1279 results about "Resin adhesive" patented technology

The invention relates to the technical field of activated carbon materials, and discloses an activated carbon material for adsorbing organic gas and a preparation method thereof.The preparation method includes the steps that activated carbon powder, epoxidized cardanol, graphene oxide modified quaternized chitosan, bentonite and nanometer titania are added into grinding equipment to be ground, and a primary material A is obtained; and then continuously adding a water-borne epoxy resin adhesive and water, stirring and drying to obtain the active carbon material for adsorbing the organic gas. Chitosan in the silane modified chitosan structurally contains amino, hydroxyl and other polar groups, so that organic gas can be adsorbed; the graphene also has a relatively good adsorption effect on organic gas, and meanwhile, the agglomeration effect of the graphene is reduced; and siloxane and quaternary ammonium salt groups contained in the adsorbent also have a relatively good adsorption effect on organic gases. Cardanol in epoxidized cardanol contains functional groups such as benzene rings, phenolic hydroxyl groups and long-chain alkanes, and the functional groups endow the cardanol with various reaction activities and can absorb organic gas.

The invention discloses a bio-based benzoxazine adhesive as well as a preparation method and application thereof. The molecular formula of the bio-based benzoxazine adhesive is shown in the specification. The biomass material isoliquiritigenin is used as the raw material of the benzoxazine resin adhesive, the synthesized benzoxazine resin structure contains phenolic hydroxyl groups protected by keto groups of adjacent chalcone, and the curing temperature can be reduced while the bonding strength of the benzoxazine resin and a matrix can be effectively improved; secondly, carbon-carbon double bonds of chalcone groups in the isoliquiritigenin can further improve the crosslinking density of benzoxazine through photodimerization and thermocuring crosslinking reaction, and the bonding strength is improved; and finally, the synthesis steps are simple, the yield is relatively high, the cured benzoxazine resin has very excellent adhesive property, thermal property and mechanical property, the product component is single, compounding is not needed, no formaldehyde is emitted, the synthesis process is easy to implement, and the benzoxazine resin is suitable for large-scale production. # imgabs0 #

The invention relates to the field of building materials, and particularly discloses a fireproof plate and a preparation method thereof. The fireproof board comprises a base material, reinforcing layers wrapping the two sides of the base material and fireproof coatings coating the outer surfaces of the two sides of the board, the base material comprises wood flour, silicate compounds and phenolic resin adhesives, the two sides of the base material are wrapped with glass fiber mesh cloth to serve as the reinforcing layers, and the surfaces of the base material are coated with the fireproof coatings; the fireproof coating is prepared from the following raw materials in parts by weight: 20 to 30 parts of hollow glass beads, 10 to 15 parts of ammonium polyphosphate, 5 to 10 parts of nano metal oxide, 10 to 15 parts of magnesia, 5 to 10 parts of tetraethoxysilane, 15 to 30 parts of epoxy resin and 30 to 40 parts of water. The composition disclosed by the invention has the advantages of fire prevention and high temperature resistance.

The invention discloses a tannic acid modified lignin phenolic resin antibacterial adhesive and a preparation method thereof, and belongs to the technical field of bio-based adhesives. Alkali lignin is used as a raw material to prepare lignin nano-particles, then ferric trichloride and tannic acid are used for modifying the lignin nano-particles, and the tannic acid modified lignin phenolic resin antibacterial adhesive is prepared. Gallotannic acid / iron complexed lignin nano-particles are obtained, the gallotannic acid / iron complexed lignin nano-particles, phenol, formaldehyde and alkali liquor are mixed, and the lignin phenolic resin adhesive is prepared through an addition condensation reaction. The lignin phenolic resin adhesive prepared by the invention can realize high-proportion phenol substitution, has a good photo-thermal antibacterial effect, and provides a new way for development of an antibacterial environment-friendly adhesive.

