707 results about "Resin adhesive" patented technology

The invention discloses a high-temperature-resistant tough epoxy resin adhesive and a preparation method thereof, and relates to the technical field of epoxy resin, the high-temperature-resistant tough epoxy resin adhesive comprises the following components by mass: 30-60 parts of epoxy resin, 15-40 parts of a modified curing agent, 5-20 parts of a flexibilizer, 8-35 parts of an inorganic filler, 1-5 parts of a coupling agent, and 0.5-3 parts of an antioxidant; the epoxy resin is formed by compounding bisphenol A epoxy resin and novolac epoxy resin according to the mass ratio of (1-3): 1; the modified curing agent is prepared by modifying an imidazole curing agent with a silane coupling agent. The problem that high temperature resistance and toughness of an epoxy resin adhesive are difficult to consider at the same time can be solved.

The invention discloses a low-temperature fast-curing two-component resin adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials. The resin adhesive is formed by mixing a component A and a component B, the component A comprises epoxy-acrylate hybrid resin, a reactive diluent, a nano reinforcing filler and the like, and the component B comprises a modified aliphatic amine curing agent, a microcapsule low-temperature efficient accelerant, a Mannich base curing agent and the like. Through the synergistic effect of a quaternary curing system and in combination with the rigid-flexible balance design of the hybrid resin, rapid curing at low temperature is achieved, and high strength, high toughness and good storage stability are achieved. The resin adhesive is suitable for the fields of bonding of automobile parts, packaging of electronic elements, repairing of wind power blades, sealing of building structures and the like, and particularly solves the problems that a traditional resin adhesive is slow in low-temperature curing and insufficient in performance.

The invention discloses a polyurethane modified epoxy resin adhesive as well as a preparation method and application thereof, and the polyurethane modified epoxy resin adhesive is prepared from the following components in parts by mass: 7-10 parts of E51 type bisphenol A diglycidyl ether, 3.5 parts of a phenolic aldehyde amine T31 curing agent and 1-3 parts of synthetic polyurethane, the synthetic polyurethane is prepared from polyether triol, polyether amine, isophorone diisocyanate and glycerol carbonate, and a blending system of the synthetic polyurethane and bisphenol A diglycidyl ether is adopted to be subjected to covalent crosslinking with phenolic aldehyde amine T31, so that the adhesive has high toughness and strength guarantee; the synthetic polyurethane prepared by the method is obtained through simple, green and efficient solvent-free synthesis, and the synthesized product has certain fluidity at room temperature, so that the subsequent stirring preparation process of an adhesive is facilitated. And a solvent-free synthesis method is adopted, so that the use of a toxic organic solvent in the traditional polyurethane synthesis process is avoided, and the synthesis process is greener.

The invention discloses a method for improving cloth lines after hot pressing of an epoxy glass fiber composite material, and the method comprises the steps of resin glue solution blending, glass fiber cloth presoaking, gradient pre-drying, hot pressing molding, cooling demolding and the like. The volume expansion rate is accurately matched with the resin curing shrinkage rate, interface stress caused by shrinkage difference is directly counteracted, meanwhile, gradient pre-drying and staged hot pressing processes are combined, and the resin fluidity and interface bonding strength are optimized. The resin conversion rate is controlled in two stages through gradient pre-drying, and flow blocking caused by premature curing is avoided; and secondly, through the chemical compensation mechanism of the expansion monomer, the mechanical property of the material is maintained while the cloth lines are eliminated.

The invention relates to the technical field of adhesives, in particular to a high-bonding-strength bio-based epoxy adhesive and a preparation method thereof. Comprising 20-50 parts of bio-based epoxy resin, 8-20 parts of a bio-based epoxy flexibilizer, 5-10 parts of an epoxy diluent, 25-60 parts of an inorganic filler, 2-8 parts of a curing agent and 0.2-1 part of a curing accelerator, the epoxy resin adhesive with excellent performance is developed by using a bio-based material as a raw material, has high adhesion to metal aluminum and the like, has excellent toughness, can be widely applied to automobiles, aviation, industry, electronics and other directions requiring shock absorption, impact resistance and structural adhesion, has an excellent economic prospect, and is worthy of popularization and application. Meanwhile, the method has important significance in environmental protection.

