293 results about "Bisphenol F" patented technology

The invention discloses a light-moisture dual-curing underwater epoxy coating with a self-repairing function as well as a preparation method and a construction method of the light-moisture dual-curing underwater epoxy coating. The epoxy coating comprises a component A and a component B, wherein the mass ratio of the component A to the component B is (1.5-3.5): 1; the component A is prepared from the following raw materials: bisphenol F type epoxy resin, dynamic disulfide bond modified polysulfide rubber, boron nitride nanosheet and silicon carbide nanowire hybrid filler, a photoinitiator and a silane coupling agent; the component B is prepared from the following raw materials: moisture-cured polyether amine, a boric acid ester bond cross-linking agent and hydrophobic modified graphene oxide. According to the invention, a light-moisture dual-curing mechanism is adopted, ultraviolet irradiation initiates rapid surface curing, and then environmental moisture permeates to complete deep curing. The material provided by the invention has the advantages of rapid curing, excellent self-repairing function, significantly improved underwater adhesion and good thermal conductivity, and provides a new solution for rapid repairing and long-acting protection of underwater structures.

The invention discloses a low-temperature polyether demulsifier for oil and gas gathering and transportation and a preparation method thereof, and relates to the technical field of petrochemical engineering, and the preparation method is characterized by comprising the following steps: compounding cardanol, pentaethylenehexamine and bisphenol F according to a specific molar ratio to obtain an initiator, and carrying out formaldehyde condensation to prepare a composite initiator; epoxypropane and ethylene oxide are grafted through staged block copolymerization to form a polyether skeleton; introducing a fluorine-containing epoxy monomer to carry out terminal fluorination modification; finally, adipic acid and epichlorohydrin are subjected to chain extension crosslinking, and the demulsifier with the molecular weight being 8000-12000 Da, the fluorine content being 5.5-6.5 wt% and the PDI being smaller than or equal to 1.3 is prepared. The low-temperature demulsifying agent has the effects of realizing efficient demulsification at low temperature, improving the demulsifying efficiency and reducing the dosage through coordination of the composite initiator, super-hydrophobic permeation of the fluorinated block and accurate regulation and control of the molecular weight, solving the problems of low-temperature failure and easiness in emulsification of a traditional demulsifying agent, and meeting the requirements of low-temperature working conditions of oil and gas gathering and transportation.

The invention discloses a high-temperature-resistant and weather-resistant epoxy resin adhesive and a preparation method thereof, and belongs to the field of epoxy resin adhesives, the adhesive can keep stable bonding strength for a long time at high temperature through the synergistic effect of hydrogenated bisphenol F type epoxy resin, silicon-containing phenyl glycidyl ether epoxy resin and a dicyandiamide-imidazole composite curing agent, and the adhesive has high temperature resistance and weather resistance. According to the present invention, the graphene aerogel is added to the silicon-containing phenyl glycidyl ether epoxy resin to meet the high temperature environment use requirement, and the silica bond in the silicon-containing phenyl glycidyl ether epoxy resin and the aging resistance of the graphene aerogel enable the adhesive to have characteristics of excellent ultraviolet aging resistance, excellent thermal cycling resistance and excellent moisture resistance, solve the performance defects of the traditional product, and be suitable for the application in the high temperature and severe environment, the method has an important practical value.

The invention provides a high-adhesion bottom filling adhesive, a preparation method thereof and a chip packaging structure, and relates to the technical field of chip packaging, the bottom filling adhesive comprises the following components by mass: 45%-64% of epoxy resin, 35%-55% of an amine curing agent, 0.1%-0.4% of an accelerator, and 0.1%-0.3% of carbon black; wherein the epoxy resin is bisphenol F type epoxy resin or bisphenol A type epoxy resin. By adjusting the formula proportion of the bottom filling glue and adopting single epoxy resin to be combined with the amine curing agent and the accelerant, the glue solution of the bottom filling glue can be quickly gelled and surface-dried on the surface of the flexible PI substrate, gap filling between the flexible PI substrate and the chip is completed, high adhesive force is achieved after curing, and packaging of the chip is achieved.