The invention discloses a sacrificial layer prepreg for a composite material and a preparation method of the sacrificial layer prepreg, and belongs to the field of composite material forming. The preparation method comprises the following steps: mixing an inorganic filler with resin, and performing film forming treatment to obtain a resin adhesive film; coating the resin adhesive film on the surface of a fiber to obtain a sacrificial layer prepreg; after the sacrificial layer prepreg is prepared, the sacrificial layer prepreg, the wave-absorbing prepreg and the structural prepreg are sequentially laid on the surface of a tool according to the tool thickening requirement, co-curing treatment and demolding treatment are carried out according to the curing process of the structural prepreg, and the composite material with the surface coated with the sacrificial layer prepreg is prepared. According to the sacrificial layer prepreg for the composite material, the aramid fiber with excellent flexibility is adopted as a carrier, direct manual stripping can be achieved, the actual laying layer number can be adjusted according to the tool thickness requirement, and compared with a traditional numerical control cutting method, the stripping efficiency is higher, and thickness control is more accurate.

The invention provides an epoxy resin binder and a preparation method and application thereof, and relates to the technical field of steel bridge deck pavement, the epoxy resin binder comprises the following components: a main agent and a curing agent; the main agent comprises the following components: bisphenol A epoxy resin, a reactive diluent, a non-reactive diluent, a nano rubber toughening agent, a liquid rubber toughening agent and an optional first antioxidant; the curing agent comprises the following components: an amine curing agent, a phenol curing agent, a coupling agent and an optional second antioxidant. The epoxy resin adhesive is a high-temperature anti-shearing type epoxy resin adhesive, has good high-temperature stability when being used for steel bridge deck pavement, still keeps relatively high tensile strength and shear strength with a steel plate, a wearing layer and a protective layer at high temperature, and balances the relationship with indexes such as tensile strength, ductility and construction holding time; and the possibility of shear failure of the steel bridge deck pavement at high temperature can be reduced.

The invention discloses an amido amine underwater curing agent for epoxy resin and a preparation method of the amido amine underwater curing agent, and belongs to the field of epoxy resin curing agents. The invention discloses a high-temperature-resistant phenolic resin, which is prepared from the following components in parts by mass: 20 to 50 parts of amine, 20 to 50 parts of single acid, 10 to 40 parts of phenolic compound and 5 to 20 parts of phenolic resin, and the amine is at least one of aliphatic amine, alicyclic amine and aromatic amine. The method comprises the following steps: reacting amine with single acid at high temperature to generate amido amine, and further dehydrating at the temperature to synthesize imidazoline. And the content of imidazoline is controlled through the water yield. And cooling to 120-140 DEG C, and adding the phenolic compound to further react with the phenolic resin. According to the invention, the stability of the imidazoline content is controlled by controlling the water yield of the reaction, and the imidazoline content is the key for solving the underwater bonding performance of the epoxy resin adhesive. The low-temperature curing characteristic and flexibility of the curing agent are improved by introducing different amines, and the curing agent can be better applied to protection, reinforcement and waterproofing of underwater buildings, so that the service life of underwater facilities is prolonged.

The invention discloses modified epoxidized soybean oil, epoxy resin glue and a preparation method thereof. The modified epoxidized soybean oil is obtained through a reaction of a cyclodextrin-epoxidized soybean oil inclusion compound and citric acid, and the cyclodextrin-epoxidized soybean oil inclusion compound is obtained through a reaction of cyclodextrin and epoxidized soybean oil. The epoxy resin adhesive is prepared from bisphenol A epoxy resin, modified epoxidized soybean oil, an anhydride curing agent and a curing accelerator. The modified epoxidized soybean oil is added into the epoxy resin adhesive, so that the epoxy resin adhesive has better tensile strength, elongation at break, impact strength and low-temperature impact strength, and the toughening effect is remarkable.

The invention relates to the field of copper-clad plates, and discloses a low-dielectric-constant high-performance copper-clad plate and a preparation method thereof.The preparation method comprises the specific steps that epoxy resin, phenolic resin, polyphenyl ether modified resin, modified nano silicon dioxide and the like are taken and mixed to obtain a resin glue solution; impregnating glass fabric in the resin glue solution to obtain a prepreg; laminating prepregs, and covering copper foil for hot pressing; the polyphenyl ether modified resin comprises epoxy resin, diallyl cyanate and fluorine-containing polyphenyl ether resin prepared by reaction of polyphenyl ether, bisphenol AF and benzoyl peroxide; the modified nano silicon dioxide is prepared by reacting allyl glycidyl ether, vinyltriethoxysilane and phenyltris (dimethylsiloxane) silane, then grafting with a phosphorus-containing intermediate to prepare a modified additive, and grafting with nano silicon dioxide, and the phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. The copper-clad plate with high flame retardance, high peel strength, heat resistance and low dielectric constant is prepared.

