The present invention is directed to a novel functional polyorganosiloxane having on average two or more vinyl groups in one molecule thereof.
The polyorganosiloxane is represented by the following formula (I):
(R23SiO1/2)a(Ph2SiO2/2)b(R1SiO3/2)c(PhSiO3/2)d(R1R2SiO2/2)e (I)
(wherein “a” to “e” represent compositional proportions by mole, satisfying the conditions: 0.15≦a≦0.4, 0.1≦b≦0.2, 0.15≦c≦0.4, 0.2≦d≦0.4, 0≦e≦0.2, and “a+b+c+d+e”=1; R1 represents a vinyl group; R2 represents a methyl group or a phenyl group; and Ph denotes a phenyl group) and is produced through polycondensation of an alkoxysilane mixture in the presence of an active solvent.
The present invention also relates to a curable resin composition containing the polyorganosiloxane, which composition is suitably employed for encapsulating optical devices such as LEDs, photo-sensors, and lasers as well as optical materials.
The invention further relates to a composition for encapsulating an LED suitable for encapsulating LEDs emitting blue to UV light and white light-emitting devices.