1006 results about "Resin adhesive" patented technology

The invention discloses a sacrificial layer prepreg for a composite material and a preparation method of the sacrificial layer prepreg, and belongs to the field of composite material forming. The preparation method comprises the following steps: mixing an inorganic filler with resin, and performing film forming treatment to obtain a resin adhesive film; coating the resin adhesive film on the surface of a fiber to obtain a sacrificial layer prepreg; after the sacrificial layer prepreg is prepared, the sacrificial layer prepreg, the wave-absorbing prepreg and the structural prepreg are sequentially laid on the surface of a tool according to the tool thickening requirement, co-curing treatment and demolding treatment are carried out according to the curing process of the structural prepreg, and the composite material with the surface coated with the sacrificial layer prepreg is prepared. According to the sacrificial layer prepreg for the composite material, the aramid fiber with excellent flexibility is adopted as a carrier, direct manual stripping can be achieved, the actual laying layer number can be adjusted according to the tool thickness requirement, and compared with a traditional numerical control cutting method, the stripping efficiency is higher, and thickness control is more accurate.

The invention relates to the field of copper-clad plates, and discloses a low-dielectric-constant high-performance copper-clad plate and a preparation method thereof.The preparation method comprises the specific steps that epoxy resin, phenolic resin, polyphenyl ether modified resin, modified nano silicon dioxide and the like are taken and mixed to obtain a resin glue solution; impregnating glass fabric in the resin glue solution to obtain a prepreg; laminating prepregs, and covering copper foil for hot pressing; the polyphenyl ether modified resin comprises epoxy resin, diallyl cyanate and fluorine-containing polyphenyl ether resin prepared by reaction of polyphenyl ether, bisphenol AF and benzoyl peroxide; the modified nano silicon dioxide is prepared by reacting allyl glycidyl ether, vinyltriethoxysilane and phenyltris (dimethylsiloxane) silane, then grafting with a phosphorus-containing intermediate to prepare a modified additive, and grafting with nano silicon dioxide, and the phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. The copper-clad plate with high flame retardance, high peel strength, heat resistance and low dielectric constant is prepared.

The invention discloses a high-temperature-resistant tough epoxy resin adhesive and a preparation method thereof, and relates to the technical field of epoxy resin, the high-temperature-resistant tough epoxy resin adhesive comprises the following components by mass: 30-60 parts of epoxy resin, 15-40 parts of a modified curing agent, 5-20 parts of a flexibilizer, 8-35 parts of an inorganic filler, 1-5 parts of a coupling agent, and 0.5-3 parts of an antioxidant; the epoxy resin is formed by compounding bisphenol A epoxy resin and novolac epoxy resin according to the mass ratio of (1-3): 1; the modified curing agent is prepared by modifying an imidazole curing agent with a silane coupling agent. The problem that high temperature resistance and toughness of an epoxy resin adhesive are difficult to consider at the same time can be solved.

The invention discloses an epoxy resin tack coat oil material suitable for a steel bridge deck, which constructs a multi-scale toughening composite system through the synergistic effect of an epoxy-terminated polyurethane elastomer toughening agent (molecular-scale chemical grafting) and a nano-scale elastomer filler (nano dispersion toughening), and solves the problem of rigidity-flexibility imbalance of the traditional epoxy tack coat oil. The material has the advantages of fast curing (surface drying at 25 DEG C is less than or equal to 4 hours), high toughness (the elongation at break is greater than or equal to 250%) and excellent weather resistance (the performance retention rate is greater than or equal to 85% after ultraviolet aging for 500 hours), and is suitable for interlayer interface bonding of steel bridge deck pit slot and crack repair. According to the preparation method, uniform dispersion and interface chemical bonding of the nanofiller are achieved through a segmented stirring process, the comprehensive performance of the material is remarkably improved, and the important engineering application value is achieved.

