342results about How to "Lower insertion force" patented technology

A connector includes a housing forming at least one receptacle and a terminal received in each receptacle. The housing has upper and lower faces in which opposite slots are defined. Through holes are defined in the slots and extending to the receptacle. The terminal has an engagement section, a retention section extending from the engagement section, an extension section extending from the retention section and opposite to the engagement section and a wire engaging section projecting from the extension section. The engagement section includes a plurality of circumferentially spaced resilient leaves forming a cylinder axially aligned with the holes defined in the upper and lower faces of the housing. Thus, when a pin of a mating connector is fit into the cylinder of the engagement section through either one of the holes of the housing, the pin is completely surrounded by the leaves and a large contact area is formed between the pin and the engagement section. Due to the resiliency of the leaves, only a low insertion force is needed in completing insertion of the pin into the engagement section. Firm engagement, low impedance and low noise, as well as reduced heat generation, can be realized between the pin and the engagement section.

An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.

A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.

Featured is a medical instrument driver, a robotic apparatus embodying such a medical instrument driver and methods related thereto for inserting a medical instrument into tissue of a mammal (e.g., human). Such medical instruments include medical needles, biopsy needles, trocars, cutters and introducers. Such a medical instrument driver according to the present invention is configured and arranged so that medical instrument is rotated as it is being moved longitudinally for insertion into the tissue such that the medical instrument is spiraling as it pierces and traverses the tissue to the target area.

A test probe consists of an elongated screw machine contact biased by a helical spring and mounted in a through hole of a non-conductive substrate. One end of the contact includes a crown for engaging a solder ball lead of an IC package, and the contact includes an intermediate collar which maintains the contact within the through hole. The helical spring is disposed about the contact, with one end thereof engaging the lower end of the collar. The other end of the helical spring has contiguous coils and is of a reduced diameter so as to extend beyond the lower end of the non-conductive substrate to make electrical contact with a printed circuit board. When the test probe is compressed between the IC package and the printed circuit board, the inherent twisting of the helical spring causes the contact to tilt and make electrical contact with the contiguous coils, thereby establishing a direct electrical path between the IC package and the printed circuit board, with minimum resistance and minimum inductance. In an alternate embodiment, each probe is disposed within a dielectric housing which, in turn, is disposed in a through hole in a conductive substrate to effectively shield the probe from electrical interference.

An optical fiber connector assembly includes a receptacle, two connectors accommodated in respective accommodation grooves in the receptacle and having a respective clip located at a top side thereof for engagement with a respective retaining groove in a mating optical fiber adapter, an optical fiber cable having two optical fibers respectively mounted in the connectors, and a sliding cover covered on the receptacle and movable relative to the receptacle to elastically deform the clips and to further disengage the clips from the respective retaining grooves of the optical fiber adapter for allowing removal of the optical fiber connector assembly out of the optical fiber adapter with less effort.

A female receiving connector for connecting sections of tubing is provided. The female receiving connector includes a housing having a top housing portion and a bottom housing portion coupled to the top housing portion. The female receiving connector also includes a button moveably coupled within the housing. A locking plate is coupled to the button and configured to move with the button. The locking plate has a profile lead-in having an interfacing surface located at a proximal side of the profile lead-in for interfacing a male connector. The interfacing surface extends along at least a portion of at least three sides of an aperture of the locking plate and is tapered along one or more of the at least three sides. Additionally, the profile lead-in includes a locking surface located at a distal side of the profile lead-in for securing the male connector within the housing of the female receiving connector. A substantially flat surface is located between the interfacing surface and the locking surface.

There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 μm, and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 μm, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%. The surface of the conductive material is subjected to a reflow process and preferably, an arithmetic mean roughness Ra of the surface of the material in at least one direction, is not less than 0.15 μm while the arithmetic mean roughness Ra thereof, in all directions, is not more than 3.0 μm and the average thickness of the Cu—Sn alloy covering layer is preferably not less than 0.2 μm. The conductive material is fabricated by a method whereby the surface of the base material is subjected to roughening treatment, an Ni plating layer, a Cu plating layer and an Sn plating layer are formed, as necessary, over the surface of the base material, and subsequently, a reflow process is applied.