The invention discloses a mould pressing carbon ceramic brake disc and a preparation method and application thereof.The preparation method comprises the steps that continuous carbon fibers are chopped to obtain chopped carbon fibers, the chopped carbon fibers are mixed, resin glue liquid is sprayed while mixing is conducted, glue-coated carbon fibers are obtained, silicon-containing particles and auxiliaries are mixed to obtain mixed powder A, then the mixed powder A and resin powder are mixed to obtain mixed powder B, and the mixed powder B is added to the mould pressing carbon ceramic brake disc; and mixing the mixed powder B with the glue-coated carbon fibers to obtain a mixture, carrying out compression molding on the mixture to obtain a preform, carbonizing the preform to obtain a porous body, and siliconizing the porous body to obtain the composite material. According to the preparation method disclosed by the invention, the surface of the carbon fiber is treated by spraying a resin glue solution for the first time, a uniform protective layer is formed on the surface layer of the carbon fiber yarn, and an auxiliary agent is added into a mixture, so that a uniform capillary tube is formed when a preform is carbonized, the infiltration uniformity is promoted, and the uniformity of components, high density and low aperture ratio are ensured; therefore, the prepared molded carbon-ceramic brake disc is stable in performance, high in strength and resistant to high temperature.

An epoxy resin adhesive is used for bonding a membrane made of soft PVC to a further substrate, wherein the curing-agent component of the adhesive includes at least one amine A1 having at least one dimethylamino group and at least one amine hydrogen, and at least one further amine A2 having at least three amine hydrogens, and the curing-agent component includes, based on the total of all the liquid or dissolved constituents contained in the curing-agent component, an amine A1 content of 10 to 45 wt. %. The use allows bonding of untreated membranes made of soft PVC to form a stable, water-resistant adhesive bond and is particularly suitable for sealing tunnels, foundations and roofs.

The invention relates to the technical field of busbars, and discloses a multi-layer composite fire-resistant shielding busbar and a preparation method thereof, and the multi-layer composite fire-resistant shielding busbar comprises a conductor layer, a fire-resistant layer, a shielding layer and a sheath layer which are sequentially coated from inside to outside; wherein the conductor layer is made of copper or aluminum; the fireproof layer wraps the conductor layer and is formed by wrapping a double-layer PI three-in-one synthetic mica tape. According to the multi-layer composite fire-resistant shielding busbar and the preparation method thereof, the double-layer PI three-in-one synthetic mica tape is used for wrapping, a stable fire-resistant insulation structure is formed outside the conductor layer in a reverse wrapping mode that the first layer is clockwise and the second layer is anticlockwise, and the mica tape is formed by combining phlogopite paper and an organic silicon resin adhesive capable of resisting the temperature of 300 DEG C; the structural integrity can be maintained under the fire high-temperature condition, and electrical short circuit caused by thermal failure is effectively prevented; and meanwhile, the mica tape adhesive layer permeates into the micro-groove structure arranged on the surface of the conductor in the thermocuring process, so that the mechanical occlusion strength is further enhanced.

The invention relates to the use of an epoxy resin adhesive for bonding substrates at least partially coated with a cured epoxy resin adhesive, characterized in that the adhesive comprises a resin component comprising at least one epoxy resin and a curing agent component comprising at least one epoxy resin, the curing agent component comprises at least one amine having at least one aliphatic amino group wherein the amine is selected from the group consisting of polyetheramines and linear or branched but non-cyclic aliphatic polyamines wherein the amine comprises at least 50% by weight of all amine curing agents having at least one amine hydrogen contained in the curing agent component, the curing agent component is based on all amine curing agents in the curing agent component. The use according to the invention allows the adhesion of substrates at least partially coated with a cured epoxy adhesive, forming a stable weather-resistant adhesive connection, and is particularly suitable for repairing rotor blades in wind turbines.

