1490 results about "Silver paste" patented technology

The invention discloses silver-nickel conductive paste for a BC battery and a preparation method of the silver-nickel conductive paste, and belongs to the technical field of photovoltaic batteries. The silver paste comprises the following raw materials in percentage by weight: 39-69% of micron silver powder, 20-50% of modified nickel, 2-6% of glass powder, 0.1-10% of a dispersing agent, 0-1% of silicone oil and the balance of an organic carrier, the modified nickel is simple substance nickel powder subjected to modification treatment, and the modification treatment mode is surface organic modification and ball milling modification or surface inorganic modification and ball milling modification. The nickel powder is adopted to replace part of silver powder, the prepared conductive silver nickel paste is used for a BC battery, the cost is remarkably reduced, the reliability is high, and the conversion efficiency is superior to or equivalent to that of traditional all-silver electrode paste.

The invention provides an all-silicon carbide double-sided heat dissipation module packaging method based on gradient thermal resistance optimization, and belongs to the technical field of electronic component packaging. Establishing a thermal resistance characteristic curve, and calculating a gradient thermal resistance vector to determine a heat flow path; constructing a heat dissipation temperature distribution matrix; obtaining thermal diffusion data; heat dissipation path thermal resistance is calculated by combining the thermal diffusion matrix and the temperature distribution matrix, and a thermal resistance sparse matrix is established and is dimensionally reduced into a thermal resistance low-dimensional matrix; calculating an optimal heat dissipation path parameter set; inputting the parameter set into a thermal resistance prediction deep attention network model for verification and fine tuning, and generating a final thermal resistance distribution scheme; a module structure and a material ratio are designed according to the scheme to form a sandwich structure; a silver paste sintering process is adopted to realize low thermal resistance connection and complete packaging, and the technical problems of non-uniform thermal resistance distribution and difficulty in optimizing a heat flow path in a double-sided heat dissipation structure of a silicon carbide power module in the prior art are solved.

The invention discloses silver-coated copper powder and a preparation method thereof, and creatively provides a technology for preparing the silver-coated copper powder by combining a chemical reduction method and a replacement method through process innovation and optimization aiming at the defects in the prior art, namely, copper powder is pretreated by acid and ammonia water and then is mixed with a reducing agent; and then the reducing agent is adsorbed on the surface of the copper powder, so that the reduction reaction is limited on the surface of the copper powder, and a uniformly-coated compact silver layer is formed on the surface of the copper powder. And in the replacement and reduction process, the organic solvent is used as a medium for dispersing the copper powder, the situation that a large amount of reducing agent exists in a dispersion medium can be effectively avoided, and then the phenomenon that pure silver powder particles are formed due to independent nucleation of the silver powder is well avoided. The technological process is simple and easy to operate, and the comprehensive performance of the prepared silver-coated copper powder is basically equivalent to that of pure silver powder conductive silver paste.

The invention discloses a solar cell and a photovoltaic module, and relates to the field of photovoltaic technology. The solar cell includes: a semiconductor substrate having a first semiconductor layer on a first surface; the passivation layer at least covers one side, deviating from the semiconductor substrate, of the first semiconductor layer; the seed layer penetrates through the passivation layer and is conductively connected with the first semiconductor layer; at least part of the first grid line is arranged on the side, away from the semiconductor substrate, of the seed layer, and the first grid line is formed by base metal slurry. The height of the seed layer is h1, the height of the first grid line is h2, and 0.08 < = h1 / h2 < = 0.8. Compared with the prior art in which the silver paste burns through the passivation layer to integrally form the silver electrode, the amount of the silver paste required for manufacturing the whole electrode structure of the solar cell can be reduced, and the manufacturing cost of the whole electrode structure is reduced.

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention provides a preparation technology of a three-dimensional camera shooting sonar sparse sensing array, and the method comprises the following steps: forming a patterned electrode on a PVDF or P (VDF-TrFE) piezoelectric film through vacuum adsorption and silk-screen printing according to sparse array element coordinates, and arranging a virtual transition array element at the periphery; performing laser etching on the edge contour and the exhaust hole of the piezoelectric film; designing a bonding positioning auxiliary tool, combining an ultrathin double-sided adhesive tape and a single-sided mask adhesive tape, and utilizing conductive silver paste to realize accurate electric connection between the array element and the PCB bonding pad; designing a polytetrafluoroethylene-metal flattening module, and laminating the array in a vacuum environment for curing and bonding; the matching layer is made of a low-impedance sound transmission material, glue filling and vacuum defoaming are performed from the back side in batches, and the sparse sensing array is prepared in combination with a polyimide film and a metal super-flat plate. The preparation problem of the large-aperture high-frequency imaging sonar on the sensing array is solved, and the array element position accuracy, the array element consistency and the imaging resolution can be improved.

