711 results about "Gold plating" patented technology

The invention relates to a processing technology of an optical module circuit board, which comprises the following steps of: cutting a double-sided copper-clad plate, cutting the plate, and manufacturing an inner-layer circuit to obtain an inner-layer plate; performing hot melting and riveting on the inner-layer plate and then adding layers to obtain a first multi-layer plate; the first multilayer board is subjected to browning copper reduction, laser target burning, plasma degumming, copper deposition and electroplating, vacuum tree plug, high-cutting grinding and circuit manufacturing; performing double-sided layer adding on the treated first multilayer board to obtain a second multilayer board, and performing browning copper reduction, laser target burning, plasma degumming, copper deposition electroplating, vacuum tree plug, high-cutting grinding and circuit manufacturing on the second multilayer board to obtain a semi-finished board; and performing finger gold plating, LPI printing, vacuum etching and the like on the semi-finished board to obtain a finished board. The processing technology can meet the market requirements of 800G optical module products, the high-speed resistance yield is improved, and the mass production capability of the optical module technology is realized.

The invention relates to the technical field of semi-gold-nickel plating and processing, in particular to a floating connector terminal continuous semi-gold-nickel plating process which comprises the following preparation steps: S1, a floating connector terminal to be electroplated is put into degreasing fluid for degreasing treatment, and then the degreased terminal is put into activating fluid for activating treatment; s2, nickel electroplating is conducted on the activated floating connector terminal through a nickel plating solution, a nickel cake serves as an anode, the pH value of the nickel plating solution is controlled to be 3.5-5.5 through weak acid in the electroplating process, the electroplating current is controlled to be 0.4-0.8 A / dm < 2 >, the temperature is controlled to be 50-60 DEG C, cleaning is conducted, and the nickel-plated floating connector terminal is obtained; and S3, the nickel-plated floating connector terminal is put into the gold plating solution to be electroplated, the electroplating temperature is 40-50 DEG C, the current density is 0.1-2 A / dm, a finished product is obtained, and the floating connector terminal can still keep high conductivity, low contact resistance, high abrasion resistance and high corrosion resistance under the complex environments of high temperature, vibration, salt mist and the like through the technology.

The invention relates to the technical field of PCB (Printed Circuit Board) processing, and discloses a method for removing lead warped copper by deep drilling in a gold finger gold plating process, which comprises the following steps of: optimizing the position and the shape of a gold-plated lead: changing the gold-plated lead from a short side of a gold finger to a side wall of the gold finger, and optimizing the shape of the gold-plated lead to be elliptical; the widest part R of the center of the ellipse satisfies Rlt by taking mil as a unit; x-R is larger than or equal to 4 mil, and X is the diameter of a deep drilling point; according to high-precision photosensitive wet film protection, before a gold-plated lead is removed through deep drilling, a photosensitive wet film is adopted to cover a gold finger lead area, the wet film is accurately positioned and printed through drilling positioning holes in the four corners, the protective area covers the gold finger lead and extends outwards by Y mil, and Y is larger than or equal to 4 mil. The method for removing the warped copper of the lead through deep drilling in the gold-plating process of the golden finger aims at solving the problem that the copper is prone to being warped when the gold-plated lead is removed through deep drilling in the gold-plating process of the golden finger.

Aiming at the limitation of the existing metal bump corrosion prevention technology, the invention provides an innovative process: pure silver electroplating is adopted to form a bump main body, a complete gold wrapping structure is formed on all exposed surfaces of the bump main body through secondary electroplating of pure gold, and the process can be used for accurately regulating and controlling the parameters of the secondary electroplating and the size of a secondary photoetching pattern. The exposed surface of the silver bump is uniformly wrapped by the thin gold layer, so that the problem that metal interconnection is easy to corrode in a severe environment in the traditional technology is effectively solved, and comprehensive breakthrough in corrosion resistance, electrical properties and cost effectiveness is realized through innovative silver core and gold shell layered structure design and precise process control.

