simple, the operation is convenient, and the realization of industrial production is easy.

The invention relates to wear-resistant epoxy glue and a preparation method thereof. The epoxy glue is prepared by mixing a component A and a component B based on a weight ratio of (100:11.1)-(100:13.3), wherein the component A comprises the following raw materials in parts by weight: 10-20 parts of liquid epoxy resin, 10-20 parts of bisphenol F epoxy resin with modified nano rubber particles, 2.5-5 parts of epoxy resin activity diluent, 0.5-1.0 part of coupling agent, 53-61 parts of aluminum oxide ceramic microsphere, 4-6 parts of white alundum powder, 3-5 parts of glass fiber powder, 0.5-1.2 parts of chopped nylon fiber and 1-2 parts of gas-phase silicon dioxide; and the component B comprises the following raw materials in percentage by weight: 55-65 parts of polyamide, 12-18 parts of isophorone diamine, 4-7.5 parts of AEPHP (N-Aminoethylpiperazine), 1-2 parts of solidification accelerating agent, 8-10 parts of kaolin, 3-6 parts of glass fiber powder and 3-5 parts of gas-phase silicon dioxide. The preparation method comprises the following steps: preparing the bisphenol F epoxy resin with modified nano rubber particles; respectively preparing the component A and the component B;and mixing the component A and the component B in proportion when the epoxy glue is used.

Epoxy polymers for dental use including the reaction product of a diepoxide oligomer and a bridged dipolyamine are described. The epoxy polymers include the reaction product of diepoxide oligomers comprised of bisphenol A diepoxide oligomers and/or bisphenol F diepoxide oligomers and bridged dipolyamine monomers having two polyamine regions and a hydrocarbon region of at least 28 carbon atoms.

The invention discloses an epoxy adhesive for OLED frame encapsulation and a preparation method of the epoxy adhesive. The epoxy adhesive is prepared from the following components in parts by weight:50-80 parts of epoxy resin, 5-10 parts of epoxy diluents, 5-10 parts of flexibilizer, 20-40 parts of filler, 1-5 parts of photoinitiator, 0.1-1 part of antioxidant and 0.3-3 parts of additive. The epoxy resin is one or a mixture of more of cycloaliphatic epoxy resin and bisphenol F epoxy resin. The epoxy diluent is one or a mixture of more of oxetane and aliphatic glycidyl ether. The photoinitiator is a cationic photoinitiator which comprises an iron-arene photoinitiator and a hexafluorophosphate photoinitiator. The epoxy adhesive adopts a curing way that ultraviolet exposure and heating are conducted in sequence, has the advantages of less curing agent residue, less volatile component residue, low curing temperature, strong bonding force, boiling resistance, water vapor resistance, oxygenbarrier performance and the like, and reaches the halogen-free standard.

The invention relates to a weather resistant epoxy-polyurethane anti-corrosion coating and a manufacturing method thereof, which adds phenol-A epoxy resin, bisphenol-F epoxy resin, hydroxyl contained saturated polyester resin and fluorocarbon resin into the mixed solvent of dimethylbenzene, n-butyl acetate, methyl isobutyl ketone and butanone; then adds rutile type titanium pigment, saponite, sericite in powder, polyacrylate co-polymer, polymethyl alkyl siloxane, benzotriazole, gas phase silica and iso-caprylic acid znic to make the fluid A of the weather resistant epoxy-polyurethane anti-corrosion coating while adds fatty group polyisocyanate into the mixed liquor of anhydro-dimethylbenzene and the n-butyl acetate to make fluid B, and mix the two components during application. The invention can be applied to the preservation of the surfaces of outdoor steel structures, pipes and concrete requiring weather resistance, light aging resistance and acid, alkali and salt corrosion resistance.

The present invention relates to a lead accumulator epoxy resins sealant and preparation method thereof, particularly a cementing compound used on lead acid batteries sealing and adhesive bonding. The lead accumulator epoxy resins sealant includes A component and B component, the mass portion proportioning between A component and B component is as following: A:B = 2:1, wherein the raw material mass proportioning of A component is as following: bisphenol A epoxy resins 70-80, bisphenol F epoxy resins 10-15, butyl glycidyl ether 3-5, 2-methylphenol glycidyl ether 8-12, polyurethane 5-8, resin acceptor 0.1; and the raw material mass portion proportioning of B component is as following: aniline 400, polyoxymethylene 70-76, aminic acid 30, water 100-300, benzenemethanol 300-500, anti-oxidant 2, cure accelerator 20-35, and nonyl phenol 60.

