Photoresist pattern trimming methods

Abstract

Provided are methods of trimming photoresist patterns. The methods involve coating a photoresist trimming composition over a photoresist pattern, wherein the trimming composition includes a matrix polymer, a free acid having fluorine substitution and a solvent, the trimming composition being free of cross-linking agents. The coated semiconductor substrate is heated to cause a change in polarity of the resist polymer in a surface region of the photoresist pattern. The photoresist pattern is contacted with a developing solution to remove the surface region of the photoresist pattern. The methods find particular applicability in the formation of very fine lithographic features in the manufacture of semiconductor devices.

Description

[0001]This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61 / 582,336, filed Dec. 31, 2011, the entire contents of which are incorporated herein by reference.BACKGROUND[0002]The invention relates generally to the manufacture of electronic devices. More specifically, this invention relates to methods of trimming photoresist patterns useful in shrink processes for the formation of fine lithographic patterns.[0003]In the semiconductor manufacturing industry, photoresist materials are used for transferring an image to one or more underlying layers, such as metal, semiconductor and dielectric layers, disposed on a semiconductor substrate, as well as to the substrate itself. To increase the integration density of semiconductor devices and allow for the formation of structures having dimensions in the nanometer range, photoresists and photolithography processing tools having high-resolution capabilities have been and continue to be dev...

AI Technical Summary

Benefits of technology

The invention provides methods for improving the process window for forming patterns on semiconductor substrates. The methods involve using a photoresist composition with a matrix polymer that can be heated to change polarity, and a developing solution to remove the surface region of the photoresist pattern. This results in a smoother and more stable pattern formation process.

Problems solved by technology

This creates a difference in solubility characteristics between exposed and unexposed regions of the resist in an aqueous alkaline developer solution.

This standard immersion lithography process, however, is generally not suitable for manufacture of devices requiring greater resolution, for example, for the 32 nm and 22 nm half-pitch nodes.

Achieving a good process window for isolated lines and posts through direct lithographic imaging is, however, extremely difficult due to poor aerial image contrast at defocus as compared with dense lines.

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