The invention discloses a manufacturing method of a support-free isolated step circuit board, which comprises the following steps of: manufacturing a plurality of inner-layer core boards, pressing and fixing the inner-layer core boards, planning a step area on the uppermost layer, and carrying out nickel-gold plating treatment on all areas outside the step area to obtain inner-layer sub-components; covering the nickel-gold plating area on the uppermost layer of the inner-layer sub-component with the cut PI adhesive tape, and leaving the step area when the opening is over against the step area; sequentially placing a prepreg I and an outer-layer core plate on the upper side of the PI adhesive tape, and pressing the prepreg I and the outer-layer core plate together; and milling a step area corresponding to the outer-layer core board, and removing the pre-pasted PI adhesive tape after milling to obtain the support-free isolated step circuit board. According to the invention, the step structure formed by direct milling is arranged on the multilayer circuit board, and the non-support isolated step structure is obtained by using the nickel-gold plating area outside the step position protected by the PI adhesive tape; the adhesive overflow risk and the difficulty in adhesive tape stripping in the micro blind groove processing are avoided, and the method is particularly suitable for high-precision and miniaturized design scenes.

The invention belongs to the technical field of photoelectric detection, and relates to a gallium oxide nanowire array type solar blind photoelectric detector and a preparation method thereof. Spreading liquid metal gallium on the surface of the substrate to form a liquid metal gallium layer on the surface of the substrate; performing vacuum evaporation on the surface of the liquid metal gallium layer to form a gold film layer to obtain a device precursor; and heating the device precursor to 400-1000 DEG C at a heating rate of 10-15 DEG C / min, and carrying out heat treatment for 1-2h to obtain the sandwich structure device. According to the method, the preparation mode of the array type gallium oxide nanowire is simplified, gallium metal left in the growth process is used as the electrode, the tedious and complex technological process needed in the previous device preparation process is improved, the ordered and regular gallium oxide nanowire array structure is prepared, and the photoelectric detection effect is improved.

The invention discloses a multi-component atomic level oxide solid solution integrated electrode for electrolyzed water and a preparation method thereof, and belongs to the field of metal material surface plating. The electrode is composed of a gas diffusion layer, a nano array substrate and an atomic level oxide solid solution catalyst layer. The preparation method comprises the following steps: constructing a nano array microreactor on the surface of the gas diffusion layer; the method comprises the following steps: driving an atomic hierarchy solid solution to reconstruct by utilizing an array confinement effect through combination of precursor directional spraying and a heat treatment-rapid quenching process, and constructing a three-dimensional conformal ionomer network on the surface of the atomic hierarchy solid solution; and performing gold plating treatment on the back side of the electrode. Through the synergistic effect of spatial constraint and thermodynamic regulation of the nano microreactor, the traditional electrode interface mismatch bottleneck is broken through, and while precise construction of atomic-scale active sites is realized, the mechanical stability and oxygen evolution reaction kinetics of the electrode are improved. The preparation process has the advantages of controllable flow, strong large-scale expansibility and good industrial preparation prospect.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The invention discloses a diamond-metal composite material with six surfaces coated with metal as well as a processing method and application of the diamond-metal composite material. The diamond-metal composite material with the six surfaces coated with the metal is a composite material formed by sintering a hexahedral metal shell and at least one diamond-metal composite layer arranged in the metal shell. The diamond-metal composite layer comprises a metal net and diamond particles, the surfaces of the diamond particles are coated with coatings, the diamond particles are arranged in grids of the metal net, and gaps between the grids and the diamond particles are filled with metal powder; metal atoms in the metal net penetrate through the coating to diffuse towards the surface of the diamond, and a mixed transition area is formed. The structural composition of the diamond-metal composite material is adjusted, and the surface of the diamond-metal composite material is coated with metal to form the diamond-metal composite material with six surfaces coated with metal, so that the diamond in the composite material is prevented from being exposed, and the problem that the surface of the diamond is difficult to machine and gold is difficult to plate is solved.

