60563 results about "Epoxy" patented technology

An electrochromic variable reflectance mirror for a vehicle includes a reflector / electrode on the third surface of the mirror. This reflector / electrode forms an integral electrode in contact with the electrochromic media, and may be a single layer of a highly reflective material or may comprise a series of coatings. When a series of coatings is used for the reflector / electrode, there should be a base coating which bonds to the glass surface and resists any adverse interaction, e.g., corrosive action, with the constituents comprising the electrochromic media, an optional intermediate layer (or layers) which bonds well to the base coating and resists any adverse interaction with the electrochromic media, and at least one highly reflective layer which directly contacts the electrochromic media and which is chosen primarily for its high reflectance, stable behavior as an electrode, resistance to adverse interaction with the materials of the electrochromic media, resistance to atmospheric corrosion, resistance to electrical contact corrosion, the ability to adhere to the base or intermediate layer(s) (if present) and to the epoxy seal, and ease of cleaning. If a base layer is deposited it preferably covers the entire third surface; however, when this is done the highly reflective layer may optionally only coat the central portion of the third surface and not the perimeter edge portion. The third surface reflector / electrode provides of improved electrical interconnection techniques used to impart a voltage drive potential to a transparent conductor on the mirror's second surface.

A lead assembly and a method of making a lead are provided. The lead comprises a terminal, proximal end having a plurality of terminal contacts and material separating the terminal contacts. In one embodiment of the lead, the terminal contacts are separated by a preformed spacer, that may be made from various hard materials such as polyurethane, PEEK and polysulfone. Epoxy may be used to fill spaces at the proximal lead end, including between the spacer and terminal contacts. In one embodiment of the lead, the terminal contacts are separated by epoxy only. The lead may include a plurality of conductor lumens that contain conductors. The lead may also include a stylet lumen for accepting a stylet.

A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.

Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. A method for degassing a substrate can include positioning a substrate comprising a polymer or an epoxy within a processing chamber maintained between a degas temperature and a glass transition temperature, exposing the substrate to variable frequency microwave radiation, exposing the substrate to a plasma comprising an inert gas, removing oxygen containing compounds from the chamber, raising the pressure of inert gas in the chamber, and maintaining the pressure of inert gas while cooling the substrate to a temperature lower than the degas temperature.

A lead assembly and a method of making a lead are provided. The lead comprises a terminal, proximal end having a plurality of terminal contacts and material separating the terminal contacts. In one embodiment of the lead, the terminal contacts are separated by a preformed spacer, that may be made from various hard materials such as polyurethane, PEEK and polysulfone. Epoxy may be used to fill spaces at the proximal lead end, including between the spacer and terminal contacts. In one embodiment of the lead, the terminal contacts are separated by epoxy only. The lead may include a plurality of conductor lumens that contain conductors. The lead may also include a stylet lumen for accepting a stylet.

A bipolar electrosurgical scissors for use in open or endoscopic surgery has a pair of opposed blade members pivotally joined to one another and to the distal end of the scissors itself by a rivet which extends through a insulated bushing member. Each of the blade members comprises a blade support and a blade itself, each fabricated from metal, such as stainless steel. The blades are affixed to their associated supports by means of a suitable adhesive or adhesive composite material such as a fiberglass reinforced epoxy exhibiting dielectric properties. Cutting is performed, steel-on-steel, without causing a short circuit between the two blade supports which themselves function as the bipolar electrodes.

A disposable downhole tool comprises a material that dissolves when exposed to a chemical solution, an ultraviolet light, a nuclear source, or a combination thereof. In an embodiment, the material comprises an epoxy resin, a fiberglass, or a combination thereof. In another embodiment, the material comprises a fiberglass and a binding agent. The material may also be customized to achieve a desired dissolution rate of the tool. In an embodiment, the disposable downhole tool further comprises an enclosure for storing the chemical solution. The tool may also comprise an activation mechanism for releasing the chemical solution from the enclosure. In an embodiment, the disposable downhole tool is a frac plug. In another embodiment, the tool is a bridge plug. In yet another embodiment, the tool is a packer.

