910 results about "Gold plating" patented technology

The invention discloses a post-pressing multilayer high-frequency metal-based carbon oil circuit board production method, and relates to the field of circuit board production, and the method comprises the steps: carrying out the engineering design, carrying out the pretreatment preparation after the engineering design is completed, and carrying out the hole metallization control of a high-frequency microwave board after the pretreatment preparation is completed. And after hole metallization control of the high-frequency microwave plate is completed, copper plating processing is carried out, and after copper plating processing is completed, metal-based chemical gold plating processing is carried out. According to the post-pressing multilayer high-frequency metal-based carbon oil circuit board production method, a dielectric layer of a multilayer high-frequency metal-based board is generally made of a high-frequency material, a multilayer high-frequency microwave board is firstly manufactured, then pressed together with a metal-based board and then subjected to surface treatment and forming, a carbon oil board is generally used on an FR4 board and is subjected to screen printing through common gauze, the resistance value and thickness error are large, and the resistance value and thickness error are large. And the produced post-pressed high-frequency metal-based carbon oil circuit board is good in heat dissipation and good in signal transmission performance, and the thickness and resistance of the carbon oil meet the requirements of customers.

The invention relates to the technical field of heat sink materials, in particular to a modified gold tin-hard gold plated heat sink material and a preparation method and application thereof. Comprising a first heat sink layer, a nickel plating layer, a gold plating layer, a gold-tin solder layer, a gold plating layer, a nickel plating layer, a second heat sink layer, a nickel plating layer, a hard gold plating layer and a modified gold-tin-silicon solder layer which are sequentially connected from bottom to top. The first heat sink layer is made of oxygen-free copper, the second heat sink layer is made of molybdenum copper or tungsten copper, and the hard gold plating layer comprises a nickel plating layer and a tungsten titanium gold plating layer which are sequentially connected from bottom to top. Tungsten and titanium are introduced into the gold-plated layer on the surface of the heat sink material, so that the hardness and corrosion resistance of the gold-plated layer are remarkably enhanced; a small amount of silicon is doped into the gold-tin solder, so that the shaping processing performance of the gold-tin brittle solder is improved; one-time forming of the solder-heat sink composite material is achieved in a vacuum thermocompression welding mode, and the problem of cavities or overflow caused by solder size errors in the welding process is solved.

The invention relates to a processing technology of an optical module circuit board, which comprises the following steps of: cutting a double-sided copper-clad plate, cutting the plate, and manufacturing an inner-layer circuit to obtain an inner-layer plate; performing hot melting and riveting on the inner-layer plate and then adding layers to obtain a first multi-layer plate; the first multilayer board is subjected to browning copper reduction, laser target burning, plasma degumming, copper deposition and electroplating, vacuum tree plug, high-cutting grinding and circuit manufacturing; performing double-sided layer adding on the treated first multilayer board to obtain a second multilayer board, and performing browning copper reduction, laser target burning, plasma degumming, copper deposition electroplating, vacuum tree plug, high-cutting grinding and circuit manufacturing on the second multilayer board to obtain a semi-finished board; and performing finger gold plating, LPI printing, vacuum etching and the like on the semi-finished board to obtain a finished board. The processing technology can meet the market requirements of 800G optical module products, the high-speed resistance yield is improved, and the mass production capability of the optical module technology is realized.

The invention discloses a preparation method of a printed circuit board with a blind slot and the printed circuit board, which are used for solving the problems that in the manufacturing process of a multi-layer board, when the inner-layer gold plating area is large, namely the prepreg bonding area is small, a core board can generate large stripping stress in a high-temperature and high-pressure environment in the pressing process, and the bonding effect is poor. And plate explosion and layering are very easy to occur. The preparation method of the printed circuit board comprises the step of drilling a ventilation hole in each of the two ends, corresponding to a blind groove area, of a conventional layer core board. Therefore, the expansion stress of the core board can be released in time through the air holes, and the phenomenon of board explosion and layering when the bonding area of the prepreg of the printed circuit board is relatively low is avoided. The printed circuit board manufactured by the invention has the advantages of no board explosion layering, simple manufacturing method, easy realization of batch production and the like.

