181results about How to "Reduce warping" patented technology

In an electronic device having multilayer resin interconnection layers, it is desired to reduce the warp of its support substrate. It is manufactured by: forming a lower layer including a via and a first insulating part on the support substrate; and forming an intermediate layer including a first interconnection and a second insulating part covering the first interconnection on the lower layer. The lower layer is formed by: forming the first insulating part on a first circuit region and a first region surrounding it; and forming the via on the first circuit region. The intermediate layer is formed by: forming the first interconnection on the first circuit region; forming a film of the second insulation part to cover the lower layer; and removing the second insulating part on the first region such that an outer circumferential part of an upper surface of the lower layer part is exposed.

The present invention provides electrolyte sheets for solid oxide fuel cells, the electrolyte sheets being able to improve their adhesion to electrode films formed on both surfaces thereof and being also able to improve electric power generation characteristics of fuel cells by an increase in their electrode reaction areas. There is disclosed an electrolyte sheet for solid oxide fuel cells including a sintered sheet, wherein surface roughness of the sheet as measured by an optical and laser-based non-contact three-dimensional profile measuring system is 2.0 to 20 μm in Rz and 0.20 to 3.0 μm in Ra, and wherein a ratio of Rz of one surface (having a greater Rz and a greater Ra) to Rz of the other surface having a smaller Rz and a smaller Ra is in a range of 1.0 to 3.0, and a ratio of Ra of one surface (having a greater Rz and a greater Ra) to Ra of the other surface having a smaller Rz and a smaller Ra is in a range of 1.0 to 3.0, and a ratio of Rmax to Rz (Rmax/Rz ratio) of at least one surface is in a range of 1.0 to 2.0.

An apparatus and method for maintaining or adjusting the orientation of a large area substrate is disclosed by using multiple support plates disposed below a susceptor adapted to support the large area substrate. The multiple support plates are supported by a plurality of support shafts that are coupled to at least one actuator. The apparatus is designed to selectively adjust the horizontal cross-sectional profile of the susceptor to promote even and uniform processing. The horizontal profile may be one of planar, concave, or convex. The apparatus allows any adjustment to be made before, during, or after processing.

A light source module of the present invention is configured such that there is a through hole (23) in one longitudinal end portion of a light guide (21) that constitutes a light guide plate, into which through hole (23) a positioning pin (24) for positioning an LED light source (12) and the light guide (21) fits. Further, a guide (9) is provided to the other end portion of the light guide (21), which guide (9) restrains the light guide (21) in a direction of a short side but does not restrain the light guide (21) in a direction of a long side. This makes it possible to provide a light source module that can reduce warping and cracking caused by expansion of a light guide, and an electronic apparatus including the light source module.

The invention provides a woven fabric structure of a glass fiber leno mesh and a weaving method thereof. In the woven fabric structure, ground warps and weft yarns are woven into the plain weave in a one-to-one up-and-down staggered manner; doup warps are orderly and regularly shuttled back and forth to extend into a strand by surrounding the same ground warp or a ground warp group composed of two adjacent ground warps in the extension direction of the ground warps; the doup warps are twisted with the ground warps to form the leno structure. The woven fabric structure is more stable than the existing woven fabric structure; the weaving method of the woven fabric structure is simple and convenient in process and low in cost, and thus is capable of completely taking the place of the traditional mesh weaving process.

The invention provides a wafer mold material for collectively subjecting a wafer having semiconductor devices on a surface thereof to resin molding, wherein the wafer mold material has a resin layer containing a filler and at least any one of an acrylic resin, a silicone resin having an epoxy group, an urethane resin, and a polyimide silicone resin, and the wafer mold material is formed into a film-like shape. There can be a wafer mold material that enables collective molding (wafer molding) with respect to a wafer having semiconductor devices formed thereon, has excellent transference performance with respect to a large-diameter thin-film wafer, can provide a flexible hardened material with low-stress properties, and can be preferably used as a mold material in a wafer level package with less warp of a formed (molded) wafer.

The invention belongs to the field of foam ceramic, and particularly relates to an alumina fiber-enhanced nano-alumina foam ceramic and a preparation method thereof. The alumina fiber-enhanced nano-alumina foam ceramic comprises the following raw materials: a nanometer aluminum oxide powder, a premix solution, a dispersing agent, aluminum oxide fiber, a foaming agent, an initiator and a catalyst, wherein premix solution is formed by adding a monomer and a crosslinking agent into an alcohol-water mixed solution; and the mass ratio of the alumina fiber to nano-alumina powder is (5-30): (95-70). By adopting the alcohol-water mixed solution as a solvent for gel casting, the surface tension among particles can be reduced, and the quality of dry blanks can be increased; the compressive strength of the finished product is more than 30MPa, the porosity is more than 50%, the volume density is less than 3g/cm<3>; the usage temperature is 1500-1750DEG C, the alumina fiber-enhanced nano-alumina foam ceramic is a lightweight and high temperature-resistant refractory material, and can be used in the field of lining materials of a high-temperature electric resistance furnace. The invention further provides a preparation method of the alumina fiber-enhanced nano-alumina foam ceramic, thus being suitable for industrial production.

