524 results about "Gold plating" patented technology

The invention relates to the technical field of semi-gold-nickel plating and processing, in particular to a floating connector terminal continuous semi-gold-nickel plating process which comprises the following preparation steps: S1, a floating connector terminal to be electroplated is put into degreasing fluid for degreasing treatment, and then the degreased terminal is put into activating fluid for activating treatment; s2, nickel electroplating is conducted on the activated floating connector terminal through a nickel plating solution, a nickel cake serves as an anode, the pH value of the nickel plating solution is controlled to be 3.5-5.5 through weak acid in the electroplating process, the electroplating current is controlled to be 0.4-0.8 A / dm < 2 >, the temperature is controlled to be 50-60 DEG C, cleaning is conducted, and the nickel-plated floating connector terminal is obtained; and S3, the nickel-plated floating connector terminal is put into the gold plating solution to be electroplated, the electroplating temperature is 40-50 DEG C, the current density is 0.1-2 A / dm, a finished product is obtained, and the floating connector terminal can still keep high conductivity, low contact resistance, high abrasion resistance and high corrosion resistance under the complex environments of high temperature, vibration, salt mist and the like through the technology.

Aiming at the limitation of the existing metal bump corrosion prevention technology, the invention provides an innovative process: pure silver electroplating is adopted to form a bump main body, a complete gold wrapping structure is formed on all exposed surfaces of the bump main body through secondary electroplating of pure gold, and the process can be used for accurately regulating and controlling the parameters of the secondary electroplating and the size of a secondary photoetching pattern. The exposed surface of the silver bump is uniformly wrapped by the thin gold layer, so that the problem that metal interconnection is easy to corrode in a severe environment in the traditional technology is effectively solved, and comprehensive breakthrough in corrosion resistance, electrical properties and cost effectiveness is realized through innovative silver core and gold shell layered structure design and precise process control.

The invention belongs to the technical field of photoelectric detection, and relates to a gallium oxide nanowire array type solar blind photoelectric detector and a preparation method thereof. Spreading liquid metal gallium on the surface of the substrate to form a liquid metal gallium layer on the surface of the substrate; performing vacuum evaporation on the surface of the liquid metal gallium layer to form a gold film layer to obtain a device precursor; and heating the device precursor to 400-1000 DEG C at a heating rate of 10-15 DEG C / min, and carrying out heat treatment for 1-2h to obtain the sandwich structure device. According to the method, the preparation mode of the array type gallium oxide nanowire is simplified, gallium metal left in the growth process is used as the electrode, the tedious and complex technological process needed in the previous device preparation process is improved, the ordered and regular gallium oxide nanowire array structure is prepared, and the photoelectric detection effect is improved.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The invention relates to an ultrasonic bonding process and a bonding process reliability evaluation method, and belongs to the technical field of semiconductor device packaging. The invention relates to an ultrasonic bonding process, which comprises the following steps of: 1, before bonding, carrying out plasma cleaning on a metal ceramic shell to remove surface contamination and an oxide layer; step 2, enabling the aluminum wire to penetrate into a chopper of a bonding machine, enabling the aluminum wire to be in contact with the surface of the gold-plated layer at the bonding pressure of 250cN-280cN by adopting the chopper, and enabling the aluminum wire to be in contact with the surface gold-plated layer of the bonding area in a low-pressure mode; and step 3, the bonding machine applies ultrasonic power of 10.5-12.3 W for 400-500 ms, the aluminum wire begins to rub and destroy the gold-plated layer on the surface of the bonding area under the action of the ultrasonic power, and after the gold-plated layer is destroyed, the aluminum wire penetrates through the gold-plated layer and forms an atomic-scale mutual diffusion interface with the nickel-plated layer. Reliable combination of gold, aluminum and nickel is achieved, meanwhile, a reliability evaluation method is provided, and therefore it is guaranteed that devices, circuits and the like adopting the ultrasonic bonding technology work reliably in the life cycle.

