4451 results about "Resin adhesive" patented technology

The invention relates to a two-component epoxy resin adhesive, including the following components: novolac epoxy resin, lipid ring type epoxy resin and terminal carboxylic acrylonitrile butadiene rubber in component A, and 1, 4-di-benzene (2, 4-diaminobenzene oxygen) in component B, wherein, the mass percentage of the lipid ring type epoxy resin is 20-35 percent of the novolac epoxy resin, the mass percentage of the terminal carboxylic acrylonitrile butadiene rubber CTBN is 12 percent of the novolac epoxy resin and the mass percentage of the 1, 4-di-benzene (2, 4-diaminobenzene oxygen) is 15-20 percent of the novolac epoxy resin; and the preparation of the two-component epoxy resin adhesive includes the step of evenly mixing the component A and the component B for use. The two-component epoxy resin adhesive used for conductive adhesive has good heat resistance, average stretching and shearing strength of 21.28MPa, simple preparation process and operation without solvent, and plays the role of protecting environment.

The present invention provides a polymer membrane enhanced with cured epoxy resin for use as the outer membrane of biosensors. The membrane includes approximately 30-80% epoxy resin adhesives, 10-60% polymer such as poly(vinyl chloride), polycarbonate and polyurethane and 0-30% plasticizers and 5-15% surface modifier reagent such as polyethylene oxide-containing block copolymers. Utilizing the polymer membrane of the present invention, a three-layered sensing element has been developed. This sensing element will be particularly useful for miniaturized biosensors used for in vitro blood measurements or for continuous in vivo monitoring such as implantable biosensors. This element includes an enzyme layer, an interference-eliminating layer and the novel polymer member of the present invention as the outer polymer layer. This novel sensing element shows excellent response characteristics in solutions and has an extremely long lifetime. This technology is particularly useful for improving the lifetime of implantable biosensors.

The invention discloses an epoxy resin adhesive for manufacturing blades of a wind driven generator and a preparation method thereof. The epoxy resin adhesive is prepared by combining a resin part and a curing agent part, wherein the resin part comprises epoxy resin, a dilutent, filler, a thixotropic agent and an auxiliary agent; the curing agent part comprises an amine curing agent, filler and athixotropic agent; and the filler comprises a powdery filler part and a fibrous filler part. The epoxy resin adhesive prepared by using the general epoxy resin has high strength, particularly furtherimproves the strength of materials by adding the fibrous filler, improves the anti-cracking performance of the materials, meets the special requirements of the blades of wind driven generators with megawatt or more on the materials and has low material cost and high economy.

A mask used when a semiconductor wafer is diced into individual semiconductor chips by plasma etching is formed as follows. First, a pattern of a liquid-repellent film is formed by printing a liquid-repellent liquid on the area to be etched on the rear surface of the semiconductor wafer. Next, a resin film thicker than the liquid-repellent film is formed in the area not having the liquid-repellent film by supplying a liquid resin to the rear surface on which the liquid-repellent pattern has been formed. Then, the resin film is cured to form the mask covering the area other than the area to be removed by the etching. This method allows the formation of an etching mask without using a high-cost method such as photolithography.

The present invention discloses one kind of making process of E1/E0 level environment protection artificial plate. After plain plate with free formaldehyde releasing amount greater than or equal to E2 level is made with common urea resin adhesive, the plain plate is processed through ammonia vacuum process to lower the free formaldehyde releasing amount to E1/E0 level. According to the density and initial formaldehyde releasing amount of the plain plate, the ammonia consumption and formaldehyde lowering time are regulated to control the processing effect. The said process has stable product quality and low cost, and is suitable for various artificial plates, including plywood, medium density fiber plate, high density fiber plate and shaving board.

