445 results about "Copper complex" patented technology

Soluble copper(I)-amine complexes, particularly copper(I)-ammonia complexes and copper(I)-monoethanmolamine complexes, are useful injectable wood preservatives. Wood treated with the copper(I)-amine complexes contains less amines, and is less corrosive to metals, than woods treated with the prior art copper(II)-amine complexes. A method of preparing an aqueous wood preservative that includes soluble copper(I) complexes comprises reacting a solution comprising a copper(II)-amine complex with metallic copper to form a copper(I)-amine complex. One aspect of the invention comprises injecting a solution comprising a copper(I)-amine complex into wood and allowing the copper(I)-amine complex to precipitate within the wood.

A method for treating rosacea of the skin of a patient employs topically applying to the affected skin a composition comprising at least one peptide copper complex. In other embodiments, the present invention is directed to such a method where the composition used therefor further comprises certain disclosed active agents, including active drug and active cosmetic substances. In a related aspect, further embodiments of the present invention are directed to compositions comprising at least one peptide copper complex and certain active drug and active cosmetic substances that render the compositions particularly effective in treating rosacea.

There is provided a high light-emission-efficiency, highly stable, low-cost light emitting device that utilizes a copper complex as a light emitting material and comprises a pair of electrodes provided on a substrate, and an organic substance layer provided between the electrode and comprising a metal coordination compound having a partial structure represented by the general formula: wherein Cu represents a copper ion.

A flux contains resin having film forming ability, activator, solvent, and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.

The present invention relates to copper complex with imidazole as ligand. Ionic one-valent copper complex is prepared with pyridyl imidazole, pyridyl benzimidazole or quinolyl benzimidazole as the first ligand, triphenyl phosphine or bridged phenyl phosphine as the second ligand and one-valent copper ion. Neutral copper complex may be further obtained under the action of alkali. The ionic copper complex and the neutral copper complex may convert mutually under the action of acid and alkali. This kind of complex possesses strong room temperature phosphorescence emission and may be used as light emitting material.

The present invention relates to a structure and a method for selectively forming a compact and precise metal pattern on a plastic substrate surface. The structure comprises three layers of materials such as a plastic substrate, nickel or zinc or an indium tin oxide material, and a metal subsequently deposited on the material, wherein the nickel or the zinc or the indium tin oxide material is formed through adopting laser to irradiate the plastic substrate, decomposing an additive previously added to the plastic, and adopting reductive chemical plating to treat. The manufacturing method comprises: adopting laser to selectively scan the plastic substrate. According to the present invention, the additive does not adopt a copper-containing oxide, a copper chelate, a copper complex and a metal oxide having a spinel structure, and adopts the environmentally friendly non-toxic inorganic salt containing nickel and zinc, and the indium tin oxide material, the coupling agent is adopted to carry out coating modification to prepare the additive having a core-shell structure, and the additive is added to the plastic to prepare the laser composite plastic; the laser is adopted to decompose the shell part of the additive so as to release active ingredients in the core; the present invention belongs to a new material based advanced assembly and manufacturing technology in the field of electronic and electric apparatuses; and the structure and the method are used for manufacturing mobile phone antennas, transparent lamp parts, automobile parts, three-dimensional circuits and other products.

The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.

This invention relates to a polyvinyl alcohol type polarizing film or plate which comprises a water-soluble dye having the formula (1) in a free acid form or a copper complex salt thereof. The said polarizing plate has excellent polarizing performance capability and durability, and is suitably used for the green channel of a liquid crystal projector when B in formula (1) is a benzoylamino group and the water-soluble dye has a wave length for maximum absorption (λmax) of 520 nm or more and less than 580 nm.

The present invention relates to an azo compound represented by the following formula (1):

wherein A denotes a phenyl group having 1 to 3 substituents such as sulfonic acid group, amino group, lower alkyl groups and lower alkoxyl groups, or a naphthyl group, B denotes hydrogen atom, sulfonic acid group, a lower alkyl group, a lower alkoxyl group or the like, each of R¹ to R⁴ independently denotes hydrogen atom, a halogen atom, a lower alkyl group, a lower alkoxyl group or the like, D denotes —NHCO—, —N═N— or —NH—, E denotes hydrogen atom, a lower alkyl group or a phenyl group having 1 to 3 substituents such as hydroxyl group and amino group, n denotes 0 or 1, and m denotes 0 or 1, or a salt thereof, or a copper complex compound of either of them, which is used for a polarizing plate having excellent polarization performance and durability and furthermore little color leakage in visible light range.