The invention provides laser-assisted sintering base metal slurry for a TOPCon solar cell and a preparation method of the laser-assisted sintering base metal slurry, and relates to the technical field of photovoltaic cell manufacturing, the slurry comprises the following components: nickel powder, glass powder and an organic carrier; wherein the glass powder at least comprises two types of glass powder, one type of glass powder is corrosive glass powder, and the corrosive glass powder at least comprises one or two of lead oxide, bismuth oxide or antimony oxide; the other kind of glass powder is auxiliary promotion type glass powder, and the auxiliary promotion type glass powder takes silicon and borate as main bodies; the two kinds of glass powder do not contain first main group element oxides. The nickel powder is used for replacing silver powder, the contact defect is made up through the LECO technology, the specific glass powder formula and the high-temperature sintering technology are combined, performance balance is achieved, and verification experiments prove that the nickel paste achieves the same efficiency (gt; 24.5%), and the cost is reduced by about 30%-40%.

The invention discloses a self-energy-supply multi-mode sensing electronic skin based on ionic gel heterojunction array integration and a preparation method and application of the self-energy-supply multi-mode sensing electronic skin. The electronic skin adopts a multi-layer composite structure design and comprises an electrode array layer, a silver paste connecting layer, a nano material doped ionic gel array layer and a pure ionic gel continuous layer, and passive self-energized work is realized through a space ion migration effect at a heterogeneous gel interface. The method is characterized in that the design of a multi-layer flexible composite structure is adopted, space-time coded light, temperature, pressure and humidity four-mode stimulation can be synchronously converted into electroneurographic signals, and a collaborative identification strategy of response intensity dynamic range and synaptic learning / delay time difference is utilized; and high-precision decoupling of the multi-source signals is realized in combination with a classification decision tree algorithm. The electronic skin has the characteristics of flexibility, deformation, environment self-repairing and bionic synapse, and geometrical characteristics of a reconfigurable target source are fused through time-space domain multi-modal data.

The invention belongs to the technical field of back contact batteries, and particularly relates to a back contact battery with a specific electrode insulation structure and a manufacturing method and application of the back contact battery with the specific electrode insulation structure. Breakpoints are arranged at the intersection areas of the fine gate electrodes and the main gate electrodes with different polarities and are distributed discontinuously, first insulating layers are arranged on the outer surfaces of partial areas of the breakpoints of the fine gate electrodes, and the first insulating layers cover the breakpoints and extend into the isolation grooves in the Y-axis direction of the back contact cell substrate. The main gate electrode is located on the outer surface of the first insulating layer and located at the breakpoint of the fine gate electrode, and a second insulating layer is arranged on the outer surface of the end of the breakpoint of the fine gate electrode. According to the invention, the problem of printing broken gate when the small opening of the main gate electrode is arranged (namely, the width is narrow) can be avoided, the manufacturing of the superfine main gate electrode is realized, the consumption of silver paste is reduced, and the cost is reduced; meanwhile, the average power and the low short-circuit rate of the battery string are improved.

The invention discloses composite conductive powder for preparing conductive silver paste and the conductive silver paste, and particularly relates to the technical field of electronic materials.The composite conductive powder is of a double-shell core-shell structure composed of a silver metal inner core, a silicon dioxide middle coating layer and a silver nanoparticle self-assembled outer layer and is subjected to ultraviolet irradiation treatment; the conductive silver paste is based on the composite conductive powder and is matched with cerium oxide modified glass powder, graphene nanosheets, thermoplastic polyurethane resin and a dibasic acid ester solvent to form a low-temperature environment-friendly formula. The volume resistivity of the conductive silver paste is as low as 1.2 * 10 <-6 > omega.cm, the curing temperature is reduced to 120 DEG C, the content of volatile organic compounds meets the environmental protection standard, meanwhile, the tensile strength is improved by 50%, the conductive silver paste can bear 500 times of bending circulation without breakage, the adhesive force reaches the level 0 of a cross-cut method, the strict requirement of a high-performance electronic device for the conductive silver paste is effectively met, and the conductive silver paste has wide application prospects.