The invention relates to the technical field of epoxy resin, in particular to self-repairing epoxy resin and a preparation method thereof. The self-repairing epoxy resin is prepared from the following raw materials in parts by mass: 80 to 120 parts of bisphenol A type epoxy resin, 20 to 40 parts of bisphenol F type epoxy resin, 5 to 15 parts of 1, 6-hexanediol diglycidyl ether, 1 to 3 parts of 3, 5-dimethylphenylboronic acid, 1 to 5 parts of furyl maleimide, 10 to 20 parts of dodecanedioic acid, 5 to 15 parts of butanetetracarboxylic acid, 1 to 3 parts of catalyst, 10 to 15 parts of nano silicon dioxide, 1 to 2 parts of boron nitride nanosheet and 1 to 2 parts of hyperbranched polyamidoamine. The curing agent is prepared from the following components in parts by weight: 20-30 parts of epoxy resin, 1-2 parts of sulfydryl-terminated polysiloxane, 20-30 parts of amine curing agent, 5-15 parts of reinforcing filler and 0.5 According to the invention, the balance among self-repairing capability, mechanical property and heat resistance is successfully realized; in the microcrack propagation process, fracture and recombination mechanisms of dynamic covalent bonds effectively prevent further propagation of cracks.

The invention relates to a marine epoxy resin composite material. The marine epoxy resin composite material is characterized by comprising the following components in parts by mass: 100 parts of epoxy resin, 20-30 parts of a curing agent, 100-120 parts of a reinforcing material, 2050 parts of hollow microsphere filler and 5-15 parts of a flame retardant, the epoxy resin is one or a mixture of two of bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyphenol type glycidyl ether epoxy resin or aliphatic glycidyl ether epoxy resin. When in use, the marine epoxy resin composite material disclosed by the invention has the advantages of excellent comprehensive performance, corrosion resistance, flame retardance, water resistance, high strength, light weight and the like, still has excellent performance retention rate after being soaked in water for several days, and is more suitable for complex and severe working conditions on a ship.

The invention discloses a bisphenol F degradation gene cluster bpf and application thereof. The strain DN12 is separated and can degrade the BPF and grow by taking the BPF as the unique carbon source and energy. On the basis, a BPF degradation gene cluster bpf is obtained from the strain DN12 by adopting whole genome and comparative transcriptome sequencing analysis. Three different degrading enzymes (two-component oxidase BpfAB, monooxygenase BpfC and hydrolase BpfD) are found in the gene cluster and can catalyze gradual degradation of BPF, and a simple aromatic ring compound p-hydroxybenzoic acid is generated.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention relates to the technical field of building materials for concrete, in particular to a high-performance two-component epoxy pouring adhesive for underwater cracks of concrete and a preparation method of the high-performance two-component epoxy pouring adhesive for the underwater cracks of the concrete. The epoxy pouring adhesive which is low in viscosity, high in underwater bonding strength, free of whitening underwater, excellent in mechanical property, high in chemical corrosion resistance and super-hydrophobic is prepared by taking epoxy resin as a main component, taking bisphenol A epoxy resin, bisphenol F epoxy resin and an epoxy coupling agent as well as adopting a specially-made modified amine curing agent and an amino coupling agent as curing agent components. The method can be used for repair engineering of various concrete underwater crack environments and concrete wet crack environments.

The invention provides bisphenol type benzoxazine resin and a preparation method thereof, and relates to the field of materials, the benzoxazine resin is diallyl bisphenol F type benzoxazine resin, and the benzoxazine resin is terminated by a phenolic group to form a benzoxazine group or terminated by an amino group to form a benzoxazine group. According to the bisphenol type benzoxazine resin provided by the technical scheme provided by the invention, bisphenol F is used as a phenol raw material, but the bisphenol type benzoxazine resin which is good in stability and better in dielectric property, strength and elongation at break is accidentally obtained.

The invention belongs to the technical field of automatic control, and particularly relates to an intelligent temperature control method for a bisphenol F type epoxy resin reaction kettle, which comprises the following steps: acquiring the temperature in the kettle, the frequency of a stirring motor and the flow of cooling water, and carrying out de-noising treatment; obtaining a dynamic viscosity thermal resistance operator based on the processed frequency of the stirring motor and the processed temperature in the kettle, and quantifying the heat transfer obstruction degree caused by the viscosity change of the material; obtaining a thermal inertia compensation driving operator by combining the target set temperature and the dynamic viscosity thermal resistance operator; the power of the heating actuator is obtained based on the thermal inertia compensation driving operator and the static balance power, and the input current of the heating actuator is adjusted through mapping and the cooling water flow is cooperatively adjusted. By sensing the thermal resistance dynamic state in a variable viscosity environment and performing feedforward compensation, the problem of temperature overshoot caused by large lag of the reaction kettle is solved, and the stability of the reaction process is improved.

