The invention discloses a shielding protection
adhesive tape for
semiconductor integrated circuit packaging and a preparation method thereof, and relates to the technical field of
semiconductor integrated circuit packaging. The shielding protective
adhesive tape for packaging the
semiconductor integrated circuit is prepared by taking
polyimide as a base material and
coating a
coating, and the
coating comprises the following raw materials in parts by weight: 3-5 parts of modified
nano silicon dioxide, 30-40 parts of N, N-
dimethylformamide, 1-3 parts of a curing agent and 1-3 parts of a curing agent. The invention discloses a high-temperature-resistant
epoxy resin coating which is prepared from the following components in parts by weight: 25-30 parts of N, N-
dimethylformamide, 25-30 parts of a modified
acrylate copolymer, 17-26 parts of
ethyl acetate, 12-15 parts of
epoxy resin, 1-2 parts of a
silane coupling agent KH-550, 0.5-1 part of an
antioxidant 1010, 0.3-0.8 part of an
ultraviolet absorbent UV-327, 1-2 parts of carboxyl-terminated
nitrile rubber, 2-4 parts of
decabromodiphenyl ether, 0.1-0.3 part of an organic
siloxane defoaming agent, 0.2-0.5 part of an
acrylate flatting agent and 10-11 parts of diaminodiphenyl
sulfone. The
adhesive tape contains the modified
nano silicon dioxide, the modified
acrylate copolymer and other components, so that the performance of the adhesive tape is guaranteed; pretreatment is meticulous, preparation steps are standard, and
mass production is easy; a finished product can be effectively shielded, and the packaging yield and the product stability can be improved.