The invention discloses a high-temperature-resistant tough epoxy resin adhesive and a preparation method thereof, and relates to the technical field of epoxy resin, the high-temperature-resistant tough epoxy resin adhesive comprises the following components by mass: 30-60 parts of epoxy resin, 15-40 parts of a modified curing agent, 5-20 parts of a flexibilizer, 8-35 parts of an inorganic filler, 1-5 parts of a coupling agent, and 0.5-3 parts of an antioxidant; the epoxy resin is formed by compounding bisphenol A epoxy resin and novolac epoxy resin according to the mass ratio of (1-3): 1; the modified curing agent is prepared by modifying an imidazole curing agent with a silane coupling agent. The problem that high temperature resistance and toughness of an epoxy resin adhesive are difficult to consider at the same time can be solved.

The invention discloses a photocatalytic purification diatomite functional decorative board and a preparation method thereof, and relates to the technical field of diatomite decorative boards. The technical solution is to provide a diatomite substrate, and polish the surface with sandpaper; uniformly coat a layer of heat-sensitive epoxy resin adhesive on the diatomite substrate; lay a carbon fiber mesh on the uncured heat-sensitive epoxy resin layer, and then spread TiO2 / paraffin / alumina composite particles, and compact them with a roller, and accelerate curing with an oven; and coat the board with UV curing resin as a weather-resistant protective layer, and use a UV lamp to cure. The invention significantly improves the distribution and fixation of the composite particles of the diatomite board by applying the carbon fiber mesh and the heat-sensitive epoxy resin adhesive, and enhances the mechanical strength and photocatalytic efficiency. The carbon fiber mesh and alumina in the structure increase the wear resistance, optimize the TiO2 distribution, and improve the air purification efficiency and thermal stability.

The invention provides a thermosetting resin composition, a resin adhesive film and application thereof. The thermosetting resin composition comprises the following components in parts by mass: 5-95 parts of benzocyclobutene resin, 5-95 parts of a component containing C = C unsaturated bonds, 5-300 parts of a modified filler and 0.1-10 parts of an initiator, the modified filler is an inorganic filler subjected to surface treatment by a coupling agent containing unsaturated groups, and the unsaturated groups are selected from any one or a combination of at least two of styryl, acryloyloxy, methacryloyloxy and polybutadiene groups. A resin adhesive film prepared from the thermosetting resin composition is excellent in dielectric property, low in dielectric loss tangent Df, good in dielectric stability, small in Df (10GHz) variation amplitude after HAST, high in chemical copper binding force and capable of fully meeting the performance requirement for preparing a high-frequency and high-speed printed circuit board through a semi-addition method or an addition method.

The invention relates to a low-temperature-resistant epoxy resin adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials. The modified epoxy resin adhesive comprises the following components in parts by weight: 90-120 parts of epoxy resin, 8-24 parts of a curing agent, 1-3 parts of a diluent, 0.5-5 parts of a curing accelerator, 4-18 parts of graphite, 1-4 parts of a hyperbranched polymerization flexibilizer and 10-30 parts of conductive filler, polyimide in the hyperbranched polymerization flexibilizer is difficult to crystallize, has no interchain winding, and cooperates with a flexible Si-O-Si chain segment with high bond energy and large bond angle to enhance low-temperature tensile strength and toughness, and chloroprene rubber effectively improves impact resistance and bending resistance; according to the low-temperature-resistant epoxy resin adhesive disclosed by the invention, a conductive network is constructed by indium tin oxide, good conductivity and chemical corrosion resistance are given to a matrix, a polyaniline layer is used for modifying a structural body and enhancing interface adhesion, and the prepared low-temperature-resistant epoxy resin adhesive not only has good low-temperature-resistant toughening and conductive effects, but also has excellent corrosion-resistant and flame-retardant effects.