The embodiment of the invention provides a plastic-coated steel pipe and a plastic coating process thereof, and relates to the technical field of plastic-coated steel pipes. The plastic-coated steel pipe comprises a steel pipe base body, a metal transition layer, an inner anticorrosive coating, a fiber reinforced winding layer and an outer protective coating are sequentially arranged on the outer surface of the steel pipe base body from inside to outside, and the metal transition layer is a nickel-chromium-aluminum-yttrium alloy layer and is formed on the surface of the steel pipe base body through a supersonic plasma spraying process. And the inner anticorrosive coating is formed by a mixture of bisphenol F type epoxy resin and novolac epoxy resin, and is doped with silicon nitride and zirconium oxide composite nanoparticles subjected to surface treatment. By arranging a multi-stage composite structure of the metal transition layer, the high-temperature-resistant anti-corrosion coating, the fiber reinforcement layer and the self-repairing outer layer and arranging the detachable heat insulation sheath, the interface bonding strength, heat resistance, mechanical damage resistance and corrosion resistance of the plastic-coated steel pipe are improved; and the service life of the composite material in high-temperature, strong-corrosion and complex construction environments is effectively prolonged.

The invention discloses an adhesive tape with high stripping stability and a preparation process thereof. The adhesive tape comprises a PET (Polyethylene Terephthalate) base material subjected to corona treatment, an acrylic acid pressure-sensitive adhesive layer, a release layer and an antistatic liquid coating. The acrylic pressure-sensitive adhesive layer is composed of acrylate monomers, saturated polyester resin, bisphenol F, bisphenol A epoxy resin and amino resin. The preparation process comprises the steps of corona pretreatment of the polyethylene glycol terephthalate base material, coating of the antistatic liquid, coating of the pressure-sensitive adhesive, compounding of the release layer and curing treatment. The stripping force change rate of the adhesive tape after damp-heat aging and low-temperature aging is smaller than 5% and is far lower than the industrial standard, and the adhesive tape has excellent stripping stability, antistatic property and weather resistance and is suitable for the fields of electronic product protection, automobile paint spraying shielding and the like.

A conductive epoxy composition is disclosed comprising an epoxy resin, a low-viscosity hydrocarbon diluent, silver, and graphene. The one-part formulation provides enhanced electrical conductivity, mechanical strength, and process stability. The epoxy resin may include resorcinol diglycidyl ether, diglycidyl ether of Bisphenol A, or Bisphenol F. The hydrocarbon diluent may include glycidyl-ether-family resins having defined carbon-chain characteristics and molecular weights. Silver may be present in particulate, flake, nanoparticle, or coated forms at about 55-90 wt. %, while graphene may be present at 0.03-0.3 wt. % with dimensions of 1-10 μm and surface areas of 400-2,000 m2 / g. Optional additives include solvents, ionic liquids, latent curing agents, and strength enhancers to optimize curing and adhesion.

The invention relates to the technical field of epoxy resin coatings, in particular to a radiation-resistant self-repairing epoxy resin coating and a preparation method thereof. The radiation-resistant self-repairing epoxy resin coating comprises the following raw materials: a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is (50-70): (40-50): (10-20); the component A comprises the following raw materials in parts by mass: 50-60 parts of bisphenol F epoxy resin, 8-12 parts of calix [5] arene, 1-2 parts of zinc acetylacetonate and 15-20 parts of a solvent; the component B is prepared from the following raw materials in parts by mass: 30 to 40 parts of octamethylcyclotetrasiloxane, 5 to 10 parts of gamma-aminopropyltriethoxysilane, 1 to 3 parts of vanillin, 0.5 to 1 part of a catalyst and 0.1 to 0.3 part of p-toluenesulfonic acid; and the component C is an amine curing agent.