The invention discloses a method for manufacturing an aluminum/magnesium/aluminum composite plate on a three-dimensional layer interface. The method comprises the steps of firstly, machining the three-dimensional interfaces matched with each other on magnesium alloy plates and aluminum alloy plates; cleaning to-be-bonded surfaces of the magnesium alloy plates and the aluminum alloy plates; stacking and assembling the magnesium alloy plates and the aluminum alloy plates alternately in a mutually meshing mode to obtain a composite plate blank; repeatedly carrying out unidirectional ultrasonic temperature change and load change hot pressing to fill a mold; and carrying out hot rolling to obtain the tightly bonded composite plate. According to the method, a two-step thermal deformation methodcombining hot pressing and rolling is adopted to obtain the laminated plate with uniform thickness, smooth surface and relatively high surface quality, the process is simple, the energy consumption islow, the quality of the composite plate is high, and the method is suitable for application and popularization.

In a deposition device, a deposition mask of a mask unit (54) has a width in the scanning (movement) direction thereof that is less than a width of a target substrate (on which film will be deposited) in the same scanning direction. A substrate holder includes a substrate holding surface that has at least one curve along the scanning direction matching a bend in the target substrate caused by the weight thereof, and this curve occurs in the direction perpendicular to the scanning direction.

The invention provides a manufacturing method for a glass substrate with a thin film, which allows easy manufacturing of a less warped glass substrate with a thin film. The method performs: a deformation step of plastically deforming a glass substrate 10 to give a principal surface 10a thereof a curved shape so that the principal surface 10a of the glass substrate 10 is flattened in the final state after the formation of the thin film; and a thin film formation step of forming a thin film 11 on the principal surface 10a of the plastically deformed glass substrate 10.

The invention discloses a slipping type seamless telescopic device. A telescopic seam is arranged between main beams, upper surfaces of the main beams are provided with comb plates, and the comb plate arranged at the upper part of the telescopic seam is a trans-seam comb plate, and a fixing comb plate is connected with the trans-seam comb plate; a top paving layer is arranged at the upper part of the trans-seam comb plate, and both sides of the top paving layer are respectively provided with elastomer prefabricating blocks; left and right sides of the elastomer prefabricating blocks are respectively arranged with bituminous concrete paving layers. The slipping type seamless telescopic device and a bridge face paving layer can be formed to be a continuous body, so as to guarantee stable and comfortable driving; the driving noise is small and waterproof performance is good, and the slipping type seamless telescopic device is convenient to clean and remove snow, and other maintaining works; the structural design is more reasonable, and construction is convenient; the comb plates are respectively arranged beneath the paving layer and above the main beam, and can be fixedly moved; and thereby, the problem of empty lower part of the tooth end of the comb plate is effectively solved, and the shortcoming that the traditional seamless telescopic device is easy to crack is overcame.

Provided are a method and a system for manufacturing a liquid crystal display device, which can reduce warping of a liquid crystal panel by bonding optical films alternately to the first and second panel surfaces of the liquid crystal panel, in which the method includes: feeding carrier films from continuous rolls, respectively; and bonding steps including bonding optical films, which are peeled off or being peeled off from the carrier films, to the first and second panel surfaces of a liquid crystal panel, respectively, wherein in the bonding steps, bonding the optical film to the first panel surface of the liquid crystal panel and bonding the optical film to the second panel surface of the liquid crystal panel are performed alternately.

The invention relates to a joint cover assembly for covering a gap between two floor elements covering a subsurface, the assembly comprising a first molding element comprising an upper section having an exposed surface, the exposed surface comprising a décor, and a foot depending therefrom, wherein the foot has a gripping groove extending towards the exposed surface and being defined by two side walls; and a second molding element comprising an upper surface and a lower surface, to be joined to the first molding element, as well as an exposed surface comprising a décor, wherein the lower surface has a groove extending towards the upper surface and being defined by two side walls; characterised in that the joint cover assembly furthermore comprises a track having two upstanding sections, wherein the distance between the upstanding sections corresponds substantially to the width of the foot and also to the distance between a gripping groove's side wall and a proximal side wall of the second molding element's groove. Furthermore, the invention relates to a kit comprising such joint cover assembly. Finally, the invention relates to a method of covering a sub floor adjacent a floor element by using this joint cover assembly or this kit.

The invention relates to a motor stator punching machining machine. The machine comprises a workbench, a punching device and clamping devices, wherein the punching device is mounted at the upper end of the workbench, the clamping devices are arranged below the punching device, the clamping devices are connected with the workbench in a slide fit mode, and the clamping devices is arranged at equal distance from left to right. According to the motor stator punching machining machine, a multi-stage adjustable design concept is adopted for motor stator punching machining, the stability degree of round steel plate machining is improved, the accuracy of punching points is guaranteed, then the precision of the motor stator punching machining is improved, and meanwhile, a motor stator with the required number of slots can be machined according to requirements due to the fact that spacing of edge punching blocks and stretching and retracting of a second jacking support column are both controllable.

