385 results about "Resin adhesive" patented technology

The invention discloses a polyurethane modified epoxy resin adhesive as well as a preparation method and application thereof, and the polyurethane modified epoxy resin adhesive is prepared from the following components in parts by mass: 7-10 parts of E51 type bisphenol A diglycidyl ether, 3.5 parts of a phenolic aldehyde amine T31 curing agent and 1-3 parts of synthetic polyurethane, the synthetic polyurethane is prepared from polyether triol, polyether amine, isophorone diisocyanate and glycerol carbonate, and a blending system of the synthetic polyurethane and bisphenol A diglycidyl ether is adopted to be subjected to covalent crosslinking with phenolic aldehyde amine T31, so that the adhesive has high toughness and strength guarantee; the synthetic polyurethane prepared by the method is obtained through simple, green and efficient solvent-free synthesis, and the synthesized product has certain fluidity at room temperature, so that the subsequent stirring preparation process of an adhesive is facilitated. And a solvent-free synthesis method is adopted, so that the use of a toxic organic solvent in the traditional polyurethane synthesis process is avoided, and the synthesis process is greener.

The invention relates to the technical field of adhesives, and discloses a preparation method of an organic silicon modified epoxy resin adhesive. The epoxy resin adhesive prepared by the invention is prepared by taking epoxy resin and organic silicon modified epoxy resin as main matrix resin, adding a curing agent, a curing accelerator, nano silicon dioxide, spherical aluminum oxide and a reactive diluent, and mixing and stirring; wherein due to the introduction of the organic silicon modified epoxy resin, the mechanical property and toughness of a cured adhesive film are improved, so that the adhesive film is not easy to embrittle and crack under external force, and meanwhile, the water resistance of the adhesive film is also improved.

The utility model belongs to the technical field of carbon fiber composite materials, and particularly relates to a multi-layer fiber prepreg and a production device thereof. The production device comprises a first upper adhesive film unwinding device, a first reinforcing material unwinding device, a first lower adhesive film unwinding device and a winding device, and the discharging end of the first upper adhesive film unwinding device, the discharging end of the first lower adhesive film unwinding device and the discharging end of the first reinforcing material unwinding device are connected with a first impregnation assembly. At least one reinforcing material laying assembly is arranged between the discharging end of the first impregnation assembly and the winding device, and the at least one reinforcing material laying assembly is connected in sequence. The prepreg comprises a single-layer fiber prepreg and N layers of reinforcing materials sequentially laid on the single-layer fiber prepreg, and a layer of resin adhesive film is laid on the side, away from the single-layer fiber prepreg, of each layer of reinforcing material. According to the invention, the fiber prepreg with large gram weight and high impregnation degree can be rapidly, efficiently and continuously produced on line, and the prepreg is good in stability and good in mechanical property.

The invention belongs to the technical field of adhesives, and relates to an epoxy resin composition, an epoxy resin adhesive film and application thereof. The epoxy resin composition comprises epoxy resin, a curing agent, a flexibilizer, a filler and rosin modified phenolic resin, the curing agent at least comprises a latent curing agent, the flexibilizer at least comprises acrylate rubber, the softening point of the rosin modified phenolic resin is 120-180 DEG C, the acid value is 40-100 mgKOH / g, and the filler is a filler. The rosin modified phenolic resin with the specific softening point and acid value is introduced, and the types of the curing agent and the flexibilizer are limited, so that the damping loss factor of an epoxy resin adhesive film prepared from the epoxy resin composition is relatively low in the range of 0-100 DEG C, and the stability of the damping loss factor is relatively high; meanwhile, the adhesive also has the characteristics of high elastic modulus, high toughness, high peel strength, good normal-temperature storage stability and good high-temperature rapid reactivity.

