629results about How to "Improve bonding quality" patented technology

Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, and then the matrix substrate is disposed above the semiconductor chips on the first heating stage. Subsequently, the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding, while heating the chips directly by the first heating stage. Thereafter, the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then, on the second heating stages, the semiconductor chips are thermocompression-bonded to the matrix substrate, while being heated directly by the second heating stage.

Transparent, UV and heat resistant adhesive compositions and associated methods of manufacturing using such compositions are provided. Exemplary methods of use include the utilization of the provided adhesive compositions as part of tape to be used outdoors where UV exposure is high. The present invention also provides a simple one-pass calendering process whereby the UV resistant adhesive compositions may be formed and extruded directly onto tape backing.

A method and apparatus for rapid and selective heating of materials using variable frequency RF and microwaves. The apparatus uses variable frequency solid state electronics as a microwave power source, a novel microwave heating head to couple microwave energy to the target materials and a match-up network to tune the frequency and impedance match between the microwave source and the load. An electronic and computer measurement and control system is employed to monitor and control the microwave heating process. The method teaches the use of inductive microwave coupling for thin conductive materials such as metal film and impurity doped silicon wafers. The method also teaches the use of capacitive microwave coupling for dielectric material such as glass and ceramics. The method further teaches the use of rapid and selective heating of heterostructure for bonding and sealing of mems and integrated circuits. The method and apparatus can provide ultra-high heating speed along with ultra-high heating temperatures for rapid thermal processing of semiconductors and other materials. It also allows the use of bonding materials with high melting temperature for strong bonding and sealing of mems and IC devices. The apparatus further provides for high interconnection density of integrated circuits as connections are made without the use of solder bumps.

A substrate bonding method using dry etching is disclosed. The substrate bonding method according to the exemplary embodiments of the present invention may notably reduce an amount of time required for bonding the substrates, and increase a manufacturing productivity.

A three-dimensional (3D) integrated circuit structure includes a first wafer and a second wafer, each comprising a substrate having devices formed thereon and an interconnect structure over the substrate; a composite layer comprising a first dielectric layer bonded to a second dielectric layer, wherein the composite layer is bonded to the first and the second wafers; a first plurality of openings extending from an interface of the first and the second dielectric layers into the first dielectric layer, wherein each opening of the first plurality of openings is in scribe lines of the first wafer; and vias connecting devices in the first and the second wafers.

The invention belongs to the technical field of material processing of metal composite plates, and particularly relates to a method for continuously rolling a metal composite substrate by a corrugatedroll and a flat roll. The method comprises the following steps: rolling a blank by using the corrugated roll to obtain a corrugated composite plate; and then flattening the corrugated-shaped composite plate by using a flat roll. In the process, high-strength combination of the composite plate from a local part to a whole surface can be realized by stress peaks at two different positions. Comparedwith a method for directly flattening in the original rolling direction, the method comprises the advantages that the elongation of metal in the plate width direction can be reduced by flattening after the corrugated composite plate rotates at an angle of 90 degrees, damage to positions which have been combined originally is reduced, extrusion at positions of wave peaks is obvious, the combination strength of portions which are originally combined weakly relatively is improved favorably, and thus, the combination quality of the whole surface is improved; and warping in a direction perpendicular to corrugations can also be prevented from being generated in a corrugated composite plate flattening process by flattening after the corrugated composite plate rotates at an angle of 90 degrees, and continuity of a follow-up thinning process is facilitated.

The invention provides a preparation method of modified soybean protein adhesive. Any one selected from soybean protein concentrate, soybean protein isolate, defatted soybean flour, soybean pulp and soybean cake is used as raw material and then organic solvent alcohol is added. The hydrophobicity group of alcohol immerges into the soybean molecule to break the molecule structure and denature the soybean, the hydrophobicity amino acid residues of protein molecule are bare, therefore the bond strength and water resistance is increased. The object of the invention is to solve the problem that the bond strength of soybean protein adhesive is low and the water resistance is bad. The soybean protein adhesive has good bond strength without pollution and the alcohol has the same function of antifoaming agent, so that the soybean protein adhesive has higher bonding strength and water resistance, compared with the soybean protein adhesive which is not modified.