An epoxy resin composition containing an epoxy resin [A1], epoxy resin [B1], epoxy resin [C1] and curing agent [D] wherein [A1] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B1] is a tri- or higher functional amine-type epoxy resin, [C1] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A1] to [C1] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A1] 20 to 50 parts by mass, [B1] 30 to 50 parts by mass and [C1] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions.

The invention discloses a preparation method of bisphenol F with high ortho-position isomer content. The preparation method comprises the following steps: synthesizing the bisphenol F by adopting a two-step method, separating an organic phase and a phosphoric acid phase, neutralizing the organic phase and removing salt, and recovering phenol under the reduced pressure to obtain the bisphenol F product, wherein in the first step of the two-step synthesis method, the phenol reacts with formaldehyde under the weakly acidic condition; and in the second step, a large amount of catalyst phosphoric acid and formaldehyde are added into the reaction liquid obtained in the first step, and the formaldehyde completely reacts. The invention overcomes the defects that the content of the ortho-position isomer in the bisphenol F prepared by the existing bisphenol F preparation method is low, the curing speed of the synthesized bisphenol F epoxy resin is slow, the resin is easy to crystallize and the like.

The invention relates to a method for preparing bisphenol F by using a 1-alkyl-3-methylimidazole acidic ionic liquid. According to the invention, phenol and formaldehyde are used as raw materials, and the 1-alkyl-3-methylimidazole acidic ionic liquid is used as a solvent and a catalyst, and bisphenol F can be prepared by condensation reaction. As for the method, other organic solvents easy to volatilize are not used, the defects that the reaction time is long, recovery is difficult, the service life is short, the corrosivity is strong and the like when the bisphenol F is subjected to catalytic synthesis by common bronsted acid can be solved, and the method provided by the invention is a novel bisphenol F preparing method which is efficient and environment-friendly.

The invention provides a kind of lead-free environmental-friendly circuit board conductive silver paste, which is prepared by the following raw material by weights: 60 to 70 of silver powder of 20 to 30mum, 5 to 8 of copper powder of 1 to 10nm, 8 to 10 of glass powder, 5 to 7 of SnO2 powder, 5 to 8 of silver powder of 40 to 60nm, 2 to 4 of pentaerythritol tristearate, 4 to 6 of isophorone, 3 to 5 of saturated polyester resin EK410, 4 to 7 of bisphenol F epoxy resin, 1 to 2 of salicylic acid, 3 to 5 of polyurethane resin, 1 to 2 of triallyl isocyanurate, 1 to 2 of microsphere starch, 1 to 2 of fumed silica, 4 to 6 of isobutyl ketone, 6 to 8 of ethanol , 2 to 4 of butanol, and 6 to 8 of butyl acetate. The lead-free environmental-friendly circuit board conductive silver paste and the preparation method thereof are characterized in that the use amount of the silver powder is small, the printing performance is good, the yield of the circuit board is high, the conductive performance is good, lead-free environmental-friendly performance is provided, the technology is simple, the operation is convenient and easy, and the product performance is convenient to control.

The invention discloses an UVLED light-curing wood coating and application thereof, the coating comprises an oxetane compound, an epoxy compound selected from the group consisting of at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin or an alicyclic epoxy compound, a (methyl) acrylate compound, a cationic and a radical photoinitiator, and optionally a sensitizer. The coating has excellent response to an UVLED light source in the wavelength range of 200 to 450 nm, and the curing speed is fast. The cured coating is excellent in hardness, wear resistance, flexibility, adhesion, alcohol resistance and yellowing resistance and the like. The coating is odorless and has strong technical and market competitiveness.

The invention discloses a corrosion-resistant electric material which is prepared from the following raw materials: graphite, borax, kieselguhr, kaolin, polypropylene resin, bisphenol F-type epoxy resin, polysiloxane, dicyclopentadiene, dimethylamino ethoxyethanol and triallyl isocyanurate. The invention further discloses an application of the electric material. The corrosion-resistant electric material disclosed by the invention is applicable to multiple different severe environments, and potential safety hazard of an ordinary electric material is avoided.

The invention provides a preparation method of low-molecular weight epoxy resin. The method comprises the following steps: adding bisphenol A, epoxy chloropropane, potassium carbonate having grain size of 100-300 nanometer and solvent into a reactor for reaction; and distilling or rectifying the reaction liquid, and recycling the solvent to obtain the low-molecular weight colorless liquid bisphenol A type epoxy resin. The same effect is obtained by replacing bisphenol A with bisphenol S, bisphenol F or bisphenol fluorene to synthesize corresponding bisphenol S, bisphenol F or bisphenol fluorene type low-molecular weight epoxyresin. The method for synthesizing the low-molecular weight epoxy resin has the advantages of low reaction temperature, short reaction time, simple operation, high epoxy value of product, no production of industrial wastewater and good industrial prospect.