The invention belongs to the technical field of digital printing heat transfer printing materials, and particularly relates to a static-free loose-powder DTF transfer printing film and a preparation method thereof. The invention aims to solve the problem of contradiction among antistatic function, ink adsorption and peel strength of the current DTF transfer film. According to the invention, the ionic liquid antistatic agent coated by the polymer microcapsule is dispersed in the water-based resin adhesive to form the lower antistatic network structure layer; meanwhile, the crystallization behavior of the crystalline polyester hot melt adhesive resin taking bio-based 2, 5-furandicarboxylic acid as a rigid component is regulated and controlled through surface modified boron nitride nanosheets, a phase separation curing process is utilized, so that an antistatic network stably exists at the lower part of the coating, and hot melt adhesive resin microcrystals are selectively enriched on the outermost surface of the coating; and a thermally induced phase change bonding layer is formed, so that no static electricity disturbs powder in the printing and powder scattering processes.

The invention relates to an epoxy resin adhesive composition and a preparation method thereof, and belongs to the technical field of high-performance polymer material modification and electronic packaging materials, and the epoxy resin adhesive composition comprises the following components by weight: 100 parts of basic epoxy resin; 5-30 parts of a hyperbranched liquid crystal modifier; adding the curing agent according to a stoichiometric ratio; 100 to 600 parts of a heat-conducting filler; 0.1-5 parts of an accelerant and an auxiliary agent; the hyperbranched liquid crystal modifier has a core-shell structure and is prepared from a hydrogen-containing hyperbranched polysiloxane core and an alkenyl-terminated liquid crystal epoxy monomer through a hydrosilylation reaction under the action of a catalyst, the hyperbranched polysiloxane core is introduced, the friction resistance among high-concentration fillers is reduced by utilizing the torispherical structure of the hyperbranched polysiloxane core, and the hyperbranched liquid crystal modifier has the advantages that the friction resistance is reduced; under the condition that 350 parts of heat-conducting filler is filled, the modifier is added, so that the high-filling system still has excellent flowability and leveling property while keeping high heat-conducting property, and is suitable for high-precision micro-encapsulation scenes; the heat conductivity of the scheme is obviously superior to that of a system which does not use the modifier or does not adopt a stepped heating process.

The application belongs to the technical field of polymer materials, and particularly relates to a high-performance fiber composite material and a preparation method thereof. The preparation method of the high-performance fiber composite material comprises the following steps: adding pretreated aluminum oxide whiskers into a solvent, then adding pretreated carboxymethyl cellulose and gallic acid, and heating to reflux to obtain modified aluminum oxide whiskers; then mixing epoxy resin, the modified aluminum oxide whiskers, a curing agent and an accelerator uniformly to coat a film to obtain a resin adhesive film; and compounding the resin adhesive film and carbon fibers through hot pressing to obtain carbon fiber prepreg, and heating and curing the obtained prepreg to obtain the high-performance fiber composite material. The fiber composite material obtained by the application not only has high strength and rigidity, but also has excellent toughness, can effectively resist the impact of the external environment, has oxidation resistance and long-term stability, and has a wide application prospect in the fields of aerospace and new energy equipment.

The invention provides an epoxy resin adhesive for RGB-LED (Red Green Blue-Light Emitting Diode) packaging and a preparation method of the epoxy resin adhesive. The epoxy resin adhesive is prepared from the following raw materials in parts by mass: 40 to 50 parts of bisphenol A epoxy resin, 20 to 30 parts of epoxy modified phenyl organic silicon resin, 10 to 15 parts of sulfur-containing epoxy resin, 4 to 6 parts of modified branched aluminum oxide, 10 to 14 parts of modified hexagonal boron nitride, 30 to 40 parts of compound curing agent, 1 to 2 parts of compound accelerant and 0.5 to 1 part of modified nano zinc oxide ultraviolet absorbent. The epoxy resin adhesive for packaging the RGB-LED, provided by the invention, has relatively high bonding stability on a PPA (Phenyl-Phenylic Acid) base material, has a slight shrinkage degree in a curing process, can effectively avoid the structural failure problems of packaging body cracking, chip offset and the like, guarantees the structural stability of the RGB-LED in long-term operation, and improves the service life of the RGB-LED. And moreover, high reliability, high weather resistance, matte high-brightness balance and low hygroscopicity are realized.