To provide other technique for suppressing corrosion by plasma of a joint part joining a plate-like part and a base part, in a holding device.SOLUTION: A holding device includes a plate-like part formed into a plate shape, a base part which supports the plate-like part and is formed into a plate shape, a joint part which is arranged between the plate-like part and the base part and is composed of a resin adhesive bonding the plate-like part and the base part, and a protective member coating at least a part of the outer peripheral surface of the joint part, wherein the protective member contains a matrix resin which has a skeleton of perfluoropolyether and contains a matrix resin containing a resin component the same as the resin adhesive.SELECTED DRAWING: Figure 1

The invention relates to alkali-soluble light-cured resin and a preparation method thereof, a light-cured resin composition, a photosensitive dry film and a semiconductor device. The structural formula of the alkali-soluble light-cured resin is shown as a formula (I) or a formula (II), wherein in the formula (I), R1 is selected from one of a single bond, an oxygen atom, a sulfonyl group and an organic group with 1-30 carbon atoms; in the formula (I) and the formula (II), n is a natural number greater than or equal to 0; r2 is selected from organic groups with 1-50 carbon atoms; r3 is selected from an aromatic organic group or an aliphatic organic group; r4 is selected from organic groups containing unsaturated carbon-carbon double bonds; and R5 is selected from carboxyl-containing organic groups. A molecular chain of the alkali-soluble light-cured resin contains a photosensitive group, an imide structure and an alkali-soluble group, on one hand, the thermal mechanical property of the alkali-soluble light-cured resin can be enhanced, and on the other hand, the alkali-soluble light-cured resin can form a uniform and stable resin glue solution in a solvent, so that the comprehensive performance of the alkali-soluble light-cured resin is improved.

The invention discloses a low-temperature fast-curing two-component resin adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials. The resin adhesive is formed by mixing a component A and a component B, the component A comprises epoxy-acrylate hybrid resin, a reactive diluent, a nano reinforcing filler and the like, and the component B comprises a modified aliphatic amine curing agent, a microcapsule low-temperature efficient accelerant, a Mannich base curing agent and the like. Through the synergistic effect of a quaternary curing system and in combination with the rigid-flexible balance design of the hybrid resin, rapid curing at low temperature is achieved, and high strength, high toughness and good storage stability are achieved. The resin adhesive is suitable for the fields of bonding of automobile parts, packaging of electronic elements, repairing of wind power blades, sealing of building structures and the like, and particularly solves the problems that a traditional resin adhesive is slow in low-temperature curing and insufficient in performance.

The invention discloses a polyurethane modified epoxy resin adhesive as well as a preparation method and application thereof, and the polyurethane modified epoxy resin adhesive is prepared from the following components in parts by mass: 7-10 parts of E51 type bisphenol A diglycidyl ether, 3.5 parts of a phenolic aldehyde amine T31 curing agent and 1-3 parts of synthetic polyurethane, the synthetic polyurethane is prepared from polyether triol, polyether amine, isophorone diisocyanate and glycerol carbonate, and a blending system of the synthetic polyurethane and bisphenol A diglycidyl ether is adopted to be subjected to covalent crosslinking with phenolic aldehyde amine T31, so that the adhesive has high toughness and strength guarantee; the synthetic polyurethane prepared by the method is obtained through simple, green and efficient solvent-free synthesis, and the synthesized product has certain fluidity at room temperature, so that the subsequent stirring preparation process of an adhesive is facilitated. And a solvent-free synthesis method is adopted, so that the use of a toxic organic solvent in the traditional polyurethane synthesis process is avoided, and the synthesis process is greener.

The invention discloses a toughening agent, a toughened epoxy resin adhesive and a preparation method and application thereof. The toughening agent is obtained by carrying out esterification reaction on components including a phenolic compound containing a polyphenol skeleton and an anhydride compound containing a long-chain alkyl structure. The raw materials used by the toughening agent are bio-based molecules and have excellent renewability, the toughening agent is high in toughening efficiency, the impact strength of the epoxy resin adhesive can be effectively improved under the condition of low addition amount, and meanwhile, the bonding strength and the hydrothermal durability of the epoxy resin adhesive can be improved.