The invention relates to a synthesis method of bisphenol F in a salt bath system. The bisphenol F, which is relatively high in yield, high in content of 4,4-dihydroxy diphenyl methane and good in selectivity, is prepared from a reaction of phenol and formaldehyde under a salt bath system and a catalyst through regulating and controlling technological parameters. And the preparation method is simple, and the synthesis process is free from an organic solvent, thus being light in environmental pollution.

The instant invention relates to compositions comprising a benzoxazine resin and an advancement resin based on bisphenol A diglycidyl ether and bisphenol S and, optionally, ferrocene and aluminium trihydrate. Such compositions are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compositions may especially be used in the production of printed wiring boards.

The present invention relates to an epoxy resin pouring sealant and a preparation method thereof, the epoxy resin pouring sealant includes A and B components, the A component includes, by weight, 40-70 parts of bisphenol F epoxy resin, 20-50 parts of an active polyurethane toughening agent, 10-20 parts of an active diluent, 30-50 parts of an inorganic filler and 1-10 parts of an additive; the B component includes, by weight, 40-70 parts of modified alicyclic amine; 30-60 parts of polyetheramine and 3-10 parts of a promoter. The weight ratio of A to B is 2-4:1. The epoxy resin pouring sealant has better aging resistance and strong resistance to cold and hot impact, and meets the high temperature and cold impact requirement of electronic sealing.

The invention belongs to the field of new materials, and discloses an insulation cable material prepared from the following raw materials by weight: 30-40 parts of PVC (polyvinyl chloride), 20-30 parts of polypropylene resin, 16-20 parts of bisphenol F epoxy resin, 12-15 parts of gamma-aminopropyltriethoxysilane, 10-12 parts of phthalic anhydride, 5-6 parts of modified diatomite, 5-6 parts of modified kaolinite, 3-4 parts of dimethyaminoethoxyethanol, 2-3 parts of polyglycolic acid, 1-2 parts of triallyl isocyanurate, 1-2 parts of aluminium hydroxide, 1-2 parts of antimonous oxide and 1-2 parts of titanium carbide. The insulation cable material not only has good insulation properties, but also has the advantages of high mechanical strength, corrosion resistance, good flame retardant performance and low cost , and the like.

The invention relates to an epoxy resin composition for vacuum introduction formation of a fibre reinforced composite material and a preparation method of the epoxy resin composition. The epoxy resin composition comprises a component A and a component B, wherein the component A comprises the following ingredients in parts by mass: 100 parts of epoxy resin, 5-20 parts of diluent, 0.5-5.0 parts of silane coupling agent, 0.5-5.0 parts of inorganic filler; and the component B comprises the following ingredients in parts by mass: 25-45 parts of amine curing agent and 0.5-5.0 parts of accelerant. According to the invention, blend type epoxy resins of hydantoin epoxy resins and low-viscosity epoxy resins (4,5-epoxy cyclohexane-1,2-dioctyl phthalate diglycidyl ester, bisphenol F type glycidyl ether epoxy resin or bisphenol A type glycidyl ether epoxy resin) are adopted as a resin matrix, so that the requirement of vacuum introduction formation of the fibre reinforced composite material for the resin low viscosity can be met, and a composite material product has excellent high temperature resistance property.

A 200-level epoxy solvent-free impregnated resin chooses bisphenol F epoxide resin, alicyclic epoxide resin and polyimide resin as main resin material. Pre-polymerization modification is carried out to the resin, and then epoxy anhydride solvent-free impregnated resin is made by adding modified thermostable anhydride as a curing agent; subsequently, by using the thermostable anhydride and metal salt to carry out complex reaction, the impregnated resin is passivated to form a relatively stable complex compound so as to ensure that the epoxy resin and the anhydride are stable at low temperature (normal condition) after mixing, and quickly react when the temperature reaches certain extent. As the bisphenol F epoxide resin, the alicyclic epoxide resin and the thermostable anhydride have small molecular weight and low viscosity, the viscosity is moderate and the permeability is good after the resins are mixed with the polyimide resin, therefore, the impregnated resin can satisfy the property and use technology requirements on impregnated resin in the insulated structure of a high-speed train motor with the speed per hour up to over 200km/h.