The present invention provides a method for electroplating gold on the surface of a circuit board. The method comprises the following steps: (1) first printing ink on the surface of the circuit board to form an ink layer; (2) slotting the ink layer to form grooves; (3) second printing a conductive silver paste in the grooves and curing the paste, then grinding the circuit board to remove the ink; and (4) electroplating the circuit board after the ink is removed with gold, and then removing the conductive silver paste. The method can effectively solve problems such as residual conductive wires or gaps in the gold plating pattern that occur during the gold plating process for drawing conductive wires, and does not require etching, thereby reducing costs and improving efficiency.

The invention relates to an ultrasonic bonding process and a bonding process reliability evaluation method, and belongs to the technical field of semiconductor device packaging. The invention relates to an ultrasonic bonding process, which comprises the following steps of: 1, before bonding, carrying out plasma cleaning on a metal ceramic shell to remove surface contamination and an oxide layer; step 2, enabling the aluminum wire to penetrate into a chopper of a bonding machine, enabling the aluminum wire to be in contact with the surface of the gold-plated layer at the bonding pressure of 250cN-280cN by adopting the chopper, and enabling the aluminum wire to be in contact with the surface gold-plated layer of the bonding area in a low-pressure mode; and step 3, the bonding machine applies ultrasonic power of 10.5-12.3 W for 400-500 ms, the aluminum wire begins to rub and destroy the gold-plated layer on the surface of the bonding area under the action of the ultrasonic power, and after the gold-plated layer is destroyed, the aluminum wire penetrates through the gold-plated layer and forms an atomic-scale mutual diffusion interface with the nickel-plated layer. Reliable combination of gold, aluminum and nickel is achieved, meanwhile, a reliability evaluation method is provided, and therefore it is guaranteed that devices, circuits and the like adopting the ultrasonic bonding technology work reliably in the life cycle.

The invention relates to an organic adhesive and a preparation method thereof, in particular to a high-strength damp-heat-resistant adhesive suitable for adhering a plated metal chip and a preparation method of the high-strength damp-heat-resistant adhesive. The problem that in the existing semiconductor field, the bonding reliability is poor under the high-humidity state and the high-humidity heat in the bonding process of an epoxy adhesive and precious metal such as a gold-plated base material is solved. The high-strength damp-heat-resistant adhesive is prepared from epoxy resin, chelated epoxy resin, polyimide precursor resin, a polyimide and chelated epoxy resin synergistic curing agent, a phthalate coupling agent, an inorganic filler and a solvent I; the preparation method comprises the following steps: 1, preparing polyimide precursor resin; 2, weighing; and 3, preparing the adhesive. The invention relates to a high-strength damp-heat-resistant adhesive suitable for bonding a plated metal chip and a preparation method thereof.

The invention discloses a Kovar alloy electroplating method. The method comprises the steps that a Kovar alloy base material is pretreated; the pretreated kovar alloy base material is immersed in an acidic copper sulfate plating solution for electrolytic copper plating, so that a copper plating layer is formed on the surface of the kovar alloy base material; immersing the kovar alloy on which the copper plating layer is formed into a chemical nickel plating solution so as to form a nickel plating layer on the surface of the copper plating layer; and immersing the kovar alloy base material on which the nickel plating layer is formed into a nanogold seed crystal solution so as to form a soft gold plating layer on the surface of the nickel plating layer. The coating quality of the kovar alloy can be improved.

The invention belongs to the technical field of CGM sensors, and particularly relates to a CGM electrode sensor and a preparation method thereof.The preparation method comprises the following steps that three sets of stainless steel microneedle arrays are prepared from a stainless steel substrate and serve as a counter electrode, a reference electrode and a working electrode respectively; mechanically polishing the stainless steel microneedle array, and performing composite pickling activation; after surface pretreatment, a sol-gel deposition aluminum oxide layer is adopted; preparing a gold plating solution, and plating gold on the stainless steel microneedle array deposited with the aluminum oxide layer by adopting two-stage pulse electroplating; the working electrode is prepared by PMMA coating, adhesion layer construction, glucose oxidase immobilization and limiting layer construction; the counter electrode, the reference electrode and the working electrode are respectively embedded into the substrate to form the microneedle array electrode sensor with a three-electrode system. Based on a nickel-free direct gold plating process, good uniformity, strong binding force and lower cost after gold plating can be realized, so that the stability of the continuous glucose sensor in use is improved.