The invention relates to a photovoltaic cell preparation method, a photovoltaic cell, a laminated cell and a photovoltaic cell module. Providing an initial battery piece; depositing and forming a protective layer on the surface; carrying out laser treatment twice; printing and sintering to form an electrode; and carrying out at least two times of laser-assisted sintering on the electrode. According to the photovoltaic cell preparation method, the protection layer at the first area is removed, the doping concentration at the first area is improved, and at least two times of laser-assisted sintering are combined, so that on one hand, the metal contact area is optimized, the usage amount of silver paste is reduced, the material cost is reduced, and meanwhile, paste contact sintering is enhanced; damage caused by laser grooving doping is removed; and on the other hand, the doping concentration is optimized, the contact resistance is remarkably reduced, the open-circuit voltage and the filling factor are favorably improved, the shading loss is reduced, and the current collection efficiency is ensured, so that the photoelectric conversion efficiency and the reliability of the cell are remarkably improved, the production process is simplified, and the production cost is reduced.

The invention discloses high-crystallinity smooth silver powder, preparation of the high-crystallinity smooth silver powder and silver paste containing the high-crystallinity smooth silver powder. A preparation method of the silver powder comprises the following steps that a silver ammonia solution is obtained; the pH value of the silver-ammonia solution is adjusted to be alkaline through a pH adjusting agent, then a stabilizer is added, ultrasonic treatment is conducted, and silver crystal nucleuses are obtained; sequentially adding a charge control agent and a silver crystal nucleus into the dispersing agent solution, and uniformly stirring to obtain a reaction base solution; and the oxidant solution and the reducing agent solution are dropwise added into the reaction base solution at the same time, stirring reaction is conducted, and the high-crystallinity smooth silver powder is obtained. The mechanism for preparing the high-crystallinity smooth silver powder is mainly reflected in precise regulation and control of silver crystal nucleation, growth and surface modification, and the comprehensive characteristics of smooth particle surface, clear edges, high crystallinity and small particle size are achieved through the multi-factor synergistic effect.

The invention discloses a heterojunction solar cell, a preparation method thereof and a photovoltaic module, and relates to the field of heterojunction solar cells. The heterojunction solar cell comprises a substrate; a front passivation layer and a front anti-reflection layer are sequentially arranged on the front surface of the substrate from inside to outside; the back surface of the substrate is provided with an N-type contact region and a P-type contact region; the N-type contact area is provided with a first passivation layer, a first conductive layer, a first mask layer, a seed layer, a copper gate electrode, insulation paste and a solder strip from inside to outside in sequence. The P-type contact area is provided with a second passivation layer, a second conductive layer, a third conductive layer, a seed layer, a copper gate electrode and a solder strip from inside to outside in sequence. Solder paste is arranged on the side wall of the copper gate electrode. The copper electroplating technology can accurately control the height and width, and is of a main-grid-free structure, so that the material cost is reduced, and the double-sided rate of the solar cell is improved; the conductivity of copper is superior to that of silver paste, so that the short-circuit current, the filling factor and the efficiency of the solar cell structure can be improved.

The invention discloses a multi-stage micro-nano structure flexible wearable pressure sensor inspired by skin, and a preparation method and application of the multi-stage micro-nano structure flexible wearable pressure sensor. The sensor is composed of a piezoresistive layer, an electrode layer and a packaging layer. The piezoresistive layer takes polydimethylsiloxane (PDMS) as a flexible substrate, a submillimeter-level cylindrical array main structure and a micron-level skin-like spinous secondary microstructure randomly distributed at the top end of the submillimeter-level cylindrical array main structure are constructed through a composite mold, and a nano-level conductive network is formed by adopting an MXene / MWCNT hybrid material through a dispensing process, so that multi-scale stress synergistic response is realized; the electrode layer takes a degradable lignocellulose biological plastic film prepared from bagasse as a base material, and a silver paste interdigital electrode is loaded through a screen printing process; the packaging layer is fully coated with a medical-grade polyurethane (PU) film so as to ensure signal stability. The sensor shows ultrahigh sensitivity, wide detection range and low detection limit through the synergistic effect of the submillimeter-micron-nano multilevel structure, and can be applied to the fields of human motion monitoring, intelligent electronic skin and the like.