The invention discloses an epoxy resin tack coat oil material suitable for a steel bridge deck, which constructs a multi-scale toughening composite system through the synergistic effect of an epoxy-terminated polyurethane elastomer toughening agent (molecular-scale chemical grafting) and a nano-scale elastomer filler (nano dispersion toughening), and solves the problem of rigidity-flexibility imbalance of the traditional epoxy tack coat oil. The material has the advantages of fast curing (surface drying at 25 DEG C is less than or equal to 4 hours), high toughness (the elongation at break is greater than or equal to 250%) and excellent weather resistance (the performance retention rate is greater than or equal to 85% after ultraviolet aging for 500 hours), and is suitable for interlayer interface bonding of steel bridge deck pit slot and crack repair. According to the preparation method, uniform dispersion and interface chemical bonding of the nanofiller are achieved through a segmented stirring process, the comprehensive performance of the material is remarkably improved, and the important engineering application value is achieved.

The invention relates to a high-impact-resistance light-weight high-strength composite board and a preparation method thereof.The preparation method comprises the following steps that S1, a first glass fiber cloth is arranged between two thermoplastic polyurethane films, hot pressing is conducted, and a glass fiber cloth reinforced polyurethane film is obtained; placing the polyamide-polyether block copolymer film between two adjacent layers of glass fabric reinforced polyurethane films, and performing hot pressing to obtain a high-toughness surface layer; s2, adding the modified hollow glass microspheres, bisphenol A epoxy resin, polyurethane modified epoxy resin, dicyandiamide and an accelerant into a solvent to obtain a resin solution; immersing second glass fiber cloth into the resin glue solution, taking out the second glass fiber cloth after the second glass fiber cloth is completely immersed, and baking the second glass fiber cloth to obtain an epoxy glass fiber prepreg; s3, stacking the plurality of epoxy glass fiber prepregs to obtain a low-density core layer; and S4, stacking the low-density core layer between two adjacent high-toughness surface layers, and performing hot pressing to obtain a target product. The high-strength and high-impact-resistance building material has the advantages of light weight, high strength and high impact resistance.

To provide other technique for suppressing corrosion by plasma of a joint part joining a plate-like part and a base part, in a holding device.SOLUTION: A holding device includes a plate-like part formed into a plate shape, a base part which supports the plate-like part and is formed into a plate shape, a joint part which is arranged between the plate-like part and the base part and is composed of a resin adhesive bonding the plate-like part and the base part, and a protective member coating at least a part of the outer peripheral surface of the joint part, wherein the protective member contains a matrix resin which has a skeleton of perfluoropolyether and contains a matrix resin containing a resin component the same as the resin adhesive.SELECTED DRAWING: Figure 1

The invention relates to the field of C09J163 / 00, in particular to a fast-curing epoxy resin adhesive and a preparation method and application thereof. The fast-curing epoxy resin adhesive is composed of a component A and a component B, the component A at least comprises the following preparation raw materials: epoxy resin, a filler A, a diluent, a flexibilizer and a coupling agent A; the component B at least comprises the following preparation raw materials: a curing agent, a filler B, an accelerant and a coupling agent B; the curing agent is a combination of a polythiol curing agent and at least one of a phenolic aldehyde amine curing agent and a polyamide curing agent, by optimizing a formula system, the operable time (pot life), the curing speed and the hardness after curing of the product are effectively balanced, the product is rapidly cured within the proper operable time, the hardness after curing can be guaranteed, and the service life of the product is prolonged. And the actual application requirements of pipeline cold welding emergency repair are met.

