187results about How to "Improve bonding quality" patented technology

The invention discloses a power source power optimization method, system and device of a copper wire system and a storage medium, and relates to the technical field of bonding copper wire production, and the method comprises the following steps: building an intelligent bonding copper wire system simulation model, obtaining virtual parameters based on the intelligent bonding copper wire system simulation model, and optimizing the virtual parameters; the optimized virtual parameters are applied to actual bonding equipment, and the actual power and the bonding effect of the bonding equipment are collected. According to the intelligent bonding copper wire system, the energy efficiency can be remarkably improved through power optimization of a power source, in the field of semiconductor packaging and microelectronic manufacturing, a traditional bonding process often depends on fixed power setting, the setting cannot adapt to different working conditions and material characteristics, energy loss and unstable bonding quality are caused, and the energy efficiency is affected. By optimizing the power of the power supply in real time, the method reduces unnecessary power consumption, reduces the production cost, and improves the bonding quality at the same time.

The invention belongs to the field of hybrid bonding, and particularly discloses a bonding head for hybrid bonding and a bonding method.The bonding head comprises a bonding head body, the lower surface of the bonding head body is of a horizontal structure, and an annular air pressure groove with a downward opening is formed in the lower surface of the bonding head body along the edge; the positive-negative air pressure device is used for adjusting the air pressure in the annular air pressure groove; and the moving rod assembly comprises a main moving rod and a plurality of auxiliary moving rods, the main moving rod and the auxiliary moving rods penetrate through the bonding head body, and the auxiliary moving rods are arranged around the peripheral side of the main moving rod. According to the bonding head, the annular air pressure groove is formed in the bonding head body, the adsorption force on the to-be-bonded chip is increased, in the bonding process, the main moving rod and the auxiliary moving rod can push the to-be-bonded chip to enable the to-be-bonded chip to have enough deformation quantity, the chip cannot be separated from the bonding head body, the bonding effect of hybrid bonding is improved, and the bonding efficiency is improved. And voids on the bonding interface are avoided.

The invention relates to the field of automobile engineering, in particular to a method for bonding a spring clamp and rubber, which comprises the following steps: surface treatment: cleaning the surface of a clamp metal plate, and polishing the surface of the clamp metal plate to be bonded with the rubber; glue coating is conducted, specifically, glue and a vulcanizing agent are dropwise added to the center of the clamp metal plate, a coating disc is driven to rotate through a driving assembly until the whole coating disc is full of the glue and the vulcanizing agent, operation of the driving assembly is stopped, and the conveying mechanism conveys the clamp metal plate coated with the glue to the rubber vulcanization position; rubber is bonded to the surface of the clamp metal plate and compacted, and then the rubber is fed into vulcanization equipment to be subjected to rubber vulcanization treatment; and cooling and curing: cooling and curing the fixture metal plate subjected to the rubber vulcanization treatment to complete the bonding of the steel plate spring fixture and the rubber. According to the bonding method, the surface of the clamp metal plate can be coated with the glue and the vulcanizing agent more simply, conveniently, efficiently and accurately, and the bonding quality is improved.

The utility model discloses an assembly type photovoltaic integrated panel and a photovoltaic system, and belongs to the technical field of photovoltaic systems. Comprising a fusion tile and a photovoltaic module. The fusion tile comprises a body and a waterproof layer, and the waterproof layer is arranged on the face, facing the photovoltaic module, of the body and attached to the molded surface of the body. The body comprises a plane part and two first supporting parts which are oppositely arranged, the plane part is clamped between the two first supporting parts, the first supporting parts protrude out of the plane part, and the backlight surface of the photovoltaic module is adhered to the waterproof layer. The fusion tile is used for supporting the photovoltaic module and also plays a role of a building roof, the backlight surface of the photovoltaic module is bonded to the fusion tile, the fusion tile and the photovoltaic module are bonded and connected through a bonding piece before the assembly type photovoltaic integrated panel leaves a factory, and then the assembly type photovoltaic integrated panel is transported to a construction site and installed on a building. The method has the beneficial effects of shortening the time for installing the assembly type photovoltaic integrated plate on the construction site, simplifying the installation process and improving the construction efficiency.