The invention provides a gold plating machine which comprises an electroplating bath, an anode outer net and an anode inner net which are respectively arranged on two sides of the electroplating bath, a first power supply connecting wire for connecting a power supply and the anode inner net, and a second power supply connecting wire for connecting the anode inner net and the anode outer net, the anode inner net comprises a first anode inner net and a second anode inner net arranged on the inner side of the first anode inner net. By controlling the electric quantity output by the power supply to flow from the internal network to the external network, compared with a mode of connecting the internal network from the external network in conventional equipment, the electric potential of the external network is reduced, the electric quantity output by the external network is reduced, and the electric quantity distribution uniformity is improved; a traditional complete outer side anode net is divided into a plurality of anode nets which are arranged at intervals, the area of the outer net is reduced, a traditional single-layer anode inner net is changed into a double-layer anode net, the area of the inner net is increased, the area of the anode outer net and the area of the anode inner net are relatively equal, the output electric quantity is relatively equal, and therefore the electric quantity of electroplating liquid is evenly distributed, and the electroplating efficiency is improved. And the plating quality is improved.

To provide an electrolytic gold plating solution having a long lifespan without toxicity, in which plating can be performed with the solution temperature of 35°C or lower and the plating film can uniformly be electrodeposited with excellent plating properties, and a production method of the solution.SOLUTION: An electrolytic gold plating solution includes a non-cyanide soluble gold salt (A) and a complexing agent (B) for complexing gold ions of the gold salt. The complexing agent (B) is a mercaptotetrazole compound expressed by the following general formula (1). The molar ratio (B / A) of the complexing agent (B) to the soluble gold salt (A) is between 10 and 260. The pH of the gold plating solution is less than 3.SELECTED DRAWING: Figure 1

The invention discloses a chemical gold plating anti-corrosion process for a gold-silver alloy or pure silver bump. The chemical gold plating anti-corrosion process comprises the following steps: forming a metal bump structure on the surface of a substrate; performing patterning processing on the metal bump structure to form a metal bump with a required pattern; carrying out pretreatment on the metal bump, wherein the pretreatment comprises acid washing and deionized water rinsing; immersing the pretreated metal bump into a chemical gold plating solution to form a continuous metal gold layer on the surface of the metal bump; and rinsing and drying the gold-plated structure to obtain the metal bump structure with the anti-corrosion performance.

The invention relates to a preparation method of a DFB (Distributed Feedback) semiconductor laser, which belongs to the technical field of semiconductor lasers and comprises the following steps of: 1, forming an epitaxial structure on a substrate; 2, forming a ridge waveguide structure; 3, forming a protective film layer on the upper part of the ridge waveguide structure and windowing; 4, spin-coating negative photoresist on the upper part of the ridge waveguide structure and exposing to form a first protective layer; step 5, forming a second protection layer; step 6, forming a first window; step 7, continuously windowing the first protection layer below the first window, and forming a second window; 8, performing magnetron sputtering gold plating by adopting a magnetron sputtering process, and at least forming a metal layer on the inner surface of the second window; step 9, removing the photoresist and the redundant metal layer, and only reserving the metal layers at the upper end of the ridge part and the upper ends of the protective film layers at the two sides of the ridge part to obtain a suspended electrode structure; the preparation method is simple in manufacturing and lower in cost, can effectively reduce parasitic capacitance, and is beneficial to realizing high-bandwidth and high-speed transmission of chips.