The invention discloses a full-opening solar cell printing plate, and belongs to the technical field of solar cell printing. The full-opening solar cell printing plate comprises a frame, an annular auxiliary material piece and a graphical steel plate, the graphical steel plate is arranged on the annular auxiliary material piece, an avoiding area is larger than a graphical area of the graphical steel plate, the graphical steel plate comprises a buffer metal layer and a first metal layer, the graphical area of the buffer metal layer is provided with a plurality of first grid line holes, and the first grid line holes are communicated with the annular auxiliary material piece. A plurality of second grid line holes are formed in the pattern area of the first metal layer, at least one buffer metal layer is arranged on the pasting and printing face of the first metal layer, the first grid line holes are communicated with the corresponding second grid line holes, and the hardness of the buffer metal layer is smaller than that of the silicon wafer. According to the method, the surface of the steel plate can be matched with the uneven surface of the silicon wafer in the printing process, consumption of printing silver paste is saved, stable batch production is facilitated, and the electrical performance of a battery piece is improved.

The invention relates to the technical field of silver paste preparation, in particular to a silver paste conductivity data modeling and formula optimization system based on machine learning, which comprises a data acquisition and storage module, a preprocessing module, a characteristic influence analysis module, a formula optimization module, a simulation verification module and the like. The method comprises the following steps: acquiring original data of a silver paste formula, preprocessing, calculating influence coefficients of all components on target performance by utilizing a machine learning model, and identifying high and low influence components; the formula optimization module is combined with component content constraints and adopts a multi-objective optimization algorithm to generate candidate formulas; and the simulation verification module verifies the performance of the formula through sintering simulation and process adaptation, and feeds back optimization. According to the invention, the full-process intelligentization of the silver paste formula from data processing to optimization verification is realized, the conductivity and other performances of the silver paste are accurately improved, the research and development cost is reduced, the period is shortened, the suitability of the formula process is enhanced, and the research and development and industrial upgrading of the silver paste are promoted.

The invention provides high-activity contact type silver powder for photovoltaic conductive silver paste, a preparation method of the high-activity contact type silver powder and the photovoltaic conductive silver paste, and belongs to the technical field of photovoltaic materials. The high-activity contact type silver powder comprises net-shaped polycrystalline spherical silver powder and an active layer wrapping the surface of the net-shaped polycrystalline spherical silver powder. Wherein the reticular polycrystalline spherical silver powder is a spherical aggregate formed by stacking and self-assembling flaky particles with the particle size of 200-600 nm, and the reticular polycrystalline spherical silver powder is of a porous structure; and the active layer is an organic amine compound. The silver powder disclosed by the invention has good conductivity after being sintered, the adhesive force of a fine grid is relatively high, and the assembly has relatively high power output.

The invention relates to a printed circuit board with a ceramic substrate embedded in a local area and a preparation method of the printed circuit board, and belongs to the technical field of semiconductor devices. The preparation method comprises the following steps: performing surface treatment on the upper surface and the lower surface of the core plate to form the L3 layer and the L4 layer; processing a through groove; sticking an adhesive tape; mounting the power chip module in the through groove; forming a first bonding layer and an L2 layer on the surface of the L3 layer; removing the adhesive tape; forming a second bonding layer and an L5 layer on the surface of the L4 layer; processing a blind hole and filling copper; processing a through hole and metalizing the inner wall; performing surface treatment on the L2 layer and the L5 layer; the ceramic substrate is bonded to the area, corresponding to the power chip module, of the surface of the L5 layer through silver paste and is baked and fixed; forming a third bonding layer and an L1 layer on the surface of the L2 layer; forming a fourth bonding layer and an L6 layer on the surface of the L5 layer; processing a blind hole and filling copper; performing surface treatment on the L1 layer; and resistance welding processing, anti-oxidation treatment and cutting forming are carried out. According to the preparation method, the heat dissipation performance and the voltage tolerance of the printed circuit board can be effectively improved.