The invention belongs to the field of super-hydrophobic or super-amphiphobic coating preparation, and particularly relates to a method for preparing durable super-amphiphobic coatings capable of being sprayed. The method particularly includes steps of 1, carrying out cleaning and sand blasting roughening treatment on the surfaces of base materials; 2, preparing resin solution; 3, preparing particle composite suspension; 4, spraying the resin solution obtained at the step 2 on the surfaces, treated at the step 1, of the base materials, drying the base materials and carrying out semi-solidification on resin adhesive; 5, spraying the particle composite suspension obtained at the step 3 on the surfaces of the base materials obtained at the step 4, and drying the base materials to completely solidify the base materials; 6, washing the surfaces of the base materials obtained at the step 5 to obtain the durable super-amphiphobic coatings capable of being sprayed. The method has the advantage that the durable super-amphiphobic coatings with excellent durability and firmness can be prepared on the surfaces of the various base materials by the aid of spraying technologies and have persistent anti-freezing performance.

The invention provides a preparation method for phenolic adhesive based on lignin phenolization liquid and application thereof. Under the condition of normal pressure heating or thermalcatalysis, phenol is taken as liquefaction reagent, lignin is added, the temperature is raised to 90 to 150 DEG C, the thermal insulation liquefaction reaction is made to cool to obtain a lignin liquefaction product; basic catalyst and formaldehyde are directly added into the liquefaction liquid, the temperature is raised to 70 to 97 DEG C under normal pressure to react for 1 to 3 hours, the reaction is terminated when the viscosity is measured to meet the preset requirement, and low-free formaldehyde environmental protection type phenolic adhesive based on lignin phenolization liquid is obtained. The adhesive obtained by the invention has lower cost and lower content of free formaldehyde than the prior phenolic resin adhesive. The plywood pressed by using the adhesive obtained by the invention has good bonding performance.

The invention discloses a preparation method of a stable superhydrophobic hot liquid coating, and belongs to the technical field of surface coating preparation. According to the preparation method, in an acetone-water mixed system, in the catalytic effect of acid or base, organic silane and nano particles carry out hydrolysis and condensation reactions to obtain organic silane polymer/nano particle compound suspension; then organic resin adhesive is added into the compound suspension, the mixture is evenly mixed and evenly sprayed on the surface of a substrate material, and finally a thermal curing treatment is performed to obtain the stable superhydrophobic hot liquid coating. The prepared coating has an excellent superhydrophobic hot liquid performance, has the advantages of good mechanical stability, chemical stability, and environmental stability, and thus has a good application prospect.

An optical-optoelectronic coupling structure comprising a flip-chip optoelectronic/ultrathin silicon-on-sapphire device mounted on a V-groove, optical-fiber-bearing carrier substrate, including light-reflective structures for launching light into the optical fiber core or transmitting light emitted by the optical fiber core to the optoelectronic device. The optical fiber may be immobilized in the V-groove using a curable resin adhesive characterized by a refractive index substantially similar to the refractive index of the optical fiber.

A power transmission belt having a body defined by rubber and having an exposed outer surface, a fiber layer on at least a part of the exposed outer surface of the body, and a mixture including a resin adhesive ingredient, a rubber ingredient, and a lubricant that is a fluorine resin powder that is applied to the fiber layer.

The invention relates to a novel polyurethane-acrylic acid-epoxy resin photosensitive pre-polymer, a synthesis method of the pre-polymer, a high-performance ultraviolet (UV) cured polyurethane modified acrylic acid epoxy resin adhesive prepared from the pre-polymer and application of the UV cured adhesive to bonding of a nylon membrane material and a polyurethane or modified polyurethane elastic body. A method for preparing the photosensitive pre-polymer comprises the following steps of: 1, synthesizing a lower-viscosity epoxy acrylic ester pre-polymer; 2, preparing a pre-polymer of urethane acrylate resin; and 3, mixing or reacting the two pre-polymers in a certain ratio so as to obtain the polyurethane-acrylic acid-epoxy resin photosensitive pre-polymer. A polyurethane-acrylic acid-epoxy resin UV cured adhesive is further prepared by adding a photoinitiator, a photosensitive diluent, a light curing crosslinking agent, other necessary aids and the like.

An optical device includes an optical element, a transparent member arranged on the optical element, and a transparent resin adhesive for causing the transparent member to adhere and be fixed onto a circuit formation face of the optical element. The optical device includes a light detecting region having a plurality of micro lenses, a peripheral circuit region formed in the outer peripheral part of the light detecting region, and an electrode region formed at the outer peripheral part of the peripheral circuit region. A roughed region in a saw-toothed shape in section is formed in part of a face of the transparent member which adheres to the optical element, the part being overlapped with the outer peripheral part of the light detecting region as viewed in plan.

