195 results about "Bisphenol F" patented technology

The invention discloses a light-moisture dual-curing underwater epoxy coating with a self-repairing function as well as a preparation method and a construction method of the light-moisture dual-curing underwater epoxy coating. The epoxy coating comprises a component A and a component B, wherein the mass ratio of the component A to the component B is (1.5-3.5): 1; the component A is prepared from the following raw materials: bisphenol F type epoxy resin, dynamic disulfide bond modified polysulfide rubber, boron nitride nanosheet and silicon carbide nanowire hybrid filler, a photoinitiator and a silane coupling agent; the component B is prepared from the following raw materials: moisture-cured polyether amine, a boric acid ester bond cross-linking agent and hydrophobic modified graphene oxide. According to the invention, a light-moisture dual-curing mechanism is adopted, ultraviolet irradiation initiates rapid surface curing, and then environmental moisture permeates to complete deep curing. The material provided by the invention has the advantages of rapid curing, excellent self-repairing function, significantly improved underwater adhesion and good thermal conductivity, and provides a new solution for rapid repairing and long-acting protection of underwater structures.

The invention discloses a low-temperature polyether demulsifier for oil and gas gathering and transportation and a preparation method thereof, and relates to the technical field of petrochemical engineering, and the preparation method is characterized by comprising the following steps: compounding cardanol, pentaethylenehexamine and bisphenol F according to a specific molar ratio to obtain an initiator, and carrying out formaldehyde condensation to prepare a composite initiator; epoxypropane and ethylene oxide are grafted through staged block copolymerization to form a polyether skeleton; introducing a fluorine-containing epoxy monomer to carry out terminal fluorination modification; finally, adipic acid and epichlorohydrin are subjected to chain extension crosslinking, and the demulsifier with the molecular weight being 8000-12000 Da, the fluorine content being 5.5-6.5 wt% and the PDI being smaller than or equal to 1.3 is prepared. The low-temperature demulsifying agent has the effects of realizing efficient demulsification at low temperature, improving the demulsifying efficiency and reducing the dosage through coordination of the composite initiator, super-hydrophobic permeation of the fluorinated block and accurate regulation and control of the molecular weight, solving the problems of low-temperature failure and easiness in emulsification of a traditional demulsifying agent, and meeting the requirements of low-temperature working conditions of oil and gas gathering and transportation.

The invention relates to the technical field of epoxy resin, in particular to self-repairing epoxy resin and a preparation method thereof. The self-repairing epoxy resin is prepared from the following raw materials in parts by mass: 80 to 120 parts of bisphenol A type epoxy resin, 20 to 40 parts of bisphenol F type epoxy resin, 5 to 15 parts of 1, 6-hexanediol diglycidyl ether, 1 to 3 parts of 3, 5-dimethylphenylboronic acid, 1 to 5 parts of furyl maleimide, 10 to 20 parts of dodecanedioic acid, 5 to 15 parts of butanetetracarboxylic acid, 1 to 3 parts of catalyst, 10 to 15 parts of nano silicon dioxide, 1 to 2 parts of boron nitride nanosheet and 1 to 2 parts of hyperbranched polyamidoamine. The curing agent is prepared from the following components in parts by weight: 20-30 parts of epoxy resin, 1-2 parts of sulfydryl-terminated polysiloxane, 20-30 parts of amine curing agent, 5-15 parts of reinforcing filler and 0.5 According to the invention, the balance among self-repairing capability, mechanical property and heat resistance is successfully realized; in the microcrack propagation process, fracture and recombination mechanisms of dynamic covalent bonds effectively prevent further propagation of cracks.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention belongs to the technical field of automatic control, and particularly relates to an intelligent temperature control method for a bisphenol F type epoxy resin reaction kettle, which comprises the following steps: acquiring the temperature in the kettle, the frequency of a stirring motor and the flow of cooling water, and carrying out de-noising treatment; obtaining a dynamic viscosity thermal resistance operator based on the processed frequency of the stirring motor and the processed temperature in the kettle, and quantifying the heat transfer obstruction degree caused by the viscosity change of the material; obtaining a thermal inertia compensation driving operator by combining the target set temperature and the dynamic viscosity thermal resistance operator; the power of the heating actuator is obtained based on the thermal inertia compensation driving operator and the static balance power, and the input current of the heating actuator is adjusted through mapping and the cooling water flow is cooperatively adjusted. By sensing the thermal resistance dynamic state in a variable viscosity environment and performing feedforward compensation, the problem of temperature overshoot caused by large lag of the reaction kettle is solved, and the stability of the reaction process is improved.