The invention provides a high-flexibility low-temperature fast curing powder coating for reinforcing steel bars as well as a preparation method and application thereof, and belongs to the technical field of powder coatings. The powder coating comprises the following components in parts by mass: 180-200 parts of high-toughness epoxy resin, 45-48 parts of a high-toughness phenolic curing agent, 6-8 parts of a flatting agent, 2-4 parts of a brightener, 1-2 parts of benzoin and 55-70 parts of pigment filler. The high-toughness epoxy resin is obtained by polymerizing bisphenol F diglycidyl ether, 1, 10-decanediol, glyceryl monobutyrate, hexamethylene diisocyanate, dodecanedioic acid, triglycidyl p-aminophenol and the like; the high-toughness phenolic curing agent is obtained by polymerizing bisphenol F diglycidyl ether, 1, 4-butanediol diglycidyl ether and bisphenol F. The coating is used for low-temperature rapid curing molding on the surface of the reinforcing steel bar to obtain a coating, and has excellent bending resistance and corrosion resistance.

The invention discloses flame-retardant electrical epoxy resin and a preparation method thereof in the field of epoxy resin. The flame-retardant electrical epoxy resin is prepared from the following components in parts by weight: 70 to 80 parts of bisphenol F epoxy resin, 20 to 30 parts of alicyclic epoxy resin, 20 to 40 parts of benzoxazine resin monomer, 50 to 70 parts of curing agent and 0.5 to 1.5 parts of curing accelerator. Through the functionalized benzoxazine resin monomer containing the diphosphorus structure, optimization of epoxy resin formula components and improvement of a preparation process, synergistic improvement of flame retardance, electrical insulation performance, heat resistance and mechanical performance is achieved.

The invention provides an antistatic epoxy packaging film and a preparation method thereof, and a filter chip packaging structure, and relates to the technical field of filter chip packaging, the antistatic epoxy packaging film comprises the following components by mass: 46%-60% of silica, 17%-25% of epoxy resin, 2%-5% of phenoxy resin, 18%-24% of a phenolic curing agent, 0.3%-0.5% of an imidazole accelerator, and 0.2%-0.3% of carbon black; the epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50000-53000, and the phenolic aldehyde curing agent is composed of solid phenolic resin and liquid phenolic resin; the antistatic epoxy resin packaging film is prepared by introducing the antistatic epoxy resin and adopting a specific formula proportion, the antistatic epoxy packaging film has excellent antistatic property and mechanical property, and after a filter chip is packaged, filter products which are packaged perfectly and qualified can be quickly screened out through a sorting machine.

The invention belongs to the technical field of adhesives, and particularly relates to a coated sucker rod adhesive and a preparation method thereof. The adhesive comprises a component A and a component B, the component A is prepared from the following raw materials in parts by mass: 40-50 parts of bisphenol A type epoxy resin, 20-35 parts of bisphenol F type epoxy resin, 5-10 parts of modified lignin, 1-3 parts of graphene nanosheets, 2-4 parts of hyperbranched polysiloxane, 0.5-1 part of a silane coupling agent, 5-10 parts of a diluent and 0.2-0.5 part of a defoaming agent; the component B is prepared from the following raw materials in parts by mass: 25 to 30 parts of a curing agent, 0.5 to 1.2 parts of 2-ethyl-4-methylimidazole and 1 to 2 parts of a silane coupling agent. The adhesive prepared by the invention is fully cured, high in crosslinking density and excellent in hardness, corrosion resistance and the like of an adhesive layer.

The invention belongs to the technical field of catalysts, and discloses a method for recycling a phosphoric acid catalyst for bisphenol F synthesis. Comprising the following steps: (1) reacting phenol, an acid catalyst and a formaldehyde aqueous solution to obtain a bisphenol F reaction solution; (2) the bisphenol F reaction liquid enters a liquid separation system I, and an oil phase I and a water phase I are obtained under certain conditions; (3) the oil phase I enters a multi-stage extraction water washing system for extraction water washing to obtain extraction water washing liquid; (4) the extraction water washing liquid enters a liquid separation system II, and an oil phase II and a water phase II are obtained; and (5) uniformly mixing the water phase I and the water phase II in a storage tank, feeding the mixture into an evaporation system for evaporation and concentration, directly feeding recycled phosphoric acid into a reaction system, and feeding distilled condensate into a clean water recycling section. The phosphoric acid catalyst can be completely recycled, and the method has the advantages of being short in technological process, small in waste water amount and free of solid waste.

