The invention discloses multi-
solvent synergistically activated low-temperature semi-sintered
copper paste and a preparation method and application thereof, and belongs to the technical field of
conductive paste. The multi-
solvent synergistically activated low-temperature semi-sintered
copper slurry comprises the following
raw material components in percentage by
mass: 82-88% of conductive filler, 2-3% of a resin carrier, 4-7% of an activating
solvent, 4-7% of a dispersing solvent and 2-3% of a curing agent. Through cooperation of multiple solvents, full-stage activation of the
copper particles is achieved, pre-connection and
sintering of the copper particles before resin is completely crosslinked and cured are promoted, densification of the overall structure is improved, the insulation
barrier effect of the resin is effectively avoided, the resistivity is reduced, meanwhile, inhibition of the resin on
sintering of the copper particles is solved, and the service life of the copper particles is prolonged. And good balance between
conductivity and interface adhesion is realized. Through resin curing, chemical bonding between the
slurry and the substrate can be enhanced, a
metal bond network among copper particles is expanded, and mechanical connection stability and
electrical performance are guaranteed.