To provide an electrolytic gold plating solution having a long lifespan without toxicity, in which plating can be performed with the solution temperature of 35°C or lower and the plating film can uniformly be electrodeposited with excellent plating properties, and a production method of the solution.SOLUTION: An electrolytic gold plating solution includes a non-cyanide soluble gold salt (A) and a complexing agent (B) for complexing gold ions of the gold salt. The complexing agent (B) is a mercaptotetrazole compound expressed by the following general formula (1). The molar ratio (B / A) of the complexing agent (B) to the soluble gold salt (A) is between 10 and 260. The pH of the gold plating solution is less than 3.SELECTED DRAWING: Figure 1

The invention relates to high-thermal-conductivity In-Pb-X alloy low-temperature soldering paste and a preparation method thereof, and belongs to the technical field of electronic packaging. The low-temperature soldering paste comprises the following components in percentage by weight: 80.0 to 90.0 percent of soldering flux alloy powder, 6.0 to 10.0 percent of high-activity soldering flux and 4.0 to 10.0 percent of coating agent, the solder alloy powder is composed of, by weight, 14.0%-41.0% of Pb, 0%-10% of X and the balance In, and the element X is one or more of Sn, Ag, Au, Bi, Sb and Cu. The preparation method comprises the steps of solder alloy smelting, solder alloy powder preparation, soldering flux preparation and soldering paste preparation. The soldering paste is low in melting point, low in brazing temperature, high in heat conductivity, high in welding rate, good in wettability to a gold-plated layer, good in brazing manufacturability and suitable for low-temperature packaging of electronic devices.

The application discloses a kind of low resistance low inductance high reliable electrode connecting structure for high voltage Pockels cell, belongs to Pockels cell electrode connecting technical field, solve the existing Pockels cell electrode connecting structure connection reliability problem, electric contact medium performance is not good;Including anti-drop insulating sleeve, pin, input electrode, metal hair button, shell and crystal;The top of pin is equipped with anti-drop insulating sleeve, the bottom of pin is connected with input electrode, input electrode is installed in the mounting hole of shell, the inside of shell is provided with crystal, and the outer side surface of both ends of crystal is provided with gold plating layer;Metal hair button at the bottom of input electrode is pressed on gold plating layer.In the application, pin and input electrode are inserted into position and wrapped by anti-drop insulating sleeve, input electrode is not exposed, and the personal safety hazard of high-voltage electric shock is fundamentally eliminated;Metal hair button is used instead of conductive rubber, to ensure that the contact pressure with crystal electrode is constant, and the anti-vibration and anti-impact performance is strong.

The invention discloses a method for composite etching of an electroplating gold plating layer, which comprises the following steps of: manufacturing a photoetching pattern on the front surface of gallium arsenide epitaxy, then evaporating a metal contact layer, depositing a SiNx protective mask layer, performing Mesa mesa etching on the gallium arsenide epitaxy, exposing a high-aluminum layer on the side surface of an epitaxial material, and forming an aluminum oxide limiting layer by adopting a wet oxidation process; a second SiNx protective mask layer continues to be deposited, and the metal contact layer is exposed through dry etching; forming a seed gold layer by adopting magnetron sputtering TiW / Au metal, and forming a photoresist mask with a target electrode pattern on the seed gold layer; electroplating thick gold on the photoresist mask pattern; the photoresist mask layer is removed after completion; the method of combining dry etching and wet etching is adopted to remove the gold plating layer in the non-electroplating area, so that the lateral corrosion of the metal layer is obviously reduced, the high-precision and high-fidelity electrode pattern transfer is realized, the lateral corrosion of the metal layer is reduced, and the passivation protection effect of the device is improved.