The invention discloses a high-temperature-resistant and weather-resistant epoxy resin adhesive and a preparation method thereof, and belongs to the field of epoxy resin adhesives, the adhesive can keep stable bonding strength for a long time at high temperature through the synergistic effect of hydrogenated bisphenol F type epoxy resin, silicon-containing phenyl glycidyl ether epoxy resin and a dicyandiamide-imidazole composite curing agent, and the adhesive has high temperature resistance and weather resistance. According to the present invention, the graphene aerogel is added to the silicon-containing phenyl glycidyl ether epoxy resin to meet the high temperature environment use requirement, and the silica bond in the silicon-containing phenyl glycidyl ether epoxy resin and the aging resistance of the graphene aerogel enable the adhesive to have characteristics of excellent ultraviolet aging resistance, excellent thermal cycling resistance and excellent moisture resistance, solve the performance defects of the traditional product, and be suitable for the application in the high temperature and severe environment, the method has an important practical value.

The invention discloses a method for improving cloth lines after hot pressing of an epoxy glass fiber composite material, and the method comprises the steps of resin glue solution blending, glass fiber cloth presoaking, gradient pre-drying, hot pressing molding, cooling demolding and the like. The volume expansion rate is accurately matched with the resin curing shrinkage rate, interface stress caused by shrinkage difference is directly counteracted, meanwhile, gradient pre-drying and staged hot pressing processes are combined, and the resin fluidity and interface bonding strength are optimized. The resin conversion rate is controlled in two stages through gradient pre-drying, and flow blocking caused by premature curing is avoided; and secondly, through the chemical compensation mechanism of the expansion monomer, the mechanical property of the material is maintained while the cloth lines are eliminated.

The utility model relates to the technical field of flywheel energy storage, and discloses a vacuum sealing electrode for flywheel energy storage, which comprises a conducting rod and an epoxy resin body arranged outside the conducting rod, a sealing ring is embedded in the left side surface of the epoxy resin body, and a plurality of through holes are formed in the upper surface of the epoxy resin body. Positioning bolts movably penetrate through the interiors of the multiple through holes; the whole body formed by the conducting rod and the epoxy resin body is small in resistance and high in sealing performance, and media inside and outside the electrode are isolated, so that the working current is large, the working voltage is high, and the long-time charging and discharging requirements of the flywheel are met; the epoxy resin body is cured outside the conducting rod, the conducting rod and the epoxy resin body form a whole with certain pressure resistance and sealing performance through the annular sealing groove in the surface of the rod body and the cohesiveness of epoxy resin glue, the sealing effect is good, and the cost is low. A rotation stopping section is processed on the rod body, so that leakage caused by relative rotation of the conducting rod and the epoxy resin body is prevented.

The invention discloses steel bridge deck pavement modified resin concrete and a pavement structure thereof, and belongs to the technical field of concrete preparation. The concrete is composed of a modified resin cementing material and aggregate, the modified resin cementing material consists of a main agent, a curing agent and an auxiliary agent; the main agent is modified bisphenol epoxy resin; the curing agent consists of a polyether amine curing agent, a modified phenolic aldehyde amine curing agent, an alicyclic amine curing agent, a curing accelerator and nano silicon dioxide; the aggregate is a compound of dried stone, filler, fiber and elastic particles; the auxiliary agent is composed of a defoaming agent, a flatting agent and an ultraviolet light absorber; the mass ratio of the main agent to the curing agent to the auxiliary agent is (50-110): (40-100): (1-3), and the mass of the modified resin cementing material accounts for 6-18% of the mass of the aggregate. The modified resin concrete is high in compressive strength and excellent in fatigue performance, and compared with common concrete, the modified resin concrete has higher strength and toughness and can bear larger load and impact force.

The invention relates to the technical field of adhesives, in particular to a high-bonding-strength bio-based epoxy adhesive and a preparation method thereof. Comprising 20-50 parts of bio-based epoxy resin, 8-20 parts of a bio-based epoxy flexibilizer, 5-10 parts of an epoxy diluent, 25-60 parts of an inorganic filler, 2-8 parts of a curing agent and 0.2-1 part of a curing accelerator, the epoxy resin adhesive with excellent performance is developed by using a bio-based material as a raw material, has high adhesion to metal aluminum and the like, has excellent toughness, can be widely applied to automobiles, aviation, industry, electronics and other directions requiring shock absorption, impact resistance and structural adhesion, has an excellent economic prospect, and is worthy of popularization and application. Meanwhile, the method has important significance in environmental protection.