The utility model discloses a steel bridge deck pavement structure, which belongs to the technical field of road pavement, and comprises a steel plate, an anti-corrosion layer, a waterproof bonding layer, a pavement lower layer, an interlayer bonding layer and a pavement upper layer which are sequentially paved from bottom to top, the anti-corrosion layer is epoxy zinc-rich primer, the waterproof bonding layer is epoxy resin adhesive, and the interlayer bonding layer is epoxy resin adhesive. The pavement lower layer is made of epoxy asphalt concrete, the interlayer bonding layer comprises an epoxy asphalt adhesive, a glass fiber grating and broken stone, the pavement upper layer is made of modified asphalt concrete SMA, and the problems of high-temperature pushing, surface layer cracking and the like can be effectively solved.

The present invention provides an epoxy resin adhesive and a preparation method thereof, and relates to the technical field of building structure adhesives, the epoxy resin adhesive is prepared from a component A and a component B, the component A comprises the following raw materials by weight: 90-110 parts of epoxy resin, 15-25 parts of a toughening agent, 40-50 parts of a filler I and 15-20 parts of benzyl alcohol, and the toughening agent comprises polycarbonate, polyamide and polypropylene glycol diglycidyl ether; the component B is prepared from the following raw materials in parts by weight: 40 to 60 parts of curing agent, 10 to 20 parts of filler II, 1.5 to 3 parts of polyvinylpyrrolidone and 5 to 10 parts of benzyl alcohol. The preparation method comprises the following steps: S1, preparing A glue; s2, preparing B glue; and S3, mixing glue. The toughening agent is added in the component A, polycarbonate, polyamide and polypropylene glycol diglycidyl ether are selected as the toughening agent, the three raw materials are compounded and cooperated, the processability and flowing property of the epoxy resin adhesive can be effectively improved, and the problems that a cured finished product is high in brittleness and poor in impact resistance are solved.

The invention relates to a high-heat-resistance and high-insulation two-component epoxy resin adhesive and application thereof, and belongs to the technical field of epoxy resin. The technical problem to be solved by the invention is to provide the high-heat-resistance and high-insulation two-component epoxy resin adhesive. The adhesive comprises a component A and a component B. The component A comprises bisphenol A epoxy resin, novolac epoxy resin, silicon carbide whiskers, potassium titanate fibers, boron phenolic resin and modified nano boron nitride. The component B is prepared from methylhexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, 2-phenylimidazole, modified aluminum oxide, polyimide micro powder and modified wollastonite. Through synergism of multiple materials, balance of heat conduction, insulation, mechanical strength and thermal stability of the adhesive is realized. Under high-frequency pulse voltage, the adhesive is long in electrical aging life. A gradient curing process is adopted for curing, complete reaction in each stage is guaranteed, and internal stress is reduced. The process fault tolerance is high, the environment compatibility is high, the cost is low, and the curing time is short.

The invention relates to a light-cured dental resin adhesive containing a silane coupling agent modified monomer as well as preparation and application of the light-cured dental resin adhesive. The dental resin adhesive comprises a resin matrix, an organic polymer and a photoinitiator, wherein the resin matrix consists of methacrylate resin grafted and modified by a silane coupling agent and unmodified methacrylate resin. According to the method, the isocyano group of the silane coupling agent is selected to react with the hydroxyl group on the resin monomer to generate the silane modified grafted resin monomer, and the method is simple, low in equipment requirement and suitable for large-scale production; the obtained dental resin adhesive can be internally covalently cross-linked to enhance the self mechanical property, can also be chemically bonded with a bonding substrate by utilizing a grafted silane coupling agent to improve the interface bonding strength, is especially suitable for being used as an enamel bonding material, and can remarkably improve the service life and the curative effect of a bonded restoration.