The utility model belongs to the technical field of metal gasket production, and particularly relates to a gold plating device for metal gasket production, which comprises a bottom plate, the top of the bottom plate is fixedly connected with a gold plating box; the side wall of the gold plating box is fixedly connected with a side plate; the side wall of the side plate is fixedly connected with a groove plate; the top of the groove plate is fixedly connected with a first motor; a lead screw is rotationally connected into the groove plate. The lead screw is connected with the output end of the first motor. The middle part of the screw rod is in threaded connection with a T-shaped plate; the side wall of the T-shaped plate is fixedly connected with a supporting plate. The top of the supporting plate is fixedly connected with a second motor. Through the structure, the metal gasket can be effectively and fully contacted with an electroplating solution, so that each part of the gasket can be more uniformly contacted with the electroplating solution, the thickness difference of a plating layer caused by non-uniform concentration distribution of metal ions in the solution is reduced, meanwhile, convection of the electroplating solution can be promoted through rotation of the placing basket, and the electroplating effect is improved. Transmission of metal ions to the surface of the gasket is accelerated, and the electroplating rate is increased.

A gold-plated silver processing method and gold-plated silver products are disclosed, relating to the field of metal processing technology. The gold-plated silver processing method includes the following steps: S1, silver blank treatment, polishing the silver blank to remove surface impurities; S3, gold plating, applying a gold layer to the treated silver blank; S4, piercing the gold layer using a cone to create multiple vent holes; S5, pressing, applying pressure from one end of the product to the other to expel residual gas within the interlayer through the vent holes; S6, water leveling, heating and water leveling the surface of the gold layer to eliminate piercing marks; S7, wire drawing and bonding, using a wire drawing machine to draw the product to the desired outer diameter to ensure a tight bond between the gold layer and the silver blank. This technical solution has the advantages of eliminating air bubbles within the interlayer, enhancing the adhesion between gold and silver, and improving product quality.

The utility model discloses a test device for verifying the influence of epoxy glue high-temperature gas release on a gold-aluminum bonding point, which comprises a shell, the inner wall of the shell is provided with a gold-plated layer, and the thickness of the gold-plated layer is 1-5 microns; the edge of the chip is bonded on the inner wall of the shell through a plurality of gold bonding wires; an epoxy glue layer is coated on the part, which is not bonded with the chip, of the inner wall of the shell; the cover plate is installed at the opening of the shell in a sealed mode. The inner wall of the shell is provided with the gold-plated layer, and the chip can be directly bonded on the gold-plated layer in the shell, so that the test process is free from interference of external factors. The shell is made of ceramic, the main component of the ceramic is Al2O3, the high-temperature resistance is excellent, excessive gas and stress release are avoided in the test process, and the interference to the test result is avoided. The airtight grade in the shell is 10-9, and the sealing requirement is met. In the test process, gas released by the epoxy glue layer cannot leak and can continuously act on the bonding points, and the test effect can be improved.

The invention discloses a PCB surface treatment process based on local gold plating and nickel and gold immersion, and relates to the technical field of surface treatment processes. The method is used for processing a PCB which needs local hard gold plating and nickel gold immersion at other positions, and comprises the following steps: S1, pre-processing: processing the PCB to a copper thickness before electroplating; s2, first-layer pattern processing: pasting a dry film on the CS surface of the PCB and etching to form a pattern; s3, gold plating preparation; s4, local gold plating; s5, removing the film and processing a second layer of pattern; s6, removing the wire; s7, resistance welding and protection; and S8, nickel and gold immersion treatment. According to the surface treatment process, the microcosmic roughness of the surface of the substrate is accurately controlled through multi-step pretreatment, and high-pressure water washing and plasma cleaning are combined, so that the mechanical embedding force of a plating layer and a copper layer is ensured, and the problem that the plating layer is not uniform due to too large roughness is avoided. And meanwhile, the current distribution is regulated and controlled by adopting pulse current and a magnetic mask in the copper deposition and electroplating stages, so that the compactness and thickness uniformity of the coating are improved.