The present invention relates to anti-pollution high efficiency isolating liquid for shaft wall cementing operation and its preparation process. The isolating liquid is compounded through adding suspension stabilizer, water reducing agent, tackifier, diluent, viscosity and shearing force increasing agent, weight additive and pH regulator in certain weight proportion into water. One compounding process is a water base process through throwing the said components successively into water in a slurry tank apparatus. One other compounding process is one dry mixture process in a cementing tank apparatus. The isolating liquid has flexible compounding process, high anti-pollution capacity and effective eliminating effect on well wall interface pollutant.

Disclosed is a preparing method for casting an inlaid ceramic/metal wear-resisting compound liner. A chemical vapor deposition method is adopted to prepare uniform, continuous and high-purity metal activation coatings on ceramic monomers in various shapes, the kind and the structure of the coatings are changed, wettability between ceramic and metal in the compound process is improved, and the compound quality is improved; finally, through the lost foam casting technology, that is, ceramic reinforcements with the metal activation coatings deposited are fixed into a polystyrene foam model, and casting molding of molten metal is carried out; solid ceramic serves the reinforcements, the ceramic reinforcements are subject to reasonable structural design, and volume fractions and distribution of the reinforcements are controlled; and through forming of the activation coatings on the surfaces of the ceramic reinforcements, the interface combination condition between the ceramic and the metal is improved, operation is simple, easy to implement and low in cost, and the inlaid ceramic/metal wear-resisting compound liner which is good in comprehensive performance and capable of meeting various complex working conditions can be prepared.

A strapless brassiere having winged -support structures to maximize surface area of the bra to which an extended-wear adhesive is applied over substantially all of the undersurface of the bra.

A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1C, and a light-transmitting member is attached so as to cover the through-opening portion 1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

The invention discloses a quad flat non-lead (QFN) package with high density and a manufacturing method. The package comprises a lead frame 201, metal material layers 25, an IC chip 27, insulating filling materials 23, bonding materials 26, metal conductors 28 and plastic package materials 29, wherein the lead frame comprises a chip carrier 202 and a plurality of leads 203 arranged in multiple circles around the chip carrier; the metal material layers are arranged on the upper and lower surfaces of the lead frame; the IC chip is arranged on a metal material layer on the upper surface of the lead frame; the insulating filling materials are arranged below stepped structures 22b of the lead frame; the bonding materials are arranged between the IC chip and the metal material layer on the upper surface of the lead frame; the IC chip is connected to the inner leads of the multiple circles of leads and the upper surface of the chip carrier respectively by the metal conductors; the plastic package materials wrap and seal the IC chip, the bonding materials, the metal conductors, partial regions of the lead frame and partial metal material layers; and the chip carrier and the outer leads exposed out of the bottom surface of a package structure, are provided with raised parts. The package and the manufacturing method have the following beneficial effects: the bottleneck of low I/O quantity is broken through and the package reliability is improved.

The invention provides an MEMS aluminum and germanium bonding structure and a manufacturing method thereof. The structure comprises a device silicon chip and a sealing cap silicon chip, wherein the device silicon chip is provided with a micro mechanical structure area and an aluminum bonding layer; the sealing cap silicon chip is provided with a germanium bonding layer, and the germanium bonding layer is in bonding with the aluminum bonding layer. The sealing cap silicon chip is further provided with a pitch column extending out of the sealing cap silicon chip, and the end of the pitch column is in contact with the device silicon chip. The MEMS aluminum and germanium bonding structure can control aluminum and germanium horizontal extension quantity caused by bonding pressure in the bonding process, and an aluminum and germanium bonding layer with a preset thickness is obtained.

The invention relates to a method for bonding two substrates by applying an activation treatment to at least one of the substrates, and performing the contacting step of the two substrates under partial vacuum. Due to the combination of the two steps, it is possible to carry out the bonding and obtain high bonding energy with a reduced number of bonding voids. The invention is in particular applicable to a substrate of processed or at least partially processed devices.

Abstract of Disclosure A multi-chip stack package having a substrate, a first chip, a second chip, a plurality of bumps, a plurality of junction interface bumps, a plurality of conductive wires, a first filler material, a second filler material and an encapsulating material is provided. The substrate has a substrate surface with a plurality of first contacts and a plurality of second contacts. The first chip has a first active surface with a plurality of bonding pads thereon and a first chip back surface. The first chip is positioned over the substrate surface. The second chip has a second active surface with a plurality of bonding pads thereon and a second chip back surface. The second chip is positioned over the first chip back surface. The bumps are positioned between the first bonding pads and the first contacts. The junction interface bumps are positioned between the first chip back surface and the second chip back surface. The conductive wires electrically connect the second bonding pads and the second contacts. The first filler material encloses the bumps and the second filler material encloses the junction interface bumps. The encapsulating material encloses the first chip, the second chip and the conductive wires.

