The invention relates to a
thermoplastic polyamide molding compound consisting of the following components: (A) 30 to 74.5% by weight of at least one partially crystalline, partially aromatic copolyamide 6T / Z having a
melting point of at least 270 DEG C, the
polyamide unit Z being composed of at least one
lactam or aminocarboxylic acid, the
polyamide unit Z being composed of at least one
polyamine, the polyamide unit Z being composed of at least one
polyamine, and the polyamide unit Z being composed of at least one
polyamine; and / or from polyamide units, different from 6T, consisting of at least one
diamine and at least one
dicarboxylic acid, the proportion of 6T in 6T / Z being more than 50 mol% in terms of the
molar proportion of all polyamide units; (B) 25% to 50% by weight of glass fibers having an
average diameter of 5 m to 8 m, the glass fibers being coated by means of a
casting coating composition comprising (b1) at least one
silane compound (b2) at least one
polymer or
copolymer based on unsaturated carboxylic acids and / or unsaturated
carboxylic acid anhydrides, and (b3) at least one
epoxy resin,
polyurethane resin or polyamide resin, with the provision that if component (b3) is a
system comprising a
carboxylic acid and / or an anhydride, the
casting coating composition can also contain no component (b2); (C) from 0.5 wt% to 8 wt% of an
impact modifier; (E) from 0% to 20% by weight of an amorphous, partially aromatic polyamide; (D) 0% to 10% by weight of an additive different from (A)-(C) and (E); and wherein the sum of the components (A) to (E) results in 100% by weight of a polyamide molding compound.