The invention belongs to the technical field of printed circuit boards, and discloses a printed circuit board manufacturing method and a printed circuit board, and the method comprises the steps: covering the surface of a plated circuit board with a positive dry film, and forming a circuit board with the positive dry film; wherein the positive dry film is provided with a pattern to be plated with nickel and gold, and the pattern to be plated with nickel and gold is a pattern which coincides with a pre-designed circuit pattern and is compensated and pre-enlarged; performing exposure, development and micro-etching treatment on the circuit board with the positive dry film to form a circuit board with a concave position to be plated with nickel and gold; carrying out nickel and gold electroplating treatment on the circuit board with the concave position to be plated with nickel and gold, and removing a film to obtain a circuit board with a nickel and gold plating layer; covering a negative dry film on the surface of the circuit board with the nickel-gold plating layer to form a circuit board with a negative dry film; performing exposure, development, acid etching and film stripping on the circuit board with the negative dry film to obtain a printed circuit board; according to the invention, the quality and reliability of the printed circuit board can be remarkably improved while the nickel-gold saving ratio is effectively improved.

The application discloses a sealing method of an ultra-thick high-low frequency metal shell, which comprises the following steps: pre-oxidation and pre-plating of raw materials, cleaning of a mold; pre-oxidation and pre-plating of the raw materials to obtain a shell, a lead wire and glass; a section of glass is assembled with the shell and the lead wire, a graphite column is sleeved on the lead wire to press the glass, and the whole is placed in a selected atmosphere to perform first sealing at 800-1200 DEG C. After the first sealing, the mold and the graphite column are removed, the sealed metal shell is treated in diluted hydrofluoric acid for dozens of seconds, a second section of glass is assembled, and the assembled shell is placed at 800-1200 DEG C to perform second sealing. The plating mode of the high-low frequency metal shell is gold plating, copper plating, nickel plating or the like. The application uses step-by-step sealing to replace conventional one-step sealing, and meets the use requirements of high insulation and voltage resistance of the metal shell; and provides technical support for mass production of other types of ultra-thick metal shells.

The application discloses a cyanide-free electroplating solution capable of electroplating soft gold and hard gold, which comprises a gold sulfite, a complexing agent, a stabilizer, a hardness regulator, a conductive salt and a pH buffer. The cyanide-free electroplating solution provided by the application can be used to electroplate hard gold or soft gold plating layer by adjusting the content of the hardness regulator in the solution, and the cyanide-free electroplating solution is neutral and slightly acidic, does not contain toxic elements such as Tl, Pb and As, is environmentally friendly, and is suitable for wide application. In addition, the cyanide-free electroplating solution has a current efficiency greater than 98%, less side reactions in the electroplating process, and a dense gold plating layer.

The application relates to a gold-plated palladium-copper bonding wire and a preparation method and application thereof, and relates to the technical field of semiconductor materials. The wire structure of the gold-plated palladium-copper bonding wire comprises, from inside to outside, a copper alloy core material, a palladium plating layer and a gold plating layer; the copper alloy core material contains one or more than two trace alloy elements of Be, P, Ag, Ca and Al; the composition of the copper alloy core material comprises, in terms of weight percentage, Cu >= 99.99 wt%, Be 0.0005-0.005 wt%, P 0.001-0.01 wt%, Ag 0.0005-0.005 wt%, Ca 0.0003-0.002 wt%, Al 0.001-0.01 wt% and inevitable impurities <= 0.001 wt%. The gold-plated palladium-copper bonding wire can be used for BOSB / BBOS ball placement and wire bonding, long wire tail zero false reporting, ball cutting stabilization, mechanical reliability, excellent oxidation resistance and low-cost mass production.

