301 results about "Gold plating" patented technology

The invention relates to the technical field of semi-gold-nickel plating and processing, in particular to a floating connector terminal continuous semi-gold-nickel plating process which comprises the following preparation steps: S1, a floating connector terminal to be electroplated is put into degreasing fluid for degreasing treatment, and then the degreased terminal is put into activating fluid for activating treatment; s2, nickel electroplating is conducted on the activated floating connector terminal through a nickel plating solution, a nickel cake serves as an anode, the pH value of the nickel plating solution is controlled to be 3.5-5.5 through weak acid in the electroplating process, the electroplating current is controlled to be 0.4-0.8 A / dm < 2 >, the temperature is controlled to be 50-60 DEG C, cleaning is conducted, and the nickel-plated floating connector terminal is obtained; and S3, the nickel-plated floating connector terminal is put into the gold plating solution to be electroplated, the electroplating temperature is 40-50 DEG C, the current density is 0.1-2 A / dm, a finished product is obtained, and the floating connector terminal can still keep high conductivity, low contact resistance, high abrasion resistance and high corrosion resistance under the complex environments of high temperature, vibration, salt mist and the like through the technology.

To provide an electrolytic gold plating solution having a long lifespan without toxicity, in which plating can be performed with the solution temperature of 35°C or lower and the plating film can uniformly be electrodeposited with excellent plating properties, and a production method of the solution.SOLUTION: An electrolytic gold plating solution includes a non-cyanide soluble gold salt (A) and a complexing agent (B) for complexing gold ions of the gold salt. The complexing agent (B) is a mercaptotetrazole compound expressed by the following general formula (1). The molar ratio (B / A) of the complexing agent (B) to the soluble gold salt (A) is between 10 and 260. The pH of the gold plating solution is less than 3.SELECTED DRAWING: Figure 1

The application discloses a kind of low resistance low inductance high reliable electrode connecting structure for high voltage Pockels cell, belongs to Pockels cell electrode connecting technical field, solve the existing Pockels cell electrode connecting structure connection reliability problem, electric contact medium performance is not good;Including anti-drop insulating sleeve, pin, input electrode, metal hair button, shell and crystal;The top of pin is equipped with anti-drop insulating sleeve, the bottom of pin is connected with input electrode, input electrode is installed in the mounting hole of shell, the inside of shell is provided with crystal, and the outer side surface of both ends of crystal is provided with gold plating layer;Metal hair button at the bottom of input electrode is pressed on gold plating layer.In the application, pin and input electrode are inserted into position and wrapped by anti-drop insulating sleeve, input electrode is not exposed, and the personal safety hazard of high-voltage electric shock is fundamentally eliminated;Metal hair button is used instead of conductive rubber, to ensure that the contact pressure with crystal electrode is constant, and the anti-vibration and anti-impact performance is strong.

The invention discloses a method for composite etching of an electroplating gold plating layer, which comprises the following steps of: manufacturing a photoetching pattern on the front surface of gallium arsenide epitaxy, then evaporating a metal contact layer, depositing a SiNx protective mask layer, performing Mesa mesa etching on the gallium arsenide epitaxy, exposing a high-aluminum layer on the side surface of an epitaxial material, and forming an aluminum oxide limiting layer by adopting a wet oxidation process; a second SiNx protective mask layer continues to be deposited, and the metal contact layer is exposed through dry etching; forming a seed gold layer by adopting magnetron sputtering TiW / Au metal, and forming a photoresist mask with a target electrode pattern on the seed gold layer; electroplating thick gold on the photoresist mask pattern; the photoresist mask layer is removed after completion; the method of combining dry etching and wet etching is adopted to remove the gold plating layer in the non-electroplating area, so that the lateral corrosion of the metal layer is obviously reduced, the high-precision and high-fidelity electrode pattern transfer is realized, the lateral corrosion of the metal layer is reduced, and the passivation protection effect of the device is improved.

The utility model belongs to the technical field of metal gasket production, and particularly relates to a gold plating device for metal gasket production, which comprises a bottom plate, the top of the bottom plate is fixedly connected with a gold plating box; the side wall of the gold plating box is fixedly connected with a side plate; the side wall of the side plate is fixedly connected with a groove plate; the top of the groove plate is fixedly connected with a first motor; a lead screw is rotationally connected into the groove plate. The lead screw is connected with the output end of the first motor. The middle part of the screw rod is in threaded connection with a T-shaped plate; the side wall of the T-shaped plate is fixedly connected with a supporting plate. The top of the supporting plate is fixedly connected with a second motor. Through the structure, the metal gasket can be effectively and fully contacted with an electroplating solution, so that each part of the gasket can be more uniformly contacted with the electroplating solution, the thickness difference of a plating layer caused by non-uniform concentration distribution of metal ions in the solution is reduced, meanwhile, convection of the electroplating solution can be promoted through rotation of the placing basket, and the electroplating effect is improved. Transmission of metal ions to the surface of the gasket is accelerated, and the electroplating rate is increased.