The invention relates to high-thermal-conductivity In-Pb-X alloy low-temperature soldering paste and a preparation method thereof, and belongs to the technical field of electronic packaging. The low-temperature soldering paste comprises the following components in percentage by weight: 80.0 to 90.0 percent of soldering flux alloy powder, 6.0 to 10.0 percent of high-activity soldering flux and 4.0 to 10.0 percent of coating agent, the solder alloy powder is composed of, by weight, 14.0%-41.0% of Pb, 0%-10% of X and the balance In, and the element X is one or more of Sn, Ag, Au, Bi, Sb and Cu. The preparation method comprises the steps of solder alloy smelting, solder alloy powder preparation, soldering flux preparation and soldering paste preparation. The soldering paste is low in melting point, low in brazing temperature, high in heat conductivity, high in welding rate, good in wettability to a gold-plated layer, good in brazing manufacturability and suitable for low-temperature packaging of electronic devices.

The invention discloses an anti-corrosion process for chemically plating nickel and gold on a gold-silver alloy or pure silver bump, which is characterized by comprising the following steps of: forming a metal bump structure on the surface of a substrate; performing patterning processing on the metal bump structure to form a metal bump of a target pattern; performing pretreatment on the metal bump, wherein the pretreatment comprises acid pickling, micro-etching, dilute nitric acid cleaning and deionized water rinsing; performing zinc replacement treatment on the pretreated metal bump for at least two times to activate the surface; the activated metal bump is placed in a chemical nickel plating solution for reaction, so that a continuous nickel metal layer is formed on the surface of the metal bump; after the nickel layer is formed, the nickel layer is further placed in a chemical gold plating solution for reaction, and a continuous metal gold layer is formed on the surface of the nickel layer; and rinsing and drying the gold-plated structure to obtain the metal bump structure with the anti-corrosion performance.

The application discloses a kind of low resistance low inductance high reliable electrode connecting structure for high voltage Pockels cell, belongs to Pockels cell electrode connecting technical field, solve the existing Pockels cell electrode connecting structure connection reliability problem, electric contact medium performance is not good;Including anti-drop insulating sleeve, pin, input electrode, metal hair button, shell and crystal;The top of pin is equipped with anti-drop insulating sleeve, the bottom of pin is connected with input electrode, input electrode is installed in the mounting hole of shell, the inside of shell is provided with crystal, and the outer side surface of both ends of crystal is provided with gold plating layer;Metal hair button at the bottom of input electrode is pressed on gold plating layer.In the application, pin and input electrode are inserted into position and wrapped by anti-drop insulating sleeve, input electrode is not exposed, and the personal safety hazard of high-voltage electric shock is fundamentally eliminated;Metal hair button is used instead of conductive rubber, to ensure that the contact pressure with crystal electrode is constant, and the anti-vibration and anti-impact performance is strong.

The invention discloses a method for composite etching of an electroplating gold plating layer, which comprises the following steps of: manufacturing a photoetching pattern on the front surface of gallium arsenide epitaxy, then evaporating a metal contact layer, depositing a SiNx protective mask layer, performing Mesa mesa etching on the gallium arsenide epitaxy, exposing a high-aluminum layer on the side surface of an epitaxial material, and forming an aluminum oxide limiting layer by adopting a wet oxidation process; a second SiNx protective mask layer continues to be deposited, and the metal contact layer is exposed through dry etching; forming a seed gold layer by adopting magnetron sputtering TiW / Au metal, and forming a photoresist mask with a target electrode pattern on the seed gold layer; electroplating thick gold on the photoresist mask pattern; the photoresist mask layer is removed after completion; the method of combining dry etching and wet etching is adopted to remove the gold plating layer in the non-electroplating area, so that the lateral corrosion of the metal layer is obviously reduced, the high-precision and high-fidelity electrode pattern transfer is realized, the lateral corrosion of the metal layer is reduced, and the passivation protection effect of the device is improved.