The invention discloses an acrylate pressure sensitive adhesive emulsion of a PET substrate for battery packaging, a preparation method and application thereof. The pressure sensitive adhesive emulsion comprises the following components by weight: 75-85 parts of an acrylate soft monomer, 15-25 parts of an acrylate hard monomer, 2-5 parts of a functional monomer, 1-3 parts of an internal crosslinking monomer, 0.5-2 parts of an anionic emulsifier, 0.5-1 part of a non-ionic emulsifier, 0.1-0.3 part of a buffering agent, 0.02-0.1 part of a defoaming agent, 0.02-0.08 part of a wetting agent, 0.02-2parts of an initiator, 120 parts of water, 0.02-0.1 part of an oxidant, 0.04-0.1 part of a reducing agent, and 1-3 parts of a pH regulator. The pressure sensitive adhesive emulsion provided by the invention has good mechanical properties, can reduce the warping and cracking probability of the PET substrate and ensure the adhesive durability, and is green, low-carbon and environment-friendly.

The invention provides a method of preparing a high electron mobility transistor (HEMT) on a large-sized Si substrate, and particularly relates to a method of preparing a crack-free and high-crystal quality AlGaN/GaN HEMT device by adopting a selective area growth (SAG) method and by adopting carbon nanotubes as a periodic dielectric mask. On the Si substrate, a metal organic chemical vapor phase epitaxy technology is adopted to grow an AlN nucleation layer and an AlGaN seed layer; then, a low pressure chemical vapor deposition (LPCVD) method is adopted to grow multiple layers of carbon nanotubes arranged neatly, and through growth and weaving, a continuous carbon nanotube film is formed finally; on the basis, the SAG method is adopted, growth selectivity of GaN on the dielectric mask and the substrate is used, a GaN epitaxial layer is limited to grow in a region without a concealed film, a discrete window is formed, and tensile stress in the overall epitaxial layer is released; and multi-cycle Al component-gradient Aly1Ga1-y1N/GaN superlattices or AlN/Aly1Ga1-y1N/GaN superlattices are adopted as a stress control layer, and the crack-free and high-crystal quality GaN epitaxial layer is acquired. On the basis, the AlGaN/GaN HEMT device is prepared.

The invention provides a soft-to-hard film sticking process and a film sticking product. The film sticking process includes the steps that step S1, vacuuming is respectively conducted on the upper andlower portions of a hard planar assembly of which film sticking needs to be conducted, a flexible protective film is placed on the upper portion of the hard planar assembly, and the vacuum degree atthe lower portion is greater than the vacuum degree at the upper portion; step S2, the flexible protective film is laminated on a sticking start end of the hard planar assembly by using a roller; stepS3, the vacuuming of the upper portion of the hard planar assembly is stopped, and the flexible protective film is rolled by using the roller until the film sticking of the hard planar assembly is completed. The deformation of the flexible protective film during the rolling process of the flexible protective film by using the roller is greatly reduced, and the tensile stress on the hard planar assembly is greatly reduced, so that the problem of warping of the hard planar assembly due to the tensile stress is effectively alleviated or even avoided, and the formation of pits and creases in thevacuum hole-adsorbed place after rolling by the roller and the protective film scratching due to the friction between the roller and the flexible protective film are avoided.

A high-frequency module la includes: a wiring substrate 2; a plurality of components 3a and 3b that are mounted on an upper surface 2a of the wiring substrate 2; a sealing resin layer 4 that is stacked on the upper surface 2a of the wiring substrate 2; a shield film 6 that covers a surface of the sealing resin layer 4; and a shield wall 5 that is provided in the sealing resin layer 4. The shield wall 5 is formed of two shield wall element bodies 5a and 5b that have straight line shapes in a plan view, and the two shield wall element bodies 5a and 5b are arranged such that the shield wall element bodies each have one end surface that is not exposed at a different peripheral side surface 4b of the sealing resin layer 4.

The invention discloses a production method of a multilayer printed circuit board. Two copper foil wire layers are disposed on upper and lower surfaces of a copper-clad substrate or insulating plate respectively, and circuit through holes by which the upper and lower surface are communicated are established between the layers. After wiring on the copper-clad substrate or insulating plate is complete, oxidation is performed and the copper-clad substrate or insulating plate is placed in an epoxy resin glue cell for cycle control of temperature, humidity and solid-content ratio. The copper-clad substrate or insulating plate is coated with an epoxy resin glue layer. After the epoxy resin glue layer fully solidifies, an epoxy resin thin glue layer is applied to the copper-clad substrate or insulating plate and is baked to semi-solid state. Multiple copper-clad substrates or insulating plates are stacked. After copper foils are spread to the top and bottom of the stack, the stack is subjected to high-temperature press-fitting. The press-fitted copper-clad substrates or insulating plates are subjected to surface circuit treatment, and circuit through holes are established between the plates to allow for communication of circuits in all layers. Flatness of the inner layer of the printed circuit board is improved, inner buried holes are smoothed, manufacturing yield of fine lines and uniformity of line width are improved, and bending and warping degree of the printed circuit board is lowered.