The invention belongs to the technical field of coatings, and discloses a corrosion-resistant high-impact-resistant electrophoretic coating and a preparation method thereof. The coating comprises a cationic water-based resin emulsion, flaky nano clay with epoxy groups grafted on the surface, a curing agent, a cosolvent and a functional additive, the core of the method is that through electric field driving in the electrophoretic deposition process, resin micelles and modified nano clay form a bionic micro-nano laminated structure in which hard inorganic sheet layers and flexible organic layers are alternately arranged on the surface of a cathode in situ, and interface bonding between the sheet layers is enhanced through chemical bonding. The bionic micro-nano laminated structure with clear periodicity and a chemical bonding interface is constructed through an in-situ co-deposition technology driven by an electric field, and the contradictions that hardness and toughness cannot be achieved at the same time and impact resistance and corrosion resistance are difficult to cooperate in the prior art are solved; the method is suitable for the high-end industrial fields such as automobile bodies, high-speed rail bogies, offshore wind power towers and the like with strict requirements on comprehensive protection performance.

The invention provides a residual glue processing method and device.The method comprises the steps that a to-be-cleaned component is provided, the surface of the component comprises a functional area, and residual glue exists on the periphery of the functional area; the carbonization step comprises the steps that the part is rotated at a first rotating speed, a carbonization agent is added into the functional area, and the carbonization agent flows to the residual glue under the action of centrifugal force and acts on the residual glue to carbonize the residual glue; the step of removing the carbonizing agent comprises the steps that adding of the carbonizing agent is stopped, the part is rotated at a second rotating speed, so that the residual carbonizing agent flows to the edge of the part under the action of centrifugal force, and the second rotating speed is larger than the first rotating speed; and the step of removing the carbonized residual adhesive comprises the step of removing the carbonized residual adhesive by adopting a physical method. According to the cleaning device, residual stubborn adhesives can be efficiently and thoroughly removed, and meanwhile it is guaranteed that the to-be-cleaned part is not damaged.

The utility model relates to the technical field of lenses, in particular to a spherical lens and cylindrical lens double-control fusion lens, which comprises a lens body and is characterized in that the lens body comprises a base layer I, and an anti-reflection layer, an ultraviolet-proof layer, an impact-resistant layer, a photochromic layer and a stain-resistant layer are arranged on the surface of the lens body. An anti-reflection layer is fixedly adhered to one side of the base layer I through a resin adhesive, and an ultraviolet-proof layer is adhered to the other side of the anti-reflection layer through the resin adhesive. According to the scheme, the functionality is remarkably improved through the multi-layer composite structure design (the anti-reflection layer, the ultraviolet-proof layer, the anti-impact layer and the like), in addition, the micro lenses of the first base layer and the second base layer are distributed in a staggered mode by rotating by 30 degrees, the one-person two-mirror alternate wearing mechanism (alternating every 2-4 weeks) is combined, fatigue of retina cells caused by fixed stimulation is avoided through dynamic out-of-focus stimulation, and the anti-fatigue performance of the retina cells is improved. Meanwhile, alternate recovery is promoted, so that myopia development is intervened more scientifically.

The utility model provides an embedded copper block structure with high stability, which relates to the technical field of PCB (printed circuit board) manufacturing, and comprises a core board, an embedded copper groove and a copper block body, the copper block body is embedded in the embedded copper groove, a plurality of hanging lugs are arranged at the joint of the copper block body and the core board, the hanging lugs extend outwards from the side edge of the copper block body and are embedded in the core board, and the embedded copper block body is embedded in the core board. The mechanical bonding force between the copper block body and the core plate is enhanced. The hanging lug is arranged at the joint of the copper block body and the core plate, the hanging lug is embedded into the core plate to form a mechanical locking structure, the bonding strength of the copper block and the core plate is remarkably improved, the problems that the copper block is loosened and falls off and the joint cracks under the pressing or external force action are effectively solved, and the resin adhesive layer is filled in the gap between the hanging lug and the copper embedding groove, so that the service life of the copper block is prolonged. A resin anchoring layer is formed after hot-pressing curing, the mechanical locking effect of the hanging lugs is combined, the combination stability of the copper block and the core plate is doubly enhanced, and thermal stress and external impact are buffered.