The invention relates to alkali-soluble light-cured resin and a preparation method thereof, a light-cured resin composition, a photosensitive dry film and a semiconductor device. The structural formula of the alkali-soluble light-cured resin is shown as a formula (I) or a formula (II), wherein in the formula (I), R1 is selected from one of a single bond, an oxygen atom, a sulfonyl group and an organic group with 1-30 carbon atoms; in the formula (I) and the formula (II), n is a natural number greater than or equal to 0; r2 is selected from organic groups with 1-50 carbon atoms; r3 is selected from an aromatic organic group or an aliphatic organic group; r4 is selected from organic groups containing unsaturated carbon-carbon double bonds; and R5 is selected from carboxyl-containing organic groups. A molecular chain of the alkali-soluble light-cured resin contains a photosensitive group, an imide structure and an alkali-soluble group, on one hand, the thermal mechanical property of the alkali-soluble light-cured resin can be enhanced, and on the other hand, the alkali-soluble light-cured resin can form a uniform and stable resin glue solution in a solvent, so that the comprehensive performance of the alkali-soluble light-cured resin is improved.

The invention discloses a low-temperature fast-curing two-component resin adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials. The resin adhesive is formed by mixing a component A and a component B, the component A comprises epoxy-acrylate hybrid resin, a reactive diluent, a nano reinforcing filler and the like, and the component B comprises a modified aliphatic amine curing agent, a microcapsule low-temperature efficient accelerant, a Mannich base curing agent and the like. Through the synergistic effect of a quaternary curing system and in combination with the rigid-flexible balance design of the hybrid resin, rapid curing at low temperature is achieved, and high strength, high toughness and good storage stability are achieved. The resin adhesive is suitable for the fields of bonding of automobile parts, packaging of electronic elements, repairing of wind power blades, sealing of building structures and the like, and particularly solves the problems that a traditional resin adhesive is slow in low-temperature curing and insufficient in performance.

The invention relates to the field of phenolic resin adhesives, and particularly discloses a preparation method of a phenolic resin adhesive for a bamboo oriented strand board, which comprises the following steps: (1) phenol activation: adding phenol and a basic catalyst aqueous solution into a reaction kettle, and activating to form an intermediate state of phenate negative ions; (2) addition stage: adding a high-concentration formaldehyde reactant into the reaction kettle, and carrying out heat preservation reaction to generate hydroxymethyl phenol; (3) heating and replenishing: heating to 80 + / -2 DEG C, keeping the temperature, replenishing the formaldehyde aqueous solution into the reaction kettle, and keeping the temperature for 20-25 minutes; (4) polycondensation stage: adding a basic catalyst aqueous solution, heating to 90 + / -2 DEG C, and carrying out heat preservation reaction; and (5) terminating the reaction: after the heat preservation reaction, detecting the viscosity, cooling, and discharging to obtain the adhesive. The phenolic resin with the solid content of 60% or above can be prepared, the adhesive has excellent bonding performance, and the prepared shaving board is excellent in mechanical strength.

The invention discloses a polyurethane modified epoxy resin adhesive as well as a preparation method and application thereof, and the polyurethane modified epoxy resin adhesive is prepared from the following components in parts by mass: 7-10 parts of E51 type bisphenol A diglycidyl ether, 3.5 parts of a phenolic aldehyde amine T31 curing agent and 1-3 parts of synthetic polyurethane, the synthetic polyurethane is prepared from polyether triol, polyether amine, isophorone diisocyanate and glycerol carbonate, and a blending system of the synthetic polyurethane and bisphenol A diglycidyl ether is adopted to be subjected to covalent crosslinking with phenolic aldehyde amine T31, so that the adhesive has high toughness and strength guarantee; the synthetic polyurethane prepared by the method is obtained through simple, green and efficient solvent-free synthesis, and the synthesized product has certain fluidity at room temperature, so that the subsequent stirring preparation process of an adhesive is facilitated. And a solvent-free synthesis method is adopted, so that the use of a toxic organic solvent in the traditional polyurethane synthesis process is avoided, and the synthesis process is greener.

The invention discloses a toughening agent, a toughened epoxy resin adhesive and a preparation method and application thereof. The toughening agent is obtained by carrying out esterification reaction on components including a phenolic compound containing a polyphenol skeleton and an anhydride compound containing a long-chain alkyl structure. The raw materials used by the toughening agent are bio-based molecules and have excellent renewability, the toughening agent is high in toughening efficiency, the impact strength of the epoxy resin adhesive can be effectively improved under the condition of low addition amount, and meanwhile, the bonding strength and the hydrothermal durability of the epoxy resin adhesive can be improved.

