6results about How to "Address stress" patented technology

This invention relates to the field of shock waveguide technology and discloses a spring electrode shock waveguide, comprising a slender carrier and a balloon. The space formed between the balloon and the carrier is an annular channel for fluid to enter and achieve inflation. First, the electrode in the guide tube is designed as a spring-type spiral structure and wound around the surface of the carrier, which can provide good electrical contact and make the electrode have excellent ductility, solving the problem of large stress on the electrode during the deformation of the balloon under fluid compression. Through the design of a first support mechanism and a second support mechanism, the first support mechanism is connected between two adjacent outer walls of the electrode, providing axial support force for the electrode, and the second support mechanism is connected between the inner wall of the balloon and the outer wall of the electrode, providing radial support force for the electrode. This reduces the pressure on the electrode when the internal pressure of the balloon increases and the balloon expands, further solving the stress problem of the electrode during the deformation of the balloon.

This invention provides a diamond thin-film battery and a method for preparing a diamond thin film. The method involves providing a single-crystal diamond substrate, which includes a first region, a second region, and a third region. The single-crystal diamond substrate is divided into an intrinsic layer and a highly doped P-type epitaxial layer, with the boundary between the intrinsic layer and the highly doped P-type epitaxial layer located within the first region. Carbon ion implantation is performed on the second region to form an amorphous carbon layer. After forming the amorphous carbon layer, it is annealed under vacuum conditions to modify the amorphous carbon layer into a graphite layer. After forming the graphite layer, a first diamond layer is deposited on the surface of the third region. A second diamond layer is deposited on the surface of the first diamond layer. After forming the second diamond layer, the graphite layer is electrochemically etched until it is removed, thereby peeling off the single-crystal diamond substrate of the first region to form a diamond thin film, resulting in a large-size and ultrathin diamond thin film.

The application discloses a hot forging process for a 7-series aluminum thin material product with a thick-thin gap structure. The application introduces a new process path of "pre-fabricated compensation deformation and partition collaborative control", effectively solves the problem of shear stress concentration and cracking at the junction caused by the mismatch of deformation capacity of the thick-thin area of the aluminum thin material in the background technology, and provides a systematic solution for the limit thin-wall forging of the 7-series aluminum. The stability of the extreme thin-wall structure in the forming and phase change process is ensured, so that the 7-series aluminum can be reliably forged to about 0.5mm thickness without cracking.

This invention discloses a multi-directional rough milling process for an automotive reducer housing and the housing itself, belonging to the field of automotive technology. The process includes: artificially aging the housing; selecting at least two areas on the edge of a preset area of ​​the main positioning datum surface of the housing to create auxiliary positioning holes; grinding an auxiliary positioning datum surface on the housing; placing the housing on a support substrate using the auxiliary positioning datum surface and auxiliary positioning holes as positioning references; using a clamping mechanism to simultaneously clamp the housing at multiple points, avoiding thin-walled areas of the housing; using a machining equipment with an A-axis rotary table, milling the main positioning datum surface in the preset area of ​​the main positioning datum surface using the auxiliary positioning datum surface as a reference, and then milling the side surface of the housing using the main positioning datum surface as a reference; after the flatness of the main positioning datum surface meets the requirements, performing low-temperature stress release treatment. This application establishes a complete process flow from pretreatment, positioning and clamping, multi-directional rough milling, dynamic control to detection and stress release.

The utility model relates to the technical field of wood strip processing, and disclose a kind of building house building wood strip cutting device, including support rack, support rack is equipped with support movable frame and wood strip cutting component, drive component is equipped between support rack and support movable frame, wood strip clamping fixed structure is equipped on support movable frame.The building house building wood strip cutting device, through the sliding cooperation of first clamping plate and second clamping plate, the interval between the two can be flexibly adjusted, to meet the preliminary clamping needs of different length wood strips;And the right-hand thread and left-hand thread design of adjusting screw rod can be moved away or opposite, effectively clamping different thickness shape wood strips is realized, the clamping design of clamping groove and plane auxiliary clamping plate, further expand the clamping mode, according to the actual shape and clamping demand of wood strip, plane auxiliary clamping plate or arc clamping strip is flexibly selected and used, greatly improve the adaptability of device to various shape wood strips.

The utility model discloses a production frock for FPC circuit board compression processing relates to production frock technical field, including frock assembly, including fixed mesa, the bottom fixed heat exchange spare of fixed mesa, the top fixed limiting piece of fixed mesa, cooling assembly, set up in frock assembly one side, including fixed in fixed mesa bottom's liquid storage spare, the top of liquid storage spare is provided with transmission part, the bottom fixed communication spare of liquid storage spare, the utility model discloses beneficial effect is through the cooling mode of synchronous hot -pressing and the stress balance's cooperation, has improved forming efficiency and structure stability, has solved the problem of heat stress accumulation and cooling lag effectively, has guaranteed the evenness of laminated combination again, avoided the plate deformation caused by temperature sudden change, realized the process synchronization of hot -pressing and cooling simultaneously, has improved the size accuracy and production yield of FPC circuit board greatly.