Low viscosity ternary mixtures of benzoxazine, epoxy and phenolic resins have been developed. The blends render homogeneous and void free cured specimen with a wide range of properties. Melt viscosity values as low as 0.3 Pa.s at 100° C. can be achieved. The phenolic resin acts as a cure accelerator to the system, besides its typical function as a hardener of epoxy resin. Glass transition temperatures Tg as high as 170° C. can also be obtained.

A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate is provided with substrate contacts and conductive pathways that are electrically coupled to the die contacts and extend through the substrate. Electrical conductors surround the conductive pathways. A monitoring circuit detects a break in continuity of one or more of the electrical conductors, and preferably renders the assembly inoperable. Preferably, an epoxy encapsulation is provided to prevent probing tools from being able to reach the die or substrate contacts.

PCT No. PCT / JP95 / 02034 Sec. 371 Date May 23, 1997 Sec. 102(e) Date May 23, 1997 PCT Filed Oct. 4, 1995 PCT Pub. No. WO96 / 10710 PCT Pub. Date Apr. 11, 1996An object of the present invention is to provide galling resistance to a threaded joint used for an oil well pipe. On a thread portion and a metallic sealing portion of the joint, there is provided a manganese phosphate chemical formation coating layer, or alternatively there are provided a nitriding layer of 1 to 20 mu m thickness and a manganese phosphate chemical formation coating layer of 5 to 30 mu m thickness, and also there is coated a solid lubricant which contains powder of molybdenum disulfide or tungsten disulfide and also contains one of epoxy resin, furan resin and polyamide resin as an essential component, and a ratio of composition is maintained at a specific value, so that a solid lubricant coating layer of 10 to 45 mu m thickness can be formed by heating. Due to the above surface treatment, even when the frequency of repetition of fastening and unfastening of the joint is increased, the occurrence of galling can be prevented over a long period of time.

A golf club head is formed of a hollow body, the rear body portion of which includes a metallic stringer that extends along the crown-skirt interface and a plurality of ribs intersecting the metallic stringer to form a lattice frame, the openings of which are filled with an organic composite material such as graphite epoxy. An additional aperture formed in the skirt is also filled with the same graphite epoxy material. Because the graphite epoxy is lighter than the surrounding metal frame, the rear body portion of the golf club head is lighter than a comparable all metal club head. Yet, the presence of the metallic stringer and frame renders the metal-organic composite rear body portion substantially stiffer than a comparable all-composite rear body portion.

A disposable downhole tool comprises a material that dissolves when exposed to a chemical solution, an ultraviolet light, a nuclear source, or a combination thereof. In an embodiment, the material comprises an epoxy resin, a fiberglass, or a combination thereof. In another embodiment, the material comprises a fiberglass and a binding agent. The material may also be customized to achieve a desired dissolution rate of the tool. In an embodiment, the disposable downhole tool further comprises an enclosure for storing the chemical solution. The tool may also comprise an activation mechanism for releasing the chemical solution from the enclosure. In an embodiment, the disposable downhole tool is a frac plug. In another embodiment, the tool is a bridge plug. In yet another embodiment, the tool is a packer.

An activatable (e.g., heat expandable) material and articles incorporating the same is disclosed. The material includes an epoxy resin; an epoxy / elastomer hybrid or reaction product; a blowing agent; a curing agent; and optionally, a filler. In preferred embodiments, the material includes aramid fiber, nanoclay or both.