The utility model relates to the technical field of epoxy resin glue processing equipment, in particular to an epoxy resin glue solution filter which comprises a support, a filtering mechanism and a recycling mechanism, the surface of the bottom end of the support is fixedly connected with a placing plate, the top of the support is provided with the filtering mechanism, and the recycling mechanism is connected with the placing plate. A filtering mechanism is arranged on the top surface of the placing plate and can filter the epoxy resin glue solution, and centrifugal force is applied to the epoxy resin glue solution in the filtering process, so that the epoxy resin glue solution is accelerated in the filtering process, and the filtering efficiency of the epoxy resin glue solution is improved; and the recovery mechanism can recover the filtered epoxy resin glue solution, so that the phenomenon of omission during filtering of the epoxy resin glue solution is avoided. According to the utility model, the filtering mechanism is matched with the recycling mechanism, and the filtering of the epoxy resin glue solution is accelerated by utilizing centrifugal force, so that the filtering speed of the epoxy resin glue solution is improved.

The present application relates to the technical field of biomedical materials, and discloses a biological activity and biocompatibility surface treatment method for dentures and implants, which comprises the following steps: a) performing surface pretreatment on the base body of the denture or implant; b) applying a composite coating containing hydroxyapatite particles and biocompatible resin adhesive on the surface of the pretreated base body; c) performing low-temperature thermal curing on the composite coating to form a composite coating layer; and d) performing precision polishing on the surface of the cured composite coating layer to selectively remove part of the resin adhesive on the surface. Through mechanical locking of the base body surface and chemical combination of the interface inside the coating, a composite coating layer which is firmly combined with the base body and chemically stable is obtained; meanwhile, through low-temperature curing and surface activation treatment, the hydroxyapatite is exposed on the surface of the coating layer while the biological activity of the hydroxyapatite is retained, so that the coating layer is endowed with effective biological functions.

This invention relates to the fields of microelectromechanical systems (MEMS) and new energy technologies, and discloses a piezoelectric energy harvester based on a nonlinear gradient negative Poisson's ratio structure. Its elastic matrix has a fixed end and a free end, with a negative Poisson's ratio structural segment on it. The piezoelectric transducer element is bonded to the surface of the negative Poisson's ratio structural segment via an epoxy resin adhesive layer. The core innovation lies in the nonlinear monotonically decreasing thickness of the elastic matrix from the fixed end to the free end along its length. This change profile is defined by a specific cubic polynomial function, which can accurately approximate the theoretical model of an isostress beam, making the stress distribution on the matrix surface tend to be uniform during vibration. Simultaneously, the lateral expansion characteristics of the negative Poisson's ratio structural segment and the longitudinal stress enhancement effect of the nonlinear thickness synergistically amplify the charge output of the piezoelectric element. This invention significantly improves the utilization efficiency of piezoelectric materials and the power density of the energy harvester, and has the advantages of compact structure, high energy conversion efficiency, and mass production via 3D printing.

The utility model relates to plywood technical field, concretely relates to a high -strength plywood with two -way deformation resistance structure, including hetero -directional reinforcing core layer, self -compensating expansion joint, wood veneer, high temperature resistant resin adhesive and surface reinforcing layer, the hetero -directional reinforcing core layer adopts the wood veneer mixed layer of two -way corrugated groove slant stripe directional paving, and the grid interlocking structure is formed through laser cutting process. The utility model through hetero -directional reinforcing core layer and multilayer wood veneer form firm combination through high temperature resistant resin adhesive, and the gradient enhancement design and the edge sealing structure of surface reinforcing layer provide comprehensive protection, and the flexible transition characteristic of transition buffer zone ensures the stress effective transmission and dispersion between each structure layer, not only significantly improved the two -way mechanical property balance and size stability of panel, also endows it with excellent temperature adaptability, edge sealing and overall structural integrity, makes it can adapt to the use requirement under various complex environment.