The invention discloses a multichannel optical fiber fluorescent temperature measuring device and method for an electrostatic chuck in an etching machine, and relates to the technical field of semiconductor etching. The device comprises temperature measurement sensors arranged in different areas of an electrostatic chuck, and each temperature measurement sensor comprises a fluorescent temperature measurement head, a ceramic sleeve, a switching optical fiber, a transmission optical fiber, an optical coupling module, a photoelectric detection module and a working light source module; wherein the fluorescent temperature measuring head comprises a fluorescent layer and a heat conducting layer which are stacked, the fluorescent layer is prepared through a hot pressing sintering method, the end face of the fluorescent layer is plated with gold, the heat conducting layer comprises a copper-diamond composite material, the end face of the heat conducting layer is plated with gold and is connected with the end face of the fluorescent layer through a vacuum backflow void-free welding process, and the ceramic sleeve wraps the switching optical fiber. The end face of the ceramic sleeve is plated with gold and is connected with the fluorescent temperature measuring head through a vacuum backflow void-free welding process. By adopting the device, the temperature measurement precision can be effectively improved, the temperature measurement range can be effectively widened, and the temperature distribution on the surface of the semiconductor wafer can be accurately measured.

The invention relates to the technical field of semi-gold-nickel plating and processing, in particular to a floating connector terminal continuous semi-gold-nickel plating process which comprises the following preparation steps: S1, a floating connector terminal to be electroplated is put into degreasing fluid for degreasing treatment, and then the degreased terminal is put into activating fluid for activating treatment; s2, nickel electroplating is conducted on the activated floating connector terminal through a nickel plating solution, a nickel cake serves as an anode, the pH value of the nickel plating solution is controlled to be 3.5-5.5 through weak acid in the electroplating process, the electroplating current is controlled to be 0.4-0.8 A / dm < 2 >, the temperature is controlled to be 50-60 DEG C, cleaning is conducted, and the nickel-plated floating connector terminal is obtained; and S3, the nickel-plated floating connector terminal is put into the gold plating solution to be electroplated, the electroplating temperature is 40-50 DEG C, the current density is 0.1-2 A / dm, a finished product is obtained, and the floating connector terminal can still keep high conductivity, low contact resistance, high abrasion resistance and high corrosion resistance under the complex environments of high temperature, vibration, salt mist and the like through the technology.

The invention relates to the technical field of PCB (Printed Circuit Board) processing, and discloses a method for removing lead warped copper by deep drilling in a gold finger gold plating process, which comprises the following steps of: optimizing the position and the shape of a gold-plated lead: changing the gold-plated lead from a short side of a gold finger to a side wall of the gold finger, and optimizing the shape of the gold-plated lead to be elliptical; the widest part R of the center of the ellipse satisfies Rlt by taking mil as a unit; x-R is larger than or equal to 4 mil, and X is the diameter of a deep drilling point; according to high-precision photosensitive wet film protection, before a gold-plated lead is removed through deep drilling, a photosensitive wet film is adopted to cover a gold finger lead area, the wet film is accurately positioned and printed through drilling positioning holes in the four corners, the protective area covers the gold finger lead and extends outwards by Y mil, and Y is larger than or equal to 4 mil. The method for removing the warped copper of the lead through deep drilling in the gold-plating process of the golden finger aims at solving the problem that the copper is prone to being warped when the gold-plated lead is removed through deep drilling in the gold-plating process of the golden finger.