The invention discloses a composite resin material for packaging a fuel cell and a preparation method of the composite resin material. The composite resin comprises bisphenol F type epoxy resin, alicyclic epoxy resin, acrylate resin, a toughening agent, nano silicon dioxide particles, a long-chain aliphatic amine curing agent, an imidazole accelerant and graphene coating carbon fibers. Bisphenol F and alicyclic epoxy resin are compounded, acrylate resin is combined to form a rigid-flexible three-dimensional network matrix, nano-silica treated by a silane coupling agent is introduced to improve moisture resistance, and graphene coating carbon fibers with oxygen-containing groups on the surface are utilized to enhance interface bonding force. And a cross-linked network is regulated and controlled through the coordination of the long-chain fatty amine curing agent and the imidazole accelerant. The obtained composite resin has excellent temperature resistance, moisture resistance, mechanical properties and interface bonding strength, effectively solves the problem of performance degradation of a traditional packaging material in high-temperature, high-humidity and corrosive environments, and meets the strict use requirements of fuel cells.

The present application relates to the technical field of fireproof board preparation, and specifically to a light fireproof board and a preparation method thereof, the method comprising: mixing and stirring PVC, phenolic resin, bisphenol F type glycidyl ether epoxy resin, polyamide and foaming agent, then adding plasticizer, flame retardant and foaming regulator, continuing stirring, and foaming treatment; in the foaming process, analyzing the foaming temperature difference at each measuring position, combining PID controller to intelligently control the ambient temperature of PVC foaming, and obtaining the foam substrate after the foaming treatment; coating the surface of the foam substrate with resin after sanding and dust removal, and then covering it with a layer of fireproof layer to obtain an intermediate product, stacking and cold pressing the multiple layers of intermediate products, naturally curing to form a semi-finished product, cutting off the excess part of the edge and removing burrs, and obtaining a PVC foamed light fireproof board. The present application can avoid the problem of uneven foaming during the foaming process of fireproof board preparation and improve the preparation quality of fireproof board.

Disclosed in the present invention are a packaging film, a manufacturing method therefor, and a filter chip packaging method. Raw materials for the packaging method comprise: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of a flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of a curing agent, 2-5 parts by mass of a photoinitiator and 0.4-0.8 part by mass of an accelerant, the curing agent being prepared by compounding a bisphenol F benzoxazine curing agent and a dicyandiamide curing agent according to a mass ratio of 10:(7-9). The packaging film of the present invention has excellent flexibility and adhesive force, low moisture absorption rate and high heat resistance, and therefore is particularly suitable for packaging of filter chips.

The invention belongs to the technical field of nano composite materials, and particularly provides a corrosion-resistant flexible carbon nano polymer coating and a preparation method thereof, and the corrosion-resistant flexible carbon nano polymer coating comprises phenolic resin, bisphenol F epoxy resin, GO-NH2, self-repairing polyimide, a BYK-011 defoaming agent, talcum powder, polytetrafluoroethylene, a BYK333 flatting agent, silicon carbide, a B215 composite antioxidant, a UV531 ultraviolet light absorber and cardanol. The corrosion-resistant flexible carbon nano polymer coating prepared by the invention has excellent mechanical strength and wear resistance, good flexibility, efficient self-repairing capability and lasting corrosion resistance, the service life of the coating can be effectively prolonged, and the protection requirement in a severe environment is met.

The invention relates to low-temperature hand lay-up resin as well as a preparation method and application thereof. The low-temperature hand lay-up resin is prepared from a component A and a component B, the component A is prepared from the following components in percentage by mass: 35 to 50 percent of bisphenol A type epoxy resin, 25 to 35 percent of bisphenol F type epoxy resin, 20 to 35 percent of aliphatic epoxy diluent and 0 to 10 percent of aromatic epoxy diluent; the component B is prepared from the following raw materials in percentage by mass: 60 to 80 percent of alicyclic amine, 1 to 15 percent of accelerant A, 1 to 10 percent of accelerant B and 5 to 25 percent of epoxy composition; the mass ratio of the component A to the component B is 1: (0.2-0.4). The low-temperature hand lay-up resin provided by the invention can still keep excellent flowability and low-viscosity property in a low-temperature environment, has excellent mechanical properties after being cured, and can meet the maintenance requirements of wind power blades under a low-temperature condition.