The invention provides a gluing method for gluing a cork board and a base material, which comprises the following steps of: 1, brushing glue on the gluing surface of the cork board and the base material, and adhering the cork board and the base material; 2, the airtight bag film is pasted to the base material through a sealing rubber strip, the cork board pasted to the base material is covered with the airtight bag film, and an airtight area is formed at the glue joint position of the cork board; and 3, an opening is formed in the airtight bag film, a suction head communicated with a vacuum pump is placed in the airtight bag film, the airtight area in the airtight bag film is pressurized through the vacuum pump, negative pressure is formed in the airtight area, and gluing of the cork board and the base material is achieved. Large and uniform contact pressure is provided for the glue joint area of the cork board in a vacuum pressing mode, and the glue joint strength and the glue joint quality between the cork board and the base material are improved.

The invention provides a method for efficiently and accurately detecting a bonding gap of a wind power blade, which comprises the following steps of: in a wind power blade bonding test mold closing process, pretreating a bonding area, placing a test strip in the bonding area, and overturning a mold to carry out a glue pressing test; judging a qualified area according to the color of the test strip; performing secondary test on the unqualified area to obtain a secondary test result; wherein the test strip is made of a piezochromic material. According to the method for efficiently and accurately detecting the bonding gap of the wind power blade, the material with the stress deformation capacity is adopted, different color changes can be generated when the deformation reaches a certain value, whether the wind power blade is qualified or not can be judged by directly observing the color, and the detection efficiency is improved.

The invention discloses a wafer bonding method and a heterogeneous wafer, and relates to the technical field of semiconductor materials.The wafer bonding method comprises the steps that contact pressing is conducted, at least one of a first wafer and a second wafer is made to rotate around the axis of the first wafer and the second wafer, so that the relative rotation angle of the first wafer and the second wafer in the circumferential direction reaches a preset value, and the first wafer and the second wafer are laminated under a preset pressure, and the preset value is adjusted according to the materials of the first wafer and the second wafer. According to the wafer bonding method, the bonded wafers rotate around the axes of the wafers in the contact pressing step, the chemical matching environment of the bonding interface is improved by adjusting the relative rotation angle of the two wafers in the circumferential direction, the adverse effect on wafer bonding caused by stress generated by lattice mismatch is reduced, the overall bonding quality is improved, and the wafer bonding quality is improved. The bonding strength is greatly improved, and the bonding stability is enhanced.

The invention discloses a manufacturing method of a micro-channel heat dissipation chip, and relates to the technical field of semiconductor processing and packaging, and the method comprises the steps: providing a first wafer, forming a micro-channel structure on the surface of the first wafer, and filling the micro-channel structure with a first supporting layer; a second wafer is provided, a water inlet and a water outlet are formed in the second wafer, the surfaces of the first wafer and the second wafer are bonded, and a micro-channel radiator wafer is formed; filling the water inlet / outlet with a second supporting layer, wherein the surface of the second supporting layer is flush with the first surface of the micro-channel radiator wafer; providing a chip wafer, and bonding the second surface of the micro-channel radiator wafer with the first surface of the chip wafer to form a bonded chip wafer; and removing the first supporting layer and the second supporting layer to obtain the micro-channel heat dissipation chip. According to the invention, the heat dissipation performance and the bonding quality of the wafer can be improved.