The embodiment of the invention provides a plastic-coated steel pipe and a plastic coating process thereof, and relates to the technical field of plastic-coated steel pipes. The plastic-coated steel pipe comprises a steel pipe base body, a metal transition layer, an inner anticorrosive coating, a fiber reinforced winding layer and an outer protective coating are sequentially arranged on the outer surface of the steel pipe base body from inside to outside, and the metal transition layer is a nickel-chromium-aluminum-yttrium alloy layer and is formed on the surface of the steel pipe base body through a supersonic plasma spraying process. And the inner anticorrosive coating is formed by a mixture of bisphenol F type epoxy resin and novolac epoxy resin, and is doped with silicon nitride and zirconium oxide composite nanoparticles subjected to surface treatment. By arranging a multi-stage composite structure of the metal transition layer, the high-temperature-resistant anti-corrosion coating, the fiber reinforcement layer and the self-repairing outer layer and arranging the detachable heat insulation sheath, the interface bonding strength, heat resistance, mechanical damage resistance and corrosion resistance of the plastic-coated steel pipe are improved; and the service life of the composite material in high-temperature, strong-corrosion and complex construction environments is effectively prolonged.

The invention discloses an adhesive tape with high stripping stability and a preparation process thereof. The adhesive tape comprises a PET (Polyethylene Terephthalate) base material subjected to corona treatment, an acrylic acid pressure-sensitive adhesive layer, a release layer and an antistatic liquid coating. The acrylic pressure-sensitive adhesive layer is composed of acrylate monomers, saturated polyester resin, bisphenol F, bisphenol A epoxy resin and amino resin. The preparation process comprises the steps of corona pretreatment of the polyethylene glycol terephthalate base material, coating of the antistatic liquid, coating of the pressure-sensitive adhesive, compounding of the release layer and curing treatment. The stripping force change rate of the adhesive tape after damp-heat aging and low-temperature aging is smaller than 5% and is far lower than the industrial standard, and the adhesive tape has excellent stripping stability, antistatic property and weather resistance and is suitable for the fields of electronic product protection, automobile paint spraying shielding and the like.

A conductive epoxy composition is disclosed comprising an epoxy resin, a low-viscosity hydrocarbon diluent, silver, and graphene. The one-part formulation provides enhanced electrical conductivity, mechanical strength, and process stability. The epoxy resin may include resorcinol diglycidyl ether, diglycidyl ether of Bisphenol A, or Bisphenol F. The hydrocarbon diluent may include glycidyl-ether-family resins having defined carbon-chain characteristics and molecular weights. Silver may be present in particulate, flake, nanoparticle, or coated forms at about 55-90 wt. %, while graphene may be present at 0.03-0.3 wt. % with dimensions of 1-10 μm and surface areas of 400-2,000 m2 / g. Optional additives include solvents, ionic liquids, latent curing agents, and strength enhancers to optimize curing and adhesion.

The invention discloses flame-retardant electrical epoxy resin and a preparation method thereof in the field of epoxy resin. The flame-retardant electrical epoxy resin is prepared from the following components in parts by weight: 70 to 80 parts of bisphenol F epoxy resin, 20 to 30 parts of alicyclic epoxy resin, 20 to 40 parts of benzoxazine resin monomer, 50 to 70 parts of curing agent and 0.5 to 1.5 parts of curing accelerator. Through the functionalized benzoxazine resin monomer containing the diphosphorus structure, optimization of epoxy resin formula components and improvement of a preparation process, synergistic improvement of flame retardance, electrical insulation performance, heat resistance and mechanical performance is achieved.

The invention belongs to the technical field of adhesives, and particularly relates to a coated sucker rod adhesive and a preparation method thereof. The adhesive comprises a component A and a component B, the component A is prepared from the following raw materials in parts by mass: 40-50 parts of bisphenol A type epoxy resin, 20-35 parts of bisphenol F type epoxy resin, 5-10 parts of modified lignin, 1-3 parts of graphene nanosheets, 2-4 parts of hyperbranched polysiloxane, 0.5-1 part of a silane coupling agent, 5-10 parts of a diluent and 0.2-0.5 part of a defoaming agent; the component B is prepared from the following raw materials in parts by mass: 25 to 30 parts of a curing agent, 0.5 to 1.2 parts of 2-ethyl-4-methylimidazole and 1 to 2 parts of a silane coupling agent. The adhesive prepared by the invention is fully cured, high in crosslinking density and excellent in hardness, corrosion resistance and the like of an adhesive layer.