The invention provides a low-VOC epoxy structural adhesive as well as a preparation method and application thereof, and relates to the technical field of high polymer materials. The low-VOC epoxy structural adhesive is mainly prepared from the following raw materials in parts by mass: 10 to 30 parts of filler, 0.1 to 0.5 part of curing accelerator, 1 to 5 parts of curing agent, 3 to 5 parts of moisture absorption agent, 0.01 to 0.05 part of pigment, 2 to 5 parts of thixotropic agent, 10 to 20 parts of core-shell modified epoxy resin, 10 to 15 parts of bisphenol F type epoxy resin, 10 to 20 parts of bisphenol A type epoxy resin, 15 to 25 parts of polyurethane modified epoxy resin and 10 to 15 parts of flexibilizer. 0.1 to 0.5 part of a silane coupling agent; and 0.1 to 0.5 part of a VOC adsorbent. By optimizing and upgrading the proportion of the low-VOC epoxy structural adhesive, high-efficiency selective adsorption of micromolecular volatile matters such as aldehydes and the like can be effectively realized, and the environmental protection property and the use safety of the product are remarkably improved.

The invention discloses conductive ink for ink-jet printing and a preparation method thereof. Comprising the following steps: step 1, dissolving bisphenol F type epoxy resin in dimethyl nylon acid, stirring for 10-15 minutes until the bisphenol F type epoxy resin is completely dissolved, then adding modified composite filler, methyl tetrahydrophthalic anhydride, a dispersing agent and a flatting agent, and continuously stirring for 20-30 minutes to obtain a mixed solution; 2, the mixed solution is subjected to ultrasonic treatment for 30-40 min till no macroscopic particles exist, and the conductive ink is obtained. The conductive ink has the beneficial effects that the epoxy resin is mixed with the modified composite filler, the methyl tetrahydrophthalic anhydride and the like, and ultrasonic treatment is performed to prepare the conductive ink; according to the conductive ink, the MXene and the carbon nanotubes are adopted to construct a three-dimensional conductive network, and the dispersity and the interface bonding force of the filler are improved through surface modification, so that the conductivity and the mechanical strength of the ink are effectively improved.

A coating composition comprising: a. a polyester imide (PEI) polymer having an acid value of ≥10 mg KOH / g; and b. a crosslinker operable to crosslink the acid functionality on the polyester imide polymer wherein the coating composition is substantially free of bisphenol A (BPA), bisphenol F (BPF), bisphenol A diglycidyl ether (BADGE) and bisphenol F diglycidyl ether (BFDGE).

The invention relates to a bi-component epoxy coating, a wire winding, a preparation method of the wire winding and an electric reactor. The bi-component epoxy coating comprises an epoxy prepolymer, an epoxy curing agent and a self-repairing microcapsule, wherein the self-repairing microcapsule contains an epoxy microcapsule and an amine microcapsule; wherein the amine microcapsule and the capsule wall of the epoxy microcapsule comprise polyurea, so that core liquid of the epoxy microcapsule and the amine microcapsule can be effectively preserved during primary thermocuring, and is not easy to flow out in advance. When the coating has cracks, bisphenol F diglycidyl ether in the amine microcapsules and aliphatic polyamine in the epoxy microcapsules can flow out and are gradually mixed, due to the high reaction activity of the aliphatic polyamine, secondary curing can be achieved without high temperature, microcracks can be repaired, further spreading of defects is prevented, and the service life of the coating is prolonged. And the long-term service capability of the self-repairing resin layer is effectively improved.

The invention provides halogen-free flame-retardant liquid epoxy resin, solid epoxy resin for powder coating and a preparation method of the solid epoxy resin, and belongs to the technical field of powder coating. The liquid epoxy resin disclosed by the invention is prepared by polymerizing 2, 4-diamino-6-phenyl-1, 3, 5-triazine, formaldehyde, triethyl phosphite, epoxy chloropropane, sodium hydroxide, DMF (Dimethyl Formamide) and the like. The contents of halogen-free flame-retardant elements nitrogen and phosphorus in the product are high, a solid epoxy resin product obtained by carrying out chain extension on liquid epoxy resin serving as a synthetic monomer of solid epoxy resin of the powder coating and bisphenol F is good in flame retardance, the oxygen index reaches 37% or above, and the flame retardance is high. A coating film obtained after the powder coating and an accelerated dicyandiamide curing agent are subjected to low-temperature rapid curing (150 DEG C / 10 min) is high in gloss and leveling grade and good in impact resistance, hardness and the like, and the application requirements of the powder coating are met.