This invention provides a fixture for controlling the adhesive thickness of Heilbeck magnetic components. The mounting base includes a station, a push rod moving mechanism, and a pressure rod moving mechanism. The station is used to place a fixture plate with a placement slot for holding the magnetic components. The magnetic components include a fixed magnet and a movable magnet, with adhesive dots positioned between them. The push rod moving mechanism includes a first drive unit and a push rod. The first drive unit drives the push rod to move the movable magnet along the placement slot, closer to the fixed magnet, and controls the adhesive dot spacing between the movable and fixed magnets. The pressure rod moving mechanism includes a second drive unit, an elastic element, a primary pressure rod, and a secondary pressure rod. The length of the primary pressure rod is greater than the length of the secondary pressure rod. The second drive unit drives the primary pressure rod to pre-press and fix the fixed magnet, preventing it from being sucked away. The second drive unit also drives the primary and secondary pressure rods to apply pressure to the fixed magnet and the movable magnet, respectively. This fixture is used to control the adhesive thickness and improve the quality of the magnetic components.

The utility model discloses a bonding device for lining paper production equipment, which comprises a base, and the top of the base is fixedly connected with a support frame. Through cooperation of the base, the supporting frame and the winding roller, the winding roller is convenient to replace, lining paper is convenient to wind, production efficiency is improved, dust and other impurities on the lining paper can be sucked away in time before the bonding process through a dust suction system composed of the portal frame, the dust collector, the flow divider, the dust suction head and the dust collection box, and the bonding quality of the lining paper is improved. According to the lining paper gluing device, impurities are prevented from affecting the gluing effect, the gluing quality is improved, then a bearing frame, a bearing plate, a lifting groove, a lead screw, a lifting block, a sliding block, a rotating shaft and a gluing roller are matched, the lead screw is driven by a lifting motor to enable the gluing roller to ascend and descend, and the lining paper gluing device can adapt to lining paper of different thicknesses; glue pumped out by the glue pump in the liquid storage tank can be uniformly coated on lining paper, and the bonding effect is ensured.

According to the aero-engine turbine blade crown repairing material and repairing method, the selected cladding powder material and the blade raw material GH105 are similar in performance, the melting temperature and the density of the cladding powder material and the blade raw material GH105 are close, the content of the selected powder material AI and Ti is low, the material welding performance is good, and cracks and other defects are not prone to being generated. A series of repairing processes are set based on the repairing material, and each step aims at recovering the functions of the blade and prolonging the service life of the blade from preliminary grinding to defect removal, heat treatment to material performance improvement, laser cladding repairing and final finishing. Through a series of treatments, the damaged blade can be repaired, the use performance can be recovered, and the damaged blade can be reinstalled for use.

This utility model relates to the field of aerogel thermal insulation felt processing technology, specifically an adaptive roller coating device for aerogel thermal insulation felt. It includes a carrier block, with a fixed frame fixed to the top of the carrier block. An electric push rod is fixed to the middle of the top of the fixed frame, with its push rod movably passing through the fixed frame and fixedly connected to a retainer. A hollow roller is rotatably mounted inside the retainer. A hot air blower is fixedly mounted on one side wall of the fixed frame, and the output end of the hot air blower is fixedly connected to a first conduit. The outer end of the first conduit is connected to a hollow short shaft via a rotary joint. The hollow short shaft passes through the retainer and communicates with the roller. This utility model generates hot air through the hot air blower and guides the hot air into the inner cavity of the roller, thereby giving the roller a certain base temperature. During the roller coating process, the heat can be transferred to the coating, thus improving the adhesion quality between the coating and the substrate during roller coating.

The invention relates to a film bonding technology for a heat dissipation plate of a special-shaped structure and a printed board. The film bonding technology comprises the steps of S1 film bonding technology formulation, S2 bonding tool design, S3 tool production, S4 film carving data processing, S5 film carving, S6 film poking, S7 cold bonding, S8 tool positioning, S9 preheating, S10 hot pressing, S11 cooling, S12 tool dismounting and S13 processing. According to the invention, through a parameter formulating technology, formulated process parameters need to be combined with the force applied to the cold plate stress area of the special-shaped structure and the area in contact with the printed board during hot pressing, so that the force can meet the film adhesion pressure requirement, the adhesion assembly cannot be damaged in the hot pressing link, the heat dissipation board and the printed board are adhered together, and the adhesion peeling strength requirement is met.