The application discloses a sealing method of an ultra-thick high-low frequency metal shell, which comprises the following steps: pre-oxidation and pre-plating of raw materials, cleaning of a mold; pre-oxidation and pre-plating of the raw materials to obtain a shell, a lead wire and glass; a section of glass is assembled with the shell and the lead wire, a graphite column is sleeved on the lead wire to press the glass, and the whole is placed in a selected atmosphere to perform first sealing at 800-1200 DEG C. After the first sealing, the mold and the graphite column are removed, the sealed metal shell is treated in diluted hydrofluoric acid for dozens of seconds, a second section of glass is assembled, and the assembled shell is placed at 800-1200 DEG C to perform second sealing. The plating mode of the high-low frequency metal shell is gold plating, copper plating, nickel plating or the like. The application uses step-by-step sealing to replace conventional one-step sealing, and meets the use requirements of high insulation and voltage resistance of the metal shell; and provides technical support for mass production of other types of ultra-thick metal shells.

The application discloses a kind of connector local gold plating control method, equipment and system, it is related to electroplating technical field.The method comprises the following steps: in response to the gold plating operation of the first connector of target connector type, the plating thickness value of the multiple detection points in the gold plating area of the first connector, the concave area of gold plating area and the first electroplating unevenness of gold plating area are obtained;Determine the first form complexity of gold plating area based on the plating thickness value of the multiple detection points in the gold plating area of the first connector and the concave area of gold plating area;Determine the necessity of hieroglyphic plate based on the first electroplating unevenness of gold plating area and the first form complexity of gold plating area;The necessity of hieroglyphic plate is the necessity of using hieroglyphic plate when the gold plating operation of the connector of target connector type is executed;In response to hieroglyphic plate necessity degree greater than preset necessary degree threshold value, the gold plating operation of the connector of target connector type is executed by hieroglyphic plate.The present application can improve the accuracy of gold plating control.

The application provides a kind of gold plating and K gold sample identification method and system, through X-ray detector, the energy spectrum of the sample to be measured is collected, the original X-ray spectrum of the sample to be measured is obtained, the original X-ray spectrum is smoothed, the target X-ray spectrum of the sample to be measured is obtained, the initial simulation spectrum of the sample to be measured is generated according to the target X-ray spectrum, the initial simulation spectrum is corrected by iterative algorithm, until the deviation of the characteristic peak intensity of each element in the target simulation spectrum obtained after correction and the corresponding element in the target X-ray spectrum meets the preset convergence condition, whether the sample to be measured is gold-plated sample is judged according to the target simulation spectrum, in the above manner, it is favorable to improve the accuracy of detection result, reduce the misjudgment rate in the scene such as thick plating layer misjudgment, similar component confusion.

The utility model discloses a power inductor structure with a conducting plate plated with a metal layer, which relates to the field of inductors and comprises an inductor body and the conducting plate arranged on the inductor body, and a silver metal layer is plated on the surface of the conducting plate. A U-shaped shielding cover is fixedly embedded in the bottom of the inductor body and located outside the guide pieces, and a shielding assembly is arranged in the U-shaped shielding cover. The top of the U-shaped shielding cover is provided with a heat conduction assembly in contact with the upper surface of the guide piece, and a ventilation opening is formed in the position, corresponding to the heat conduction assembly, of the side wall of the inductor body. The conductive sheet plated with the metal layer improves the conductivity and the corrosion resistance of the conductive sheet, has a shielding and heat dissipation structure, improves the anti-electromagnetic interference performance and the heat dissipation performance of the conductive sheet, and improves the performance of the power inductor.

