This invention discloses a parallel material cleaning
machine and cleaning method, relating to the field of
silicon wafer cleaning. It includes a cleaning table, a first drive beam, a cleaning frame, a receiving box, and a cleaning mechanism. The cleaning mechanism is used to clean the cleaning frame and
silicon wafers at the receiving position of the receiving box to remove residual liquid. By setting up the receiving box and cleaning mechanism between
degreasing and
pickling, residual
degreasing agent, saponified substances, and
grease on the workpiece surface are removed, eliminating the triple hazards of
neutralization failure, salt
contamination, and uncontrolled foaming caused by alkaline substances mixing into the
pickling tank, ensuring stable free acidity of the
pickling solution. This invention, by setting up the receiving box and cleaning mechanism between pickling and
passivation, not only rinses the surface acid solution but also neutralizes residual acid radicals through the penetration of a neutralizing agent into the micropores, and removes
calcium and
magnesium ions with deionized water, completely avoiding the
contamination of acid and Fe²⁺. + Cl ‑ SO4² ‑ By allowing pollutants to enter the phosphating tank, problems such as
system collapse, membrane failure, and excessive
sludge accumulation can be prevented.