This invention belongs to the field of high-content ceramic / metal composite material preparation technology, specifically relating to a high-fatigue-strength B4C / Al composite material and its preparation method. This invention employs chemical vapor deposition to generate CNTs in situ on the surface of micro / nano-scale B4C particles. These CNTs are then thoroughly mixed with aluminum alloy powder, and a billet is prepared using SPS plasma discharge sintering equipment. After grinding and polishing, the billet is processed using a high-frequency current rolling test bench to obtain a high-fatigue-strength B4C / Al composite material. This invention aims to improve the interfacial bonding quality of ceramic / metal composite materials and inhibit harmful reaction products through the modification effect of CNTs; the addition of high-frequency current-assisted rolling enhances the fatigue resistance of the composite material, resulting in a B4C / Al composite material with excellent comprehensive performance.

The application discloses a battery pack, which comprises: a plurality of battery modules arranged in sequence; a partition plate arranged between two adjacent battery modules; the partition plate is provided with a fixing support on a surface facing the battery module; the horizontal part of the bottom of the fixing support is provided with a convex part, and the horizontal part and the convex part are made of elastic material; the vertical part of the fixing support on both sides is in a strip shape and is made of hard material; and an adhesive is filled in a space formed by the partition plate, the fixing support and the battery module to bond and fix the partition plate and the battery module. The vertical part made of hard material is used to control the compression amount of the horizontal part and the convex part, so that the gap size between the fixing support and the battery module is kept consistent, which can not only ensure that the adhesive amount filled between the partition plate and the battery module is the same, but also ensure that the coverage area of the adhesive is the same, so that the resonance frequency and the stiffness of the battery pack cannot be reduced.

The invention relates to the technical field of steel wire machining, in particular to a steel wire head casting die which mainly comprises a machining table, a supporting frame fixedly installed on the top face of the machining table, a lower die fixedly installed on the top face of the machining table through bolts, an upper die arranged above the lower die and a fixing mechanism arranged on one side of the lower die. The fixing mechanism comprises a clamping plate located on one side of the lower die, an L-shaped rod and a removing mechanism are fixedly installed on the outer wall of the clamping plate, and the removing mechanism is arranged on one side of the clamping plate. After a steel wire and a steel wire sleeve are combined, an upper die moves upwards, an elastic piece pushes a moving block and an air bag to move upwards, the upper end of the air bag and the inner wall of the upper end of a cavity extrude, air in the air bag is sprayed into a groove of a lower die from a spray head through an exhaust pipe and a hose, and metal chippings generated by stamping are blown away; and the next group of to-be-assembled steel wire sleeves and steel wires are prevented from being damaged by metal scraps, so that the connection strength between the steel wires and the steel wire sleeves, the safety performance of the whole assembly and the service life of the whole assembly are ensured.

The application relates to the field of loudspeaker assembly, and discloses an automatic production line for an external-magnet loudspeaker, which comprises a rack, a conveying line, a drying chamber, glue dispensing heads, a pressing plate and an assembling mechanism arranged on the rack. A plurality of supporting assemblies are arranged on the upper surface of the conveying line along the conveying direction. The two glue dispensing heads are arranged on the two adjacent assembling assemblies. The assembling mechanism comprises assembling assemblies and positioning assemblies. The three assembling assemblies are arranged on the two adjacent assembling assemblies. The five positioning assemblies are arranged below the three assembling assemblies and the two glue dispensing heads. The assembling assemblies are used for transferring the parts of the external-magnet loudspeaker to the supporting assemblies. The positioning assemblies are used for making the center lines of the parts of the external-magnet loudspeaker clamped by the assembling assemblies and located above the supporting assemblies, the center line of the supporting assemblies and the center lines of the parts of the external-magnet loudspeaker located on the supporting assemblies coincide.

