Method for recovering gold and copper from gold-plated printed circuit board waste material

A printed circuit board, gold recovery technology, applied in the field of gold and copper recovery, can solve the problem of strong corrosion of toxic aqua regia

Inactive Publication Date: 2007-08-29
苏州天地环境科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for recovering gold and copper from gold-plated printed circuit board waste, the purpose of which is to overcome the problems that the existing process is easy to produce toxic substances and the strong corrosion of aqua regia has higher requirements on equipment. Propose a recovery method that is suitable for industrial production and has good environmental and economic benefits

Method used

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  • Method for recovering gold and copper from gold-plated printed circuit board waste material
  • Method for recovering gold and copper from gold-plated printed circuit board waste material
  • Method for recovering gold and copper from gold-plated printed circuit board waste material

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Embodiment

[0076] Embodiment: a kind of method that reclaims gold and copper from gold-plated printed circuit board scrap, is object with waste and old gold-plated printed circuit board, comprises the following steps successively:

[0077] (1) Pretreatment of waste circuit boards

[0078] In order to reduce the subsequent purification, the waste circuit boards are washed with water before the leaching and stripping step in the industry to remove soil impurities, and they are classified according to the thickness of the circuit boards. Specifically, it can be divided into three categories. The first category is thin and soft waste circuit boards, the second category is waste thick circuit boards with little copper content, and the third category is waste thick circuit boards with high copper content.

[0079] (2), leaching stripping

[0080] Put a batch of waste circuit boards with similar thickness into a reaction tank 2 (as shown in FIG. 3 ) and soak them in the leaching solution. The ...

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Abstract

The invention is a method for recovering Au and Cu from Au-plated PCB waste, adopting oxydol and vitriol as reacting reagent to recover Au and Cu from the Au-plated PCB waste. And it researches the effect of concentration and utilization of vitriol, oxydol utilization, reacting conditions, and reacting time on the results. And the experimental result indicates that both overhigh and overlow acidity are detrimental to the Au and Cu recovery. Considering from the cost and time aspects, it advances the optimum concentration and utilization of vitriol. And the Au peeling ratio can be 99% and the Cu recovery rate can be 99%; after purified, the obtained Au has purity up to 99%, and the obtained bluestone can crystallize to obtain bluestone products. And the used reagent is nontoxic, cheap and easy to obtain; no harmful matters are generated in the experiment course; and the invention has better economic and social benefits and wide development future.

Description

technical field [0001] The present invention relates to a method for recovering gold and copper from gold-plated printed circuit board scrap. Background technique [0002] Comprehensive utilization is one of the most important means to realize solid waste recycling and reduction. The Chinese government has always attached great importance to the comprehensive utilization of solid waste. According to statistics, the comprehensive utilization rate of industrial solid waste in my country has reached 78.67%. However, judging from the status quo of comprehensive utilization technologies, most of them remain at a lower level as fuel, road construction, backfill, and production of building materials, lacking value-added and deep-processed products, and the comprehensive utilization of waste with a wide range of issues is not yet clear. has not been fundamentally resolved. [0003] In recent years, with the vigorous development of the electronics industry, a large number of manufa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B3/06C22B3/08C22B3/22C22B3/44B22D21/00C22B11/00C22B15/00
CPCY02P10/20
Inventor 李金荣陈土根章文华郁宏
Owner 苏州天地环境科技有限公司
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