The invention discloses an ASA material capable of being bonded with PVC without a base coat and a preparation method of the ASA material, and the ASA material capable of being bonded with PVC without the base coat is obtained by mixing SAN resin, ASA rubber powder, filler, ACR and auxiliaries. In the prior art, PVC and an insert are bonded in a glue prime coat mode, so that the process is long, the cost is high, VOC volatilization exists, and the environment is not protected; the glue prime coat mode increases one procedure, so that the efficiency is low, and the time is consumed; the invention develops the modified ASA material which is a low-cost prime coat-free modified ASA material capable of being bonded with PVC, the problem of prime coat-free bonding is solved, the cost is greatly reduced, and the modified ASA material is extremely environment-friendly.

The application discloses a winding forming device, comprising a rack, a glue dipping device for dipping yarn, a core mold fixing device for fixing a core mold, a winding device for winding yarn on the core mold, the glue dipping device, the core mold fixing device and the winding device being sequentially arranged along the length direction of the rack; the rack comprises a first rack and a second rack, the core mold fixing device is arranged on the first rack, and the winding device is vertically arranged on the second rack; and the first rack and the second rack are separately arranged. The winding forming device can prevent the fiber layer from deviating due to the vibration of the winding device caused by the stress of the core mold, effectively improves the qualified rate of products, and is simple in installation and dismounting operation of the core mold, high in operation efficiency and high in recycling rate of resin glue solution. The application further discloses a winding forming production line.

The application discloses a laser light source packaging method based on silicon nitride ceramics and relates to the technical field of laser light source packaging.The laser light source packaging method is composed of silicon nitride ceramics, a laser chip, silver powder resin glue, aluminum oxide, epoxy resin and N-methyl pyrrolidone raw materials.The light source packaging steps are as follows: firstly, the position of the center point of the laser in the laser cavity of the silicon nitride ceramics is measured by using a screw micrometer; the laser light source packaging method based on silicon nitride ceramics measures the position of the center point of the silicon nitride ceramic circuit plate by using a screw micrometer, marks the position by using silver powder resin glue, and stabilizes the light spot line by using laser light source projection technology, so that the laser pad plate of the silicon nitride ceramics is aligned and packaged with the envelope frame, the laser light cannot be offset, the quality of the laser light source packaging based on silicon nitride ceramics is high, the packaging effect is good, cost is saved, and the market use is widened.

This utility model discloses a suspended ultrasonic bird repeller, belonging to the field of electric bird control equipment, aiming to solve the problems of poor compatibility and cumbersome operation of existing bird repellers for live installation. It includes an ultrasonic bird repeller body and a clamping component, which are connected by epoxy resin adhesive; the clamping component includes a mounting base, spring baffle, torsion spring, etc., and can quickly clamp 25-500mm... 2 The device includes a wire; the main body is equipped with three sets of triangularly distributed ultrasonic horns, a Fresnel lens and infrared pyroelectric sensor combination, a V-shaped strobe light, a photovoltaic panel, and a boat-shaped switch. This bird deterrent device achieves rapid installation while energized via a spring structure, utilizes a combination of sound and light with infrared sensing to enhance bird deterrence efficiency, is compatible with multiple wire specifications, has a time-delay protection function, provides stable photovoltaic power supply, is suitable for long-term bird deterrence on high-voltage lines, and is easy to install and highly safe.

The application discloses a kind of composite ultra-thin bonding sheet for high-frequency copper-clad plate multilayer pressing and a preparation method thereof, and specifically belongs to the field of copper-clad plate bonding sheet manufacturing.The composite ultra-thin bonding sheet is obtained by impregnating the reinforcing substrate in a composite resin adhesive and then drying.The composite resin adhesive comprises a composite resin composition and a solvent.The composite resin composition comprises a composite bisphenol A type epoxy resin, an o-cresol formaldehyde epoxy resin, a brominated epoxy resin, poly(4-vinyl butyl benzoate), a heat-resistant filler, a curing agent, and a curing accelerator.The copper-clad plate prepared using the composite ultra-thin adhesive provided by the application has excellent high-temperature resistance and tracking resistance, as well as good flame retardance, low dielectric constant, and peel strength, with excellent overall performance.