This invention utilizes an outer protective frame and double-layer adhesive sealing to introduce high-humidity air into a vacuum furnace, followed by evacuation of the hollow interlayer. This allows for rapid curing of the double-sealed glass, achieving quick sealing and curing of the vacuum glass edges. A connecting sealing tube is provided on the vacuum tempered glass plate, linking both sides. This invention achieves excellent glass-metal bonding quality, solves the problem of tempering loss in vacuum glass, and addresses safety issues. It results in functional vacuum glass with simple manufacturing processes, widespread use of ordinary tempered glass, significantly reduced manufacturing costs, greatly improved safety and yield, and diverse structural options. The tempered glass plate is thin, lightweight, high-strength, safe, long-lasting, can be large-sized, has a high yield, strong functionality, low energy consumption, high light transmission, safety, low cost, anti-condensation, and is suitable for large-scale production.

A semiconductor package assembly process that uses a self-aligned die-to-wafer bonding process that aligns interconnects of a semiconductor die with corresponding interconnects of a wafer. A surface preparation process assists in the accurate alignment of the die and the wafer. The surface preparation process serves to define a liquid confinement region that helps ensure accurate alignment. Additionally, the surface preparation process helps ensure that the bonding surfaces of the wafer and the die are smooth and free of debris, which enhances the quality of the bonds between the interconnects of each component. When the surfaces of the wafer and the die have been prepared, the self-aligned die-to-wafer bonding process utilizes surface tension to align the interconnects of the die with the interconnects of the wafer.

The invention relates to the technical field of corrugated paper processing, in particular to corrugated paper surface treatment equipment which comprises a protective shell and a collecting box, a glue coating structure is arranged in the protective shell, and an adjusting structure used for controlling the flow speed of glue is arranged in the protective shell. A cleaning structure used for cleaning the surface of the waterproof film is arranged in the protective shell, and a collecting structure is arranged in the protective shell; according to the corrugated paper surface treatment equipment and process, through cooperation of the movable frame, the sliding rod, the swing plate, the connecting shaft and other structures, the water pressure in the rotating rod can be changed while glue is sprayed to different positions, so that different amounts of glue can be sprayed to different positions; different glue amounts are needed by the corrugated paper at different positions to ensure the optimal bonding effect, and a proper amount of glue can be obtained at each position by adjusting the water pressure, so that the overall bonding quality of the corrugated paper and the strength of the corrugated paper are improved.

The application discloses a PMMA micro-fluidic chip packaging method, mainly comprising the following steps: providing a PMMA micro-fluidic chip to be packaged; adding phase change material into a micro-fluid channel of a chip bottom plate after the phase change material is heated to a molten state; covering a layer of solvent on a bonding surface of the chip bottom plate after the phase change material is cooled and solidified; aligning a chip cover plate with the chip bottom plate and combining the chip cover plate with the chip bottom plate, the solvent infiltrating the bonding surfaces of the chip bottom plate and the chip cover plate and forming a liquid bridge between the chip bottom plate and the chip cover plate, the chip bottom plate and the chip cover plate being automatically aligned according to a contour by a horizontal directional component force of the liquid bridge force; and after standing until the bonding is completed, heating the micro-fluidic chip to melt and blow out the phase change material in the micro-fluid channel, and completing the packaging. Furthermore, the application also provides a PMMA micro-fluidic chip formed by the packaging method. The application realizes the packaging of the PMMA micro-fluidic chip by one-step method, does not need to rely on external expensive equipment, is simple to operate, has high alignment precision and good bonding quality.

The invention relates to the technical field of interface reinforcing agent preparation, in particular to an interface reinforcing agent for improving the cementing quality of a well cementation two-interface, a preparation method of the interface reinforcing agent, an interface modification prepad fluid and a preparation method of the interface modification prepad fluid. The raw materials comprise styrene, acrylic acid, acrylonitrile, acrylamide, acrylic acid-2-hydroxyethyl ester, an initiator, styrene, butadiene, an initiator, calcium oxide and deionized water. The interface reinforcing agent for improving the cementing quality of the well cementation two-interface is good in compatibility with drilling fluid, and interface modified prepad fluid obtained by taking the interface reinforcing agent for improving the cementing quality of the well cementation two-interface as a raw material has good suspension stability and filtration loss control capability; the cementing strength of a well cementation interface can be effectively improved, and the cementing quality of the well cementation interface is remarkably improved, so that the purpose of preventing annulus channeling or annulus pressure is achieved.