The invention belongs to the technical field of nano composite materials, and particularly provides a corrosion-resistant flexible carbon nano polymer coating and a preparation method thereof, and the corrosion-resistant flexible carbon nano polymer coating comprises phenolic resin, bisphenol F epoxy resin, GO-NH2, self-repairing polyimide, a BYK-011 defoaming agent, talcum powder, polytetrafluoroethylene, a BYK333 flatting agent, silicon carbide, a B215 composite antioxidant, a UV531 ultraviolet light absorber and cardanol. The corrosion-resistant flexible carbon nano polymer coating prepared by the invention has excellent mechanical strength and wear resistance, good flexibility, efficient self-repairing capability and lasting corrosion resistance, the service life of the coating can be effectively prolonged, and the protection requirement in a severe environment is met.

The invention relates to low-temperature hand lay-up resin as well as a preparation method and application thereof. The low-temperature hand lay-up resin is prepared from a component A and a component B, the component A is prepared from the following components in percentage by mass: 35 to 50 percent of bisphenol A type epoxy resin, 25 to 35 percent of bisphenol F type epoxy resin, 20 to 35 percent of aliphatic epoxy diluent and 0 to 10 percent of aromatic epoxy diluent; the component B is prepared from the following raw materials in percentage by mass: 60 to 80 percent of alicyclic amine, 1 to 15 percent of accelerant A, 1 to 10 percent of accelerant B and 5 to 25 percent of epoxy composition; the mass ratio of the component A to the component B is 1: (0.2-0.4). The low-temperature hand lay-up resin provided by the invention can still keep excellent flowability and low-viscosity property in a low-temperature environment, has excellent mechanical properties after being cured, and can meet the maintenance requirements of wind power blades under a low-temperature condition.

The invention provides a low-VOC epoxy structural adhesive as well as a preparation method and application thereof, and relates to the technical field of high polymer materials. The low-VOC epoxy structural adhesive is mainly prepared from the following raw materials in parts by mass: 10 to 30 parts of filler, 0.1 to 0.5 part of curing accelerator, 1 to 5 parts of curing agent, 3 to 5 parts of moisture absorption agent, 0.01 to 0.05 part of pigment, 2 to 5 parts of thixotropic agent, 10 to 20 parts of core-shell modified epoxy resin, 10 to 15 parts of bisphenol F type epoxy resin, 10 to 20 parts of bisphenol A type epoxy resin, 15 to 25 parts of polyurethane modified epoxy resin and 10 to 15 parts of flexibilizer. 0.1 to 0.5 part of a silane coupling agent; and 0.1 to 0.5 part of a VOC adsorbent. By optimizing and upgrading the proportion of the low-VOC epoxy structural adhesive, high-efficiency selective adsorption of micromolecular volatile matters such as aldehydes and the like can be effectively realized, and the environmental protection property and the use safety of the product are remarkably improved.

The invention relates to a bi-component epoxy coating, a wire winding, a preparation method of the wire winding and an electric reactor. The bi-component epoxy coating comprises an epoxy prepolymer, an epoxy curing agent and a self-repairing microcapsule, wherein the self-repairing microcapsule contains an epoxy microcapsule and an amine microcapsule; wherein the amine microcapsule and the capsule wall of the epoxy microcapsule comprise polyurea, so that core liquid of the epoxy microcapsule and the amine microcapsule can be effectively preserved during primary thermocuring, and is not easy to flow out in advance. When the coating has cracks, bisphenol F diglycidyl ether in the amine microcapsules and aliphatic polyamine in the epoxy microcapsules can flow out and are gradually mixed, due to the high reaction activity of the aliphatic polyamine, secondary curing can be achieved without high temperature, microcracks can be repaired, further spreading of defects is prevented, and the service life of the coating is prolonged. And the long-term service capability of the self-repairing resin layer is effectively improved.

The invention provides halogen-free flame-retardant liquid epoxy resin, solid epoxy resin for powder coating and a preparation method of the solid epoxy resin, and belongs to the technical field of powder coating. The liquid epoxy resin disclosed by the invention is prepared by polymerizing 2, 4-diamino-6-phenyl-1, 3, 5-triazine, formaldehyde, triethyl phosphite, epoxy chloropropane, sodium hydroxide, DMF (Dimethyl Formamide) and the like. The contents of halogen-free flame-retardant elements nitrogen and phosphorus in the product are high, a solid epoxy resin product obtained by carrying out chain extension on liquid epoxy resin serving as a synthetic monomer of solid epoxy resin of the powder coating and bisphenol F is good in flame retardance, the oxygen index reaches 37% or above, and the flame retardance is high. A coating film obtained after the powder coating and an accelerated dicyandiamide curing agent are subjected to low-temperature rapid curing (150 DEG C / 10 min) is high in gloss and leveling grade and good in impact resistance, hardness and the like, and the application requirements of the powder coating are met.