The invention discloses high-temperature photoetching silver paste suitable for narrow line width and line spacing, which is prepared from the following components in parts by weight: 20-40 parts of photosensitive resin, 20-40 parts of ethoxylated 1, 2, 4-trimethyl-1, 3-pentanediol monoisobutyrate, 20-30 parts of a solvent and 1- The invention relates to a photocurable conductive coating which is prepared from the following components in parts by weight: 10 to 30 parts of 1, 6-hexanediol diacrylate, 5 to 15 parts of a photoinitiator, 0.5 to 1 part of an antioxidant, 0.5 to 1 part of 2-hydroxy-4-n-octyloxybenzophenone, 0.5 to 1.5 parts of a defoaming agent, 0.5 to 1.5 parts of a flatting agent, 0.5 to 1.5 parts of a dispersing agent, 5 to 20 parts of an organic solvent, 60 to 85 parts of conductive filler and 0.5 to 5 parts of glass powder. The selected photosensitive resin is formed by mixing alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin according to the weight part ratio of 10: (2-6). According to the high-temperature photoetching silver paste suitable for the narrow line width and line distance, the five steps of printing, baking, photoetching, developing and sintering are achieved, patterns which cannot be manufactured in a traditional printing mode can be manufactured, and a high-density circuit with the line width and the line distance reaching 20 micrometers / 20 micrometers can be manufactured.

The invention relates to the field of flexible sensing, and discloses a flexible dual-mode sensor with a foot arch and motion detection function, the flexible dual-mode sensor comprises an upper substrate, a lower substrate, an electrode layer, a conductive pin, a PVDF doped BTO-NPs nanofiber film and a PVDF doped ionic salt solution nanofiber film, the upper substrate and the lower substrate are polyimide films (PI), the electrode layer is an immersion gold (Au) pad, and the conductive pin is arranged on the electrode layer. The conductive pin is formed by fixing a copper wire on the electrode plate through silver paste, the nanofiber membrane is obtained by PVDF doped BTO-NPs and PVDF doped ionic salt electrostatic spinning, the gold immersion (Au) bonding pad membrane is designed on the PI substrate to form polar plates and electrodes of the capacitive sensor and the piezoelectric sensor, and the electrode plate is led out through the copper wire to serve as the conductive pin. According to the flexible dual-mode sensor, the flexible PI in a specific shape is prepared to serve as the upper substrate and the lower substrate of the flexible dual-mode sensor, and the gold immersion (Au) bonding pad films are designed on the PI substrates, so that the flexible sensor has flexibility and ductility and is more attached to surfaces with different curvatures.

The invention provides high-wettability glass powder, a preparation method of the high-wettability glass powder and BC battery conductive silver paste, and belongs to the technical field of photovoltaic battery paste. The glass powder comprises the following components in parts by mass: 50-60 parts of a first component, wherein the first component is PbO and Bi2O3; 30 to 40 parts by mass of a second component, wherein the second component is TeO2 and SiO2; the third component is prepared from the following components in parts by mass: Li2CO3, Na2CO3 and K2CO3; and 0.1 to 5 parts by mass of a fourth component, wherein the fourth component is at least one of MoO3, In2O3, SeO2, WO3, Al2O3 and ZnO. The glass powder disclosed by the invention has good wettability, and the problems of high interface resistance and low filling factor caused by non-uniform thickness of a glass layer in the prior art are solved.

The invention provides high-performance silver powder suitable for TOPCon battery fine grid silver paste, a preparation method of the high-performance silver powder and the silver paste, and belongs to the technical field of photovoltaic materials. The preparation method comprises the steps that a silver salt solution and a composite reducing agent are mixed, a first-stage hydrothermal reaction is carried out at the first temperature, a second-stage hydrothermal reaction is carried out at the second temperature, and silver powder is obtained after centrifugation, washing and drying; wherein the composite reducing agent is selected from a mixture of two of potassium tartrate, sodium sulfite and ferrous sulfate. According to the method, gradual growth and crystallinity improvement of silver crystal nucleuses are achieved through two-stage heating, particle aggregation or uneven morphology caused by rapid reduction is avoided, in addition, the adopted composite reducing agent combination is remarkably superior to a single reducing agent (such as ascorbic acid), and the morphology and particle size distribution of the silver powder can be more accurately regulated and controlled.