The invention relates to the technical field of adhesives, and discloses a preparation method of an epoxy resin adhesive, which comprises the following steps: reacting p-aminophenol with diphenyl dichlorosilane under the catalysis of triethanolamine to obtain di (p-aminophenoxy) diphenyl silane; the preparation method comprises the following steps: carrying out Mannich reaction on amino in di (p-aminophenoxy) diphenyl silane, amino in polyether amine, formaldehyde and phenol to obtain the silane-containing polyether amine type benzoxazine intermediate. And finally, uniformly mixing the silane-containing polyether amine type benzoxazine intermediate and epoxy resin, and curing to obtain the epoxy resin adhesive. The prepared silane-containing polyether amine benzoxazine intermediate contains a silane structure and a benzoxazine structure, both the silane structure and the benzoxazine structure have excellent heat resistance, and the epoxy resin adhesive prepared by adding the silane-containing polyether amine benzoxazine intermediate into epoxy resin has excellent heat resistance.

The invention relates to a shield tunnel assembly type UHPC (Ultra High Performance Concrete) reinforcing structure and method.The shield tunnel assembly type UHPC reinforcing structure is arranged on a segment lining cutting of a tunnel and comprises prefabricated UHPC plates, joints, epoxy resin adhesive layers and chemical anchor bolts; the number of the prefabricated UHPC plates is multiple, all the prefabricated UHPC plates are spliced with one another and surround the inner wall of the duct piece lining cutting part, the adjacent prefabricated UHPC plates are connected through connectors, the prefabricated UHPC plates are fixed to the duct piece lining cutting part through chemical anchor bolts, and gaps between the prefabricated UHPC plates and the duct piece lining cutting part are filled with the epoxy resin glue layers. Compared with the prior art, the manufacturing precision and the mechanical property of the prefabricated UHPC plate can be strictly controlled, and the method has the advantages of being low in construction difficulty, high in efficiency and the like.

The invention discloses a flame-retardant epoxy resin adhesive with a low dielectric constant and a low dielectric loss factor as well as a preparation method and application of the flame-retardant epoxy resin adhesive, and belongs to the technical field of electrical insulating materials. The method comprises the following steps: uniformly mixing and stirring epoxy resin and alicyclic epoxy resin to obtain an epoxy resin mixture; uniformly stirring liquid acid anhydride, a flame retardant, an epoxy active toughening agent and an accelerant to obtain an epoxy resin curing agent; and vacuumizing and uniformly stirring the epoxy resin mixture and the epoxy resin curing agent to obtain the flame-retardant epoxy resin adhesive with low dielectric constant and low dielectric loss factor. Dielectric loss of the epoxy resin mixture is reduced through polarity complementation, and molecular chain segment polarization is reduced through an alicyclic epoxy resin ring structure. And the flame retardant is dispersed into a uniform flame-retardant phase in liquid anhydride, so that the mechanical property is prevented from being reduced. A flexibilizer and anhydride are grafted to introduce a flexible chain segment, vacuum mixing is performed to eliminate an air gap, and after gradient curing, a low dielectric constant, a low dielectric loss factor and flame retardance are obtained.

The invention relates to a multi-layer glass fiber reinforced plastic production line, a production method and multi-layer glass fiber reinforced plastic, and relates to the field of glass fiber reinforced plastic production equipment.The multi-layer glass fiber reinforced plastic production line comprises a bottom film processing unit, a first fiber laying and gluing unit, a composite thickness determining unit, a heating and curing unit and a trimming and cutting unit which are sequentially arranged; the upper layer processing unit is capable of forming a top film gel coat on the top film and / or paving a second fiber layer on the top film and infiltrating a second resin adhesive on the top film and forming a semi-cured state, and the lower layer processing unit is capable of forming a second fiber layer on the top film and infiltrating a second resin adhesive on the top film and forming a semi-cured state. The composite thickness determining unit can lay the second fiber layer on the first fiber layer to form a composite glass fiber reinforced plastic material with a set thickness, and the composite glass fiber reinforced plastic material is heated and cured by the heating and curing unit and trimmed and cut by the trimming and cutting unit to form the composite glass fiber reinforced plastic, so that the production quality of the composite glass fiber reinforced plastic product can be ensured.