The invention relates to a two-component epoxy resin adhesive, including the following components: novolac epoxy resin, lipid ring type epoxy resin and terminal carboxylic acrylonitrile butadiene rubber in component A, and 1, 4-di-benzene (2, 4-diaminobenzene oxygen) in component B, wherein, the mass percentage of the lipid ring type epoxy resin is 20-35 percent of the novolac epoxy resin, the mass percentage of the terminal carboxylic acrylonitrile butadiene rubber CTBN is 12 percent of the novolac epoxy resin and the mass percentage of the 1, 4-di-benzene (2, 4-diaminobenzene oxygen) is 15-20 percent of the novolac epoxy resin; and the preparation of the two-component epoxy resin adhesive includes the step of evenly mixing the component A and the component B for use. The two-component epoxy resin adhesive used for conductive adhesive has good heat resistance, average stretching and shearing strength of 21.28MPa, simple preparation process and operation without solvent, and plays the role of protecting environment.

An iron golf club head having a thin (less than 0.12 inches) first section that has an expanded unsupported front face region. The first section including a central portion forming part of a leading edge and wrapping around a sole section of the club, to create an increase the coefficient of restitution of the club head to greater than 0.8. The club head utilizes a rear insert that in addition to providing support for the front face, also allows for the fine tuning of swing weights with no change in geometry or size of the club head. This is accomplished this by the utilization of weight adjustment inserts that impregnate tungsten loaded plastic into sheets of carbon graphite and epoxy. The percentage of tungsten creating a weight range without any size change in the sheets.

A mechanically formed vortex transducer is described. The transducer has a plurality of piezoelectric elements suspended in an epoxy and heat molded into a desired shape. An irregularity in the transducer shape provides for a mechanically induced vortex focal field without the need for electronic steering or lens focusing. A system and methods of making the same are also described.

A solar cell module of the present invention was made to improve adhesion between electrodes, which is formed with thermosetting resin containing silver paste, of a solar cell element and connecting tabs coated with lead (Pb) free solder. To achieve this purpose, the solar cell module is comprised of a front surface member, a rear surface protective member, a plurality of solar cell elements provided between the front surface member and the rear surface protective member, and connecting tabs for electrically connecting the solar cell elements to each other through electrodes with the use of lead free solder. The electrodes of the solar cell elements are made of silver paste containing thermosetting resin and silver powder. The thermosetting resin contains epoxy resin at volume ratio of 70% or more having a glass transition rate of 80° C. to 200° C. measured by a TMA method. The connecting tabs coated with lead free solder are soldered to the electrodes.

A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are present in the curable composition in the appropriate amounts and ratios such that, upon curing, the block copolymer self-assembles into a nano structure morphology, such as a worm-like micelle morphology. The resulting cured product made from the composition of the present invention has a remarkably increased high fracture resistance; and allows the use of flame retardant epoxies in applications where fracture resistance is an issue.

A modular segmented structural reinforcement system for use with closed forms or cavities defined with automotive vehicles having a plurality of modular segments designed to be secured within a defined portion of an automotive vehicle applications. An expandable or bonding material, such as an epoxy-based reinforcing foam or other sound absorption, damping, vibration reduction, or sealing material is disposed on at least a portion of the outer surface of each of the plurality of segments. Once the system is flexible fitted within the closed form or placed within a selected cavity of an automotive vehicle, the material expands and cures during an automobile assembly operation, bonding the reinforcement system to the segments. As a result, the reinforcement system provides enhanced load distribution over the vehicle frame without adding excessive weight and further serves to reduce noise and vibrational characteristics of the automotive vehicle.

A coated print bed for a 3D printer having a permanent print-surface coating permanently secured to a print bed substrate plate, having a smooth, planar surface that provides an adhesive interface layer between a first layer of an applied plastic print material and the coated print bed. The coating contains a matrix-forming compound, such as a solvent- or water-based epoxy resin, an adhesive material, and optionally a filler. The user can print a series of print object directly onto the permanent print surface coating of the coated print bed, without having to refresh or refurbish the print surface, such as by applying to the print bed surface a temporary coating such as painter's tape, or a liquid adhesive.