The utility model relates to PCB small-batch gold immersion equipment, which comprises a liquid medicine box, a hanging basket assembly and an air knife assembly, the hanging basket assembly comprises a first lifting part and a hanging basket body which are fixedly connected with the liquid medicine box, and the output end of the first lifting part is connected with the hanging basket body and used for driving the hanging basket body to move along the vertical direction so as to enable the hanging basket body to enter and exit from the liquid medicine box; the air knife assembly comprises a second lifting part installed on the hanging basket body and an air knife body, the output end of the second lifting part is connected with the air knife body and used for driving the air knife body to move in the vertical direction, and the air supply end of the air knife body points to the hanging basket body; a small batch of PCBs are placed on the hanging basket body, the hanging basket body is driven by the first lifting part to be immersed into the liquid medicine box to achieve gold immersion treatment, the hanging basket body is moved out of the liquid medicine box after gold immersion treatment is completed, the air knife body is driven by the second lifting part to move in the vertical direction, the PCBs are dried through the air knife body, and therefore the whole gold immersion process is completed. The equipment is suitable for gold immersion treatment of small-batch PCBs, and the cost is reduced.

The present invention discloses a low heat leakage thin film composite ribbon line structure and a design method for cryogenic packaging. The low heat leakage thin film composite ribbon line structure for cryogenic packaging of the present invention is composed of a type A lead merged conductive layer, a type A lead conductive layer, a film coating layer, via holes, a type B lead conductive layer, a type B lead merged conductive layer, a bonding wire finger layer, a strengthening layer, a gold layer, and a soldering pad gold plating layer. The present invention systematically expounds the design principles and implementation methods of the low heat leakage thin film composite ribbon line structure, materials, electricity, heat, etc., and obtains a low heat leakage thin film composite ribbon line assembly. The present invention adopts a multi-layer composite structure compatible with the ordinary flexible cable process. On the premise of ensuring performance matching with the detector, low thermal conductivity alloys, multi-layer structure lead merging, and specific surface treatment are used to reduce the heat leakage of the leads and solve the reliability problems brought by high-density leads.

The utility model relates to an adjustable tool for electroplating gold on a printed board. Comprising a cuboid frame, transverse supporting rods arranged above a top frame of the cuboid frame in parallel, and a connecting frame used for connecting the cuboid frame and the transverse supporting rods. A first positioning piece is vertically arranged on the bottom frame of the cuboid frame; the side frames, located at the two ends of the transverse supporting rods, of the cuboid frame are positioning side frames, and at least one positioning side frame is perpendicularly provided with a second positioning piece; a positioning rod perpendicular to the transverse supporting rod is arranged on the transverse supporting rod, and a third positioning piece is arranged at the end, close to the cuboid frame, of the positioning rod; the position of the positioning rod is adjustable in the length direction; the first positioning piece, the second positioning piece and the third positioning piece are comb-tooth-shaped positioning pieces; and the first positioning piece, the second positioning piece and the third positioning piece are used for positioning the printed board in the cuboid frame. According to the utility model, a plurality of printed boards can be positioned and supported at one time, and the electroplating efficiency is improved.

The utility model belongs to the technical field of metal gasket production, and particularly relates to a gold plating device for metal gasket production, which comprises a bottom plate, the top of the bottom plate is fixedly connected with a gold plating box; the side wall of the gold plating box is fixedly connected with a side plate; the side wall of the side plate is fixedly connected with a groove plate; the top of the groove plate is fixedly connected with a first motor; a lead screw is rotationally connected into the groove plate. The lead screw is connected with the output end of the first motor. The middle part of the screw rod is in threaded connection with a T-shaped plate; the side wall of the T-shaped plate is fixedly connected with a supporting plate. The top of the supporting plate is fixedly connected with a second motor. Through the structure, the metal gasket can be effectively and fully contacted with an electroplating solution, so that each part of the gasket can be more uniformly contacted with the electroplating solution, the thickness difference of a plating layer caused by non-uniform concentration distribution of metal ions in the solution is reduced, meanwhile, convection of the electroplating solution can be promoted through rotation of the placing basket, and the electroplating effect is improved. Transmission of metal ions to the surface of the gasket is accelerated, and the electroplating rate is increased.