An electrical contact includes a first set of spaced apart cantilevered beams connected to a first rail, and a second set of cantilevered beams connected to a second rail. The first set of cantilevered beams project toward the second rail, and the second set of cantilevered beams project toward the first rail, wherein the first and second sets of cantilevered beams reside in alternating relationship. Each cantilevered beam is bowed and is outwardly tapered from its connected proximal to its unconnected distal end.

A button head tie has a button head and a tie strap. The button head is a generally flat member having an aperture for receiving the tie strap. The aperture includes lead-in ramps to facilitate tie strap insertion and is configured to prevent angled tie strap insertion. The tie strap is a flat elongate member having a wedge that is captured within the aperture. The remainder of the strap passes through the aperture. The wedge and strap have teeth and serrations on both sides, respectively, the teeth and serrations being engageable. In use, the strap is looped around a bundle and inserted into the aperture to either side of the wedge. Strap insertion force is reduced by standoff tabs which elevate the wedge out of aperture, temporarily, during installation. When loop tension is applied to the bundle, the wedge is pulled into the aperture, compressively locking the strap.

A test probe consists of an elongated screw machine contact biased by a helical spring and mounted in a through hole of a non-conductive substrate. One end of the contact includes a crown for engaging a solder ball lead of an IC package, and the contact includes an intermediate collar which maintains the contact within the through hole. The helical spring is disposed about the contact, with one end thereof engaging the lower end of the collar. The other end of the helical spring has contiguous coils and is of a reduced diameter so as to extend beyond the lower end of the non-conductive substrate to make electrical contact with a printed circuit board. When the test probe is compressed between the IC package and the printed circuit board, the inherent twisting of the helical spring causes the contact to tilt and make electrical contact with the contiguous coils, thereby establishing a direct electrical path between the IC package and the printed circuit board, with minimum resistance and minimum inductance.

A harness clamp tie includes a locking head and a flexible strap extending outwardly from the locking head. The strap is insertable through the locking head to form a loop that can be used at least one item. A pawl in the locking head secures the strap. Nonslip rails formed along the outer edge of the strap face and clamping rails formed on the locking head aid in securing small items. Conic friction points are formed on both sides of the strap surface to provide a mechanical grip for pulling the strap through the locking head. A mounting fastener extends from the locking head in the opposite direction. The fastener secures the tie to a mounting structure such as an aperture in a panel. The fastener includes a pair of flexible winged springs which help to stabilize the tie and hold the tie perpendicular to the panel.

A transseptal needle includes an elongate needle body having a distal end and a proximal end and a cannular needle tip located proximate the distal end of the needle body. The needle tip has a distal segment, a proximal segment, and a longitudinal axis. An inner surface of the needle tip defines a passageway spanning at least a portion of the needle tip, and an outer surface of the needle tip defines a wall with the inner surface. The distal segment of the needle tip also includes a wedge surface and a dome-shaped region. The wedge surface forms a wedge angle of other than 90 degrees relative to the longitudinal axis. The dome-shaped region, which intersects the wedge surface, includes at least two bevels that intersect the wedge surface and that intersect each other at one or more points on the needle tip.

An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.

A card edge connector for receiving a module and includes an insulative housing having a mounting face, a pair of side walls with a central slot formed therebetween, a tower portion extending upwardly from the side wall; a number of contacts mounted to the housing and each defining a retaining portion to fix with the housing, a deflectable contacting arm extending upwardly from the retaining portion and a soldering portion extending downwardly from the retaining portion and projecting beyond the mounting face; and an ejector rotatably mounted on the tower portion of the housing. The ejector includes a base portion, an ejecting portion extending inwardly from the base portion and protruding into the central slot to eject the memory module from the central slot and a cam lobe extending inwardly from the base portion to drive the module down, the cam lobe is located above the ejecting portion.

A disk drive comprises a cartridge holding mechanism which has a small size and reduces a damper load. The disk drive comprises: a spindle motor 91 which mounts and rotates a disk; a traverse base 82 which holds the spindle motor 91; a rubber damper 71 which flexibly holds the traverse base 82; a mechanical chassis 60 which holds the traverse base 82 through the rubber damper 71; a tray 20 which mounts a cartridge 1 in which a disk is housed; and a loading motor 61 which moves the disk in the cartridge 1 close to the spindle motor 91 or away from the spindle motor 91. The cartridge 1 is supported by the mechanical chassis 60 through the tray 20.