The invention discloses a quantum dot catalyzed rapid light-cured cellulose resin adhesive, a preparation method and application, and the preparation method comprises the following steps: carrying out acylating chlorination on a photoinitiator primer by using oxalyl chloride to obtain an acylating chlorination product; dissolving cellulose, a catalyst and the acylating chlorination product in a good solvent, reacting, precipitating in deionized water, collecting the precipitate, and drying to obtain a cellulose macromolecular photoinitiator; mixing and stirring the acrylate monomer A, the acrylate monomer B, the cellulose macromolecular photoinitiator and the quantum dots to obtain the adhesive. According to the method, the rapid light-cured cellulose resin adhesive with excellent performance can be simply and efficiently prepared, the prepared cellulose resin adhesive can be cured for 0.2-1 min under a 365 nm ultraviolet lamp to achieve adhesion of a transparent base material, the method has the advantages of being environmentally friendly, easy to operate and wide in applicable monomer range, and the application range of cellulose is further widened.

The invention relates to the technical field of adhesives, and discloses a preparation method of an organic silicon modified epoxy resin adhesive. The epoxy resin adhesive prepared by the invention is prepared by taking epoxy resin and organic silicon modified epoxy resin as main matrix resin, adding a curing agent, a curing accelerator, nano silicon dioxide, spherical aluminum oxide and a reactive diluent, and mixing and stirring; wherein due to the introduction of the organic silicon modified epoxy resin, the mechanical property and toughness of a cured adhesive film are improved, so that the adhesive film is not easy to embrittle and crack under external force, and meanwhile, the water resistance of the adhesive film is also improved.

The invention discloses an epoxy resin adhesive and a preparation method thereof, and belongs to the technical field of material preparation. The adhesive is composed of 50-100 parts of an epoxy resin main agent and 50-120 parts of a curing agent; the epoxy resin main agent is functionalized carbon nanotube modified liquid epoxy resin, and the functionalized carbon nanotube modified liquid epoxy resin is composed of 100 parts of bisphenol epoxy resin, 5-25 parts of diglycidyl ether and 5-15 parts of glycidyl methacrylate; the curing agent is prepared from 60 to 100 parts of modified polyamine curing agent, 10 to 25 parts of hyperbranched polymer modifier, 5 to 15 parts of nano silicon dioxide dispersion, 10 to 20 parts of amino-terminated liquid nitrile rubber and 3 to 10 parts of curing accelerator. According to the invention, a high-temperature curing and normal-temperature curing combined technology is adopted to realize that the epoxy resin adhesive forms strength in a short time at normal temperature and does not adhere to the wheel, and secondary curing can be carried out at high temperature, so that interlayer bonding is enhanced. The preparation process is simple, and the prepared epoxy resin adhesive is excellent in tensile property and bonding property.

The invention provides a composite material oil tank and a manufacturing method thereof, relates to the technical field of composite material oil tanks, and greatly simplifies the mold manufacturing and assembling process through the integrated design of a modular numerical control mold and a three-dimensional digital model. The die purchasing and processing cost is greatly reduced through partition die assembly and reuse of the supporting prosthesis, repeated investment of a special core die is avoided through accurate matching of the silicone rubber soft die and the air bag, and the laying quality of corners and narrow parts is improved. Through cooperation of two times of curing and a stepped lap joint structure, defects of fiber wrinkles, cavities, bridging and the like are effectively eliminated, and fiber continuity and resin bonding strength of a complex curved surface area are ensured. The finally formed composite material oil tank shell not only has excellent mechanical properties of high strength, high rigidity and light weight, but also has excellent sealing performance and durability, and an efficient and reliable solution is provided for large-scale application of a composite material oil tank with a complex structure.

The utility model belongs to the technical field of carbon fiber composite materials, and particularly relates to a multi-layer fiber prepreg and a production device thereof. The production device comprises a first upper adhesive film unwinding device, a first reinforcing material unwinding device, a first lower adhesive film unwinding device and a winding device, and the discharging end of the first upper adhesive film unwinding device, the discharging end of the first lower adhesive film unwinding device and the discharging end of the first reinforcing material unwinding device are connected with a first impregnation assembly. At least one reinforcing material laying assembly is arranged between the discharging end of the first impregnation assembly and the winding device, and the at least one reinforcing material laying assembly is connected in sequence. The prepreg comprises a single-layer fiber prepreg and N layers of reinforcing materials sequentially laid on the single-layer fiber prepreg, and a layer of resin adhesive film is laid on the side, away from the single-layer fiber prepreg, of each layer of reinforcing material. According to the invention, the fiber prepreg with large gram weight and high impregnation degree can be rapidly, efficiently and continuously produced on line, and the prepreg is good in stability and good in mechanical property.