The invention discloses a multi-layer composite structure gold-plated inner layer drinking water conveying pipeline and a preparation method thereof, and belongs to the field of drinking water conveying pipelines. The pipeline is of a four-layer composite structure, the outer layer is a 316L stainless steel pipe with the diameter being 1.2-3.0 mm, the middle layer is a food-grade epoxy resin layer with the diameter being 0.3-0.8 mm, the inner layer is a TP2 thin-wall copper pipe with the diameter being 0.5-1.5 mm, and the inner wall of the copper pipe is a 99.99% high-purity gold plating layer with the diameter being 0.001-0.002 mm. The preparation comprises six core processes, gold plating adopts an electroplating and chemical plating composite process, and parameters such as specific current density, plating solution temperature and the like are controlled. The designed service life of the pipeline is gt; 100 years later, sanitation and mechanical performance are excellent, the gold layer is firmly attached, the problems that a traditional pipeline is poor in corrosion resistance, and the gold layer is prone to falling off are solved, and the composite pipe is suitable for drinking water conveying scenes such as high-end residences and medical treatment.

The application discloses an additive for improving the bonding force of a chemical gold plating layer and a preparation method thereof, relates to the technical field of chemical gold plating, and comprises the following steps: preparing a pH buffer type-viscosity controlled substrate activation solution; adding an epoxy-based pre-anchoring-disulfide bond functionalized copolymer into an N-methyl-2-pyrrolidone solvent and stirring until complete dissolution; then, adding a pH buffer stabilizer and a thixotropic viscosity regulator in sequence and continuing to stir; and finally, carrying out ultrasonic dispersion and defoaming on the mixed solution, and then carrying out static defoaming to obtain the additive. The application realizes high bonding force without damaging sensitive substrates, and solves the technical problems of high-temperature failure, poor storage stability and low batch consistency through double covalent anchoring, pH locking and viscosity controlled design.

The utility model discloses a kind of light touch switches of falling anti-failure, it is related to electronic component technical field.It includes support and base, support is rectangular groove body, support front end is equipped with positioning hole, support left side bottom interval is equipped with two first support feet, support right side bottom interval is equipped with two second support feet, first support foot and second support foot respectively extend outward and present 90 degrees bending, support rear end is equipped with limit baffle;Base is located in support, base front end movably connects with the pressing handle of silica gel material, pressing handle passes through positioning hole, base front end is also equipped with multiple fixed columns, multiple electrically-conductive terminals are installed in base, electrically-conductive terminal is equipped with terminal pin, terminal pin extends backward and presents 90 degrees bending, terminal pin is brass material, and its surface is covered with gold plating layer by electroplating process.The utility model reduces the probability that light touch switch appears functional failure or damage due to falling, avoids short circuit of positive and negative electrode conduction of soldering pin.

The invention discloses a process method for promoting nitriding through an amorphous nitride pre-coating film, and belongs to the field of chemical heat treatment. The invention provides a process method for compounding a pre-plated amorphous nitride film and vacuum nitriding in order to achieve a larger nitriding layer depth in a shorter time, reduce the production cost and improve the hardness of a nitriding layer in order to solve the problem that an existing compounding process for pre-plated metal layers and nitriding does not effectively promote nitrogen elements to permeate into a substrate, and the invention provides the process method for compounding the pre-plated amorphous nitride film and the vacuum nitriding. Compared with a non-pre-plated part, the composite process has the advantages that the nitriding layer depth is increased by more than 30% at most and the surface hardness is increased by 22% at most within the same nitriding time.

The present application relates to the technical field of biochip, in particular to a multi-waveband synergic release permeation-quantitative biochip, which comprises a substrate, a permeation function layer and a gold plating layer stacked from bottom to top; the substrate is made of graphene material with a thickness of 0.05-0.1mm, used for receiving and storing environmental energy; the permeation function layer has a thickness of 0.1-0.3mm, which is made of a mixture of nano far infrared powder, anion powder, magnetic powder and nano catalytic material with a mass ratio of 3:2:2:1, and then compounded with a biocompatible adhesive; the present application simultaneously releases magnetic wave, far infrared wave, anion wave and quantitative wave, and has the dual functions of human physiotherapy and material purification, solves the problem of single function of the existing products, the energy storage capacity of the graphene substrate and the energy aggregation effect of the gold plating layer greatly improve the energy utilization efficiency, prolong the chip action time, the permeation technology strengthens the waveband penetration capacity, and when acting on the human body, it does not need to be pasted on the skin, and when acting on the material, it does not need to be soaked, and the use scene is flexible.