The invention relates to the technical field of textiles, and discloses functional aramid fiber UD cloth and a preparation method thereof.The functional aramid fiber UD cloth is formed by taking modified aramid fiber as a base material, gluing the modified aramid fiber with epoxy resin glue, overlapping the modified aramid fiber with a low-density polyethylene film and then curing the modified aramid fiber and the low-density polyethylene film, and the modified aramid fiber is aramid fiber with the surface modified with a macromolecular modifier. The macromolecular modifier structure contains a large number of ether bonds and hydroxyl groups, the ether bonds can generate hydrogen-bond interaction with epoxy resin molecular chains, and the hydroxyl groups can participate in the curing process of epoxy resin glue in the subsequent hot pressing process; the branched structure of the macromolecular modifier can form a hydrogen bond connection site at the interface of the aramid fiber and the glue, and a hydrogen bond connective network is formed, so that the affinity of the aramid fiber and the epoxy resin glue is greatly improved, and the phenomena of layer warping, swelling and the like of the subsequently prepared UD cloth can be avoided.

The invention discloses a high-temperature-resistant and weather-resistant epoxy resin adhesive and a preparation method thereof, and belongs to the field of epoxy resin adhesives, the adhesive can keep stable bonding strength for a long time at high temperature through the synergistic effect of hydrogenated bisphenol F type epoxy resin, silicon-containing phenyl glycidyl ether epoxy resin and a dicyandiamide-imidazole composite curing agent, and the adhesive has high temperature resistance and weather resistance. According to the present invention, the graphene aerogel is added to the silicon-containing phenyl glycidyl ether epoxy resin to meet the high temperature environment use requirement, and the silica bond in the silicon-containing phenyl glycidyl ether epoxy resin and the aging resistance of the graphene aerogel enable the adhesive to have characteristics of excellent ultraviolet aging resistance, excellent thermal cycling resistance and excellent moisture resistance, solve the performance defects of the traditional product, and be suitable for the application in the high temperature and severe environment, the method has an important practical value.

The invention relates to the technical field of adhesives, and discloses a preparation method and application of a modified urea-formaldehyde resin adhesive. The invention adopts an "alkali-acid-alkali" synthesis process, and adds a cyclic heterocyclic polyphenol flame retardant in the early stage of the reaction of formaldehyde and urea to participate in the synthesis reaction of synthesizing urea-formaldehyde resin. The phenolic hydroxyl group in the flame retardant structure can react with formaldehyde, thereby reducing the free formaldehyde content in the molecule; the structure contains phosphorus and nitrogen synergistic flame retardant elements, which can promote the endothermic dehydration carbonization reaction of hydroxyl-containing compounds and play a positive role in inhibiting the combustion-supporting factors of charcoal materials; the epoxy group of epoxidized lignin can undergo a cross-linking reaction with urea-formaldehyde resin, thereby promoting the reaction of lignin and formaldehyde and reducing the formaldehyde release of plywood; the urea-formaldehyde resin adhesive has low free formaldehyde content and short curing time, and the plywood prepared by using the adhesive has low formaldehyde release, good flame retardant performance and high bonding strength.

The invention discloses a method for improving cloth lines after hot pressing of an epoxy glass fiber composite material, and the method comprises the steps of resin glue solution blending, glass fiber cloth presoaking, gradient pre-drying, hot pressing molding, cooling demolding and the like. The volume expansion rate is accurately matched with the resin curing shrinkage rate, interface stress caused by shrinkage difference is directly counteracted, meanwhile, gradient pre-drying and staged hot pressing processes are combined, and the resin fluidity and interface bonding strength are optimized. The resin conversion rate is controlled in two stages through gradient pre-drying, and flow blocking caused by premature curing is avoided; and secondly, through the chemical compensation mechanism of the expansion monomer, the mechanical property of the material is maintained while the cloth lines are eliminated.