Aiming at the limitation of the existing metal bump corrosion prevention technology, the invention provides an innovative process: pure silver electroplating is adopted to form a bump main body, a complete gold wrapping structure is formed on all exposed surfaces of the bump main body through secondary electroplating of pure gold, and the process can be used for accurately regulating and controlling the parameters of the secondary electroplating and the size of a secondary photoetching pattern. The exposed surface of the silver bump is uniformly wrapped by the thin gold layer, so that the problem that metal interconnection is easy to corrode in a severe environment in the traditional technology is effectively solved, and comprehensive breakthrough in corrosion resistance, electrical properties and cost effectiveness is realized through innovative silver core and gold shell layered structure design and precise process control.

The invention discloses a manufacturing method of a support-free isolated step circuit board, which comprises the following steps of: manufacturing a plurality of inner-layer core boards, pressing and fixing the inner-layer core boards, planning a step area on the uppermost layer, and carrying out nickel-gold plating treatment on all areas outside the step area to obtain inner-layer sub-components; covering the nickel-gold plating area on the uppermost layer of the inner-layer sub-component with the cut PI adhesive tape, and leaving the step area when the opening is over against the step area; sequentially placing a prepreg I and an outer-layer core plate on the upper side of the PI adhesive tape, and pressing the prepreg I and the outer-layer core plate together; and milling a step area corresponding to the outer-layer core board, and removing the pre-pasted PI adhesive tape after milling to obtain the support-free isolated step circuit board. According to the invention, the step structure formed by direct milling is arranged on the multilayer circuit board, and the non-support isolated step structure is obtained by using the nickel-gold plating area outside the step position protected by the PI adhesive tape; the adhesive overflow risk and the difficulty in adhesive tape stripping in the micro blind groove processing are avoided, and the method is particularly suitable for high-precision and miniaturized design scenes.

The invention belongs to the technical field of photoelectric detection, and relates to a gallium oxide nanowire array type solar blind photoelectric detector and a preparation method thereof. Spreading liquid metal gallium on the surface of the substrate to form a liquid metal gallium layer on the surface of the substrate; performing vacuum evaporation on the surface of the liquid metal gallium layer to form a gold film layer to obtain a device precursor; and heating the device precursor to 400-1000 DEG C at a heating rate of 10-15 DEG C / min, and carrying out heat treatment for 1-2h to obtain the sandwich structure device. According to the method, the preparation mode of the array type gallium oxide nanowire is simplified, gallium metal left in the growth process is used as the electrode, the tedious and complex technological process needed in the previous device preparation process is improved, the ordered and regular gallium oxide nanowire array structure is prepared, and the photoelectric detection effect is improved.

The invention discloses a multi-component atomic level oxide solid solution integrated electrode for electrolyzed water and a preparation method thereof, and belongs to the field of metal material surface plating. The electrode is composed of a gas diffusion layer, a nano array substrate and an atomic level oxide solid solution catalyst layer. The preparation method comprises the following steps: constructing a nano array microreactor on the surface of the gas diffusion layer; the method comprises the following steps: driving an atomic hierarchy solid solution to reconstruct by utilizing an array confinement effect through combination of precursor directional spraying and a heat treatment-rapid quenching process, and constructing a three-dimensional conformal ionomer network on the surface of the atomic hierarchy solid solution; and performing gold plating treatment on the back side of the electrode. Through the synergistic effect of spatial constraint and thermodynamic regulation of the nano microreactor, the traditional electrode interface mismatch bottleneck is broken through, and while precise construction of atomic-scale active sites is realized, the mechanical stability and oxygen evolution reaction kinetics of the electrode are improved. The preparation process has the advantages of controllable flow, strong large-scale expansibility and good industrial preparation prospect.