The invention belongs to the technical field of adhesives, and relates to an epoxy resin composition, an epoxy resin adhesive film and application thereof. The epoxy resin composition comprises epoxy resin, a curing agent, a flexibilizer, a filler and rosin modified phenolic resin, the curing agent at least comprises a latent curing agent, the flexibilizer at least comprises acrylate rubber, the softening point of the rosin modified phenolic resin is 120-180 DEG C, the acid value is 40-100 mgKOH / g, and the filler is a filler. The rosin modified phenolic resin with the specific softening point and acid value is introduced, and the types of the curing agent and the flexibilizer are limited, so that the damping loss factor of an epoxy resin adhesive film prepared from the epoxy resin composition is relatively low in the range of 0-100 DEG C, and the stability of the damping loss factor is relatively high; meanwhile, the adhesive also has the characteristics of high elastic modulus, high toughness, high peel strength, good normal-temperature storage stability and good high-temperature rapid reactivity.

The invention discloses a high-temperature-resistant resin glue solution for a copper-clad plate and a preparation method of the high-temperature-resistant resin glue solution, and relates to the technical field of copper-clad plates. The high-temperature-resistant resin glue solution is prepared from the following raw materials in parts by mass: 60 to 80 parts of dicyclopentadiene phenol type epoxy resin, 20 to 40 parts of fluorinated benzoxazine, 10 to 30 parts of dicyclopentadiene phenol type phenolic resin, 5 to 10 parts of hyperbranched polysiloxane, 90 to 100 parts of solvent, 5 to 8 parts of additive and 10 to 20 parts of inorganic filler. Wherein trifluoromethyl and naphthalene rings are introduced into the fluorinated benzoxazine, so that the heat-resistant stability and the dielectric property of the resin glue solution are effectively improved; a copper-clad plate sample prepared from the resin glue solution has a good application effect.

The invention discloses a composite fiberboard and a preparation method thereof, and belongs to the technical field of artificial boards. Comprising the following raw materials in parts by weight: 34-45 parts of wood fiber, 17-26 parts of composite resin, 7-13 parts of hydroxymethyl cellulose, 5-9 parts of aluminate cement, 4-8 parts of talcum powder, 11-16 parts of polyvinyl alcohol, 9-14 parts of polyvinyl acetate emulsion, 7-11 parts of urea-formaldehyde resin adhesive, 5-9 parts of polyacrylate and 1.2-2.5 parts of a composite coupling agent. According to the composite fiberboard, the water resistance of the composite fiberboard can be improved, and the problem that harmful substances containing formaldehyde and the like are released is solved.

The invention belongs to the technical field of digital printing heat transfer printing materials, and particularly relates to a static-free loose-powder DTF transfer printing film and a preparation method thereof. The invention aims to solve the problem of contradiction among antistatic function, ink adsorption and peel strength of the current DTF transfer film. According to the invention, the ionic liquid antistatic agent coated by the polymer microcapsule is dispersed in the water-based resin adhesive to form the lower antistatic network structure layer; meanwhile, the crystallization behavior of the crystalline polyester hot melt adhesive resin taking bio-based 2, 5-furandicarboxylic acid as a rigid component is regulated and controlled through surface modified boron nitride nanosheets, a phase separation curing process is utilized, so that an antistatic network stably exists at the lower part of the coating, and hot melt adhesive resin microcrystals are selectively enriched on the outermost surface of the coating; and a thermally induced phase change bonding layer is formed, so that no static electricity disturbs powder in the printing and powder scattering processes.