An electromagnetic-wave shielding and light transmitting plate is thin and light, hard to be broken, and hard to scatter even if broken. Further, the electromagnetic-wave shielding and light transmitting plate has significantly improved electromagnetic-wave shielding function and near infrared ray blocking function so that it can be suitably used as an electromagnetic-wave shielding filter for a PDP, and has high transparency so that distinct pictures are displayed. Furthermore, the electromagnetic-wave shielding and light transmitting plate has durability of near infrared ray blocking function, that is, excellent in resistance to heat, moisture, and ultraviolet ray. The plate has a ransparent base plate 2, an antireflection film 8, a conductive mesh member 3, and a near infrared ray blocking film 5 which are laminated and integrated by adhesive intermediate films 4A, 4B and adhesive agent 4C. The near infrared ray blocking film 5 comprises a base film and a near infrared ray blocking layer on a surface of the base film, wherein said near infrared ray blocking layer contains a near infrared ray absorbing agent composed of diimmonium compound and a copper type antioxidant such as 1,2-benzenethiol copper complex compound.

A carbon quantum dot based on a copper complex and a preparing method thereof are disclosed. Copper disodium ethylenediaminetetraacetate having a saturated Schiff base structure is adopted as a raw material, the copper complex and a carbon quantum dot having a structure similar to that of graphene are composited, and the carbon quantum dot based on the copper complex is prepared by a thermo-polymerization method so as to improve electron transfer capability of photosensitizers of this type. The prepared carbon quantum dot based on the copper complex is good in water solubility, electron receptivity, electron releasing capability and electrical conductivity and wide in visible-light response range, and is an excellent photosensitizer. By application of the photosensitizer into a photooxidation reaction of 1,4-dihydropyridine, efficient photo-catalytic oxidation of reactions of this type is achieved and byproducts only comprise water and oxygen.

The invention discloses a copper complex catalyst for an acetylene hydrochlorination reaction and a preparation method thereof. The copper complex catalyst for the acetylene hydrochlorination reactioncomprises a carrier and a copper complex, wherein the copper complex is loaded onto the surface of the carrier; the copper complex is formed by complexing copper salt and an organic phosphate-containing ligand. According to the copper complex catalyst for the acetylene hydrochlorination reaction and the preparation method thereof, the preparation method is simple, the operation is convenient andthe preparation cost is low; the prepared catalyst is a base metal catalyst, is low in price, and has relatively good stability, relatively high conversion rate and relatively high selectivity.

Copper salts and copper organic complexes are added to thermal inkjet inks, to deliver copper to a resistor surface where the copper ion aids in removal of koga.

The invention relates to a copper complex based on a dipyridine bisamide organic ligand and Keggin type polyoxometalate, its synthetic method and its application. A molecular formula is one of the following formulas: [Cu2(L<1>)3(H2O)6(SiMo12O40)].2H2O; [Cu2(L<2>)3(H2O)6(SiMo12O40)].9H2O; [Cu2(L<2>)3(H2O)6(SiW12O40)].6H2O; [Cu2(L<3>)3(H2O)6(SiMo12O40)].6H2O; [Cu2(L<3>)3(H2O)6(SiW12O40)].6H2O; wherein L<1> is N, N'-di(3- pyridylformamido)-1,2-ethane; L<2> is N, N'-di(3-pyridylformamido)-1,4-butane; L<3> is N, N'-di(3-pyridylformamido)-1,6-hexane. The method comprises the following steps: addingdeionized water in the Cu(NO3).3H2O, Keggin type polyoxometalate, dipyridine diamide organic ligand, stirring under room temperature, regulating pH value, dumping in a high pressure reaction vessel and heating, insulating under hydrothermal condition, cooling to the room temperature to obtain bulk blue green crystals, alternatively cleaning by deionized water and ethanol, naturally drying under room temperature to prepare the copper complex based on dipyridine bisamide organic ligand and Keggin type polyoxometalate. The complex has the advantages of simple synthetic method, easy crystallization, high synthesis yield, strong affinity capability to water-soluble pollutants and good catalytic degradation effect, and can be used as photocatalysis materials.

The invention relates to a fluorescent probe for measuring generation of nitric monoxide and application of the fluorescent probe. The fluorescent probe is copper complex formed by Cu<2+> and organic ligand 2-(2-hydroxy phenyl) benzimadazoles derivatives, and has the structure of a formula (I) or a formula (II). The complex can simply and quickly enter into viable cells for specific acquisition of cells or active NO in tissues, thereby the fluorescence intensity of the complex is obviously increased, consequently the complex can be applied to the detection of NO in a chemical system, analytic detection and fluorescence imaging detection of NO in viable cells or living tissues of organisms, the detection of NO in lesion tissues clinically, and real-time detection of NO of living biological systems. The fluorescent probe has high NO measurement sensitivity; the minimum lower detectable limit of the fluorescent probe is 17 nmol/L; the fluorescent probe has good selectivity on the NO; fluorescence change is quick before and after the reaction with the NO; and the fluorescence is stable. Simultaneously, the probe has good stability, can be stored for use for a long time, and is suitable for various environments of neutrality, subacidity and alkalinity.

Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.