A gold-plated silver processing method and gold-plated silver products are disclosed, relating to the field of metal processing technology. The gold-plated silver processing method includes the following steps: S1, silver blank treatment, polishing the silver blank to remove surface impurities; S3, gold plating, applying a gold layer to the treated silver blank; S4, piercing the gold layer using a cone to create multiple vent holes; S5, pressing, applying pressure from one end of the product to the other to expel residual gas within the interlayer through the vent holes; S6, water leveling, heating and water leveling the surface of the gold layer to eliminate piercing marks; S7, wire drawing and bonding, using a wire drawing machine to draw the product to the desired outer diameter to ensure a tight bond between the gold layer and the silver blank. This technical solution has the advantages of eliminating air bubbles within the interlayer, enhancing the adhesion between gold and silver, and improving product quality.

The utility model discloses a test device for verifying the influence of epoxy glue high-temperature gas release on a gold-aluminum bonding point, which comprises a shell, the inner wall of the shell is provided with a gold-plated layer, and the thickness of the gold-plated layer is 1-5 microns; the edge of the chip is bonded on the inner wall of the shell through a plurality of gold bonding wires; an epoxy glue layer is coated on the part, which is not bonded with the chip, of the inner wall of the shell; the cover plate is installed at the opening of the shell in a sealed mode. The inner wall of the shell is provided with the gold-plated layer, and the chip can be directly bonded on the gold-plated layer in the shell, so that the test process is free from interference of external factors. The shell is made of ceramic, the main component of the ceramic is Al2O3, the high-temperature resistance is excellent, excessive gas and stress release are avoided in the test process, and the interference to the test result is avoided. The airtight grade in the shell is 10-9, and the sealing requirement is met. In the test process, gas released by the epoxy glue layer cannot leak and can continuously act on the bonding points, and the test effect can be improved.

The present invention relates to the technical field of laser manufacturing, and particularly discloses a welding method for a novel crystal slab and disc, comprising the following steps: plating a gold film on the welding surfaces of a heat sink and a laser amplification medium, plating a special film layer on the gold film, assembling an indium solder sheet, the heat sink plated with the special film layer, and the laser amplification medium plated with the special film layer into an assembly, placing the assembly in a welding furnace, and heating and pressurizing for welding, so that an interfacial micro-region eutectic reaction occurs between the special film layer and the surface of the indium solder sheet to fill the weld seam of the welding surface. Compared with the traditional technology, this technical solution effectively avoids the pollution and voids generated by the large-scale melting of the solder. Since the pressure applied during welding is small, it avoids the problem that the stress of the solid laser is too large to retreat easily, solves the defects generated during the laser welding process, ensures the performance and working reliability of the laser, and provides a method for the solid laser to generate a higher power and better beam quality.

The invention discloses a PCB surface treatment process based on local gold plating and nickel and gold immersion, and relates to the technical field of surface treatment processes. The method is used for processing a PCB which needs local hard gold plating and nickel gold immersion at other positions, and comprises the following steps: S1, pre-processing: processing the PCB to a copper thickness before electroplating; s2, first-layer pattern processing: pasting a dry film on the CS surface of the PCB and etching to form a pattern; s3, gold plating preparation; s4, local gold plating; s5, removing the film and processing a second layer of pattern; s6, removing the wire; s7, resistance welding and protection; and S8, nickel and gold immersion treatment. According to the surface treatment process, the microcosmic roughness of the surface of the substrate is accurately controlled through multi-step pretreatment, and high-pressure water washing and plasma cleaning are combined, so that the mechanical embedding force of a plating layer and a copper layer is ensured, and the problem that the plating layer is not uniform due to too large roughness is avoided. And meanwhile, the current distribution is regulated and controlled by adopting pulse current and a magnetic mask in the copper deposition and electroplating stages, so that the compactness and thickness uniformity of the coating are improved.