The application provides a preparation method of a PIN limiter based on a silicon-based PIN diode and the PIN limiter, and the method comprises the following steps: preparing a multistage PN junction on a silicon wafer substrate to obtain an N+ layer, a plurality of P+ layers and a plurality of I layer regions; preparing an upper electrode on the upper surface of each P+ layer; preparing a lower electrode on the lower surface of the N+ layer; preparing a first passivation layer on the upper surface of the N+ layer; etching a plurality of grooves to the N+ layer on the upper surface of the first passivation layer to prepare a plurality of ground pads based on the plurality of grooves; preparing an insulating dielectric layer on the upper surface of the first passivation layer; performing windowing on the upper surface of the insulating dielectric layer to form a plurality of openings; preparing a preset peripheral circuit on the upper surface of the insulating dielectric layer; and performing gold plating treatment in the plurality of openings to electrically connect the plurality of upper electrodes and the plurality of ground pads with the preset peripheral circuit. The single-chip preparation method is adopted, so that the prepared PIN limiter based on the silicon-based PIN diode is small in size and high in integration.

The embodiment of the application provides a manufacturing method of a golden finger circuit board and the golden finger circuit board. It relates to the field of circuit board processing technology. The method comprises the following steps: obtaining a to-be-processed circuit board; plating copper on the surface of the to-be-processed circuit board, and plating gold in the golden finger area of the to-be-processed circuit board, the length of the golden finger area being greater than or equal to a first threshold value; pasting dry film on the surface of a first area of the to-be-processed circuit board, the first area comprising a circuit area, a golden finger area and a first temporary lead area, the length of the first temporary lead area being less than or equal to a second threshold value; exposing the circuit area and the golden finger area, and developing the to-be-processed circuit board; and etching the to-be-processed circuit board to obtain the golden finger circuit board. The stability of data transmission can be improved.

To provide a backside connection access structure and a fabrication method.SOLUTION: A method includes forming a gold layer on at least a portion of a substrate. The method also includes forming a metal layer on the gold layer, and forming an opening in the substrate to expose at least a portion of the gold layer.SELECTED DRAWING: Figure 1

The invention discloses a stamping connection terminal and a preparation method thereof, and relates to the technical field of electric appliance connection terminals. The stamping connection terminal is integrally formed by continuously stamping a high-precision phosphor copper strip, and comprises a contact end and a connection end. The contact end comprises a pair of elastic contact arms which are oppositely arranged, the free end of each elastic contact arm is bent to form a guide flange with a guide surface, and a plurality of hemispherical contact salient points are arranged at the junction of the guide surface and the elastic contact arms. The connecting end is provided with a clamping structure, and the clamping structure is provided with at least two rows of antiskid teeth which are distributed in a staggered mode. And a transition region between the contact end and the connection end. The surface of the contact end is provided with a gold-plated layer, and the surfaces of the connecting end and the transition area are provided with a mist tin-plated layer. The purity of the high-precision phosphorus copper strip is larger than or equal to 99.95%, the content of phosphorus is 0.03-0.08 wt%, the tensile strength is 350-400 MPa, and the ductility is larger than or equal to 15%. According to the invention, the problems that the connection is not tight enough, the conductive performance is not stable and the preparation cost is high in the actual use process of the current connection terminal can be effectively improved.

The application provides a core cavity local thick gold sealing packaging shell, a packaged device and a preparation method, and belongs to the technical field of ceramic packaging, and comprises a ceramic piece with a core cavity, the bottom of the core cavity is divided into at least one chip mounting area and at least one passive device mounting area; the chip mounting area is provided with a sunken cavity, the bottom of the sunken cavity is at a different horizontal plane from the passive device mounting area; wherein the sunken cavity is a thick gold area, and the passive device mounting area is a thin gold area; the bottom of the sunken cavity is provided with a first gold plating layer, the passive device mounting area is provided with a second gold plating layer, and the thickness of the first gold plating layer is greater than that of the second gold plating layer. The bonding fingers of the thick gold part are sunken in the vertical direction of the ceramic piece, so that the thick gold part is lower than the thin gold part, thereby realizing the effect of different plating layer thicknesses in different areas inside the same ceramic piece, meeting the use requirements of low-temperature solder sintering and gold wire bonding, and meeting the requirements of high reliability of power supply SIP products with gradually increasing current and power consumption.