A photosensitive resin composition according to the present disclosure contains an acid-modified vinyl-group-containing resin, a photopolymerizable compound, a photopolymerization initiator, and a thermosetting resin. The photopolymerization initiator includes a photopolymerization initiator having a fluorene skeleton. The thermosetting resin includes at least one selected from the group consisting of bisphenol F epoxy resins and novolac epoxy resins.

The invention discloses a high-adhesion bottom filling adhesive, a preparation method thereof and a chip packaging structure, and relates to the technical field of chip packaging, the bottom filling adhesive is composed of the following components by mass: 28-54% of epoxy resin, 38-67% of an anhydride curing agent, 2-5% of an accelerator, and 1-4% of an additive; wherein the epoxy resin is formed by compounding bisphenol F type epoxy resin and alicyclic epoxy resin, and the additive comprises liquid bismaleimide. The anhydride curing agent is adopted to accelerate the cross-linking curing reaction of the underfill adhesive and shorten the surface drying time, so that the underfill adhesive can be suitable for a tunnel type oven, and the chip packaging efficiency is improved; meanwhile, bismaleimide is introduced into the system, so that the surface energy difference between the underfill adhesive and a PI substrate is reduced, the adhesive force between the underfill adhesive and the PI substrate as well as between the underfill adhesive and a chip is improved, and the packaging yield of the chip is improved.

The present application belongs to the technical field of bisphenol F epoxy resin, and particularly relates to a preparation method of bisphenol F epoxy resin. In a protective gas atmosphere, bisphenol F, epichlorohydrin and an inorganic strong alkali aqueous solution are mixed to perform etherification reaction to obtain a reaction liquid containing chlorohydrin ether; under negative pressure, the inorganic strong alkali aqueous solution is added dropwise to the reaction liquid containing chlorohydrin ether to perform ring closure reaction to obtain bisphenol F epoxy resin; the dropwise adding includes sequentially performing first stage dropwise adding, second stage dropwise adding and third stage dropwise adding. By adopting a two-step method, no solvent or additive is needed in the pre-reaction stage, the dropwise adding procedure of liquid alkali in the main reaction stage is controlled, the alkali utilization rate is effectively improved, the raw material consumption is reduced, the side reaction is reduced, the quality of bisphenol F epoxy resin is improved, the product has high epoxy value and low hydrolyzable chlorine, and the safe and green production level is reached.

This invention provides a high-solids anti-rust primer suitable for all seasons and its preparation method. The anti-rust primer comprises component A and component B. Component A includes the following raw materials in parts by weight: 30-40% bisphenol F epoxy resin, 1-10% reactive diluent, 1-8% liquid carboxyl-terminated nitrile butadiene rubber (CTBN), 0.1-0.3% triphenylphosphine, 0.1-0.6% dispersant, 0.2-0.6% defoamer, 1-5% modified chopped glass fiber, 40-50% pigments and fillers, 0.7-1.3% thixotropic agent, and 3-5% solvent. Component B includes the following raw materials in parts by weight: 50-70% amine curing agent, 2-5% hyperbranched epoxy resin, and 25-45% modified ketimide curing agent. The anti-rust primer of this invention has the advantages of high solids content and high flexibility, and can be applied to damp surfaces and in ambient temperatures ranging from -10 to 40°C. Furthermore, the prepared anti-rust primer, as a coating, can be used as a rust-preventive primer for multiple parts of the ship, from the bottom to the hull, and has significant benefits in improving ship painting efficiency and reducing fugitive VOC emissions during the painting process.