The application belongs to the technical field of rail transit, and particularly relates to a light-weight, high-strength and high-temperature-resistant composite ceramsite and a preparation method thereof. The preparation method of the light-weight, high-strength and high-temperature-resistant composite ceramsite comprises the following steps: step 2-1: the single-layer composite ceramsite is placed into a rolling ball machine, the temperature is 90-120 DEG C, and the single-layer composite ceramsite is preheated; step 2-2: the epoxy resin adhesive is poured into the rolling ball machine and uniformly mixed with the single-layer composite ceramsite; step 2-3: compressed air is blown into the filler, and under the condition of 90-120 DEG C and 5-90 revolutions per minute, rolling forming is performed for 30-90 minutes; step 2-4: steps 2-2 and 2-3 are repeated until the composite ceramsite reaches the specified density; and step 2-5: the composite ceramsite is kept in an oven at 150-200 DEG C for 3-6 hours to complete curing. The application provides a light-weight, high-strength and high-temperature-resistant composite ceramsite and a preparation method thereof.

The invention discloses a high and low temperature resistant epoxy resin adhesive for bonding complex components in the aerospace field and a preparation method of the high and low temperature resistant epoxy resin adhesive, relates to the field of aerospace new materials, and aims to solve the problem that an existing epoxy resin adhesive is difficult to maintain high bonding strength in a wide temperature range. Wherein the component A is prepared from liquid epoxy resin, aromatic heterocyclic epoxy resin, super-tough resin and inorganic filler; the component B is prepared from aromatic amine, modified alicyclic amine, polymer particles and a thixotropic agent. The method comprises the following steps: adding the liquid epoxy resin and the aromatic heterocyclic epoxy resin into mixing equipment for mixing, and then adding the super-tough resin and the inorganic filler for mixing to obtain a component A; aromatic amine and modified alicyclic amine are mixed, then polymer particles and a thixotropic agent are added and mixed, and a component B is obtained. According to the adhesive disclosed by the invention, the bonding strength of different materials can be kept at a high level in a temperature range of-160 DEG C to 230 DEG C. The adhesive is used for bonding complex components in the aerospace field.

The application relates to the technical field of resin glue, in particular to a defect detection method of thermosetting resin glue, which comprises the following steps: converting original image intensity into normalized reflectivity, and generating a defect candidate response according to the normalized reflectivity; generating a severity index according to the defect candidate response, and generating a candidate fusion amount according to the severity index; generating a discriminant potential according to the candidate fusion amount; and generating a traceable label according to the discriminant potential. The application realizes accurate discovery of bubbles, cracks and uncured areas by selectively enhancing the tip of a fine crack and the boundary of a bubble based on a defect candidate response, realizes unified input for subsequent grading based on the discriminant potential, and can indicate the severity of defects and record statistical parameters and a calculation path corresponding to the label, so that subsequent review and cross-batch comparison are facilitated, and the transparency and traceability of detection results are realized.

The invention discloses a treatment method of a DLC film, which comprises the following steps: covering a to-be-protected area on the surface of an original DLC film by using a resin adhesive, the to-be-protected area being other areas on the surface of the original DLC film except the to-be-treated area; after the resin adhesive in the to-be-protected area is cured, the original DLC film is placed in a vacuum chamber; the original DLC film is heated to a preset temperature in the vacuum chamber, and meanwhile an external electric field is applied to the original DLC film; and after a preset time, converting the carbon element in the to-be-treated region into a graphite structure by utilizing the electron migration characteristic of the carbon element. By adopting the technical scheme provided by the invention, part of carbon elements in the DLC film can be converted into a graphite structure, and the method has the advantages of low energy consumption, low cost, short treatment time, simple process and the like.