An integral gasketed filtration cassette structure of a type comprising a filtration cassette fully or partially overcoated by a gasket layer, forming a fluid-tight seal between the filtration cassette and the filtration cassette holder to which the filtration cassette is to be affixed. The filtration cassette comprises filter sheets arranged in a multilaminate, peripherally bonded array, wherein the filter sheets alternate with permeate and retentate sheets. The gasket layer comprises an elastomeric material with suitable hardness and temperature resistance for sealing, such as silicone, ethylenepropylenedienemonomer (EPDM), viton, polyurethane, polypropylene, polyethylene, polyvinylchloride, polyester, epoxy, ethylvinylacetate, bunnas, and styrene butadiene. The filtration cassettes and filter of the invention may be advantageously employed for dewatering of aqueous biomass suspensions, desalting of proteins, removal of secreted metabolites from cellular suspensions, and the like.

A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed from epoxy-bonded single-crystalline silicon wafer as its cap, epoxy and deposited metal or insulator as at least part of its sidewall, on substrate wafers.

Golf clubs and club-heads for same are disclosed. An exemplary club-head has a hollow body and a face plate. The body defines a front opening and a face support, wherein the face plate is affixed to the face support and covers the front opening. The “face portion” of the club-head has a face area (Af, in mm2) and a face mass (Mf, in grams), wherein Af>5400 mm2, and in a plot of Mf as a function of Af, Mf is below Mf=0.0072(Af)+18. At least a portion of the face plate can be made of composite. E.g., the face plate can include a composite plate made of carbon fiber and cured epoxy resin. The strike face of the face plate can include a composite plate and a cap bonded to the composite plate on the strike face. The cap can be made of a metallic material, such as (but not limited to) titanium alloy or stainless steel.

A composite interposer for providing power and signal connections between an integrated circuit chip or chips and a substrate. The interposer includes a signal core formed from a conductive power / ground plane positioned between two dielectric layers. A method for fabricating a composite interposer comprising disposing a silicon layer on a substrate, and selectively etching the silicon layer down to the substrate to develop silicon openings with a silicon profile, and to expose part of the substrate. Vias are formed through the exposed part of the substrate. The method additionally includes filling the vias and the silicon openings with a filler material (e.g., a high-aspect-ratio-capable photodefinable epoxy polymer) to form filled silicon openings and filled vias, forming first openings through the filled silicon openings and through the filled vias, forming second opening through filler material to expose semiconductor devices on the silicon layer, and interconnecting electrically, through the first openings and through the second openings, the exposed semiconductor devices with pads disposed against a bottom of the substrate.

The present invention provides a polymer membrane enhanced with cured epoxy resin for use as the outer membrane of biosensors. The membrane includes approximately 30-80% epoxy resin adhesives, 10-60% polymer such as poly(vinyl chloride), polycarbonate and polyurethane and 0-30% plasticizers and 5-15% surface modifier reagent such as polyethylene oxide-containing block copolymers. Utilizing the polymer membrane of the present invention, a three-layered sensing element has been developed. This sensing element will be particularly useful for miniaturized biosensors used for in vitro blood measurements or for continuous in vivo monitoring such as implantable biosensors. This element includes an enzyme layer, an interference-eliminating layer and the novel polymer member of the present invention as the outer polymer layer. This novel sensing element shows excellent response characteristics in solutions and has an extremely long lifetime. This technology is particularly useful for improving the lifetime of implantable biosensors.

An electromagnetic shield for an electronic module includes a surface finish that is applied to the surface of an electronic module so as to minimize the size of the shield. Once the shield is in place, the shield acts to address electromagnetic interference (EMI) concerns associated with the electronic module. An electronic module having a ring of conductive material embedded about its peripheral edge is formed. The electronic module is then sub-diced so as to expose the ring of conductive material. After sub-dicing, a conductive material may be applied through an electroless plating process followed by an electrolytic plating process. Alternatively, a conductive epoxy may be sprayed or painted onto the surface of the electronic module.