This invention discloses a method for the integrated fabrication of high-current, thick
copper multilayer PCB circuit boards, belonging to the field of PCB
manufacturing technology. The method includes: inner core board fabrication, integrated filling and insulating layer construction, integrated conductive layer construction, multilayer stacking, and integrated lamination. This invention uses vacuum printing to force-fill high
thermal conductivity composite resin into the gaps between thick
copper lines, forming a flat, coplanar structure, fundamentally eliminating the filling voids and
delamination defects caused by insufficient resin flow in traditional lamination processes. The outer layer circuits employ a semi-additive method,
electroplating a rectangular cross-section thick
copper circuit on an ultra-thin seed layer, with an
etching factor ≥6.0, solving the severe side
etching problem caused by thick copper
etching in traditional subtractive methods. Combined with a stepped vacuum lamination process and a homogeneous resin
material system, interlayer thermal stress is significantly reduced, and
thermal conductivity is improved. This invention is applicable to fields such as
new energy vehicles and high-power power supplies, offering advantages such as
high current carrying capacity,
high heat dissipation, and high reliability.