The invention provides a viscous seed coating agent for desert aerial seeding and application thereof, and belongs to the technical field of ecological restoration. According to the coating agent, seeds serve as a core, and an inner-layer nutrition matrix and an outer-layer mucus layer are sequentially formed from inside to outside; the inner layer comprises a water-retaining agent, a binder and a microbial agent of nitrogen-fixing bacteria and phosphate solubilizing bacteria; the outer layer comprises an Arabic gum / natto resin adhesive, gibberellic acid and indolebutyric acid plant growth regulator and a bitter taste element / capsaicin animal repellent. Seeds are firmly attached to the sand surface through the outer-layer viscous substance, and sand blowing loss is reduced; the inner water retention layer and the microbial agent continuously supply water and fertilizer, so that the seed germination and seedling survival capability is improved; the outer layer repellent reduces animal pecking, and plasma activation further promotes germination. The coating agent can significantly improve the retention rate, the germination rate and the seedling survival rate of desert aerial seeding seeds, and is suitable for ecological restoration of xerophytes such as caragana microphylla.

The copper-clad plate for the high-speed line comprises an insulating layer and copper foils arranged on the surface of one side or two sides of the insulating layer, the insulating layer is formed by alternately stacking PI film prepregs and glass fiber cloth, and the outermost layer of the insulating layer is the PI film prepreg; the PI film prepreg is formed by impregnating a PI film in a resin glue solution. According to the copper-clad plate for the high-speed line, the components are relatively stable, the mass percent is relatively stable, fluctuation of dielectric constants is avoided, the requirement for thickness tolerance of plates is met, and the copper-clad plate has low dielectric constants and dielectric loss constants.

According to the preparation method of the modified organic silicon resin, hydrogen-containing silicon resin, acrylate with a long-chain alkane group and glycidyl monoene are subjected to an addition reaction, and the long-chain alkane group and an epoxy group are grafted to the hydrogen-containing silicon resin; the prepared modified organic silicon resin is applied to an epoxy resin adhesive system, and the characteristics of the two resins can complement each other and have a synergistic effect, so that the compatibility of the system is improved, the heat resistance is improved, the permeation and hydrophobic capacities of a flexible copper-clad plate and a copper foil to a base material are improved, the stripping force is improved, and the probability of etching by an etching solution is reduced; therefore, the resolution and the accuracy of the electronic circuit prepared by the photoetching process are improved.

The invention discloses an atomic oxygen-resistant epoxy resin adhesive and a preparation method thereof, and relates to the technical field of adhesives. The epoxy resin adhesive with atomic oxygen resistance is prepared by introducing autonomously synthesized epoxy-terminated T-type phenyl polysiloxane with fluorine atoms on a side chain as a modifier into an epoxy resin system. A modifier molecule takes a flexible silicon-oxygen-silicon bond as a main chain, and a side chain has rigidity of phenyl and strong stability of trifluoropropyl; epoxy groups at the tail end guarantee the dispersity of the modifier, and tight combination of the components is achieved in a covalent bond chemical bonding mode. A fluorocarbon bond in trifluoropropyl can effectively resist denudation attack of space atomic oxygen by virtue of an extremely high bond, so that the atomic oxygen resistance of the material is optimized; the adhesive has toughness improvement and space environment tolerance on the basis of keeping the inherent strength of epoxy resin, and is suitable for the field of spacecraft structure bonding with strict requirements on reliability and durability.

The invention discloses a high-temperature-resistant and electrolyte-corrosion-resistant battery cell insulating film. An adhesive tape sequentially comprises a release film layer, an adhesive layer, a first primer layer, a first base material layer, a second primer layer, a middle adhesive layer and a second base material layer from top to bottom. The adhesive layer is an acrylate resin adhesive layer, 0-15% of modified filler and reactive tackifying resin compounded by high and low softening points are added into the acrylate resin adhesive layer, the high softening point is specifically 120-150 DEG C, the adding proportion is 8-30%, the low softening point is specifically 70-100 DEG C, and the adding proportion is 5-25%. The high-temperature-resistant and electrolyte-corrosion-resistant battery cell insulating film provided by the invention has good tolerance to organic solvents, weak acids, saline water, electrolyte and the like while having a conventional lithium battery surface insulation protection effect, and an adhesive tape can also keep good adhesive property after high-temperature and low-temperature circulation; and meanwhile, the properties of insulation, pressure resistance, puncture resistance and the like of the insulating film can be improved.