The invention relates to the technical field of fabric compounding devices, in particular to a multi-layer textile fabric continuous compounding device which comprises a bottom frame, a material guiding assembly is fixedly installed in the middle of the upper end face of the bottom frame, and a glue feeding assembly is fixedly installed on the inner side of the bottom frame. The material guiding assembly comprises two clamping assemblies, two adjusting assemblies and pressurizing rollers installed on the opposite sides of the two adjusting assemblies, the clamping assemblies are fixedly installed on the inner sides of the adjusting assemblies, material guiding rollers are movably installed on the opposite sides of the two clamping assemblies, and the outer walls of the material guiding rollers and the outer walls of the pressurizing rollers are coated with soft rubber coatings. And the glue feeding assembly comprises a third mounting frame, and a first spraying machine and a second spraying machine are fixedly mounted on the two sides of the upper end face of the third mounting frame correspondingly. The problems that in the prior art, when the dispensing assembly makes close contact with the fabric and conducts rolling dispensing, the bonding face of the fabric is abraded, and the dispensing amount cannot be adjusted according to different fabric textures can be effectively solved.

According to the welding method and device of the electronic device, the electronic equipment and the storage medium, the method comprises the steps that firstly, the real-time deformation value of a welding area of the electronic device is obtained in the welding process of the electronic device; if the real-time deformation value is within the preset deformation threshold range, the ultrasonic power of the ultrasonic generation unit is calculated based on the preset deformation value, the real-time deformation value and a preset proportionality coefficient, and the current pressure compensation serves as the first pressure compensation of the pressure compensation unit; wherein the preset proportionality coefficient is used for proportionally adjusting the deformation deviation between the real-time deformation value and the preset deformation value. And finally, the welding pressure applied to the welding area by the pressure compensation unit is compensated and adjusted according to the first pressure, ultrasonic vibration energy emitted by the ultrasonic generation unit in the welding process is adjusted according to the ultrasonic power, and device deformation in the welding process is effectively restrained through cooperative regulation and control of the pressure and the ultrasonic energy. And the welding interface bonding quality and the welding quality are improved.

The utility model relates to the technical field of chip bonding, and provides a thermocompression bonding device, which comprises a turning mechanism, the thermocompression bonding pressure head assembly comprises a rotation adjusting mechanism, a pickup mechanism and a first chamber, the rotation adjusting mechanism is connected with the pickup mechanism and is used for adjusting the rotation angle of the pickup mechanism, the first chamber is arranged on the pickup mechanism, and the end part of the pickup mechanism is arranged in the first chamber; the thermocompression bonding platform or the first substrate on the thermocompression bonding platform is matched with the first cavity to form a vacuum cavity; the preheating platform is arranged on the side of the thermocompression bonding platform, the first visual identification mechanism is arranged between the turnover mechanism and the thermocompression bonding platform, and the first visual identification mechanism is electrically connected with the rotation adjusting mechanism and used for identifying and adjusting the angle of the pickup mechanism. The preheating platform is used for leveling, and a nitrogen protection device is arranged to prevent oxidation and conduct cooling.

The utility model discloses a lap joint shear sample preparation tool which comprises a first base, first check blocks are arranged on the two sides of the upper surface of the first base, a first installation groove is defined between the two first check blocks and the upper surface of the first base, and the first installation groove is used for installing a first sample to be bonded; the second base is arranged opposite to the first base, second check blocks are arranged on the two sides of the upper surface of the second base, a second mounting groove is defined between the two second check blocks and the upper surface of the second base, and a second to-be-bonded sample is mounted in the second mounting groove; the first cover plate covers the two first check blocks so as to press the first to-be-bonded sample, after the first to-be-bonded sample and the second to-be-bonded sample are bonded together through the adhesive, a sample preparation worker can use a scraper blade and other tools to scrape off overflowing glue in a bonding area, and therefore rapid sample preparation of the lap joint shear sample is achieved, the sample preparation quality is guaranteed, and meanwhile the sample preparation efficiency is improved. And the sample preparation efficiency is also improved.