The invention discloses a preparation method of a bottom cell of a perovskite / crystalline silicon laminated solar cell, which comprises the following steps of: providing a bottom cell precursor with a surface heavily doped silicon layer and / or an emitter layer exposed, and depositing a hydrogen-rich metal oxide layer on the front surface or double surfaces of the bottom cell precursor by adopting an ALD (Atomic Layer Deposition) method; depositing a hydrogen injection passivation layer on the emitter layer on the back surface of the bottom cell precursor by adopting a PECVD method; printing low-aluminum-content silver paste on the hydrogen injection passivation layer to obtain a metal electrode grid line, and drying, shaping and slightly sintering the metal electrode grid line; and placing the lightly sintered bottom cell precursor in LECO equipment, and carrying out single-sided LECO treatment on a back metal electrode of the bottom cell to obtain the bottom cell. The preparation method is simple, streamline production is easy, the bottom cell precursor does not need to be additionally processed, the bottom cell precursor on a production line can be cut out for back metal electrode preparation and subsequent single-side LECO processing, and preparation and removal of a front metal electrode of the bottom cell are not needed.

The invention discloses a broadband paper-based honeycomb microwave absorber with bidirectional impedance gradually changing, and relates to the technical field of electromagnetic protection radar stealth, the broadband paper-based honeycomb microwave absorber comprises a paper-based honeycomb structure, the paper-based honeycomb structure comprises N paper-based honeycomb units which are periodically arranged, and a bottom plate of each paper-based honeycomb unit is a grounded metal bottom plate; wherein each paper-based honeycomb unit comprises six honeycomb walls, the six honeycomb walls are a first honeycomb wall, a second honeycomb wall, a third honeycomb wall, a fourth honeycomb wall, a fifth honeycomb wall and a sixth honeycomb wall in sequence, and impedance gradual change structures are printed on the inner surfaces of the first honeycomb wall, the second honeycomb wall and the sixth honeycomb wall; or impedance gradient structures are printed on the inner surfaces of the second, fourth and sixth honeycomb walls; or impedance gradient structures are printed on the inner surfaces of the second, third, fifth and sixth honeycomb walls; the impedance gradual change structure is composed of carbon paste and silver paste, and bidirectional impedance gradual change from the free space to the grounded metal bottom plate is achieved. The paper-based honeycomb microwave absorber has the advantages of light bearing, wide band, low profile and small thickness.

The invention discloses a SiC power module sintering packaging method, and relates to the technical field of power module packaging, and the method comprises the steps: sequentially carrying out the ultrasonic cleaning, plasma activation and drying of a SiC chip and a ceramic substrate, and obtaining an activated ceramic substrate and a SiC chip; the surfaces of the activated ceramic substrate and the SiC chip are spin-coated with nano-silver paste, and a nano-porous silver layer is formed through pre-curing and low-temperature sintering; aligning the graphene / nano-porous silver composite layer chip with the ceramic substrate, performing segmented pressure sintering in a vacuum sintering furnace, and outputting a SiC power module; the SiC power module is subjected to epoxy resin packaging glue coating, ultraviolet light curing and annealing treatment, internal stress is eliminated, and the corrosion resistance is enhanced; and screening a SiC power module, performing XRD and SEM detection, coating a high-temperature-resistant silica gel sealing layer, performing curing, and outputting a finished product. Through the epoxy resin packaging adhesive coating and thermal-acoustic combined annealing technology, the residual stress of the packaging interface is released, the service life of the SiC power module is prolonged, and the adaptability of the SiC power module is improved.

The invention discloses metallized silver paste for improving sintering dusting of a TOPCon battery, a preparation method and application, and belongs to the technical field of solar battery manufacturing, and the technical scheme is that the metallized silver paste comprises the following components in percentage by mass: 72-87% of a metal phase; 3-9% of a glass phase; 8-12% of an organic carrier; 0.1%-0.5% of a polyimide precursor; 0.1 to 0.5 percent of cerium oxide; wherein the polyimide precursor forms a cross-linked network at a high temperature, the cerium oxide is used as a passivation layer protective agent, and lithium borosilicate glass is also added into the glass phase; according to the metalized silver paste for improving the sintering dusting of the TOPCon cell, the preparation method and the application, the dusting rate is reduced by improving and optimizing materials and process parameters, and compared with a traditional process, the efficiency, the photoelectric conversion efficiency and the yield of the solar cell are further improved.