The invention discloses a hot-pressing adhesive with good adhesion to a silica gel frame, an adhesive tape and a preparation method of the hot-pressing adhesive. The hot-pressing adhesive comprises the following raw material components in parts by weight: 100 parts of saturated polyester, 10-20 parts of bisphenol F epoxy resin, 5-20 parts of bisphenol A epoxy resin, 0.5-2 parts of polysiloxane, 2-3 parts of an anti-hydrolysis agent, 50-90 parts of a flame retardant and 0.5-1.5 parts of an isocyanate A curing agent, and 15-30 parts of an isocyanate B curing agent. In the formula of the hot-pressing adhesive, epoxy resin and polysiloxane structures are introduced into the combination of several saturated polyesters, stable carbonyl and ether bonds are formed, meanwhile, the content of the carboxyl in the saturated polyesters is low, and the hydrolysis-resistant agent prevents the autocatalytic hydrolysis reaction of the ester bonds to a certain extent, so that the hot-pressing adhesive has a good hot-pressing effect. And meanwhile, the damp-heat aging resistance of the saturated polyester is improved, so that the high-stripping-force glue for the packaging film has good damp-heat aging resistance.

A slow-reaction recyclable epoxy resin system for structural composites and a process of recycling the composites made therefrom are disclosed. The system includes an epoxy resin component including: a high purity epoxy resin selected from a high purity bisphenol A epoxy resin, a high purity bisphenol F epoxy resin, and combinations thereof, where the high purity epoxy resin is in a range of from 20 wt% to 95 wt% of the total weight of the cyclopentene resin component; a standard epoxy resin selected from a standard bisphenol A epoxy resin, a standard bisphenol F epoxy resin, and combinations thereof, where the standard epoxy resin is in the range of from 1 wt% to 50 wt% of the total weight of the epoxy resin component; and a curing agent component including a curing agent having at least one cleavage bond selected from a group including an acetal bond, a ketal bond, a formal bond, an orthoester bond, or a siloxy bond. The pot life of the slow-reaction recyclable epoxy resin system is greater than 540 minutes at 25 DEG C.

The invention relates to a negative dielectric constant polyaniline / epoxy resin composite material and a preparation method thereof. The preparation method comprises the following steps: step 1, pretreating polyaniline powder; step 2, pre-dispersing and mixing the pretreated polyaniline powder and bisphenol F epoxy resin; step 3, performing curing agent addition and degassing treatment on the pre-dispersed and mixed mixture; 4, the degassed mixture is subjected to mold filling and preliminary forming; step 5, carrying out electric field auxiliary curing on the primarily formed mixture; and step 6, carrying out post-treatment and sample preparation on the polyaniline / epoxy composite material subjected to electric field auxiliary curing. The dielectric property and the reliability of the composite insulating material can be remarkably improved.

The application discloses a glass fiber sizing agent for molded grating, which comprises effective components and water, and the solid content of the sizing agent is 6-9%, and the percentage of the solid mass of the effective components in the total solid mass of the sizing agent is as follows: 5.0-12.0% of silane coupling agent A; 2.0-7.0% of silane coupling agent B; 20.0-45.0% of film forming agent A; 20.0-44.0% of film forming agent B; 10.0-17.0% of film forming agent C; 3.0-8.0% of lubricant; and 1.0-6.0% of pH value regulator; wherein the film forming agent A is a vinyl acetate-vinyl copolymer emulsion, the film forming agent B is a bisphenol F epoxy resin emulsion, and the film forming agent C is a modified polyester resin emulsion. The glass fiber coated by the sizing agent has good yarn smoothness, easy dispersion, good fusing property and flexibility, is not easy to be abraded, has good compatibility with unsaturated polyester resin, has fast penetration speed, has good use smoothness, and meets the process requirements of molded glass steel grating production, and the molded glass steel grating prepared from the sizing agent has excellent shearing resistance.

This invention provides a tunnel ceramic coating suitable for high-altitude areas and its preparation method, belonging to the field of coating technology. The ceramic coating, by mass percentage, comprises the following raw material components: 20-28% hydroxyl-modified polysiloxane, 5-9% glycidylamine epoxy resin, 5-9% bisphenol F epoxy resin, 4-8% silicon-containing elastic particles, 3-5% nano-silica, 8-12% 3-aminopropyltriethoxysilane, 0.3-0.6% film-forming aid, and the balance being solvent. This invention ensures that the prepared ceramic coating can maintain high hardness and high adhesion for a long time even in environments with large temperature differences.

The invention relates to a single-component epoxy adhesive suitable for magnetic induction heating curing and a preparation method of the single-component epoxy adhesive. The adhesive comprises the following components in percentage by weight: 3-10% of a modifier, 3-15% of bisphenol F type epoxy resin, 1-4% of alkyl glycidyl ether, 5-14% of a curing agent, 35-50% of filler, 0.5-2% of carbon black, 0.5-3% of fumed silica, 0.5-5% of an auxiliary agent and the balance of first bisphenol A type epoxy resin, the modifier is polyurethane modified epoxy resin; the curing agent comprises dicyandiamide and imidazole, and the weight ratio of the dicyandiamide to the imidazole is (3-8): (2-6). According to the invention, the modifier is limited to be polyurethane modified epoxy resin, fumed silica is added, and the curing agent comprises the compounding of dicyandiamide and imidazole, so that the prepared adhesive can keep the heat conduction and toughening properties, further balance the stability and sag resistance, and meet the application of a magnetic induction heating process.