The invention relates to a film coating device for plating true gold, which comprises a support table, a film coating box, a vacuum film coating device, a vacuum film coating device, a vacuum film coating device and a vacuum film coating device, and is characterized in that the support table is provided with a film coating box; the top of the clamping frame is rotationally connected with the top end in the coating box; the bearing mechanism comprises a supporting ring arranged in the coating box, a plurality of bearing rods fixedly connected to the supporting ring and a combination frame fixedly connected between every two bearing rods, the combination frame is used for installing a workpiece to be machined, and a plurality of positioning blocks are symmetrically arranged on the front face and the rear face of the combination frame; clamping blocks are arranged on the opposite faces of the positioning blocks in a telescopic mode and used for positioning and clamping a workpiece to be machined, and the top of the bearing rod is connected with the clamping frame. According to the vacuum coating device, efficient and uniform coating of the to-be-machined workpiece can be achieved, and a stable vacuum coating environment is provided.

The utility model discloses an ultra-thin S-waveband isolator assembly, which comprises a cavity, a circular groove is arranged in the cavity, ports communicated with the groove are arranged on three side edges of the cavity, the circular surface of the circular groove is divided into three arc-shaped end surfaces by the three ports, and the arc-shaped end surfaces are communicated with the circular groove. Three crescent samarium-cobalt magnetic fields are arranged in the circular groove, and the outer arc-shaped end face of each crescent samarium-cobalt magnetic field is correspondingly attached to the three arc-shaped end faces in the circular groove. A first triangular gyromagnetic ferrite is installed among the three crescent samarium-cobalt magnetic fields, and a gold-plated inner conductor, a second triangular gyromagnetic ferrite, a nickel sheet and a cover plate are sequentially installed on the first triangular gyromagnetic ferrite from bottom to top. The utility model has the advantages of simple structure, small volume, wide bandwidth, low loss, good heat dissipation performance, high power, high normal temperature and high and low temperature reliability, easy assembly and the like.

The application discloses a kind of connector local gold plating control method, equipment and system, it is related to electroplating technical field.The method comprises the following steps: in response to the gold plating operation of the first connector of target connector type, the plating thickness value of the multiple detection points in the gold plating area of the first connector, the concave area of gold plating area and the first electroplating unevenness of gold plating area are obtained;Determine the first form complexity of gold plating area based on the plating thickness value of the multiple detection points in the gold plating area of the first connector and the concave area of gold plating area;Determine the necessity of hieroglyphic plate based on the first electroplating unevenness of gold plating area and the first form complexity of gold plating area;The necessity of hieroglyphic plate is the necessity of using hieroglyphic plate when the gold plating operation of the connector of target connector type is executed;In response to hieroglyphic plate necessity degree greater than preset necessary degree threshold value, the gold plating operation of the connector of target connector type is executed by hieroglyphic plate.The present application can improve the accuracy of gold plating control.

The application provides a kind of gold plating and K gold sample identification method and system, through X-ray detector, the energy spectrum of the sample to be measured is collected, the original X-ray spectrum of the sample to be measured is obtained, the original X-ray spectrum is smoothed, the target X-ray spectrum of the sample to be measured is obtained, the initial simulation spectrum of the sample to be measured is generated according to the target X-ray spectrum, the initial simulation spectrum is corrected by iterative algorithm, until the deviation of the characteristic peak intensity of each element in the target simulation spectrum obtained after correction and the corresponding element in the target X-ray spectrum meets the preset convergence condition, whether the sample to be measured is gold-plated sample is judged according to the target simulation spectrum, in the above manner, it is favorable to improve the accuracy of detection result, reduce the misjudgment rate in the scene such as thick plating layer misjudgment, similar component confusion.

The application discloses a kind of direct eutectic chip packaging structures, including semiconductor chip and ceramic tube shell, the semiconductor chip includes chip body, chip back metallization layer and chip front metallization layer, the chip body lower surface is provided with chip back metallization layer, the ceramic tube shell eutectic welding in chip back metallization layer bottom, the ceramic tube shell includes tube shell surface layer gold plating layer, tube shell surface layer secondary gold plating layer, tube shell tungsten slurry layer and tube shell ceramic body.This direct eutectic chip packaging structure, chip back metallization layer and tube shell surface layer gold plating layer are heated after high temperature, after friction direct eutectic welding, realize chip and tube shell direct effective connection, direct eutectic welding is conducive to enhancing connection firmness, reduce resistance impedance, improve current flow and heat dissipation capacity, and do not need to use alloy solder, it is favorable to reduce operation difficulty, to improve production efficiency and improve qualified product rate, strong practicality is convenient for popularization and use.