The invention provides a metal/ceramic gradient material and a preparation method thereof. The method comprises the steps that metal powder needed for each layer and element powder needed for ceramic synthesis are fully mixed and are subjected to mechanical alloying treatment according to designed gradient components, the number of gradient layers and the component content in each layer, and mixed powder needed for each layer is obtained; the mixed powder needed for each layer is subjected to cold pressing, and semi-densified powder blanks are obtained; the semi-densified powder blanks are laid up according to the designed gradient components, the number of gradient layers and the component content in each layer, and pre-formed blanks are obtained; the pre-formed blanks are vacuumized after being packaged through metal sheaths, and the packaged pre-formed blanks are obtained; and after the packaged pre-formed blanks are preheated, pulse current is applied to the packaged pre-formed blanks, so that a self-propagating high-temperature in-situ synthesis reaction is driven, and the metal/ceramic gradient material is obtained after the reaction finishes. The prepared metal/ceramic gradient material is full in reaction, high in density and good in bonding quality between gradient interfaces.

The invention relates to a full-automatic magnetic tile sticking machine which comprises a control system, a rotatable turnplate mechanism, a feeding mechanism, a discharging mechanism, a gluing mechanism, a magnetic tile sticking and mounting mechanism and a filling glue coating mechanism. The feeding mechanism, the discharging mechanism, the gluing mechanism, the magnetic tile sticking and mounting mechanism and the filling glue coating mechanism are arranged sequentially, the magnetic tile sticking and mounting mechanism comprises a magnetic tile library driving device, an intermediate wheel, two driving plates, multiple pins and multiple loading units capable of adsorbing magnetic tiles, the magnetic tile library driving device can drive the driving plates to rotate, the intermediate wheel is fixedly arranged between the driving plates, multiple guide grooves are formed between the outer wall of the periphery of the intermediate wheel and the side walls of the driving plates, each loading unit is mounted in the corresponding guide groove, each driving plate is provided with multiple pin driving mechanisms corresponding to the loading units, and the pin driving mechanism are used for pushing the pins to move. The magnetic tile sticking and mounting mechanism adopts a magnetic tile library to adsorb the magnetic tiles needed by a rotor to the loading units of the magnetic tile library, and the loading units move outwards at the same time to stick the magnetic tiles to the inner wall of the rotor at the same time when the driving plates rotate, so that the full-automatic magnetic tile sticking machine is high in efficiency and quality.

The invention discloses a preparation method of a paper-surface gypsum board. The method comprises the following steps: after being metered, gypsum clinker and PGCS are fully mixed, and then the mixture enters a mixer; paper pulp, mixing cement and foam respectively enter the mixer; the above dry and wet materials are fully stirred in the mixer to prepare uniform slurry, the slurry is continuously poured between two layers of covering paper, and a wet gypsum board is prepared by extrusion molding; and the wet gypsum board undergoes solidification, cutting, drying, final trimming, edge banding, stacking and packaging so as to prepare the paper-surface gypsum board finished product. According to the invention, bonding quality and strength of the board are enhanced; raw materials can be saved, energy consumption is reduced, and production cost is decreased; and dependence of bonding quality of the covering paper on operation and drying system is reduced. The scheme of drying the paper-surface gypsum board by the use of waste heat from a power plant or a steel mill is feasible. Energy conservation and emission reduction as well as automatic disposal of industrial waste residues are realized. In addition, the aggregate resources conservation purpose of ''low energy, low pollution and high return'' is achieved.

A golf club head includes a body and a striking plate. The body includes a front side having a recessed portion. The striking plate includes a front side for striking golf balls and a rear side. At least one groove is defined in one of the front side of the body and the rear side of the striking plate. At least one plastic protrusion is formed on the other of the front side of the body and the rear side of the striking plate. When assembling the striking plate and the body, the plastic protrusion deforms under pressure to form an engaging portion that is engaged in the groove, thereby securely engaging the striking plate with the body.