An adhesive binder composition containing a urea-formaldehyde resin modified with a protein, preferably with a source of soy protein and the use of the binder for preparing wood composites, especially particleboard.

The invention provides a modified urea-formaldehyde resin adhesive low in formaldehyde residue and a production method thereof. The modified urea-formaldehyde resin adhesive is characterized by being prepared from the following raw materials in parts by weight: 100 parts of modified urea-formaldehyde resin, 20-25 parts of reinforcing agent and 0.1-0.2 part of defoamer, wherein the reinforcing agent is any one or a composition of several of white carbon black, titanium dioxide, calcium carbonate and kaolin having the particle size greater than 300 meshes; the defoamer is polydimethylsiloxane or tributyl phosphate. The formaldehyde residue of the modified urea-formaldehyde resin adhesive provided by the invention is less than 0.1 mg/L; the modified urea-formaldehyde resin adhesive is used as an adhesive for an artificial board; as the modified urea-formaldehyde resin adhesive is low in release amount of formaldehyde, the health of customers is protected.

The invention provides a composite modification method for a phenolic resin adhesive. A mixture of organic silicon and (or) a polyhydric compound serves as a modifier in a synthetic process of phenolic resin. The composite modification method is technically characterized in that: the modifier is added in a prepolymerization reaction process or after the prepolymerization reaction; formaldehyde is added at one time under an alkaline condition; dehydration is not performed in the later period of the reaction; the whole process flow is simple and is easy to operate; the product has stable performance and does not pollute environment; and the content of free formaldehyde is low.

The invention discloses a modified epoxy resin adhesive, which comprises the following components in portion by weight: 10 to 50 portions of epoxy resin, 20 to 80 portions of toughening agent, 0.2 to 5 portions of curing agent, 0 to 2 portions of curing accelerant, 0 to 1 portion of assistant, 2 to 15 portions of inorganic filler and 20 to 80 portions of solvent. In order to overcome the defects in the prior art, the invention provides the modified epoxy resin adhesive with strong flexibility, high peeling strength, good flexure property, good size stability, strong chemical corrosion resistance and excellent electric performance, and a method for producing the modified epoxy resin adhesive.

The invention provides a high-performance thermosetting epoxy resin adhesive for roads and bridges. The adhesive comprises a component A and a component B, wherein, the component A comprises the following components in parts by mass: 100 parts of epoxy resin, 25 to 33 parts of flexibilizer, and 5 to 10 parts of diluent; the component B comprises the following components in parts by mass: 80 to 120 parts of curing agent, 5 to 10 parts of accelerant, 0.5 to 2 parts of coupling agent, 1 to 10 parts of reinforcing agent, and 0.2 to 0.5 part of antifoaming agent; and the ratio of the component A to the component B is 100:100-100:120. According to the adhesive, a flexible long-chain aliphatic amine serving as the curing agent has a curing reaction with the epoxy resin to form a solid crosslinking structure, so that the epoxy resin adhesive is high in adhesion capability and water resistance; The toughness of the epoxy asphalt adhesive is improved by adopting the soybean oil-based polyurethane to be adapted to the flexibility of a steel plate, and the soybean oil-based polyurethane containing massive hydroxyl has good compatibility with the epoxy resin. The adhesive is applicable to adhesion and waterproofing of steel bridge decks, viaducts, cement concrete bridge decks, tunnels, expressways and other decks. The invention discloses a preparation method of the high-performance thermosetting epoxy resin adhesive.

The invention relates to a preparation method for post-crosslinking modified urea-formaldehyde resin, which is characterized in that under low molar ratio of formaldehyde/carbamide, a cross linker is added in the addition stage or the condensation stage. The method of the invention guarantees the excellent bonding strength of the resin under low free formaldehyde content and low formaldehyde release amount. By detecting, the modified urea-formaldehyde resin prepared by the invention has less than 0.1 percent of free formaldehyde content, less than 1mg/L of formaldehyde release amount of plywood and larger than 2.8MPa of bonding strength and the comprehensive performance is obviously better than the existing urea-formaldehyde resin adhesive.