The problem of the present invention is to provide a plating stack (a stack of plating films) for applying on surface of conductor circuits or the like, the plating stack can maintain high bond strength when solder is bonded on that and can be produced stably. In the method for producing a plating stack of the present invention, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of nickel is deposited on the plating layer B by a redox reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum or silver.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The invention discloses a circuit board golden finger processing method which comprises the following steps: providing circuit board precursors which comprise a circuit area, a golden finger area and a lead area, the circuit area is provided with a metal circuit, the golden finger area comprises a plurality of golden finger precursors, the lead area comprises a plurality of leads, and the leads are connected with the golden finger precursors; the gold finger precursor is connected with the metal circuit, a solder mask layer covering the circuit area is formed, a wet film covering the lead area is formed, a first dry film covering the lead area is formed on the wet film, a gold layer is formed on the gold finger precursor in an electroplating mode, the first dry film and the wet film are removed, and the lead is removed in an etching mode. The first dry film can completely cover the lead in the lead area, the problem that the edge of the lead is exposed does not exist, the problem that the edge of the lead is plated with gold in the gold plating process, consequently, the edge of the lead cannot be etched and removed subsequently, and then the connection stability of the circuit board is affected is solved, and the connection stability and quality of the circuit board are improved.

The invention discloses a diamond-metal composite material with six surfaces coated with metal as well as a processing method and application of the diamond-metal composite material. The diamond-metal composite material with the six surfaces coated with the metal is a composite material formed by sintering a hexahedral metal shell and at least one diamond-metal composite layer arranged in the metal shell. The diamond-metal composite layer comprises a metal net and diamond particles, the surfaces of the diamond particles are coated with coatings, the diamond particles are arranged in grids of the metal net, and gaps between the grids and the diamond particles are filled with metal powder; metal atoms in the metal net penetrate through the coating to diffuse towards the surface of the diamond, and a mixed transition area is formed. The structural composition of the diamond-metal composite material is adjusted, and the surface of the diamond-metal composite material is coated with metal to form the diamond-metal composite material with six surfaces coated with metal, so that the diamond in the composite material is prevented from being exposed, and the problem that the surface of the diamond is difficult to machine and gold is difficult to plate is solved.

The present invention provides a method for electroplating gold on the surface of a circuit board. The method comprises the following steps: (1) first printing ink on the surface of the circuit board to form an ink layer; (2) slotting the ink layer to form grooves; (3) second printing a conductive silver paste in the grooves and curing the paste, then grinding the circuit board to remove the ink; and (4) electroplating the circuit board after the ink is removed with gold, and then removing the conductive silver paste. The method can effectively solve problems such as residual conductive wires or gaps in the gold plating pattern that occur during the gold plating process for drawing conductive wires, and does not require etching, thereby reducing costs and improving efficiency.

The invention discloses equipment for removing a gold-plated layer of a contact pin, belongs to the technical field of automatic processing, and solves the problems that in the prior art, the gold-plated layer of the contact pin is low in efficiency and not environmentally friendly, the technical scheme for solving the problems includes that the equipment comprises a rack, and the rack is provided with a feeding mechanism, a laser removing module, a multi-station circulating module, a processing station and a feeding and discharging station; the machining station and the feeding and discharging station are each provided with a rotating mechanism, the laser removing module is used for removing a gold plating layer of a contact pin of the machining station, the feeding mechanism is used for rotating the contact pin to the rotating mechanism, and the rotating mechanism is used for driving the contact pin to rotate so that the laser removing module can circumferentially remove the gold plating layer of the contact pin. The multi-station circulation module is used for driving the rotating mechanism of the machining station and the rotating mechanism of the feeding and discharging station to exchange positions, and when the feeding and discharging station conducts feeding and discharging of the contact pins, the machining station removes gold plating layers of the contact pins. The production efficiency is improved, the production quality is optimized, and the device is more environmentally friendly.