The invention relates to an epoxy resin adhesive composition and a preparation method thereof, and belongs to the technical field of high-performance polymer material modification and electronic packaging materials, and the epoxy resin adhesive composition comprises the following components by weight: 100 parts of basic epoxy resin; 5-30 parts of a hyperbranched liquid crystal modifier; adding the curing agent according to a stoichiometric ratio; 100 to 600 parts of a heat-conducting filler; 0.1-5 parts of an accelerant and an auxiliary agent; the hyperbranched liquid crystal modifier has a core-shell structure and is prepared from a hydrogen-containing hyperbranched polysiloxane core and an alkenyl-terminated liquid crystal epoxy monomer through a hydrosilylation reaction under the action of a catalyst, the hyperbranched polysiloxane core is introduced, the friction resistance among high-concentration fillers is reduced by utilizing the torispherical structure of the hyperbranched polysiloxane core, and the hyperbranched liquid crystal modifier has the advantages that the friction resistance is reduced; under the condition that 350 parts of heat-conducting filler is filled, the modifier is added, so that the high-filling system still has excellent flowability and leveling property while keeping high heat-conducting property, and is suitable for high-precision micro-encapsulation scenes; the heat conductivity of the scheme is obviously superior to that of a system which does not use the modifier or does not adopt a stepped heating process.

The application belongs to the technical field of polymer materials, and particularly relates to a high-performance fiber composite material and a preparation method thereof. The preparation method of the high-performance fiber composite material comprises the following steps: adding pretreated aluminum oxide whiskers into a solvent, then adding pretreated carboxymethyl cellulose and gallic acid, and heating to reflux to obtain modified aluminum oxide whiskers; then mixing epoxy resin, the modified aluminum oxide whiskers, a curing agent and an accelerator uniformly to coat a film to obtain a resin adhesive film; and compounding the resin adhesive film and carbon fibers through hot pressing to obtain carbon fiber prepreg, and heating and curing the obtained prepreg to obtain the high-performance fiber composite material. The fiber composite material obtained by the application not only has high strength and rigidity, but also has excellent toughness, can effectively resist the impact of the external environment, has oxidation resistance and long-term stability, and has a wide application prospect in the fields of aerospace and new energy equipment.

The invention relates to a low-expansion moisture-resistant electronic component packaging resin adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials. The resin adhesive comprises the following components: modified resin, phenyl methyl organic silicon resin, epoxy vinyl resin, a dynamic functional curing agent, a microencapsulated dicyandiamide curing agent, perfluorooctyltriethoxysilane, functional filler and the like; the modified resin is obtained by modifying hydrogenated bisphenol A epoxy resin with hydrogen-terminated polydimethylsiloxane and trimethylsiloxy silicate ester, adding a silane coupling agent and mixing; the dynamic function curing agent is obtained by reacting hexamethylenediamine and intermediate powder obtained by reacting 2, 3-dihydroxy benzaldehyde with pinacol borane; the functional filler comprises silicon dioxide and boron nitride which are subjected to surface treatment by a silane coupling agent. The low-expansion and high-moisture-resistance electronic component packaging resin adhesive is prepared from the components according to a specific ratio and a specific method, the components have a synergistic effect and play advantages, and the packaging reliability and the service life of an electronic component are guaranteed.

The utility model relates to the technical field of insulation board, and disclose a double -faced composite fireproof renewable insulation board, including the board body, the board body is sequentially provided with the heat preservation layer from inside to outside. The double -faced composite fireproof renewable insulation board, when the high temperature or open fire appears outside, the first fireproof layer and the second fireproof layer of both sides give priority to play the fire -resistant barrier effect, rely on material high -temperature -resistant, non -combustion characteristics, block flame spread and high -temperature transmission, the heat insulation layer in the middle, with the help of the closed bubble structure evenly distributed inside, reduce air convection and heat conduction, realize heat barrier, maintain the temperature difference of both sides of the board body to reach the heat preservation effect, the reinforcing layer is connected closely with the heat preservation layer and the second fireproof layer through epoxy resin adhesive, both strengthen the bonding strength of each layer, prevent interlayer peeling, and improve the overall structural stability of the board body, avoid its deformation, cracking when stressed or temperature changes.