The invention relates to a two-component thermally conductive composition comprising: a composition (A) comprising: a silylated
polymer, and a
rheology agent (r1) selected from
amide waxes and / or a
rheology agent (r2) comprising: from 1% to 40% by weight of a bis-
urea (a) obtained by reacting a primary
aliphatic amine with a diisocyanate of
molar mass less than 500 g / mol, relative to the total weight of the
rheology agent (r2), and from 60% to 99% by weight of a specific
plasticizer (b), relative to the total weight of the rheology agent (r2), said rheology agent (r2) being in the form of a suspension of
solid particles of the bis-
urea (a) in a continuous phase of
plasticizer (b), and a composition (B) comprising: at least 1% by weight of a filler (C) relative to the total weight of the composition (B), the filler (C) contributing at least 0.0025% by weight of
moisture relative to the total weight of the composition (B),Composition (A) and / or composition (B) further comprising at least one thermally conductive filler. The invention also relates to the use of a filler (C) having a specific
moisture content for crosslinking, without the addition of
free water, a two-component composition, the two-component composition comprising a composition (A) comprising a silylated
polymer, and a composition (B) comprising said filler (C). Figure for the abstract: none.