The invention relates to an ultrasonic bonding process and a bonding process reliability evaluation method, and belongs to the technical field of semiconductor device packaging. The invention relates to an ultrasonic bonding process, which comprises the following steps of: 1, before bonding, carrying out plasma cleaning on a metal ceramic shell to remove surface contamination and an oxide layer; step 2, enabling the aluminum wire to penetrate into a chopper of a bonding machine, enabling the aluminum wire to be in contact with the surface of the gold-plated layer at the bonding pressure of 250cN-280cN by adopting the chopper, and enabling the aluminum wire to be in contact with the surface gold-plated layer of the bonding area in a low-pressure mode; and step 3, the bonding machine applies ultrasonic power of 10.5-12.3 W for 400-500 ms, the aluminum wire begins to rub and destroy the gold-plated layer on the surface of the bonding area under the action of the ultrasonic power, and after the gold-plated layer is destroyed, the aluminum wire penetrates through the gold-plated layer and forms an atomic-scale mutual diffusion interface with the nickel-plated layer. Reliable combination of gold, aluminum and nickel is achieved, meanwhile, a reliability evaluation method is provided, and therefore it is guaranteed that devices, circuits and the like adopting the ultrasonic bonding technology work reliably in the life cycle.

The present invention discloses a highly corrosion-resistant and highly conductive palladium-plated / gold-plated palladium-copper bonding wire and a production process thereof, and relates to the technical field of bonding wires. In order to improve the corrosion resistance of the bonding wire, the present invention improves the bonding wire by modifying the core material and preparing a composite coating. The present invention first improves the core layer, and by adding graphene to the core layer, the corrosion potential of the core material is greatly improved, and the copper core has good heat dissipation performance and high-temperature electrical conductivity, thereby avoiding heat accumulation and temperature rise in the bonding wire. On this basis, the present invention also improves the coating, and by reducing the metal ion concentration in the plating solution, adding a hole-filling agent, and performing pulse current electroplating, the surface morphology of the electroplated coating is improved, and by annealing, a diffusion layer is formed between the graphene copper alloy core and different electroplated layers, thereby improving the mutual bonding strength and improving the performance of the bonding wire.

The invention discloses a two-dimensional Te / ReSe2 variable-angle heterojunction photoelectric detector and a preparation method and application thereof, and belongs to the technical field of semiconductor devices. The two-dimensional Te / ReSe2 variable-angle heterojunction photoelectric detector sequentially comprises a Si / SiO2 substrate, a Te layer and a ReSe2 layer from bottom to top, and the ReSe2 layer and the Te layer form Van der Waals heterojunctions with different angles. Through a CVD method, PMMA wet transfer, PVA dry transfer, photoetching gold plating, high-temperature annealing treatment and other methods, customization of functions of the photoelectric detector is realized, and a multi-angle heterojunction device with rich polarization characteristics is obtained. Based on different polarization sensitive characteristics of devices, the functions of simultaneous detection of polarized light direction and intensity of incident light, encryption and decryption and polarization imaging can be realized.

The invention relates to an organic adhesive and a preparation method thereof, in particular to a high-strength damp-heat-resistant adhesive suitable for adhering a plated metal chip and a preparation method of the high-strength damp-heat-resistant adhesive. The problem that in the existing semiconductor field, the bonding reliability is poor under the high-humidity state and the high-humidity heat in the bonding process of an epoxy adhesive and precious metal such as a gold-plated base material is solved. The high-strength damp-heat-resistant adhesive is prepared from epoxy resin, chelated epoxy resin, polyimide precursor resin, a polyimide and chelated epoxy resin synergistic curing agent, a phthalate coupling agent, an inorganic filler and a solvent I; the preparation method comprises the following steps: 1, preparing polyimide precursor resin; 2, weighing; and 3, preparing the adhesive. The invention relates to a high-strength damp-heat-resistant adhesive suitable for bonding a plated metal chip and a preparation method thereof.

The invention discloses a Kovar alloy electroplating method. The method comprises the steps that a Kovar alloy base material is pretreated; the pretreated kovar alloy base material is immersed in an acidic copper sulfate plating solution for electrolytic copper plating, so that a copper plating layer is formed on the surface of the kovar alloy base material; immersing the kovar alloy on which the copper plating layer is formed into a chemical nickel plating solution so as to form a nickel plating layer on the surface of the copper plating layer; and immersing the kovar alloy base material on which the nickel plating layer is formed into a nanogold seed crystal solution so as to form a soft gold plating layer on the surface of the nickel plating layer. The coating quality of the kovar alloy can be improved.