The invention discloses a mould pressing carbon ceramic brake disc and a preparation method and application thereof.The preparation method comprises the steps that continuous carbon fibers are chopped to obtain chopped carbon fibers, the chopped carbon fibers are mixed, resin glue liquid is sprayed while mixing is conducted, glue-coated carbon fibers are obtained, silicon-containing particles and auxiliaries are mixed to obtain mixed powder A, then the mixed powder A and resin powder are mixed to obtain mixed powder B, and the mixed powder B is added to the mould pressing carbon ceramic brake disc; and mixing the mixed powder B with the glue-coated carbon fibers to obtain a mixture, carrying out compression molding on the mixture to obtain a preform, carbonizing the preform to obtain a porous body, and siliconizing the porous body to obtain the composite material. According to the preparation method disclosed by the invention, the surface of the carbon fiber is treated by spraying a resin glue solution for the first time, a uniform protective layer is formed on the surface layer of the carbon fiber yarn, and an auxiliary agent is added into a mixture, so that a uniform capillary tube is formed when a preform is carbonized, the infiltration uniformity is promoted, and the uniformity of components, high density and low aperture ratio are ensured; therefore, the prepared molded carbon-ceramic brake disc is stable in performance, high in strength and resistant to high temperature.

An epoxy resin adhesive is used for bonding a membrane made of soft PVC to a further substrate, wherein the curing-agent component of the adhesive includes at least one amine A1 having at least one dimethylamino group and at least one amine hydrogen, and at least one further amine A2 having at least three amine hydrogens, and the curing-agent component includes, based on the total of all the liquid or dissolved constituents contained in the curing-agent component, an amine A1 content of 10 to 45 wt. %. The use allows bonding of untreated membranes made of soft PVC to form a stable, water-resistant adhesive bond and is particularly suitable for sealing tunnels, foundations and roofs.

The invention relates to the technical field of busbars, and discloses a multi-layer composite fire-resistant shielding busbar and a preparation method thereof, and the multi-layer composite fire-resistant shielding busbar comprises a conductor layer, a fire-resistant layer, a shielding layer and a sheath layer which are sequentially coated from inside to outside; wherein the conductor layer is made of copper or aluminum; the fireproof layer wraps the conductor layer and is formed by wrapping a double-layer PI three-in-one synthetic mica tape. According to the multi-layer composite fire-resistant shielding busbar and the preparation method thereof, the double-layer PI three-in-one synthetic mica tape is used for wrapping, a stable fire-resistant insulation structure is formed outside the conductor layer in a reverse wrapping mode that the first layer is clockwise and the second layer is anticlockwise, and the mica tape is formed by combining phlogopite paper and an organic silicon resin adhesive capable of resisting the temperature of 300 DEG C; the structural integrity can be maintained under the fire high-temperature condition, and electrical short circuit caused by thermal failure is effectively prevented; and meanwhile, the mica tape adhesive layer permeates into the micro-groove structure arranged on the surface of the conductor in the thermocuring process, so that the mechanical occlusion strength is further enhanced.

The invention relates to the use of an epoxy resin adhesive for bonding substrates at least partially coated with a cured epoxy resin adhesive, characterized in that the adhesive comprises a resin component comprising at least one epoxy resin and a curing agent component comprising at least one epoxy resin, the curing agent component comprises at least one amine having at least one aliphatic amino group wherein the amine is selected from the group consisting of polyetheramines and linear or branched but non-cyclic aliphatic polyamines wherein the amine comprises at least 50% by weight of all amine curing agents having at least one amine hydrogen contained in the curing agent component, the curing agent component is based on all amine curing agents in the curing agent component. The use according to the invention allows the adhesion of substrates at least partially coated with a cured epoxy adhesive, forming a stable weather-resistant adhesive connection, and is particularly suitable for repairing rotor blades in wind turbines.