This invention discloses a shell structure and fabrication method for a laser control module in a microwave photonics system. The structure includes a ceramic component with a first metal frame and a second metal frame disposed on its upper and lower surfaces, forming a double-sided cavity structure for encapsulating multiple components. Several lead pads are arranged around the ceramic component, with a metal lead soldered onto each lead pad. Several metallized patterns are formed on each layer of the ceramic component's surface and interior. The metallized patterns on the surface of the ceramic component are connected to the metallized patterns inside the ceramic component through metal holes, forming multiple signal networks. Signal networks not connected to the lead pads are called island networks. Electroplated interconnects are distributed on the surface of the ceramic component, connecting the island networks to the lead pads for nickel-gold plating of the island networks. This invention effectively improves the integration of the circuit module and also improves electroplating efficiency, ensuring a high plating yield.

The utility model relates to the technical field of PCB (Printed Circuit Board) processing, and discloses a feeding device for a PCB chemical immersion gold wire, which comprises an electroplating box, a conveying belt located in the electroplating box and a driving piece used for driving the conveying belt to operate are installed on the electroplating box. The periphery of the conveying belt is connected with a plurality of elastic clamping assemblies arranged at intervals, and the elastic clamping assemblies are used for limiting plates. A water filtering piece is installed on the side face of the elastic clamping assembly, and an included angle exists between the water filtering piece and the elastic clamping assembly. According to the feeding device for the PCB chemical immersion gold line, the conveying belt, the elastic clamping assembly and the water filtering piece are combined, the uniformity of a gold plating layer in the PCB electroplating process can be effectively improved, when the elastic clamping assembly and the water filtering piece operate in the electroplating box, electroplating liquid can be evenly distributed on a PCB, and the electroplating quality is improved. And liquid in the electroplating box can be stirred, flowing of the liquid is accelerated, and therefore the problem that a plating layer is not uniform due to insufficient liquidity of the electroplating liquid is solved.

The present invention belongs to the field of infrared detection sensors and proposes a cold screen for a refrigerated infrared detector. Specifically, it is a cold screen with a wavy, integrated structure. The cold screen has a wavy appearance and is directly processed using a single electroforming process. The inner surface of the cold screen is blackened, and the outer surface can be gold-plated or untreated. The cold screen does not require welding during processing, making the process simple and the cold screen itself has high mechanical strength. Furthermore, the cold screen can be designed into different structural shapes based on the cooling effect and the need to shield stray light, further improving the accuracy of refrigerated infrared detection and showing good application prospects.

The utility model belongs to the technical field of split needle machining, and particularly relates to gold-plated split needle machining equipment which comprises a bottom plate, a gold-plated assembly is arranged on one side of the top end of the bottom plate, a plurality of stand columns are arranged at the other end of the bottom plate, a rotating plate is arranged at the top ends of the stand columns, and a grinding assembly is arranged at the top end of the rotating plate. A rotating assembly is arranged on the bottom side of the rotating plate, the gold plating assembly comprises a vibration motor, the vibration motor is arranged at the top end of the bottom plate, the output end of the vibration motor is connected with a rotating rod through a coupler, a vibration disc is arranged at the top end of the rotating rod, and a material conveying opening is formed in the outer side wall of the vibration disc; a material conveying opening is formed in the bottom plate, a conveying frame is erected in the material conveying opening, a gold plating groove is formed in the top end of the bottom plate, a plurality of heating strips are arranged in the gold plating groove, and a frame opening of the conveying frame is located over the gold plating groove, so that an oxide layer on the surface of the split needle can be comprehensively removed through cooperation, and the gold plating efficiency is improved.