The invention discloses a secondary texturing method, a monocrystalline silicon wafer and a solar cell, the textured monocrystalline silicon wafer is immersed in a secondary texturing solution, and texturing is carried out for 100-200 s at 55-70 DEG C, so that the textured structure of the monocrystalline silicon wafer comprises a pyramid with the bottom edge length of 2-7 [mu] m, the top of the pyramid is round and full, the pyramid is overlooked, and the textured structure of the monocrystalline silicon wafer is obtained. And the side surface of the tower is provided with a step-shaped microstructure which is transited to the tower top layer by layer. The textured structure prepared by the method disclosed by the invention is beneficial to uniform growth of the amorphous silicon film, the passivation quality of amorphous silicon is improved, the service life of a carrier is prolonged, the light trapping effect is improved, and the reflectivity of a silicon wafer is reduced. Meanwhile, the prepared suede structure has a larger specific surface area, so that the contact area of the low-temperature conductive silver paste and the silicon wafer is larger, and the silver paste and the silicon wafer have better ohmic contact; the step-shaped microstructure of the tower surface enables the adhesive force of the silver paste to be increased on the surface of the pyramid, the width of the grid line can be reduced, the shading area and the silver paste consumption are reduced, and the purposes of reducing cost and improving efficiency of the HJT battery are achieved.

The invention belongs to the technical field of conductive silver paste, and particularly relates to composite conductive silver paste and a preparation method and application thereof. The raw materials comprise modified silver powder, glass powder and an additive; wherein the raw materials of the modified silver powder comprise micron-scale silver powder and nano-scale silver powder; the organic carrier comprises the following raw materials: polyimide resin, simethicone and a dispersing agent; the additives comprise carbon nanotubes, a titanate coupling agent, fumed silica, a defoaming agent and an organic carrier. The method comprises the following steps: adding the modified silver powder, the glass powder, the carbon nano tube, the titanate coupling agent, the fumed silica and the defoaming agent into the organic carrier, and stirring to obtain primary mixed slurry; and grinding the preliminary mixed paste until the fineness of the paste is less than or equal to 5 microns, and then defoaming to obtain the composite conductive silver paste. The composite conductive silver paste is applied to preparation of a flexible circuit board. The printing forming process is adopted, waste water and waste gas are avoided, safety is high, and production efficiency is high.

The invention discloses conductive silver paste for a solar cell and application of the conductive silver paste, and belongs to the technical field of conductive silver paste. According to the invention, the prepared silver paste is printed on a silicon wafer cell in a silk-screen printing manner, so that the good rheological property of printing can be obtained. And a rheometer is introduced for testing, and an SEM scanning electron microscope is introduced for checking the surface appearance of the silver grid line. The invention discloses a TOPCon silicon wafer for a silicon solar cell, which comprises the following components in percentage by weight: 82-90% of silver powder, 20-30% of glass powder and 20-30% of organic carrier. 2-5% of glass powder; and 8-13% of an organic carrier. The conductive silver paste with good rheological property is prepared by using a mixture of polyamide wax and hydrogenated castor oil in a mass ratio of 1: 1 as a thixotropic agent. The main grid silver paste for the silicon solar cell provided by the invention can be well matched with step-by-step printing of a cell piece, different proportions of the binder and the thixotropic agent are used, the photoelectric conversion efficiency is high, the peeling strength of the main grid is high, and the step-by-step printing main grid paste requirements of current different types of paste and cell pieces can be well met.

The invention discloses high-conductivity low-temperature sintering composite copper paste and a preparation method and application thereof, and belongs to the technical field of conductive paste. The composite copper paste consists of the following components in percentage by mass: 70-90% of a conductive phase, 2-10% of a binding phase and the balance of an organic carrier. Wherein the conductive phase comprises cuprous hydride modified copper powder and a copper complex; the copper complex is formed by a copper compound and an organic ligand through a coordination reaction. The copper paste can be sintered to form an electrode or a circuit in a nitrogen atmosphere at a temperature of less than or equal to 300 DEG C, and has the advantages of low resistivity, good oxidation resistance, strong adhesion and the like, and the cost of the copper paste is obviously lower than that of silver paste. The invention also provides a preparation method of the composite copper paste and an application of the composite copper paste in preparation of an electronic component electrode or a conductive circuit.