The invention discloses gold plating equipment utilizing tile waste heat, and relates to the technical field of tile gold plating equipment, the gold plating equipment comprises a kiln cooling zone, a base fixed at the side end of the kiln cooling zone, a machine table slidably distributed at the top of the base, and a transmission mechanism is arranged in the machine table; a gold plating mechanism used for spraying gold plating glaze is arranged on the upper portion in the machine table. A main cleaning mechanism used for cleaning the upper surfaces of the ceramic tiles is arranged on the lower portion in the machine table. According to the gold plating process and equipment disclosed by the invention, the sliding machine table is directly arranged at the side end of the cooling zone of the existing kiln, cleaning and gold plating of the ceramic tiles are completed through the main cleaning mechanism and the gold plating mechanism, and gold plating paint is roasted by utilizing residual heat of the ceramic tiles; and the gold plating work on the ceramic tiles is completed before the ceramic tiles are completely cooled, so that the manufacturing process of the equipment on the gold-plated ceramic tiles is simpler, the cost required by equipment operation is reduced, and meanwhile, the working efficiency of the equipment is improved.

The present disclosure provides methods for determining concentration of various trace metal ions in aqueous solutions, such as gold plating solutions. At a particular fixed reduction potential, the cathodic current can suddenly increase in magnitude after a certain period of time (e.g., an incubation time) passes in the presence of a trace metal ion (e.g., Tl(I)), where the incubation time is inversely proportional to the concentration of trace metal in the electrolyte. The concentration of the trace metal can be calculated after measuring the incubation time and comparing it against a calibration curve.

The application discloses a method for preparing an oxide composite insulating layer on a titanium alloy surface and relates to the technical field of insulating material preparation. The titanium alloy is subjected to high-temperature oxidation to obtain a porous titanium oxygen layer, then the porous titanium oxygen layer is subjected to ultrasonic-assisted sealing treatment by using an organic sealing agent, and after solidification, the oxide composite insulating layer is obtained on the titanium alloy surface. The oxide composite insulating layer prepared on the titanium alloy surface has good insulating capacity in a solution environment and is resistant to hydrochloric acid and nitric acid corrosion, and has good application on a gold plating and nickel plating hanger in the watch industry.

Provided are: a gold plating method for achieving soft gold plating; a composition for gold plating; and a plating solution. The gold plating method is performed using a plating solution comprising: a gold sulfite salt; and at least one among thiosulfate ions and trithionic acid ions.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a method for improving poor gold surface of nickel immersion gold. The method comprises the following steps: sequentially carrying out board grinding and sand blasting pretreatment on the copper surface of the circuit board, carrying out automatic visual inspection to identify defects of the copper surface, overhauling and sorting based on defect identification, carrying out secondary sand blasting treatment and carrying out nickel-gold immersion treatment. According to the method, a closed-loop process of automatic visual inspection and maintenance sorting is embedded before the main process of nickel and gold immersion of the circuit board, so that the conversion from passive scrapping to active prevention is realized, the copper surface defects can be accurately identified and repaired on line, the poor gold surface caused by the defects is completely eradicated from the source, and the product rejection rate is remarkably reduced; and meanwhile, the unrepairable units are blocked, so that invalid consumption of precious metal materials is avoided, and the production cost is saved. In addition, a process optimization closed loop is formed based on feedback adjustment of detection data, and the quality stability and the production yield are improved.

This utility model relates to a circular vertical lifting continuous electroplating nickel-gold wire, comprising several clamps for holding PCB boards, a symmetrically arranged rotating mechanism one and a rotating mechanism two, with vertically lifting electroplating tweezers and vertically lifting electroplating gold wires arranged facing each other between rotating mechanism one and rotating mechanism two. The clamps move cyclically along the vertically lifting electroplating tweezers, rotating mechanism two, vertically lifting electroplating gold wires, and rotating mechanism one in a circular trajectory. The advantages are: the cyclic movement of the clamps along the circular trajectory ensures a consistent electroplating path for each OCB board, avoiding differences in electroplating paths affecting electroplating quality; the cyclic movement of the clamps reduces the need for transfer equipment and channels, reducing the footprint of the electroplating equipment; and the vertical lifting method allows the PCB board to be directly inserted into the lower gold bath, eliminating the need for the upper gold bath in traditional vertical continuous electroplating lines, reducing the volume of the gold bath and the initial one-time investment cost for the enterprise.

The invention discloses a manufacturing method of an ultra-fine and ultra-thick gold film circuit, and relates to the technical field of PCBs, and the method comprises the following steps: S1, cleaning a substrate; s2, performing double-sided sputtering of a gold seed layer on the cleaned substrate to form a gold-plated sheet; s3, photoresist is sprayed on the gold-plated sheet in a photoresist spraying mode, and exposure and development are carried out; s4, carrying out stepped electroplating on the gold-plated sheet; s5, removing redundant metal regions on the front surface by using an etching means, and etching a cutting channel on the back surface; and S6, finally, cutting is conducted along the cutting channel, and a plurality of products can be obtained. According to the scheme, after thin gold is sputtered to serve as the seed layer, the photoresist pattern is manufactured on the gold-plated sheet in a glue spraying mode, and therefore the inductor product of the superfine and ultra-thick electrode with the line width meeting the requirement of 20 + / -3 microns and the gold layer thickness meeting the requirement of 10-12 microns is manufactured, and the manufactured film inductor series product can meet the high inductance value.

