The invention provides high-stability double-layer core-shell coated pure
copper silver-substituted
conductive paste and a preparation method thereof, and belongs to the technical field of electronic special materials. The
copper-resistant
coating comprises the following components in percentage by
mass: 82%-90% of
antioxidant copper powder with a double-layer core-shell structure, 3%-6% of
bismuth-
boron-
zinc lead-free low-melting-point glass
powder, 3%-7% of a modified
epoxy resin
compound organic carrier, 2%-5% of a gradient volatilization compound
solvent and 0.5%-2% of a special compound additive for copper. Through the double-layer core-shell copper
powder design of inner-layer nano-silver
passivation and outer-layer organic
composite coating and in cooperation with a liquid-phase synergistic anti-oxidation
system, the volume resistivity after
slurry curing is smaller than or equal to 3.5 * 10 <-5 >
omega.cm, the resistivity change rate after 1000-hour damp-heat aging at 85 DEG C / 85% RH is smaller than or equal to 10%, the normal-temperature storage period without opening a tank is larger than or equal to 6 months, direct curing can be conducted in the conventional
air atmosphere of 120-160 DEG C, and the high-temperature-resistant copper paste can be applied to the field of high-temperature storage. The
silver paste is completely compatible with production and application production lines of existing
silver paste, equipment transformation is not needed, the comprehensive cost is reduced by more than 80% compared with pure
silver paste, and the silver paste can be widely applied to the fields of PCBs, membrane switches,
flexible electronics, photovoltaic back electrodes,
LED packaging and the like.