An HTCC ceramic tube shell cavity structure comprises a ceramic cavity which comprises a ceramic side wall and a ceramic bottom surface and forms a hollow structure used for packaging an electronic element; the metal pattern is arranged on the ceramic bottom surface and is used for forming a circuit connection path so as to realize electric connection between the electronic element and an external circuit; and the insulating layer is arranged at the connecting part of the ceramic bottom surface and the ceramic side wall and is used for separating the metal pattern from the edge and the corner of the ceramic cavity so as to prevent overplating at the edge and the corner of the cavity in the chemical plating process. According to the invention, overplating generated at the edge and corners of the cavity when the ceramic substrate is subjected to chemical nickel gold plating is solved, and the risks of insulation resistance reduction and short circuit are avoided. According to the HTCC ceramic tube shell cavity structure, the insulating layer is arranged at the joint of the ceramic bottom surface and the side wall, so that the overplating phenomenon generated at the edge and the corner of the cavity in the chemical plating process is effectively avoided, and the reliability and the stability of electronic component packaging are remarkably improved.

The invention discloses a manufacturing method of a gold finger PCB (Printed Circuit Board) without a gold guide lead. Adding a gold guide lead wire at the position of the golden finger; printing easy-to-wash selective solder mask ink: exposing the golden finger position needing gold plating to form a first selective area, and covering other positions which do not need gold plating with the easy-to-wash selective solder mask ink; gold plating is carried out on the first selective area, and after gold plating is completed, the selective solder mask ink covering the board is removed; the PCB is covered with a layer of selective dry film, the gold guide lead is exposed to form a second selective area, and other positions are all covered with a layer of selective dry film for protection; etching off the gold guide lead by using etching liquid medicine; after etching is completed, the selective dry film is washed away, the gold finger PCB without the gold guide lead is obtained, and the defect that in the prior art, wire residues exist in the gold finger manufacturing process is overcome.

A base layer (3) and a gold layer (4) are sequentially formed on a semiconductor substrate (1). A resist pattern (5) is formed on the gold layer (4). A plating film (6) is formed on portions of the gold layer (4), which are not covered with the resist pattern (5). Portions of the gold layer (4), which are exposed by removing the resist pattern (5), and the base layer (3) are etched by ion milling so as to form a metal mask (8). The semiconductor substrate (1) is plasma-etched using the metal mask (8) so as to form a via (9). The base layer (3) is composed of at least one metal layer that is formed of any one metal selected from among Ti, Ta, W, Ni, Co, and Nb or an alloy of two or more of those metals. The film thickness of the gold layer (4) is 20 nm or less, and the film thickness of the base layer (3) is 100 nm or more.

The invention discloses an automatic gold-tin fusion seal welding process method, and designs an annular suction nozzle aiming at the size of a seal welding surface of a tube socket, and the annular suction nozzle can pick up the tube socket and a cover plate and provide welding pressure for the seal welding surface at the same time. And by accurately positioning the positions of the tube seat and the cover plate, high-precision alignment is realized, and the problem of cover plate alignment deflection is solved. The welding pressure is accurately controlled by a suction nozzle, the temperature is accurately controlled by a heating table in the equipment, the consistency of welding process conditions of each circuit is ensured, and the equipment cavity is filled with nitrogen with the purity being greater than 99.999%, so that on one hand, welding flux is protected from being oxidized at high temperature, and on the other hand, the welding quality is improved; on the other hand, the purpose that pure nitrogen exists in the sealed circuit is achieved, gold plating treatment is conducted on the surface of the suction nozzle, gold plating components are consistent with those on the surface of the cover plate, and a gold plating layer on the surface of the cover plate is protected against damage in the picking process.