The utility model discloses a steel bridge deck pavement structure, which belongs to the technical field of road pavement, and comprises a steel plate, an anti-corrosion layer, a waterproof bonding layer, a pavement lower layer, an interlayer bonding layer and a pavement upper layer which are sequentially paved from bottom to top, the anti-corrosion layer is epoxy zinc-rich primer, the waterproof bonding layer is epoxy resin adhesive, and the interlayer bonding layer is epoxy resin adhesive. The pavement lower layer is made of epoxy asphalt concrete, the interlayer bonding layer comprises an epoxy asphalt adhesive, a glass fiber grating and broken stone, the pavement upper layer is made of modified asphalt concrete SMA, and the problems of high-temperature pushing, surface layer cracking and the like can be effectively solved.

The present invention provides an epoxy resin adhesive and a preparation method thereof, and relates to the technical field of building structure adhesives, the epoxy resin adhesive is prepared from a component A and a component B, the component A comprises the following raw materials by weight: 90-110 parts of epoxy resin, 15-25 parts of a toughening agent, 40-50 parts of a filler I and 15-20 parts of benzyl alcohol, and the toughening agent comprises polycarbonate, polyamide and polypropylene glycol diglycidyl ether; the component B is prepared from the following raw materials in parts by weight: 40 to 60 parts of curing agent, 10 to 20 parts of filler II, 1.5 to 3 parts of polyvinylpyrrolidone and 5 to 10 parts of benzyl alcohol. The preparation method comprises the following steps: S1, preparing A glue; s2, preparing B glue; and S3, mixing glue. The toughening agent is added in the component A, polycarbonate, polyamide and polypropylene glycol diglycidyl ether are selected as the toughening agent, the three raw materials are compounded and cooperated, the processability and flowing property of the epoxy resin adhesive can be effectively improved, and the problems that a cured finished product is high in brittleness and poor in impact resistance are solved.

The invention relates to the technical field of geological sample preparation, in particular to special coring equipment for a hard broken stratum in geothermal drilling, which comprises a counterweight support and further comprises a rotary sample drilling structure connected with the counterweight support, the rotary sample drilling structure comprises a rotary lifting driving part, a limiting rotary driving part is mounted on the rotary lifting driving part, and the limiting rotary driving part is connected with the counterweight support. The limiting rotation driving part is connected with a pile casing, the outer wall of the pile casing is fixedly connected with four sets of buckling frames, the lower end of the pile casing is fixedly provided with a core drill bit, and four sets of pneumatic glue filling parts are installed in the pile casing; and the power-assisted separation part is connected with the rotary lifting driving part. Through cooperation of the rotary sample drilling structure and the power-assisted separation part, while the rock core sample is drilled, the rock core sample in a broken and loose state is fixed in a manner of filling transparent epoxy resin glue, so that complete collapse and mixing of the interior of the rock core sample in the taking-out and transporting process are avoided; subsequent observation and analysis of the rock core sample are facilitated, and the difficulty of subsequent analysis of the rock core sample is reduced.

The invention discloses electrophoretic coating liquid, an electronic ink layer and an electrophoretic display assembly, and relates to the technical field of electronic paper display. The electrophoresis coating liquid provided by the invention contains the surfactant, the rheological agent, the water-based resin adhesive, the defoaming agent, the emulsifier and the microcapsules, and by controlling the particle size distribution of the microcapsules, the microcapsules with the particle size D10 of 20-25 microns, the particle size D90 of 45-50 microns and the particle size D50 of 27-30 microns are selected, so that local deformation of large-particle-size capsules caused by stress concentration in the coating and drying process is avoided; in addition, the small-particle-size capsule shortens the migration path of electrophoretic particles, so that the electric field driving efficiency is improved, and the response time is effectively prolonged. By optimizing the ratio of the microcapsules to the water-based resin adhesive, the water-based resin adhesive can fill gaps of the microcapsules more sufficiently, a uniform supporting network is formed around the microcapsules after curing, capsule breakage caused by mechanical extrusion is reduced, and the breakage rate of the capsules is effectively reduced.