The application relates to the technical field of paint, in particular to a two-component epoxy strong-acid-and-strong-base-resistant heavy-duty paint and a preparation method thereof, which comprises a main paint and a curing agent, the main paint contains a compounded system of bisphenol A epoxy resin and bisphenol F epoxy resin, a composite diluent, a functional filler synergized by flaky glass flake and spherical filler, a silane coupling agent and a special anti-rust pigment; the curing agent is compounded by polyamide, phenolic amine, modified alicyclic amine and modified aliphatic amine, the paint has high solid content and low VOC, has strong adhesion to various substrates, has a bottom-surface-combined function in a single coating layer, is resistant to strong acid, strong base and extreme corrosive environment, is simple to construct, is fast to cure and has a long service life.

The invention relates to the field of high-performance adhesives, in particular to a double-component adhesive for a strain gauge and a preparation method of the double-component adhesive, and the adhesive is composed of a component A and a component B, the component A comprises an epoxy resin system and a solvent, the epoxy resin system comprises bisphenol A type epoxy resin, bisphenol F type epoxy resin and a reactive diluent, and the solvent is tetrahydrofuran; the component B comprises a curing agent, a curing catalyst and a solvent, the curing agent is pyromellitic dianhydride, the curing catalyst comprises N, N-dimethyl benzylamine and salicylic acid, and the solvent is tetrahydrofuran; the mass ratio of the component A to the component B is (3: 1)-(4: 1), the working temperature range of the adhesive is from-269 DEG C to 210 DEG C and is far higher than that of a traditional epoxy adhesive, and the adhesive is particularly suitable for strain measurement in an extreme temperature environment.

The application relates to the field of resin coatings, and particularly discloses a coating containing a resin composition and a preparation method and application thereof. The coating containing the resin composition is prepared from raw materials including a resin composition, a curing agent and an auxiliary material mixture, and the resin composition, the curing agent and the auxiliary material mixture are used in a weight ratio of 100:30-50:50-150 of the resin composition, the curing agent and the auxiliary material mixture; wherein the resin composition is composed of isocyanuric acid triglycidyl ester, bisphenol F type ring sulfur resin and tetraglycidyl amine type epoxy resin. The preparation method is that the auxiliary material mixture is added into the resin composition and the curing agent in a certain proportion respectively, mixed uniformly and then mixed, and finally the coating containing the resin composition is obtained. The coating has good bonding strength, good high-temperature resistance, acid corrosion resistance, rapid cooling resistance and rapid heating resistance, and the surface drying time meets the construction requirement, and the coating can be applied in a wet desulfurization chimney inner wall coating.

An insulating tape (100) is impregnated with a liquid resin containing at least one of a bisphenol A-type epoxy compound having a repeating number of zero and a bisphenol F-type epoxy compound having a repeating number of zero. A microcapsule (130) includes an outer shell body and an inclusion material having a property of promoting curing of the liquid resin. A binder layer (120) is composed of a crystalline epoxy resin having a molecular structure in which two phenyl groups are linked by a single bond, a molecular structure in which two phenyl groups are linked by an ether bond, or a molecular structure in which two phenyl groups are linked by a methylene group.

The invention relates to an epoxy adhesive for assembling bridge segments in a marine environment and a preparation method, the epoxy adhesive comprises a component A and a component B. The component A comprises epoxy resin, modified epoxy resin, a reactive diluent, a thixotropic agent, a coupling agent, a defoaming agent, an ultraviolet light absorber and a filler; the epoxy resin comprises bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin and bisphenol F type epoxy resin, and the reactive diluent is C12-C14 alkyl glycidyl ether; the component B comprises a modified amine curing agent, a thixotropic agent and a filler, and the filler is formed by compounding different grades of active silica micropowder. Through molecular hydrophobic design, physical structure dense filling and interface chemical bonding, the adhesive has excellent wet concrete adhesion, extremely low chloride ion permeability, excellent damp-heat aging resistance and balanced construction manufacturability, and solves the problem of durability of a joint of a segment assembled bridge in a marine environment.