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5667 results about "Nitrogen oxide" patented technology

Nitrogen oxide may refer to a binary compound of oxygen and nitrogen, or a mixture of such compounds: Nitric oxide, also known as nitrogen monoxide, nitrogen oxide Nitrogen dioxide, nitrogen oxide Nitrous oxide, nitrogen oxide Nitrosylazide, nitrogen oxide Dinitrogen trioxide, nitrogen oxide Dinitrogen tetroxide, nitrogen oxide Dinitrogen pentoxide, nitrogen oxide Trinitramide, nitrogen oxide In addition, nitrogen oxides form several radicals. The most stable of these is the nitrate anion: Nitrate, nitrogen oxide but other nitrogen oxoanions include nitrite, peroxonitrite, trioxodinitrate, and nitroxylate. In atmospheric chemistry, air pollution, and related fields, nitrogen oxides refers specifically to NOₓ. Only the first three of these compounds can be isolated at room temperature. N₂O₃, N₂O₄, and N₂O₅ all decompose rapidly at room temperature. NO₃, N₄O, and N(NO₂)₃ are very reactive. N₂O is stable and rather unreactive at room temperature, while NO and NO₂ are quite reactive but nevertheless quite stable when isolated. Nitric oxide, NO Nitrogen dioxide, NO₂

Thin films

Thin films are formed by formed by atomic layer deposition, whereby the composition of the film can be varied from monolayer to monolayer during cycles including alternating pulses of self-limiting chemistries. In the illustrated embodiments, varying amounts of impurity sources are introduced during the cyclical process. A graded gate dielectric is thereby provided, even for extremely thin layers. The gate dielectric as thin as 2 nm can be varied from pure silicon oxide to oxynitride to silicon nitride. Similarly, the gate dielectric can be varied from aluminum oxide to mixtures of aluminum oxide and a higher dielectric material (e.g., ZrO2) to pure high k material and back to aluminum oxide. In another embodiment, metal nitride (e.g., WN) is first formed as a barrier for lining dual damascene trenches and vias. During the alternating deposition process, copper can be introduced, e.g., in separate pulses, and the copper source pulses can gradually increase in frequency, forming a transition region, until pure copper is formed at the upper surface. Advantageously, graded compositions in these and a variety of other contexts help to avoid such problems as etch rate control, electromigration and non-ohmic electrical contact that can occur at sharp material interfaces. In some embodiments additional seed layers or additional transition layers are provided.
Owner:ASM INTERNATIONAL

Control unit and control method for reductant supply device

There are provided a reductant supply device and a control method for the reductant supply device, which can prevent heat damage of a reductant injection valve, and also prevent crystallization of urea solution due to excessive cooling of the solution reductant.The reductant supply device which is used in an exhaust gas purification device that injects and supplies, as a reductant, a urea solution to an exhaust gas upstream side of a reduction catalyst disposed in an exhaust gas passage of an internal combustion engine, and that reduces and purifies nitrogen oxides contained in exhaust gas using the reduction catalyst, the reductant supply device having a reductant injection valve that is fixed to an exhaust pipe on the exhaust gas upstream side of the reduction catalyst, includes: a cooling water circulation passage that circulates at least part of cooling water of the internal combustion engine to cool the reductant injection valve; flow rate control means for adjusting a flow rate of cooling water flowing through the cooling water circulation passage; temperature detection means for detecting a temperature of the reductant injection valve; and control means for controlling the flow rate control means based on the temperature of the reductant injection valve.
Owner:BOSCH CORP
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