The invention discloses a low-concentration activated gold immersion method for an ultra-small line spacing circuit board, and relates to the field of circuit board preparation. The low-concentration activation gold immersion method for the circuit board with the ultra-small line spacing comprises the following steps of S1, oil removal treatment, S2, micro-etching treatment, S3, pre-soaking treatment, S4, low-concentration activation treatment, S5, post-soaking treatment and S6, gold immersion treatment, and the line spacing of the circuit board with the ultra-small line spacing is smaller than or equal to 20 microns. According to the low-concentration activation gold immersion method for the circuit board with the ultra-small line spacing, by limiting the low-concentration Pd < + > activation solution and greatly reducing the dosage of Pd salt, compared with a traditional high-concentration activation process, the cost of the Pd salt can be saved, the content of Cu < + > in the activation solution and process parameters are strictly controlled, excessive deposition of Pd particles on the edge of the circuit with the ultra-small line spacing is avoided, and the occurrence rate of circuit bridging is reduced; an ultra-small line spacing circuit board with the line spacing smaller than or equal to 20 microns is adapted, and the size precision error of the circuit is guaranteed.

The invention discloses a novel electronic price tag FPC prepared based on weldable silver paste, which comprises a base material printed with a silver paste circuit, a display unit used for displaying a price tag identifier, a driving unit, a communication unit and a power supply unit welded with the silver paste circuit, and the silver paste circuit is prepared by mixing and printing composite silver powder, an organic carrier and a modifier. The preparation method comprises the steps of (1) substrate pretreatment, (2) preparation of weldable silver paste, (3) silver paste printing, (4) low-temperature curing and (5) component welding. The conductive circuit is formed through direct printing and low-temperature curing of the weldable silver paste with low surface energy and high oxidation resistance, low-temperature welding of components can be realized without a gold plating layer, the process is simple, the production period is greatly shortened, and the equipment cost and the material cost are effectively reduced; the electrical resistivity after curing can be greatly reduced, the matching property of a silver paste circuit and a base material is better, and the bending resistance is effectively improved.

The invention provides a gold-plated solder laser deplating recovery method and system based on AI cooperation, and the method comprises the steps: carrying out the multi-modal data collection and AI cooperation modeling of a to-be-machined part, and obtaining a partition characteristic model; laser processing parameters and a laser processing path are generated based on the partition characteristic model, and laser deplating processing is carried out; the method comprises the following steps: carrying out negative pressure adsorption enrichment on noble metal particles through a micro-fluidic chip, and synchronously collecting characteristic spectrum data and temperature data; a laser deplating effect evaluation result is obtained through an AI evaluation model; and performing dynamic fine adjustment on the laser processing parameters according to an effect evaluation result to form closed-loop iteration. According to the application, integrated intelligent cooperation of gold-plated solder deplating detection, process execution and precious metal recovery is realized through cooperative linkage of multi-mode sensing, AI cooperative regulation and control, laser precision processing and micro-fluidic recovery feedback and differential process adaptation; and the plating adaptability of the laser deplating process, the controllability of the deplating process and the high efficiency of precious metal recovery are improved.

The invention discloses a technological method for plating gold on fuzz buttons and a special tool, and belongs to the field of surface treatment of electronic components. The method comprises the following steps: fixing the fuzz button on a special electroplating auxiliary tool, wherein the tool consists of a small positioning disc, a net-shaped connecting structure and an electrode plate; immersing the tool into a gold-containing electroplating solution, switching on a power supply through an electrode plate, and simultaneously starting an ultrasonic generating device to carry out vibration plating; gold ions are uniformly deposited on the surface of the fuzz button and a ten-micron-level random winding gap in the fuzz button by utilizing micro-stirring and strong infiltration capacity generated by an ultrasonic cavitation effect and cooperating with an electrochemical deposition effect; the problems that in the prior art, plating is not uniform, cost is high, and the structure of the fuzz button is prone to being damaged are solved, high-efficiency, low-cost and high-quality gold plating is achieved, the contact resistance consistency of the fuzz button is remarkably improved, and the mechanical life of the fuzz button is remarkably prolonged.