The utility model provides a gold-plated part cleaning device, and relates to the technical field of gold-plated part cleaning. The gold-plated part cleaning device comprises a base, a cleaning treatment box is fixedly connected to the upper surface of the base, a plurality of vertically-through cleaning grooves are formed in the cleaning treatment box, an inner cavity plate is fixedly inserted into the base, and the lower end of the inner cavity plate penetrates out of the base; an air injection frame is fixedly installed on the upper surface of the base and located below each cleaning tank, and the upper surface of the air injection frame is of a plurality of vertical through hole structures communicating with the interior of the air injection frame. According to the gold-plated part cleaning device, the air injection frame and the cleaning tank are arranged, cleaning liquid is added into the cleaning tank, the cleaning liquid in the cleaning tank has the continuous upward gushing tendency under upward airflow, and the upward-jetted liquid flow can support a gold-plated part, so that the surface of the gold-plated part can be in full contact with the cleaning liquid; and meanwhile, the gushing airflow impacts the surface of the gold-plated part to clean the gold-plated part.

The invention belongs to the technical field of CGM sensors, and particularly relates to a CGM electrode sensor and a preparation method thereof.The preparation method comprises the following steps that three sets of stainless steel microneedle arrays are prepared from a stainless steel substrate and serve as a counter electrode, a reference electrode and a working electrode respectively; mechanically polishing the stainless steel microneedle array, and performing composite pickling activation; after surface pretreatment, a sol-gel deposition aluminum oxide layer is adopted; preparing a gold plating solution, and plating gold on the stainless steel microneedle array deposited with the aluminum oxide layer by adopting two-stage pulse electroplating; the working electrode is prepared by PMMA coating, adhesion layer construction, glucose oxidase immobilization and limiting layer construction; the counter electrode, the reference electrode and the working electrode are respectively embedded into the substrate to form the microneedle array electrode sensor with a three-electrode system. Based on a nickel-free direct gold plating process, good uniformity, strong binding force and lower cost after gold plating can be realized, so that the stability of the continuous glucose sensor in use is improved.

The present invention discloses a semiconductor laser bar stack array and a packaging method thereof. The bar stack array includes multiple stacking groups, an electrically insulating heat sink and a heat sink, each stacking group includes a bar and two conductive heat dissipation blocks, the bar is welded between the two conductive heat dissipation blocks, and the stacking groups are welded to each other. A plurality of gold soldering points are arranged on the bottom surface of each conductive heat dissipation block, and both sides of the bottom surface have chamfers. The middle two chamfers of each stacking group are non-gold-plated chamfers, and the two chamfers on both sides are gold-plated chamfers. The top surface of the electrically insulating heat sink is provided with a plurality of electrically insulating grooves. A semiconductor laser bar stack array and a packaging method thereof in the present invention solves the problem of solder extrusion by distinguishing between gold-plated chamfers and non-gold-plated chamfers on both sides of the conductive heat dissipation block, and also solves the problem of uncontrollable solder extrusion caused by the height difference of the conductive heat dissipation blocks on both sides of the bar by making soldering points on the conductive heat dissipation block and the heat sink.

The invention provides a gold plating machine which comprises an electroplating bath, an anode outer net and an anode inner net which are respectively arranged on two sides of the electroplating bath, a first power supply connecting wire for connecting a power supply and the anode inner net, and a second power supply connecting wire for connecting the anode inner net and the anode outer net, the anode inner net comprises a first anode inner net and a second anode inner net arranged on the inner side of the first anode inner net. By controlling the electric quantity output by the power supply to flow from the internal network to the external network, compared with a mode of connecting the internal network from the external network in conventional equipment, the electric potential of the external network is reduced, the electric quantity output by the external network is reduced, and the electric quantity distribution uniformity is improved; a traditional complete outer side anode net is divided into a plurality of anode nets which are arranged at intervals, the area of the outer net is reduced, a traditional single-layer anode inner net is changed into a double-layer anode net, the area of the inner net is increased, the area of the anode outer net and the area of the anode inner net are relatively equal, the output electric quantity is relatively equal, and therefore the electric quantity of electroplating liquid is evenly distributed, and the electroplating efficiency is improved. And the plating quality is improved.