The utility model discloses a power inductor structure with a conducting plate plated with a metal layer, which relates to the field of inductors and comprises an inductor body and the conducting plate arranged on the inductor body, and a silver metal layer is plated on the surface of the conducting plate. A U-shaped shielding cover is fixedly embedded in the bottom of the inductor body and located outside the guide pieces, and a shielding assembly is arranged in the U-shaped shielding cover. The top of the U-shaped shielding cover is provided with a heat conduction assembly in contact with the upper surface of the guide piece, and a ventilation opening is formed in the position, corresponding to the heat conduction assembly, of the side wall of the inductor body. The conductive sheet plated with the metal layer improves the conductivity and the corrosion resistance of the conductive sheet, has a shielding and heat dissipation structure, improves the anti-electromagnetic interference performance and the heat dissipation performance of the conductive sheet, and improves the performance of the power inductor.

The invention discloses a multi-layer composite structure gold-plated inner layer drinking water conveying pipeline and a preparation method thereof, and belongs to the field of drinking water conveying pipelines. The pipeline is of a four-layer composite structure, the outer layer is a 316L stainless steel pipe with the diameter being 1.2-3.0 mm, the middle layer is a food-grade epoxy resin layer with the diameter being 0.3-0.8 mm, the inner layer is a TP2 thin-wall copper pipe with the diameter being 0.5-1.5 mm, and the inner wall of the copper pipe is a 99.99% high-purity gold plating layer with the diameter being 0.001-0.002 mm. The preparation comprises six core processes, gold plating adopts an electroplating and chemical plating composite process, and parameters such as specific current density, plating solution temperature and the like are controlled. The designed service life of the pipeline is gt; 100 years later, sanitation and mechanical performance are excellent, the gold layer is firmly attached, the problems that a traditional pipeline is poor in corrosion resistance, and the gold layer is prone to falling off are solved, and the composite pipe is suitable for drinking water conveying scenes such as high-end residences and medical treatment.

The utility model discloses a cyanide-free imitation gold plating layer structure of an aluminum alloy part, which comprises an aluminum alloy substrate, and a chemical zinc deposition layer, a citrate pre-nickel plating layer, a nickel-copper alloy plating layer, a bright nickel plating layer, a cyanide-free imitation gold plating layer and an electrophoretic varnish coating which are sequentially prepared on the aluminum alloy substrate from inside to outside. According to the cyanide-free gold-imitating plating layer structure of the aluminum alloy part disclosed by the utility model, the binding force of the plating layer is tested by a thermal shock method according to the GB / T 5270-2005'metal covering layer electro-deposition and chemical deposition layer adhesion strength test method on a metal matrix ', the binding force meets the standard requirement, an acetate fog test is carried out for 168 hours according to the GB / T 10125-2021'artificial atmosphere corrosion test and salt spray test', and the binding force meets the standard requirement. And no red corrosives are generated on the surface of a plated part, and the plating layer structure has good corrosion resistance.

The application discloses an additive for improving the bonding force of a chemical gold plating layer and a preparation method thereof, relates to the technical field of chemical gold plating, and comprises the following steps: preparing a pH buffer type-viscosity controlled substrate activation solution; adding an epoxy-based pre-anchoring-disulfide bond functionalized copolymer into an N-methyl-2-pyrrolidone solvent and stirring until complete dissolution; then, adding a pH buffer stabilizer and a thixotropic viscosity regulator in sequence and continuing to stir; and finally, carrying out ultrasonic dispersion and defoaming on the mixed solution, and then carrying out static defoaming to obtain the additive. The application realizes high bonding force without damaging sensitive substrates, and solves the technical problems of high-temperature failure, poor storage stability and low batch consistency through double covalent anchoring, pH locking and viscosity controlled design.