The invention relates to the technical field of storage
chip packaging, and discloses a high-density
assembly method for a storage
chip by using a modular integrated packaging technology, which comprises the following steps of: obtaining a storage
chip to be assembled and a packaging element, performing high-precision scanning to obtain geometrical shape data, and constructing an
assembly model; the method comprises the following steps: defining an
assembly constraint for a chip to obtain an assembly relationship, searching a preferred path, constructing and segmenting an assembly space, and adjusting the path through a
collision test to obtain a target assembly path. And querying path parameters to construct assembly equipment parameters, and completing parameter configuration through
dynamic simulation to obtain target assembly equipment. A chip and an element are sent to a
station to obtain a pre-assembled part,
pose deviation is adjusted to obtain a target assembled part, and a target device and a path are used for packaging to obtain a preliminarily packaged chip. And through an
electrical performance test, if the chip is normal, packaging enhancement
processing is carried out, quality classification is carried out after
nondestructive testing, then integrated packaging is carried out, and finally a target packaging chip is obtained. According to the invention, the high-density assembly quality of the storage chip can be improved.