The application belongs to the technical field of mechanical devices, and specifically provides a device for bonding annular copper-clad strips in a spherical fairing, which comprises a spherical fairing, an annular copper-clad strip, a bottom glue coating device and a surface glue coating device; the bottom glue coating device comprises a base one, an upper stop block one, a lower stop block one and a positioning ring one, and the surface glue coating device comprises a base two, an upper stop block two, a lower stop block two and a positioning ring two; the device solves the problem that the bonding position of the existing annular copper-clad strip on the spherical surface in the spherical fairing is difficult to determine, and the position and width of the glue solution cannot be controlled; and the device realizes accurate control of the bonding position of the surface glue of the annular copper-clad strip, the position and width of the glue solution.

This utility model discloses a device for electroplating and film penetration of composite current collectors, belonging to the field of composite current collector technology. It includes: a base, a lifting assembly on one side of the top of the base, a storage assembly on the lifting assembly, a tape roller detachably mounted on the storage assembly via a fixing assembly, an unwinding roller on one side of the storage assembly, and a gantry frame fixedly mounted to the base on one side of the unwinding roller. The top of the gantry frame is equipped with a cutting mechanism for cutting the tape and an adsorption moving assembly for adsorbing one end of the cut tape. The height of the tape roller can be flexibly adjusted by the lifting assembly (vertical frame + lifting screw + slider), and the tape roller is automatically stored in conjunction with the storage assembly (cover plate + storage box). When not in use, the lifting assembly lowers the tape roller into the storage box, and the cover plate and storage box close to form a protective space. When in use, the lifting assembly raises the tape roller to the working height, eliminating the need for manual handling throughout the process.

The present application discloses a cloth guide heating device and a bonding device, the cloth guide heating device comprises a cloth guide seat installed on a work surface of a heat sealer, the cloth guide seat is provided with a first cloth guide groove and a second cloth guide groove, the first cloth guide groove has a first opening on one side along the width direction, and the second cloth guide groove has a second opening on one side along the width direction; the first opening and the second opening have opposite opening directions; the first cloth guide groove is located below the second cloth guide groove; the cloth guide seat is provided with a material guide groove between the first cloth guide groove and the second cloth guide groove, the cloth guide seat is provided with a first commutator and a second commutator, the first commutator is used to guide the adhesive tape into the material guide groove, and the second commutator is used to commutate the adhesive tape to the same direction as the outlet of the material guide groove; the cloth guide seat is provided with two hot air pipes at the outlet of the material guide groove, the two hot air pipes are arranged at intervals to allow the adhesive tape to pass through, and the blowing ports of the two hot air pipes are both facing the adhesive tape. The present application can improve the bonding quality of the cloth.

The invention discloses a membrane element, a membrane element manufacturing method, a filtering device and water purification equipment, and relates to the technical field of water purification equipment, and the membrane element comprises a main body, a first end cover and a second end cover. The main body comprises a central pipe and multiple layers of membranes wound on the outer side of the central pipe, a plurality of water inlets are formed in the side wall of the central pipe, the central pipe is provided with a first end and a second end, and a water outlet is formed in the second end of the central pipe; the first end cover is arranged at one end of the main body and is hermetically bonded with one end of the multi-layer membrane through an adhesive; and the second end cover is arranged at the other end of the main body, is hermetically adhered to the other end of the multi-layer membrane through the adhesive, and is provided with a water outlet channel butted with the water outlet. The technical scheme provided by the invention aims to improve the sealing effect of the membrane element.