The invention discloses a high-temperature-resistant epoxy resin adhesive as well as a preparation method and application thereof, the high-temperature-resistant epoxy resin adhesive comprises a component A and a component B. The component A comprises the following raw materials in parts by weight: 50-60 parts of epoxy resin; 5 to 15 parts of a toughening agent; 0.1 to 0.3 part of a dispersant; 0.1 to 0.3 part of a coupling agent; 0.05 to 0.15 part of a defoaming agent; 0.5 to 2 parts of a thixotropic agent; 20 to 50 parts of filler; the epoxy resin is composed of trifunctional epoxy resin, tetrafunctional epoxy resin and organosilicon modified epoxy resin; the component B comprises the following raw materials in parts by weight: 18-30 parts of a curing agent; 0.1 to 0.3 part of a dispersant; 0.1 to 0.3 part of a coupling agent; 0.05 to 0.2 part of a defoaming agent; 0.5 to 2 parts of a thixotropic agent; and 70-80 parts of a filler. The high-temperature-resistant epoxy resin adhesive can meet the long-term 250 DEG C high-temperature-resistant requirement, and can be applied as a high-temperature-resistant electronic component bonding material.

The invention relates to an epoxy adhesive and a preparation method thereof, in particular to a low-hygroscopicity medium-temperature curing single-component epoxy adhesive suitable for bonding special-shaped structure composite materials and a preparation method of the low-hygroscopicity medium-temperature curing single-component epoxy adhesive. The invention aims to solve the problems of poor flowability resistance and wet resistance of the medium-temperature curing dicyandiamide system single-component epoxy adhesive for bonding special-shaped composite structures. The invention relates to a low-hygroscopicity medium-temperature curing single-component epoxy adhesive suitable for bonding special-shaped structure composite materials. The epoxy resin is prepared from the following components in parts by mass: 70 to 90 parts of bisphenol A epoxy resin, 10 to 30 parts of multifunctional epoxy resin, 10 to 30 parts of core-shell toughened epoxy resin, 10 to 20 parts of polysulfide rubber modified resin, 8 to 12 parts of dicyandiamide, 1 to 2 parts of 2-ethyl-4-methylimidazole and 7 to 9 parts of fumed silica. The polysulfide rubber modified resin disclosed by the invention has a good toughening effect in the epoxy resin adhesive, the shear strength can be improved, and the moisture resistance can be remarkably improved.

The utility model provides a DC-link film capacitor with high temperature resistance and high ripple current in the new energy field and a method, the DC-link film capacitor comprises a flame-retardant plastic shell, an insulating epoxy resin adhesive layer, a capacitor roll core and a metal connecting layer arranged at the corresponding position of the winding side wall surface of the capacitor roll core, and two tinned outgoing lines are connected to the corresponding positions of the two side wall surfaces of the metal connecting layer. By effectively improving the heat conductivity coefficient and the heat dissipation capability of the capacitor, heat in the inner core of the capacitor can be quickly and effectively dissipated, heat balance in a capacitor product is achieved, the capacitor has high temperature resistance, the charging time can be greatly shortened, and the service life of the capacitor is prolonged. The high-temperature-resistant high-ripple-current capacity requirement of capacitors in the new energy field such as the new energy field is met, the preparation process is simple, and the cost is low.

The invention provides a special-shaped magnetic core and a manufacturing method thereof.The special-shaped magnetic core comprises a first magnetic core part, a second magnetic core part and a magnetic adhesive layer, the magnetic adhesive layer is bonded between the first magnetic core part and the second magnetic core part, and the magnetic adhesive layer comprises a plurality of magnetic powder particles, a resin adhesive base material and at least one spherical particle; the maximum size of any magnetic powder particle is smaller than the sphere diameter of one sphere particle, and the first bonding face of the first magnetic core part and the second bonding face of the second magnetic core part abut against the two radial opposite ends of one sphere particle respectively to form a bonding combination gap between the first magnetic core part and the second magnetic core part. The sphere diameter of the sphere particles ranges from 1 micrometer to 20 micrometers. The special-shaped magnetic core has the advantages of being small in size, good in consistency, good in magnetic property and low in production cost, so that the product quality is improved, and the requirement for product miniaturization is met.