The invention discloses a reinforced semi-immersed liquid cooling heat dissipation board card. The board card comprises a cold plate with an immersion cavity, a printed board assembly in partition layout and a sealing system. An annular sealing groove is formed in the edge of the cold plate immersion cavity, and a baffle is arranged between the liquid inlet and the liquid outlet to force cooling liquid to flow through the high-power-consumption device. The printed board assembly is glued and fixed by a pressing plate through epoxy resin, the high-power-consumption device is located in the immersion cavity, and the tail electric connector is exposed; the D-shaped sealing strip is embedded in the sealing groove and is pressed and sealed by the distributed screw; the liquid inlet connector, the liquid outlet connector and the overflow valve are installed at the front end of the cold plate in an inwards-concave mode, and the overflow valve is provided with a 1 bar pressure-resistant value for overpressure relief. The design realizes targeted heat dissipation of components and parts (temperature rise at 360W power consumption is less than or equal to 55 DEG C), is compatible with a standard electric connector, meets the size standard of a marine 6U reinforcing module, and is suitable for severe environments such as salt mist and vibration.

The invention provides a bulletproof structure and a preparation process thereof. The bulletproof structure comprises a ceramic layer plate, a titanium alloy layer plate, an aramid fiber layer plate, an ultra-high molecular weight polyethylene layer plate and a honeycomb heterogeneous anti-impact layer which are sequentially stacked, the ceramic layer plate and the titanium alloy layer plate, the titanium alloy layer plate and the aramid fiber layer plate, and the aramid fiber layer plate and the ultra-high molecular weight polyethylene layer plate are connected through a large-surface-density polyurethane resin adhesive film; wherein the ceramic laminate is made of nano modified B4C ceramic or nano modified TiB2 ceramic. The impact resistance of the base body can be improved, incoming projectiles are partially eroded and decomposed in the residence stage of the ceramic plate, then a large number of cracks are formed on the surfaces, conical fracture failure is achieved, bullet energy is decomposed greatly, the projectiles are eroded to deform and break, high temperature of combustion of the projectiles is blocked, and the impact resistance of the ceramic plate is improved especially for large-momentum and high-invasion-force projectiles. The invention particularly relates to a 12.7 mm armor-piercing combustion bomb and a kinetic energy warhead below.

The invention discloses a resin composition for a benzocyclobutenyl cyclotriphosphazene copper-clad plate as well as a preparation method and application of the resin composition, and belongs to the field of electronic resin synthesis. Comprising 20-33 parts by weight of benzocyclobutenyl cyclotriphosphazene, 67-80 parts by weight of hydrocarbon resin, 0.0-0.22 part by weight of an initiator, 25-53 parts by weight of a filler, and a first solvent accounting for 34-36 wt% of the total weight of the benzocyclobutenyl cyclotriphosphazene, the hydrocarbon resin and the filler, when the resin composition for the copper-clad plate is applied to the preparation of the copper-clad plate, the resin composition is firstly prepared into a resin glue solution, then glass fiber cloth is impregnated in the resin glue solution, and the halogen-free flame-retardant copper-clad plate is prepared through the steps of baking, sheet overlapping, hot pressing, cooling and pressure relief. The resin composition for the copper-clad plate has excellent flame retardant property, dielectric property, heat resistance and the like under the interaction of benzocyclobutenyl cyclotriphosphazene and hydrocarbon resin, and can endow the copper-clad plate with excellent flame retardant property, dielectric property, heat resistance and the like.

The present invention discloses a method for improving the gluing performance of heat-treated bamboo, belonging to the technical field of bamboo processing, and comprising the following steps: S1, fumigation treatment; S2, ultrasonic-electric field alternating treatment; S3, heat treatment; S4, spraying-drying cycle treatment. The present application provides a method for improving the gluing performance of heat-treated bamboo. After being treated by the method of the present application, the equilibrium contact angle of the bamboo becomes smaller, and the surface wettability is significantly improved, which is beneficial to the penetration and spreading of adhesives such as phenolic resin adhesives on its surface, thereby promoting the improvement of the gluing strength. Moreover, the method for improving the gluing performance of heat-treated bamboo in the present application is a whole, and there is a synergistic effect between each step. After the bamboo is treated by the method of the present application, the gluing performance is significantly improved.

The invention relates to a high-heat-resistance and high-insulation two-component epoxy resin adhesive and application thereof, and belongs to the technical field of epoxy resin. The technical problem to be solved by the invention is to provide the high-heat-resistance and high-insulation two-component epoxy resin adhesive. The adhesive comprises a component A and a component B. The component A comprises bisphenol A epoxy resin, novolac epoxy resin, silicon carbide whiskers, potassium titanate fibers, boron phenolic resin and modified nano boron nitride. The component B is prepared from methylhexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, 2-phenylimidazole, modified aluminum oxide, polyimide micro powder and modified wollastonite. Through synergism of multiple materials, balance of heat conduction, insulation, mechanical strength and thermal stability of the adhesive is realized. Under high-frequency pulse voltage, the adhesive is long in electrical aging life. A gradient curing process is adopted for curing, complete reaction in each stage is guaranteed, and internal stress is reduced. The process fault tolerance is high, the environment compatibility is high, the cost is low, and the curing time is short.

The invention relates to a light-cured dental resin adhesive containing a silane coupling agent modified monomer as well as preparation and application of the light-cured dental resin adhesive. The dental resin adhesive comprises a resin matrix, an organic polymer and a photoinitiator, wherein the resin matrix consists of methacrylate resin grafted and modified by a silane coupling agent and unmodified methacrylate resin. According to the method, the isocyano group of the silane coupling agent is selected to react with the hydroxyl group on the resin monomer to generate the silane modified grafted resin monomer, and the method is simple, low in equipment requirement and suitable for large-scale production; the obtained dental resin adhesive can be internally covalently cross-linked to enhance the self mechanical property, can also be chemically bonded with a bonding substrate by utilizing a grafted silane coupling agent to improve the interface bonding strength, is especially suitable for being used as an enamel bonding material, and can remarkably improve the service life and the curative effect of a bonded restoration.

The invention discloses a high-temperature resistant epoxy resin adhesive and a preparation method and application thereof. The high-temperature resistant epoxy resin adhesive includes a component A and a component B. The component A includes the following raw materials in parts by weight: 50-60 parts of epoxy resin; 5-15 parts of toughening agent; 0.1-0.3 parts of dispersant; 0.1-0.3 parts of coupling agent; 0.05-0.15 parts of defoaming agent; 0.5-2 parts of thixotropic agent; and 20-50 parts of filler. The epoxy resin is composed of a trifunctional epoxy resin, a tetrafunctional epoxy resin, and a silicone-modified epoxy resin. The component B includes the following raw materials in parts by weight: 18-30 parts of curing agent; 0.1-0.3 parts of dispersant; 0.1-0.3 parts of coupling agent; 0.05-0.2 parts of defoaming agent; 0.5-2 parts of thixotropic agent; and 70-80 parts of filler. This high-temperature resistant epoxy resin adhesive can meet the long-term high-temperature resistance requirements of 250°C and can be used as a bonding material for high-temperature resistant electronic components.

The invention relates to the technical field of adhesives, and discloses a preparation method of an epoxy resin adhesive, which comprises the following steps: reacting p-aminophenol with diphenyl dichlorosilane under the catalysis of triethanolamine to obtain di (p-aminophenoxy) diphenyl silane; the preparation method comprises the following steps: carrying out Mannich reaction on amino in di (p-aminophenoxy) diphenyl silane, amino in polyether amine, formaldehyde and phenol to obtain the silane-containing polyether amine type benzoxazine intermediate. And finally, uniformly mixing the silane-containing polyether amine type benzoxazine intermediate and epoxy resin, and curing to obtain the epoxy resin adhesive. The prepared silane-containing polyether amine benzoxazine intermediate contains a silane structure and a benzoxazine structure, both the silane structure and the benzoxazine structure have excellent heat resistance, and the epoxy resin adhesive prepared by adding the silane-containing polyether amine benzoxazine intermediate into epoxy resin has excellent heat resistance.